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The top documents tagged [d stacking]

3D ICs for Mobile Computing GSA/ITAC April 2011 Paul Kempf
3D ICs for Mobile Computing GSA/ITAC April 2011 Paul Kempf
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NC STATE UNIVERSITY The State of ZettaRAM Center for Embedded Systems Research (CESR) Department of Electrical and Computer Engineering North Carolina
NC STATE UNIVERSITY The State of ZettaRAM Center for Embedded Systems Research (CESR) Department of Electrical and Computer Engineering North Carolina
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Combining the strengths of UMIST and The Victoria University of Manchester Matthew Livesey, Hemanth John Jose and Yongping Men COMP60611 – Future of large-scale
Combining the strengths of UMIST and The Victoria University of Manchester Matthew Livesey, Hemanth John Jose and Yongping Men COMP60611 – Future of large-scale
229 views
Dual-Gate TFT for 3-D Flash Memory
Dual-Gate TFT for 3-D Flash Memory
1.076 views
Moinuddin K. Qureshi ECE, Georgia Tech Gabriel H. Loh, AMD Fundamental Latency Trade-offs in Architecting DRAM Caches MICRO 2012
Moinuddin K. Qureshi ECE, Georgia Tech Gabriel H. Loh, AMD Fundamental Latency Trade-offs in Architecting DRAM Caches MICRO 2012
215 views
Three-Dimensional Microelectronics Integration: Design, Analysis and Characterization Zeynep Dilli Ph.D. Program Dissertation Proposal
Three-Dimensional Microelectronics Integration: Design, Analysis and Characterization Zeynep Dilli Ph.D. Program Dissertation Proposal
217 views
Welcome to PROFIT Pacific-Rim Outlook Forum on IC Technology 1
Welcome to PROFIT Pacific-Rim Outlook Forum on IC Technology 1
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UNDERSTANDING THE ROLE OF THE POWER DELIVERY NETWORK IN 3-D STACKED MEMORY DEVICES Manjunath Shevgoor, Niladrish Chatterjee, Rajeev Balasubramonian, Al
UNDERSTANDING THE ROLE OF THE POWER DELIVERY NETWORK IN 3-D STACKED MEMORY DEVICES Manjunath Shevgoor, Niladrish Chatterjee, Rajeev Balasubramonian, Al
237 views
L i a b l eh kC o m p u t i n gL a b o r a t o r y On Effective TSV Repair for 3D- Stacked ICs Li Jiang †, Qiang Xu † and Bill Eklow § † CUhk REliable
L i a b l eh kC o m p u t i n gL a b o r a t o r y On Effective TSV Repair for 3D- Stacked ICs Li Jiang †, Qiang Xu † and Bill Eklow § † CUhk REliable
215 views
PathFinding Methodology for Interposer and 3D Die Stacking
PathFinding Methodology for Interposer and 3D Die Stacking
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Designing a Fast and Reliable Memory with Memristor Technology Manjunath Shevgoor, Rajeev Balasubramonian, Naveen Muralimanohar University of Utah, HP
Designing a Fast and Reliable Memory with Memristor Technology Manjunath Shevgoor, Rajeev Balasubramonian, Naveen Muralimanohar University of Utah, HP
217 views
1 Lecture: Memory, Coherence Protocols Topics: wrap-up of memory systems, multi-thread programming models, snooping-based protocols
1 Lecture: Memory, Coherence Protocols Topics: wrap-up of memory systems, multi-thread programming models, snooping-based protocols
220 views