Summary

of the

FEE Session

Christian J. Schmidt

JINR, Dubna, Oct. 17th 2008

                                                                                    

12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008

Activities

n-XYTER front end boards and hybrid technologies

Status of the n-XYTER engineering run

CBM-Dedicated Chip Developments

Preliminary observations on radiation hardness of the

chip technology (UMC 0.180)

Status of chip development work

CBM-XYTER Family Planning

                                                                                    

12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008

"Simple" FEB for the n-XYTER Starter Kit

Allow development of the DAQ chain

Allow the readout of various detector prototypes

The September beam time has shown the whole signal chain operative!

Silicon Strip / GEM Gas Detectors --- n-XYTER --- SysCore DAQ System

After several iterations, technology seems to get straight:

FEB-Rev D will be distributable at the end of the year!

                                                                                    

12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008

Other Versions for other applications in production

2 chips on n-XYTER-GEM (FoPi GEM-TPC)

4 chips on n-XYTER-Quattro (CBM-STS test)

Rafal Lalik (AGH Krakow/GSI) has realized FEBs for several applications

                                                                                    

12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008

Future hybrid technology, very promising options

Bump bonding may be the technology for our STS hybrid assembly!

Hybrid assembly with Si-based circuit board very dense assemblies

cooling from both sides possible

devices may be stacked

One dummy module populated with 52 chipsNo failures !Christian Kreidl, ZITI Heidelberg

                                                                                    

12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008

Activities in Heidelberg: n-XYTER engineering run preparation

Engineering Run of the n-XYTER will supply chips for detector prototyping activities! Hans K.Soltveit, Physik. Inst.

Heidelberg

Some modifications included:

Annoying temp. coefficient addressed

Rearrangement of bond-pads for better interconnect

Two different versions of dynamic range in one submission: 120 000 e and 1000 000 e.

Extensive simulations realized (corners analysis)

Schematics review in November 2008

Layout review in January, submission to follow

                                                                                    

12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008

TEMPERATURE SENSITIVITYTEMPERATURE SENSITIVITY

FA

ST

-SH

AP

ER

OU

TP

UT

DC

-LE

VE

L

TEMP(°C)

Old TEMP.COEFF. ~29 mV/°C

Config for negative input signals NEW: TEMP.COEFF. ~0.7 mV/°C

Config. for positive input signals NEW: TEMP.COEFF. ~0.5 mV/°C

Hans K.Soltveit, Physik. Inst. Heidelberg

                                                                                    

12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008

Radiation Hardness Tests on UMC 0.180µ

ZITI current mode logic (Ivan Peric)

single DEPFET pixel

chip with manyDEPFET pixels

                                                                                    

12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008

Irradiation Campaign up to 7.5 MRad

                                                                                    

12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008

Very promising observations: Damage does anneal!

Very promising observations!

Very similar results observed by Sven Loechner GSI on test transistors

Valuable support from Valeriy Shunkov (Inst. for System Studies) towards modelling effects

                                                                                    

12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008

Building blocks for the CBM-XYTER at ZITI Heidelberg

Concentrated ADC expertise at ZITI David Muthers ADC resurrected

(Kaiserslautern)

New Current Mode ADC (Ivan Peric, ZITI) Design study very promising

9 bit, 25 MHz, 4.5 mW (0.36 pJ/conv.)

Simple Serial Data Driver Prestudy towards a serial chip data-

interface

CMOS standard cells yield 1.9 GHz

DEPFET Pixel with 2 ADC

Size x: 180µmSize y: 110µm

                                                                                    

12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008

Second Front End Test Chip Submitted at ZITI Heidelberg

26 channel charge sensitive amplifier

scaling: multiple parallel amplifier cells to meet overall noise specs

study various pulse injection circuits

study current mode logic based discriminator

Work by Tim Armbruster, ZiTi Heidelberg

Chips expected Jan. 2009

More Building blocks for the CBM-XYTER

                                                                                    

12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008

NIHAM Bucharest: TRD Front-End Test Chip close to Submission

Particular emphasis on high counting rates TRD needs peaking times adapted to high

counting rate TRD

analogue baseline restauration

particularly fast return to baseline from overload

choice of peaking time (20ns, 40ns)

fast peak detector

Vasile Catanescu, NIHAM Bucharest

                                                                                    

12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008

The Dedicated CBM-XYTER, Family Planning

STS-XYTER minimize power

dc-leakage compensation

compact, high channel density

MIP sensitivity in Si

dense mounting

4 to 5 bit res.

TRD-XYTER high resolution needs

(8 to 9 bit)

lower channel density

next neighbor forced trigger logic?

ion tail cancellation facilities

baseline restauration

lower occupancy

MUCH needs are somewhere in

between.Preferably adopt

these specs within one of the two!

MUCH needs are somewhere in

between.Preferably adopt

these specs within one of the two!

R. Szczygiel, P. GrybosAGH KrakowRealization in TOT architecure

P. Fischer ZITI Uni-HeidelbergArchitecture/specs not yet settled

Common process 0.180nm UMC, on-chip infrastructure, rad. hard libraries but different architectural specifics

                                                                                    

12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008

Discussion on CBM TRD electronics needs started

Mihai Petrovici, NIHAM Bucharest

                                                                                    

12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008

Discussion on CBM MUCH electronics needs started

V. Nikulin agreed to help out with thoughts on MUCH electronics needs!

                                                                                    

12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008

Towards Specs for TRD and MUCH-XYTER

Workshop planned early Dec. 2008 Get electronics- and detector-experts together

Work-out the architectural needs and specifications for both detectors

Principle questions to be answered:

Can we subsum MUCH and TRD electronics needs within one chip?

Specifications for the TRD-XYTER chip

Chip-System design may start from there

                                                                                    

12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008