Status report on:

•Module assembly procedure •FPC-pixel chips interconnection

WP8 - C. Pastore, 23.01.2014 1

Module assembly procedure

A B

New jigs reference pinsNew jigs

WP8 - C. Pastore, 23.01.2014 2

Module assembly procedure Dummy chips:• 50 µm thick• size 15 mm x 30 mm

Dummy FPC:•Designed as in TDR1 to accommodate 7 x 2 chips•holes metalized• no coverlay at the bottom•produced by Nuova Eurotar

FPC layer stack upCover-sheet 25 µm

Copper 50 µm

Copper 50 µmKapton 25 µm

First version of FPC

WP8 - C. Pastore, 23.01.2014 3

Nominal Measured

X 210,6 210,6030

Y 30,1 30,1270

L 180,6 180,6744

Distance (i) i = 1,…,6 30,1 30,116730,113130,115530,106930,107930,1145

Metalized hole diameter i = 1,…,7

0,21 0,26290,26590,26730,26610,26340,26460,2632

i1 i4 i5 i6

L

X

Y

i2 i3

i1

Module assembly procedure

i1

CHIP 2CHIP 1

CHIP 8

CHIP 2CHIP 1

Measures in mm

WP8 - C. Pastore, 23.01.2014 4

Nominal Needed Measured

A 30,4 30,1 29,95 B 30,4 30,1 30,34C 30,4 30,1 30,05

L 210,6 210,6 210,77

L

A

B

C

Carbon plate K13D2U 75gsm (≈ 40µ) 3 layers 0°/90°/0°

Thickness 0,11-0,12mmWeight 1,22g

Module assembly procedure

Measures in mm

Open questions:Module carbon plate : yes or notIf yes,• higher precision• adhesive tape or glue? WP8 - C. Pastore, 23.01.2014 5

Module assembly procedure FPC pre-alignment and handling

1 2

3 4

WP8 - C. Pastore, 23.01.2014 6

A A

Module assembly procedure Chips alignment respect to the FPC5

7

6

WP8 - C. Pastore, 23.01.2014 7

A

A

Module assembly procedure Gluing procedure to fix the FPC on the chips

Adhesive mask8 9

10 11

WP8 - C. Pastore, 23.01.2014 8

Module assembly procedure

Modules without carbon plate

Accuracy of chips x,y position: < 8 um (average)

Front view

Back view

Modules with carbon plate

Front view

Back view

Chip: 15 mm x 30 mm300 um thick

Carbon plate K13D2U 75gsm (≈ 40µ) Thickness 0,11-0,12mm

Weight 1,22g

WP8 - C. Pastore, 23.01.2014 9

Module assembly procedure

Modules without carbon plate

Modules with carbon plate

FPC FPC 150 µm thickChip 50 µm thickCarbon plate 120 µm thickGlue: Ecobond 40 µm thick

Does the module plate help for handling and testing? WP8 - C. Pastore, 23.01.2014 10

Collaboration with FBK/ Micro Technologies Lab, Italy and Kirana

FPC- pixel chips Interconnections

Sp Tab Bonding

Dummy FPC stack up

Aluminum 25 µmKapton 50 µm

First test: laser tuned to remove Kapton up to the Al

layerSecond test

Next week Kirana will deliver 10 dummy FPC :

7 for us and 3 for Giacomo

WP8 - C. Pastore, 23.01.2014 11

12

Summary

• The first 2 dummy modules with and without carbon plate were produced. Accuracy of chips x,y position: less than 8 µm (average).

• By the end of the next week we will start the production of 7 dummy modules which will be useful to develop the stave assembly procedure.

• Does the module plate help for handling and testing?

• Next week Kirana will deliver 10 dummy FPC in polyimide (thickness 50 µm) laminated to aluminum foil (thickness 25 µm) : 7 for us and 3 for Giacomo.

WP8 - C. Pastore, 23.01.2014 12

Back slide

Crown axis distance (i)

Hole axis distance (i)

30,1167 30,1332

30,1131 30,0987

30,1155 30,1314

30,1069 30,1080

30,1079 30,1212

30,1145 30,0887

i i i i i i

L

XY

Nominal Measured

X 210,6 210,6 ± 0,015

Y 30,1 30,1 ± 0,010

i i = 1,…,6 30,1

L 180,6 180,6744

Crown diameter

Hole diameter Axes distance

0,3778 0,2629 0,0085

0,3667 0,2659 0,0226

0,3686 0,2673 0,0082

0,3649 0,2661 0,0242

0,3689 0,2634 0,0254

0,3733 0,2646 0,0414

0,3672 0,2632 0,0132

Height (Y) Length (X)30,1291 210,6066

30,1252 210,6090

30,1311 210,6168

30,1272 210,6010

30,1252 210,6166

30,1271 210,6005

30,1232 210,6089

30,1232 210,6130

30,1173 210,6108

30,1212 210,6091

30,1212 210,6046

30,1252 210,6125

30,1272 210,5962

30,1212 210,5976

30,1291 210,6090

30,1331 210,5967

FPC- pixel chips Interconnections

FOR GIACOMO