stgb10h60df, stgf10h60df, stgp10h60df ce(sat) · 1 electrical ratings table 1. absolute maximum...

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1 2 3 TO-220 TAB 1 2 3 TO-220FP 1 3 TAB D PAK 2 C(2, TAB) E(3) NG1E3C2T G(1) Features High speed switching Tight parameters distribution Safe paralleling Low thermal resistance Short-circuit rated Ultrafast soft recovery antiparallel diode Applications Motor control UPS PFC Description These devices are IGBTs developed using an advanced proprietary trench gate field- stop structure. These devices are part of the H series of IGBTs, which represents an optimum compromise between conduction and switching losses to maximize the efficiency of high switching frequency converters. Furthermore, a slightly positive V CE(sat) temperature coefficient and very tight parameter distribution result in safer paralleling operation. Product status link STGB10H60DF STGF10H60DF STGP10H60DF Trench gate field-stop 600 V, 10 A high speed H series IGBT STGB10H60DF, STGF10H60DF, STGP10H60DF Datasheet DS9880 - Rev 4 - March 2020 For further information contact your local STMicroelectronics sales office. www.st.com

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  • 1 23

    TO-220

    TAB

    12

    3

    TO-220FP

    13

    TAB

    D PAK2

    C(2, TAB)

    E(3)NG1E3C2T

    G(1)

    Features• High speed switching• Tight parameters distribution• Safe paralleling• Low thermal resistance• Short-circuit rated• Ultrafast soft recovery antiparallel diode

    Applications• Motor control• UPS• PFC

    DescriptionThese devices are IGBTs developed using an advanced proprietary trench gate field-stop structure. These devices are part of the H series of IGBTs, which represents anoptimum compromise between conduction and switching losses to maximize theefficiency of high switching frequency converters. Furthermore, a slightly positiveVCE(sat) temperature coefficient and very tight parameter distribution result in saferparalleling operation.

    Product status link

    STGB10H60DF

    STGF10H60DF

    STGP10H60DF

    Trench gate field-stop 600 V, 10 A high speed H series IGBT

    STGB10H60DF, STGF10H60DF, STGP10H60DF

    Datasheet

    DS9880 - Rev 4 - March 2020For further information contact your local STMicroelectronics sales office.

    www.st.com

    https://www.st.com/en/applications/industrial-motor-control.html?ecmp=tt9471_gl_link_feb2019&rt=ds&id=DS9880https://www.st.com/en/applications/power-supplies-and-converters/uninterruptable-power-supplies-ups.html?ecmp=tt9471_gl_link_feb2019&rt=ds&id=DS9880https://www.st.com/en/applications/power-supplies-and-converters/pfc-converter-single-phase-input.html?ecmp=tt9471_gl_link_feb2019&rt=ds&id=DS9880https://www.st.com/en/product/stgb10h60df?ecmp=tt9470_gl_link_feb2019&rt=ds&id=DS9880https://www.st.com/en/product/stgf10h60df?ecmp=tt9470_gl_link_feb2019&rt=ds&id=DS9880https://www.st.com/en/product/stgp10h60df?ecmp=tt9470_gl_link_feb2019&rt=ds&id=DS9880http://www.st.com

  • 1 Electrical ratings

    Table 1. Absolute maximum ratings

    Symbol ParameterValue

    UnitD2PAK, TO-220 TO-220FP

    VCES Collector-emitter voltage (VGE = 0 V) 600 V

    ICContinuous collector current at TC = 25 °C 20 20 (1)

    AContinuous collector current at TC = 100 °C 10 10 (1)

    ICP (2) Pulsed collector current 40 40 A

    VGEGate-emitter voltage ±20

    VTransient gate-emitter voltage ±30

    IFContinuous forward current TC = 25 °C 20 20 (1)

    AContinuous forward current at TC = 100 °C 10 10 (1)

    IFP (2) Pulsed forward current 40 40 A

    VISOInsulation withstand voltage (RMS) from all three leads toexternal heat sink (t = 1 s; Tc = 25 °C)

    2.5 kV

    PTOT Total power dissipation at TC = 25 °C 115 30 W

    TSTG Storage temperature range -55 to 150°C

    TJ Operating junction temperature range -55 to 175

    1. Limited by maximum junction temperature.2. Pulse width limited by maximum junction temperature.

    Table 2. Thermal data

    Symbol ParameterValue

    UnitD2PAK, TO-220 TO-220FP

    RthJC Thermal resistance junction-case IGBT 1.3 5 °C/W

    RthJC Thermal resistance junction-case diode 2.78 6.25 °C/W

    RthJA Thermal resistance junction-ambient 62.5 62.5 °C/W

    STGB10H60DF, STGF10H60DF, STGP10H60DFElectrical ratings

    DS9880 - Rev 4 page 2/24

  • 2 Electrical characteristics

    TC = 25 °C unless otherwise specified.

    Table 3. Static

    Symbol Parameter Test conditions Min. Typ. Max. Unit

    V(BR)CESCollector-emitterbreakdown voltage VGE = 0 V, IC = 2 mA 600 V

    VCE(sat)Collector-emittersaturation voltage

    VGE = 15 V, IC= 10 A 1.50 1.95

    VVGE = 15 V, IC = 10 A, TJ = 125 °C 1.65

    VGE = 15 V, IC = 10 A, TJ = 175 °C 1.70

    VGE(th)Gate thresholdvoltage VCE = VGE, IC = 250 μA 5 6 7 V

    ICESCollector cut-offcurrent VCE = 600 V, VGE = 0 V 25 μA

    IGESGate-emitter leakagecurrent VGE = ±20 V, VCE = 0 V ±250 nA

    Table 4. Dynamic

    Symbol Parameter Test conditions Min. Typ. Max. Unit

    Cies Input capacitance

    VCE = 25 V, f = 1 MHz, VGE = 0 V -

    1300

    - pFCoes Output capacitance 60

    CresReverse transfercapacitance 30

    Qg Total gate chargeVCC = 480 V, IC = 10 A, VGE = 0 to 15 V

    (see Figure 33. Gate charge test circuit)-

    57

    - nCQge Gate-emitter charge 8

    Qgc Gate-collector charge 27

    STGB10H60DF, STGF10H60DF, STGP10H60DFElectrical characteristics

    DS9880 - Rev 4 page 3/24

  • Table 5. Switching characteristics (inductive load)

    Symbol Parameter Test conditions Min. Typ. Max. Unit

    td(on) Turn-on delay time VCE = 400 V, IC = 10 A, RG = 10 Ω,

    VGE = 15 V

    (see Figure 32. Test circuit for inductive loadswitching and Figure 34. Switchingwaveform)

    -

    19.5

    -

    nstr Current rise time 6.9

    (di/dt)on Turn-on current slope 1170 A/μs

    td(on) Turn-on delay time VCE = 400 V, IC = 10 A, RG = 10 Ω,

    VGE = 15 V, TJ = 175 °C

    (see Figure 32. Test circuit for inductive loadswitching and Figure 34. Switchingwaveform)

    20ns

    tr Current rise time 6.8

    (di/dt)on Turn-on current slope 1176 A/μs

    tr(Voff) Off voltage rise time VCE = 400 V, IC = 10 A, RG = 10 Ω,

    VGE = 15 V

    (see Figure 32. Test circuit for inductive loadswitching and Figure 34. Switchingwaveform)

    -

    19.6

    - ns

    td(off) Turn-off delay time 103

    tf Current fall time 73

    tr(Voff) Off voltage rise time VCE = 400 V, IC = 10 A, RG = 10 Ω,

    VGE = 15 V, TJ = 175 °C

    (see Figure 32. Test circuit for inductive loadswitching and Figure 34. Switchingwaveform)

    28

    td(off) Turn-off delay time 104

    tf Current fall time 110

    tscShort-circuit withstandtime VCC ≤ 360 V, VGE = 15 V, RG = 10 Ω 3 5 - μs

    Table 6. Switching energy (inductive load)

    Symbol Parameter Test conditions Min. Typ. Max. Unit

    Eon (1)Turn-on switchingenergy VCE = 400 V, IC = 10 A,

    RG = 10 Ω, VGE = 15 V(see Figure 32. Test circuit for inductive loadswitching)

    -

    83

    - μJ

    Eoff (2)Turn-off switchingenergy 140

    Ets Total switching energy 223

    Eon(1)Turn-on switchingenergy

    VCE = 400 V, IC = 10 A,

    RG = 10 Ω, VGE = 15 V

    TJ = 175 °C(see Figure 32. Test circuit for inductive loadswitching)

    148

    Eoff (2)Turn-off switchingenergy 214

    Ets Total switching energy 362

    1. Including the reverse recovery of the diode.2. Including the tail of the collector current.

    STGB10H60DF, STGF10H60DF, STGP10H60DFElectrical characteristics

    DS9880 - Rev 4 page 4/24

  • Table 7. Collector-emitter diode

    Symbol Parameter Test conditions Min. Typ. Max. Unit

    VF Forward on-voltageIF = 10 A

    -1.7 2.2

    VIF = 10 A, TJ = 175 °C 1.3

    trrReverse recoverytime

    Vr = 60 V; IF = 10 A, diF/dt = 100 A / μs

    (see Figure 35. Diode reverse recoverywaveform)

    -

    107 ns

    QrrReverse recoverycharge 120 nC

    IrrmReverse recoverycurrent 2.24 A

    trrReverse recoverytime Vr = 60 V; IF = 10 A, diF/dt = 100 A / μs

    TJ = 175 °C

    (see Figure 35. Diode reverse recoverywaveform)

    161 ns

    QrrReverse recoverycharge 362 nC

    IrrmReverse recoverycurrent 4.5 A

    STGB10H60DF, STGF10H60DF, STGP10H60DFElectrical characteristics

    DS9880 - Rev 4 page 5/24

  • 2.1 Electrical characteristics (curves)

    Figure 1. Power dissipation vs case temperature forD2PAK and TO-220

    Ptot

    60

    40

    20

    00 25 TC(°C)

    (W)

    100

    80

    50 75

    100

    175125 150

    120

    140

    GIPD281020131339FSR

    VGE≥ 15V, T J≤ 175 °C

    Figure 2. Collector current vs case temperature for D2PAKand TO-220

    IC

    10

    5

    0 0 25 TC(°C)

    (A)

    100

    15

    50 75

    20

    175

    VGE ≥ 15V, TJ ≤ 175 °C

    125 150

    GIPD230420191104MT

    Figure 3. Power dissipation vs case temperature forTO-220FP

    GIPD281020131351FSR

    Figure 4. Collector current vs case temperature forTO-220FP

    IC

    10

    5

    00 TC(°C)

    (A)

    100

    15

    50

    VGE ≥ 15V, TJ ≤ 175 °C

    150

    GIPD281020131401FSR

    Figure 5. Output characteristics (TJ = 25°C)

    IC

    10

    00 1 VCE(V)

    (A)

    4

    20

    2 3

    VGE=15V

    30

    9V

    11V

    GIPD281020131405FSR

    Figure 6. Output characteristics (TJ = 175°C)

    IC

    10

    00 1 VCE(V)

    (A)

    4

    20

    2 3

    VGE=15V

    30

    9V

    11V

    7V

    13V

    GIPD281020131411FSR

    STGB10H60DF, STGF10H60DF, STGP10H60DFElectrical characteristics (curves)

    DS9880 - Rev 4 page 6/24

  • Figure 7. VCE(sat) vs junction temperature

    VCE(sa t)

    1.8

    1.6

    1.4

    1.2

    -50 TJ(°C

    GE= 15V IC= 20A

    IC= 10A

    IC

    GIPD281020131418FSR

    Figure 8. VCE(sat) vs collector current

    GADG130620191022VCEC

    2.2

    2.0

    1.8

    1.6

    1.4

    1.2

    1.0

    0.80 4 8 12 16 20

    VCE(sat) (V)

    IC (A)

    VGE = 15 VTJ = 175°C

    TJ = -40°C

    TJ = 25°C

    Figure 9. Collector current vs switching frequency forD2PAK and TO-220

    GADG130620191139CCS

    40

    30

    20

    10

    010 0 10 1 10 2

    IC (A)

    f (kHz)

    Rectangular current shape(duty cycle = 0.5, VCC = 400 V,RG = 4.7Ω, VGE = 0/15 V , TJ = 175 °C)

    TC = 80°C

    TC = 100°C

    Figure 10. Collector current vs switching frequency forTO-220FP

    GADG130620191023CCS

    16

    12

    8

    4

    010 0 10 1 10 2

    IC (A)

    f (kHz)

    Rectangular current shape(duty cycle = 0.5, VCC = 400 V,RG = 4.7Ω, VGE = 0/15 V , TJ = 175 °C)

    TC = 80°C

    TC = 100°C

    Figure 11. Forward bias safe operating area for D2PAKand TO-220

    IC

    10

    1

    0.11 VCE(V)

    (A)

    Tj≤175 °C, Tc= 25°C

    single pulseVGE = 15 V

    10

    10 µs

    100 µs

    1 ms

    100

    GIPD281020131452FSR

    Figure 12. Forward bias safe operating area for TO-220FP

    IC

    10

    1

    0.11

    Tj≤175 °C, Tc= 25°C

    single pulseVGE = 15 V

    VCE(V)

    (A)

    10

    10 µs

    100 µs

    1 ms

    100

    GIPD281020131505FSR

    STGB10H60DF, STGF10H60DF, STGP10H60DFElectrical characteristics (curves)

    DS9880 - Rev 4 page 7/24

  • Figure 13. Transfer characteristics

    IC

    15

    10

    5

    06 7 VGE(V)

    (A)

    10

    20

    8 9

    25

    TJ=175°C

    30

    35

    TJ=-40°C

    TJ=25°C

    VCE=5V

    GIPD281020131513FSR

    Figure 14. Diode VF vs forward current

    GADG130620191024DVF

    2.0

    1.6

    1.2

    0.8

    0.40 4 8 12 16 20

    VF (V)

    IF (A)

    TJ = 40 °C

    TJ = 25 °C

    TJ = 175 °C

    Figure 15. Normalized VGE(th) vs junction temperature

    VGE(th)

    1.1

    1.0

    0.6-50 TJ(°C)

    (norm)

    0 50 100 150

    IC= 1mAVCE= VGE

    0.7

    0.8

    0.9

    GIPD281020131600FSR

    Figure 16. Normalized V(BR)CES vs junction temperature

    GADG130620191025NVBR

    1.10

    1.05

    1.00

    0.95

    0.90-50 0 50 100 150

    V(BR)CES (Norm.)

    TJ (°C)

    IC = 2mA

    Figure 17. Capacitance variation

    GADG130620191026CVR

    10 3

    10 2

    10 1

    10 0 10 -1 10 0 10 1 10 2

    C (pF)

    VCE (V)

    CIES

    COESCRES

    f = 1MHZ

    Figure 18. Gate charge vs gate-emitter voltage

    VGE

    8

    0Qg(nC)

    (V)

    0 20

    IC= 10AIGE= 1mAVCC= 480V

    4

    40

    12

    60

    16

    GIPD281020131606FSR

    STGB10H60DF, STGF10H60DF, STGP10H60DFElectrical characteristics (curves)

    DS9880 - Rev 4 page 8/24

  • Figure 19. Switching energy vs collector current

    GADG130620191055SLC

    360

    300

    240

    180

    120

    60

    00 4 8 12 16 20

    E (µJ)

    IC (A)

    VCC = 400V, VGE = 15V,RG = 10Ω, TJ = 175°C Eoff

    Eon

    Figure 20. Switching energy vs gate resistance

    E

    100RG(Ω)

    (µJ)

    0 10 20

    140

    180

    220

    30 40

    260

    EOFF

    VCC = 400 V, VGE = 15 V, IC = 10 A, TJ = 175 °C

    EON

    GIPD281020131618FSR

    Figure 21. Switching energy vs temperature

    E

    0TJ(°C)

    (µJ)

    -50 0 50

    50

    100

    150

    100 150

    EOFF

    VCC= 400V, VGE= 15V, RG= 10Ω, IC= 10A

    EON

    200

    GIPD281020131623FSR

    Figure 22. Switching energy vs collector-emitter voltage

    E

    0VCE(V)

    (µJ)

    200 300 400

    50

    100

    150

    EOFF

    TJ= 175°C, VGE= 15V, RG= 10Ω, IC= 10A

    200

    250

    EON

    250 350 450

    GIPD281020131630FSR

    Figure 23. Short circuit time and current vs VGE

    tsc

    10

    8

    6

    10 VGE(V)12

    (µs)

    11

    VCC= 360V, RG= 10W

    4

    tSC

    ISC

    13

    12

    ISC(A)

    100

    50

    150

    200

    14

    14

    GIPD281020131634FSR

    Figure 24. Switching times vs collector current

    t

    IC(A)

    (ns)

    0 4 810

    12

    tf

    TJ= 175°C, VGE= 15V, RG= 10Ω, VCC= 400V

    tdoff100

    tr

    tdon

    16

    GIPD281020131641FSR

    STGB10H60DF, STGF10H60DF, STGP10H60DFElectrical characteristics (curves)

    DS9880 - Rev 4 page 9/24

  • Figure 25. Switching times vs gate resistance

    t

    1RG(Ω)

    (ns)

    0 10 20

    10

    30

    tf

    TJ= 175°C, VGE= 15V, IC= 10A, VCC= 400V

    40

    100

    tdon

    tdoff

    tr

    GIPD281020131655FSR

    Figure 26. Reverse recovery current vs diode currentslope

    Irm

    0di/dt(A/µs)

    (A)

    0 200 400

    8

    600

    IF = 10A, Vr = 400V

    800

    12

    =175°C

    =25°C

    16

    4

    TJ

    TJ

    20

    GIPD281020131713FSR

    Figure 27. Reverse recovery time vs diode current slope

    trr

    0di/dt(A/µs)

    (µs)

    0 200 400

    80

    600

    IF = 10A, Vr = 400V

    800

    120

    =175°C

    =25°C

    160

    40

    TJ

    TJ

    GIPD281020131720FSR

    Figure 28. Reverse recovery charge vs diode currentslope

    Qrr

    0di/dt(A/µs)

    (nC)

    0 200 400

    300

    600

    IF = 10A, Vr = 400V

    800

    400

    =175°C

    =25°C200

    TJ

    TJ

    100

    500

    GIPD281020131724FSR

    Figure 29. Reverse recovery energy vs diode current slope

    Err

    20di/dt(A/µs)

    (µJ)

    0 200 400

    80

    600

    IF = 10A, Vr = 400V

    800

    120=175°C

    =25°C

    40

    140

    TJ

    TJ60

    100

    GIPD281020131728FSR

    STGB10H60DF, STGF10H60DF, STGP10H60DFElectrical characteristics (curves)

    DS9880 - Rev 4 page 10/24

  • Figure 30. Thermal impedance for IGBT

    10 10 10 10 10 tp(s)-5 -4 -3-2 -1

    10-2

    10-1

    K

    0.2

    0.05

    0.02

    0.01

    0.1

    Zth=k Rthj-cδ=tp/t

    tp

    t

    Single pulse

    δ=0.5

    ZthTO2T_B

    Figure 31. Thermal impedance for diode

    STGB10H60DF, STGF10H60DF, STGP10H60DFElectrical characteristics (curves)

    DS9880 - Rev 4 page 11/24

  • 3 Test circuits

    Figure 32. Test circuit for inductive load switching

    A AC

    E

    G

    B

    RG+

    -

    G

    C 3.3µF1000

    µF

    L=100 µH

    VCC

    E

    D.U.T

    B

    AM01504v1

    Figure 33. Gate charge test circuit

    AM01505v1

    k

    k

    k

    k

    k

    k

    Figure 34. Switching waveform

    AM01506v1

    90%

    10%

    90%

    10%

    VG

    VCE

    IC td(on)ton

    tr(Ion)

    td(off)

    toff

    tf

    tr(Voff)tcross

    90%

    10%

    Figure 35. Diode reverse recovery waveform

    25

    STGB10H60DF, STGF10H60DF, STGP10H60DFTest circuits

    DS9880 - Rev 4 page 12/24

  • 4 Package information

    In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,depending on their level of environmental compliance. ECOPACK specifications, grade definitions and productstatus are available at: www.st.com. ECOPACK is an ST trademark.

    4.1 D²PAK (TO-263) type A2 package information

    Figure 36. D²PAK (TO-263) type A2 package outline

    0079457_A2_26

    STGB10H60DF, STGF10H60DF, STGP10H60DFPackage information

    DS9880 - Rev 4 page 13/24

    https://www.st.com/ecopackhttp://www.st.com

  • Table 8. D²PAK (TO-263) type A2 package mechanical data

    Dim.mm

    Min. Typ. Max.

    A 4.40 4.60

    A1 0.03 0.23

    b 0.70 0.93

    b2 1.14 1.70

    c 0.45 0.60

    c2 1.23 1.36

    D 8.95 9.35

    D1 7.50 7.75 8.00

    D2 1.10 1.30 1.50

    E 10.00 10.40

    E1 8.70 8.90 9.10

    E2 7.30 7.50 7.70

    e 2.54

    e1 4.88 5.28

    H 15.00 15.85

    J1 2.49 2.69

    L 2.29 2.79

    L1 1.27 1.40

    L2 1.30 1.75

    R 0.40

    V2 0° 8°

    Figure 37. D²PAK (TO-263) recommended footprint (dimensions are in mm)

    Footprint_26

    STGB10H60DF, STGF10H60DF, STGP10H60DFD²PAK (TO-263) type A2 package information

    DS9880 - Rev 4 page 14/24

  • 4.2 D²PAK packing information

    Figure 38. D²PAK tape outline

    STGB10H60DF, STGF10H60DF, STGP10H60DFD²PAK packing information

    DS9880 - Rev 4 page 15/24

  • Figure 39. D²PAK reel outline

    A

    D

    B

    Full radius

    Tape slot in core for tape start

    2.5mm min.width

    G measured at hub

    C

    N

    40mm min. access hole at slot location

    T

    AM06038v1

    Table 9. D²PAK tape and reel mechanical data

    Tape Reel

    Dim.mm

    Dim.mm

    Min. Max. Min. Max.

    A0 10.5 10.7 A 330

    B0 15.7 15.9 B 1.5

    D 1.5 1.6 C 12.8 13.2

    D1 1.59 1.61 D 20.2

    E 1.65 1.85 G 24.4 26.4

    F 11.4 11.6 N 100

    K0 4.8 5.0 T 30.4

    P0 3.9 4.1

    P1 11.9 12.1 Base quantity 1000

    P2 1.9 2.1 Bulk quantity 1000

    R 50

    T 0.25 0.35

    W 23.7 24.3

    STGB10H60DF, STGF10H60DF, STGP10H60DFD²PAK packing information

    DS9880 - Rev 4 page 16/24

  • 4.3 TO-220FP package information

    Figure 40. TO-220FP package outline

    7012510_Rev_13_B

    STGB10H60DF, STGF10H60DF, STGP10H60DFTO-220FP package information

    DS9880 - Rev 4 page 17/24

  • Table 10. TO-220FP package mechanical data

    Dim.mm

    Min. Typ. Max.

    A 4.40 4.60

    B 2.50 2.70

    D 2.50 2.75

    E 0.45 0.70

    F 0.75 1.00

    F1 1.15 1.70

    F2 1.15 1.70

    G 4.95 5.20

    G1 2.40 2.70

    H 10.00 10.40

    L2 16.00

    L3 28.60 30.60

    L4 9.80 10.60

    L5 2.90 3.60

    L6 15.90 16.40

    L7 9.00 9.30

    Dia 3.00 3.20

    STGB10H60DF, STGF10H60DF, STGP10H60DFTO-220FP package information

    DS9880 - Rev 4 page 18/24

  • 4.4 TO-220 type A package information

    Figure 41. TO-220 type A package outline

    0015988_typeA_Rev_22

    STGB10H60DF, STGF10H60DF, STGP10H60DFTO-220 type A package information

    DS9880 - Rev 4 page 19/24

  • Table 11. TO-220 type A package mechanical data

    Dim.mm

    Min. Typ. Max.

    A 4.40 4.60

    b 0.61 0.88

    b1 1.14 1.55

    c 0.48 0.70

    D 15.25 15.75

    D1 1.27

    E 10.00 10.40

    e 2.40 2.70

    e1 4.95 5.15

    F 1.23 1.32

    H1 6.20 6.60

    J1 2.40 2.72

    L 13.00 14.00

    L1 3.50 3.93

    L20 16.40

    L30 28.90

    øP 3.75 3.85

    Q 2.65 2.95

    STGB10H60DF, STGF10H60DF, STGP10H60DFTO-220 type A package information

    DS9880 - Rev 4 page 20/24

  • 5 Ordering information

    Table 12. Order codes

    Order code Marking Package Packing

    STGB10H60DF GB10H60DF D2PAK Tape and reel

    STGF10H60DF GF10H60DF TO-220FPTube

    STGP10H60DF GP10H60DF TO-220

    STGB10H60DF, STGF10H60DF, STGP10H60DFOrdering information

    DS9880 - Rev 4 page 21/24

  • Revision history

    Table 13. Document revision history

    Date Version Changes

    12-Aug-2013 1 Initial release.

    31-Oct-2013 2

    Document status promoted from preliminary to production data.

    Inserted Section 2.1: Electrical characteristics (curves).

    Minor text changes.

    20-Jun-2019 3

    Updated title, applications and description in cover page.

    Added Section 5 Ordering information.

    Updated Section 2.1 Electrical characteristics (curves).

    Minor text changes.

    05-Mar-2020 4Updated Table 3. Static and Table 4. Dynamic.

    Minor text changes.

    STGB10H60DF, STGF10H60DF, STGP10H60DF

    DS9880 - Rev 4 page 22/24

  • Contents

    1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2

    2 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

    2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

    3 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

    4 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

    4.1 D²PAK (TO-263) type A2 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

    4.2 D²PAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

    4.3 TO-220FP package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

    4.4 TO-220 type A package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

    5 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21

    Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

    STGB10H60DF, STGF10H60DF, STGP10H60DFContents

    DS9880 - Rev 4 page 23/24

  • IMPORTANT NOTICE – PLEASE READ CAREFULLY

    STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to STproducts and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. STproducts are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.

    Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design ofPurchasers’ products.

    No license, express or implied, to any intellectual property right is granted by ST herein.

    Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.

    ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or servicenames are the property of their respective owners.

    Information in this document supersedes and replaces information previously supplied in any prior versions of this document.

    © 2020 STMicroelectronics – All rights reserved

    STGB10H60DF, STGF10H60DF, STGP10H60DF

    DS9880 - Rev 4 page 24/24

    http://www.st.com/trademarks

    1 Electrical ratings2 Electrical characteristics2.1 Electrical characteristics (curves)

    3 Test circuits4 Package information4.1 D²PAK (TO-263) type A2 package information4.2 D²PAK packing information4.3 TO-220FP package information4.4 TO-220 type A package information

    5 Ordering informationRevision history