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COMPANY CONFIDENTIAL P AGE 1 March 2016 SYSTEM IN PACKAGE 2016 2026 …. TECHNOLOGY IS PROGRESSING

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Page 1: SYSTEM IN PACKAGE - Insight SiP · PDF fileMatthew Humphries - Project Funded by DARPA under Hybrid Insect MEMS program . COMPANY CONFIDENTIAL PAGE 14 – March 2016 MEDICAL Smart

COMPANY CONFIDENTIAL PAGE 1 – March 2016

SYSTEM IN PACKAGE 2016 – 2026 ….

TECHNOLOGY IS PROGRESSING

Page 2: SYSTEM IN PACKAGE - Insight SiP · PDF fileMatthew Humphries - Project Funded by DARPA under Hybrid Insect MEMS program . COMPANY CONFIDENTIAL PAGE 14 – March 2016 MEDICAL Smart

COMPANY CONFIDENTIAL PAGE 2 – March 2016

• Today Wafer Grinding can be Below 40 micrometers

NEW PROCESSES BECOME AVAILABLE

WAFER GRINDING

Human hair thickness : 40 to 100 micrometers

Smart label - 250µm thick flexible substrate CMST Gent - Belgium

Page 3: SYSTEM IN PACKAGE - Insight SiP · PDF fileMatthew Humphries - Project Funded by DARPA under Hybrid Insect MEMS program . COMPANY CONFIDENTIAL PAGE 14 – March 2016 MEDICAL Smart

COMPANY CONFIDENTIAL PAGE 3 – March 2016

NEW PROCESSES BECOME AVAILABLE

THRU-SILICON-VIA - TSV

Samsung’s 4 Gb D-die

DDR4 SDRAM

Page 4: SYSTEM IN PACKAGE - Insight SiP · PDF fileMatthew Humphries - Project Funded by DARPA under Hybrid Insect MEMS program . COMPANY CONFIDENTIAL PAGE 14 – March 2016 MEDICAL Smart

COMPANY CONFIDENTIAL PAGE 4 – March 2016

NEW PROCESSES BECOME AVAILABLE

EMBEDDED DIES

Die in a cavity Max Clemons in Electronic Design 2014

Chip-in-polymer technology enables

thin packages to be embedded directly

into the laminate framework of a PCB. Max Clemons in Electronic Design 2014

Page 5: SYSTEM IN PACKAGE - Insight SiP · PDF fileMatthew Humphries - Project Funded by DARPA under Hybrid Insect MEMS program . COMPANY CONFIDENTIAL PAGE 14 – March 2016 MEDICAL Smart

COMPANY CONFIDENTIAL PAGE 5 – March 2016

NEW PROCESSES BECOME AVAILABLE

EMBEDDED DIES

Samsung Galaxy S4 features a Wi-Fi

module board with components

embedded in a cavity.

TDK SESUB-PAN-D14580.

Page 6: SYSTEM IN PACKAGE - Insight SiP · PDF fileMatthew Humphries - Project Funded by DARPA under Hybrid Insect MEMS program . COMPANY CONFIDENTIAL PAGE 14 – March 2016 MEDICAL Smart

COMPANY CONFIDENTIAL PAGE 6 – March 2016

NEW PROCESSES BECOME AVAILABLE

CONNECTIVITY WITHIN CLOTHES

Page 7: SYSTEM IN PACKAGE - Insight SiP · PDF fileMatthew Humphries - Project Funded by DARPA under Hybrid Insect MEMS program . COMPANY CONFIDENTIAL PAGE 14 – March 2016 MEDICAL Smart

COMPANY CONFIDENTIAL PAGE 7 – March 2016

NEW PROCESSES BECOME AVAILABLE

CONNECTIVITY WITHIN CLOTHES

Textile headband for facial EMG

DataGloveTM VRLOGIC

with flex sensors

Page 8: SYSTEM IN PACKAGE - Insight SiP · PDF fileMatthew Humphries - Project Funded by DARPA under Hybrid Insect MEMS program . COMPANY CONFIDENTIAL PAGE 14 – March 2016 MEDICAL Smart

COMPANY CONFIDENTIAL PAGE 8 – March 2016

NEW PROCESSES BECOME AVAILABLE

ENERGY HARVESTING

Vibration energy harvesting Design University of Michigan

Kinetic energy harvesting

Using piezoelectrics or MEMS Design Columbia University

Page 9: SYSTEM IN PACKAGE - Insight SiP · PDF fileMatthew Humphries - Project Funded by DARPA under Hybrid Insect MEMS program . COMPANY CONFIDENTIAL PAGE 14 – March 2016 MEDICAL Smart

COMPANY CONFIDENTIAL PAGE 9 – March 2016

INTERNET OF THINGS REVOLUTION

Number of Connected Objects Expected to reach 50 Billion by 2020

Page 10: SYSTEM IN PACKAGE - Insight SiP · PDF fileMatthew Humphries - Project Funded by DARPA under Hybrid Insect MEMS program . COMPANY CONFIDENTIAL PAGE 14 – March 2016 MEDICAL Smart

COMPANY CONFIDENTIAL PAGE 10 – March 2016

WEALTHNESS, FITNESS, SPORT, TOYS, …

Page 11: SYSTEM IN PACKAGE - Insight SiP · PDF fileMatthew Humphries - Project Funded by DARPA under Hybrid Insect MEMS program . COMPANY CONFIDENTIAL PAGE 14 – March 2016 MEDICAL Smart

COMPANY CONFIDENTIAL PAGE 11 – March 2016

SHOPPING – SOCIAL MEDIA

Beacons Deployment

Page 12: SYSTEM IN PACKAGE - Insight SiP · PDF fileMatthew Humphries - Project Funded by DARPA under Hybrid Insect MEMS program . COMPANY CONFIDENTIAL PAGE 14 – March 2016 MEDICAL Smart

COMPANY CONFIDENTIAL PAGE 12 – March 2016

AUTOMOTIVE

Page 13: SYSTEM IN PACKAGE - Insight SiP · PDF fileMatthew Humphries - Project Funded by DARPA under Hybrid Insect MEMS program . COMPANY CONFIDENTIAL PAGE 14 – March 2016 MEDICAL Smart

COMPANY CONFIDENTIAL PAGE 13 – March 2016

DRONES & MILITARY

Concept of 1 microwatt energy harvested to

power cyborg beetle’s mind-control circuitry

Matthew Humphries - Project Funded by DARPA under

Hybrid Insect MEMS program

Page 14: SYSTEM IN PACKAGE - Insight SiP · PDF fileMatthew Humphries - Project Funded by DARPA under Hybrid Insect MEMS program . COMPANY CONFIDENTIAL PAGE 14 – March 2016 MEDICAL Smart

COMPANY CONFIDENTIAL PAGE 14 – March 2016

MEDICAL

Smart Temperature Patch™ Stemp Inc. CA

Page 15: SYSTEM IN PACKAGE - Insight SiP · PDF fileMatthew Humphries - Project Funded by DARPA under Hybrid Insect MEMS program . COMPANY CONFIDENTIAL PAGE 14 – March 2016 MEDICAL Smart

COMPANY CONFIDENTIAL PAGE 15 – March 2016

MEDICAL

Batteryless Electrostimulator David A. B. Miller, Stanford University, Stanford, CA

Page 16: SYSTEM IN PACKAGE - Insight SiP · PDF fileMatthew Humphries - Project Funded by DARPA under Hybrid Insect MEMS program . COMPANY CONFIDENTIAL PAGE 14 – March 2016 MEDICAL Smart

COMPANY CONFIDENTIAL PAGE 16 – March 2016

MEDICAL

Audio-dental Implant Concept Florian Schumacher – Wearable Technology

Page 17: SYSTEM IN PACKAGE - Insight SiP · PDF fileMatthew Humphries - Project Funded by DARPA under Hybrid Insect MEMS program . COMPANY CONFIDENTIAL PAGE 14 – March 2016 MEDICAL Smart

COMPANY CONFIDENTIAL PAGE 17 – March 2016

MEDICAL

Wireless Controlled

Pacemaker Concept Florian Schumacher – Wearable Technology

Boston Scientific's

pacemaker

MDDIonline – February 22,

2016

Page 18: SYSTEM IN PACKAGE - Insight SiP · PDF fileMatthew Humphries - Project Funded by DARPA under Hybrid Insect MEMS program . COMPANY CONFIDENTIAL PAGE 14 – March 2016 MEDICAL Smart

COMPANY CONFIDENTIAL PAGE 19 – March 2016

OTHERS

Page 19: SYSTEM IN PACKAGE - Insight SiP · PDF fileMatthew Humphries - Project Funded by DARPA under Hybrid Insect MEMS program . COMPANY CONFIDENTIAL PAGE 14 – March 2016 MEDICAL Smart

PAGE 20 – March 2016

THANK YOU !