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The top documents tagged [chip interconnection]

Copyright © 2006 MIPS Technologies, Inc and First Silicon Solutions. All rights reserved. At the core of the user experience ® Getting System On Silicon
Copyright © 2006 MIPS Technologies, Inc and First Silicon Solutions. All rights reserved. At the core of the user experience ® Getting System On Silicon
214 views
PyCoRAM: Yet Another Implementation of CoRAM Memory Architecture for Modern FPGA-based Computing (CARL2013 co-located with MICRO-46)
PyCoRAM: Yet Another Implementation of CoRAM Memory Architecture for Modern FPGA-based Computing (CARL2013 co-located with MICRO-46)
1.034 views
A Low Stress Bond Pad Design for Low Temperature Solder Interconnections on Through Silicon Vias (TSVs)
A Low Stress Bond Pad Design for Low Temperature Solder Interconnections on Through Silicon Vias (TSVs)
166 views
Communication Centric Design
Communication Centric Design
360 views
Application Behavior-Aware Flow Control in Network-on-Chip
Application Behavior-Aware Flow Control in Network-on-Chip
47 views
|Introduction |Background |TAP (TLP-Aware Cache Management Policy) Core sampling Cache block lifetime normalization TAP-UCP and TAP-RRIP |Evaluation Methodology
|Introduction |Background |TAP (TLP-Aware Cache Management Policy) Core sampling Cache block lifetime normalization TAP-UCP and TAP-RRIP |Evaluation Methodology
226 views
1 H Friedman Fully Asynchronous framework for GALS network on chip 2010 Fully Asynchronous framework for GALS network on chip Friedman Harel Seminar in
1 H Friedman Fully Asynchronous framework for GALS network on chip 2010 Fully Asynchronous framework for GALS network on chip Friedman Harel Seminar in
222 views
An Efficient Shared Memory Based Virtual Communication System for Embedded SMP Cluster Wenxuan Yin Institute of Computing Technology Chinese Academy of
An Efficient Shared Memory Based Virtual Communication System for Embedded SMP Cluster Wenxuan Yin Institute of Computing Technology Chinese Academy of
223 views
Multilayer thin film technology for the STS electronic high density interconnection E. Atkin Moscow Engineering Physics Institute (State University) –
Multilayer thin film technology for the STS electronic high density interconnection E. Atkin Moscow Engineering Physics Institute (State University) –
214 views
Uzi Vishkin Electrical and Computer Engineering Dept
Uzi Vishkin Electrical and Computer Engineering Dept
42 views
Ultra-Low Power On-Chip Differential Interconnects Using High-Resolution Comparator Hao Liu and Chung-Kuan Cheng University of California, San Diego 10/22/2012
Ultra-Low Power On-Chip Differential Interconnects Using High-Resolution Comparator Hao Liu and Chung-Kuan Cheng University of California, San Diego 10/22/2012
217 views
Communication-Centric Design
Communication-Centric Design
43 views