status update of ieee p1838 · 2011-10-11 · imec leuven, belgium adam cron working group...
TRANSCRIPT
Erik Jan MarinissenWorking Group Chair
Status Update ofIEEE P1838
IMECLeuven, Belgium
Adam CronWorking Group Vice-Chair
SynopsysHilton Head, SC, USA
3D-TEST Workshop 2011Anaheim, California – September 22+23, 2011
Status Update of IEEE P1838Erik Jan Marinissen, Adam Cron – 3D-TEST Workshop 2011 2
Status Update of IEEE P1838
Presentation Outline
1. History2. Organization3. PAR4. To-the-Point Please5. Today in Your Working Group6. Conclusion
Status Update of IEEE P1838Erik Jan Marinissen, Adam Cron – 3D-TEST Workshop 2011 3
1. History
3D-Test Standardization Study Group
• Active January 2010,initiated by Erik Jan Marinissen (IMEC)
• Charter:inventory need for and timeliness ofstandards in 3D test and DfT
• ~60 members, weekly WebEx conference calls(hosted by Cisco Systems)
• Regular status updates: VTS’10, ETS’10, ITC’10
• Formulated Project Authorization Request P1838:“Standard for Test Access Architecture forThree-Dimensional Stacked Integrated Circuits”– PAR submitted to IEEE-SA NesCom : November 23, 2010– PAR approved : February 2, 2011
Status Update of IEEE P1838Erik Jan Marinissen, Adam Cron – 3D-TEST Workshop 2011 4
1. History
3D-Test Working Group
• Active February 2011, after approval of PAR P1838
• Charter:define standards in 3D test and DfT
• Current project:– P1838: “Standard for Test Access Architecture for
Three-Dimensional Stacked Integrated Circuits”
Status Update of IEEE P1838Erik Jan Marinissen, Adam Cron – 3D-TEST Workshop 2011 5
2. Organization
Embedding in IEEE Organization
• IEEE sponsorsComputer Society sponsorsTTTC sponsorsTTSC sponsorsWG on 3D-Test
•http://www.ieee.org/
http://www.computer.org
http://tab.computer.org/tttc/
http://grouper.ieee.org/groups/ttsg/
Test TechnologyStandards Committee
http://grouper.ieee.org/groups/3Dtest/
http://standards.ieee.org/
IEEE StandardsAssociation
Test Technology Technical Council
Working Groupon 3D Test
• WG Membership− Open to professionals− No dues or fees
• IEEE-SA– Provides facilities
• Web hosting• E-mail reflector facility
– IEEE-SA membershiprequired for ballot
– Will own and publishresulting standard(s)
Status Update of IEEE P1838Erik Jan Marinissen, Adam Cron – 3D-TEST Workshop 2011 6
2. Organization
WG Leadership and Officers
• Chair : Erik Jan Marinissen (IMEC)• Vice-Chair : Adam Cron (Synopsys)• Secretary : Sophocles Metsis (AMD)• Co-Editor : Al Crouch (Asset-Intertech)• Co-Editor : Michael Wahl (University of Siegen)• Web-Masters : Saman Adham (TSMC), Erik Jan Marinissen (IMEC)
• WebEx Hosts : Ted Eaton; Bill Eklow, Hongshin Jun (Cisco Systems)
Status Update of IEEE P1838Erik Jan Marinissen, Adam Cron – 3D-TEST Workshop 2011 7
2. Organization
Working Group Members*
Saman AdhamSandeep BhatiaSudipta BhawmikCraig BullockTapan ChakrabortyVincent Chalendard Sangeetha ChellappaJi-Jan ChenChen-An ChenVivek ChickermaneCJ ClarkZoe ConroyEric CormackAdam CronAl CrouchTed EatonHeiko EhrenbergBill Eklow
Paul EmmettSandeep K. GoelMichelangelo GrossoRuifeng GuoMichael HigginsChun-Lung HsuHongshin JunStephane LecomtePrasad MantriArie MargulisErik Jan MarinissenCedric MayorTeresa McLaurinSankaran MenonHarrison MilesSophocles MetsisSuriyaprakash NatarajanJay Orbon
Ken ParkerJohn PotterBill PriceJoseph ReynickMike RicchettiBen RogelArani SinhaRoger SowadaCraig StephanBrian TurmellManuel UmlaufMichael WahlMin-Jer WangLee Whetsel
+ 34× “followers”
* status 2011/08/27
Status Update of IEEE P1838Erik Jan Marinissen, Adam Cron – 3D-TEST Workshop 2011 8
2. Organization
3D-Test WG Participating Companies
Status Update of IEEE P1838Erik Jan Marinissen, Adam Cron – 3D-TEST Workshop 2011 9
2. Organization
Operation
• Communication– Public websites:
• 3D-Test WG : http://grouper.ieee.org/groups/3Dtest/• Project P1838: http://grouper.ieee.org/groups/1838/
– Private web site and e-mail reflector for internal communication
• Meetings– Weekly conference calls: Thursdays 5-6pm Europe / 8-9am Pacific
Kindly hosted by Cisco Systems– Ad-hoc face-to-face meetings (e.g., here at ITC’11)
Status Update of IEEE P1838Erik Jan Marinissen, Adam Cron – 3D-TEST Workshop 2011 10
3. PAR
Project Authorization Request (PAR)
• Title”Standard for Test Access Architecture forThree-Dimensional Stacked Integrated Circuits”
• Dates− PAR request date : November 23, 2010− PAR approval date : February 2, 2011− PAR expiration date : December 31, 2015
− Expected initial sponsor ballot : 09/2012− Projected completion date : 02/2013
• PAR On-Line:http://grouper.ieee.org/groups/1838/PAR1838-110202-public.pdf
Status Update of IEEE P1838Erik Jan Marinissen, Adam Cron – 3D-TEST Workshop 2011 11
3. PAR
PAR Summary – 1/2
• Focus– Generic test access to and between dies in a multi-die stack– Prime focus on stacks with TSV-based interconnects
• Test– Pre-bond, mid-bond (partial stack), post-bond (complete stack)– Intra-die circuitry and inter-die interconnects– Pre-packaging, post-packaging, board-level situations
• Die-Centric Standard– Die-level features comprise a stack-level architecture
– Compliance to standard pertains to a die (not to the stack)– Enables interoperability between Die and Stack Maker(s)
– Standard does not address stack/product-level challenges/solutions– E.g. Boundary Scan for board-level interconnect testing– However, standard should not prohibit application thereof
Status Update of IEEE P1838Erik Jan Marinissen, Adam Cron – 3D-TEST Workshop 2011 12
3. PAR
PAR Summary – 2/2
• Scan-Based– Based on and works with digital scan-based test access
• Leverage Existing DfT Wherever Applicable/Appropriate– Test access ports (such as IEEE 1149.x)– On-die design-for-test (such as IEEE 1500)– On-die design-for-debug (such as IEEE P1687)
• Two Standardized Components1. 3D Test Wrapper hardware per die2. Description + description language
• Standard does not mandate– Specific defect or fault models– Test generation methods– Die-internal design-for-test
Status Update of IEEE P1838Erik Jan Marinissen, Adam Cron – 3D-TEST Workshop 2011 13
4. To-The-Point Please
A Glimpse Of What We Are Thinking Of...
Pre-Bond• Die test
Mid/Post-Bond• Die (re-)test• Interconnect test
Post-Packaging• Die (re-)test• Interconnect (re-)test
Status Update of IEEE P1838Erik Jan Marinissen, Adam Cron – 3D-TEST Workshop 2011 14
4. To-The-Point Please
An IEEE 1149.1-Based Die Wrapper...
Status Update of IEEE P1838Erik Jan Marinissen, Adam Cron – 3D-TEST Workshop 2011 15
4. To-The-Point Please
... Or An IEEE 1500-Based Die Wrapper
Status Update of IEEE P1838Erik Jan Marinissen, Adam Cron – 3D-TEST Workshop 2011 16
5. Today in Your Working Group
Ongoing Discussions
• After looking at several solution proposals,the Working Group took a step back for Requirements Engineering
• Some of the ongoing discussions– Die stacks under consideration:
single-tower, multi-tower,multi-tower with roof or overhang,passive interposer base, passive interposer intermediate layers,TSV-interconnects only, wire-bonds (connecting non-adjacent tiers)
– Digital only, or also support for non-digital dies/tests– Die wrapper based on IEEE 1149.1, IEEE 1500, or both
Status Update of IEEE P1838Erik Jan Marinissen, Adam Cron – 3D-TEST Workshop 2011 17
6. Conclusion
Conclusion
• 3D-SIC: hot topic w.r.t. processing, design, and now also test
• 3D-Test Standardization Study Group yielded approved PAR
• 3D-Test Working Group working on Project P1838− Die Wrapper− Generic test access to and between dies in a multi-die stack
• More information− Websites: http://grouper.ieee.org/groups/3Dtest/
http://grouper.ieee.org/groups/1838/− WG Chair : Erik Jan Marinissen – [email protected]− WG Vice-Chair : Adam Cron – [email protected]