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1SLOU461–November 2016Submit Documentation Feedback

Copyright © 2016, Texas Instruments Incorporated

TAS2557 Evaluation Module

User's GuideSLOU461–November 2016


This user’s guide describes the characteristics, operation, and use of the TAS2557 Evaluation Module(EVM). A complete schematic diagram, printed-circuit board layouts, and bill of materials are included inthis document.

NOTE: Recipient agrees to not knowingly export or re-export, directly or indirectly, any product ortechnical data (as defined by the U.S., EU, and other Export Administration Regulations)including software, or any controlled product restricted by other applicable nationalregulations, received from Disclosing party under this Agreement, or any direct product ofsuch technology, to any destination to which such export or re-export is restricted orprohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S.Department of Commerce and other competent Government authorities to the extentrequired by those laws. This provision shall survive termination or expiration of thisAgreement. According to our best knowledge of the state and end-use of this product ortechnology, and in compliance with the export control regulations of dual-use goods in forcein the origin and exporting countries, this technology is classified as follows:• US ECCN: 3E991• EU ECCN: EAR99

This technology may require export or re-export license for shipping it in compliance with theapplicable regulations of certain countries.

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2 SLOU461–November 2016Submit Documentation Feedback



Contents1 Description.................................................................................................................... 32 Specifications................................................................................................................. 33 Software....................................................................................................................... 34 Mono Setup................................................................................................................... 45 Dual Mono .................................................................................................................... 76 Digital Audio Interfaces ..................................................................................................... 87 Hardware Documentation ................................................................................................. 10

List of Figures

1 TAS2557 EVM Mono Setup ................................................................................................ 42 Setting Default Playback Device........................................................................................... 53 3-Pin Jumper ................................................................................................................. 64 TAS2557EVM Dual Mono Setup .......................................................................................... 75 USB Audio Selection ........................................................................................................ 96 Direct (AP/PSIA) Audio Selection ........................................................................................ 107 TAS2557EVM USB Block ................................................................................................. 118 TAS2557EVM Input Muxes and Translators ........................................................................... 129 TAS2557EVM Output Muxes and Translators ......................................................................... 1310 TAS2557EVM Channel 1 Schematic .................................................................................... 1411 TAS2557EVM Channel 2 Schematic .................................................................................... 1512 TAS2557EVM Power Supply ............................................................................................. 1613 Top Overlay ................................................................................................................. 1714 Top Solder Mask ........................................................................................................... 1715 Top Layer ................................................................................................................... 1816 Copper Layer 2 ............................................................................................................. 1817 Copper Layer 3 ............................................................................................................. 1918 Copper Layer 4 ............................................................................................................. 1919 Copper Layer 5 ............................................................................................................. 2020 Bottom Layer................................................................................................................ 2021 Bottom Solder Mask ....................................................................................................... 2122 Drill Drawing ................................................................................................................ 2123 Board Dimensions.......................................................................................................... 22

List of Tables

1 EVM Specifications .......................................................................................................... 32 Default Jumper Settings .................................................................................................... 53 TAS2557EVM Bill of Materials ........................................................................................... 23

TrademarksPurePath is a trademark of Texas Instruments.Microsoft, Windows are registered trademarks of Microsoft Corporation.All other trademarks are the property of their respective owners.

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www.ti.com Description




1 DescriptionThe TAS2557 device is an amplifier with integrated boost converter and programmable digital signalprocessor. The output amplifier is a Class-D device that can be driven to higher output levels with the on-chip Class-H boost. The on-chip voltage and current sense, together with TI’s Smart Amp algorithm,protect the speaker against overheating and excessive excursion.

The TAS2557 EVM supports evaluation and development with the TAS2557 device through the followinginterfaces:

• USB interface– TAS2557 control through PurePath™ Console 3 (PPC3) GUI, USB-HID– USB-class audio device, compatible with Microsoft® Windows® 7+

• Digital audio AP and PSIA interface through 100-mil headers• TI Learning Board 2 for speaker characterization• SPI interface for TAS2557 control• I2C interface for TAS2557 control

2 Specifications

Table 1. EVM Specifications

SOURCE REQUIREMENTAmplifier Power Supply (VBAT) 2.9 to 5.5 V

Analog Supply (AVDD) 1.65 to 1.95 VDigital Supply (DVDD) 1.65 to 1.95 V

EVM Power Supply 5.0 VIO Power Supply (IOVDD) 1.62 to 3.6 V

Output Power 5.7 WUSB, USB Class-Audio Micro-USB B

3 SoftwareThe TAS2557 EVM requires PurePath Console 3 with the TAS2557 plug-in.

NOTE: The TAS2557 device needs to be configured using this software. It will not function withoutthis configuration.

Please refer to the Smart Amp Tuning Guide which can be found in the project folder atMySecureSoftware for detailed information about this software and how to configure the TAS2559 devicefor Smart Amp Speaker Protection.

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https://www.ti.com/securesoftware/docs/securesoftwarehome.tsp

Mono Setup www.ti.com




4 Mono Setup1. Install PurePath Console 3 with the TAS2557EVM plug-in.2. Connect a speaker to J8 on the EVM.3. Attach a 5.0 V/ 2.5 A power supply to connector J29 (inner = 5V, outer = GND).4. Connect the EVM to a Windows 7+ PC with a micro-USB cable (J23). It will enumerate as a USB-

AudioEVM device (sound card).

Figure 1. TAS2557 EVM Mono Setup

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5. Verify that the EVM is the default playback device by opening the sound dialog from the WindowsControl Panel as shown in Figure 2.

Figure 2. Setting Default Playback Device

6. Check if the sampling rate matches the Windows setting by opening the advanced tab in the propertiesmenu. The EVM firmware enumerates as a USB-AudioEVM that supports 48 kHz sampling rate bydefault. This setting must match the EVM at 2-channel, 16-bit, 48000 Hz (CD Quality).

Table 2. Default Jumper Settings

JUMPER SETTING DESCRIPTION CHANNELJ2 Insert VBAT 5VJ3 Remove DOUT 1J4 Insert DVDD 1.8V 1J6 Insert AVDD 1.8V 1J7 Insert IOVDD Setting from J30 1J9 Remove SCL / SS 1J10 Remove SDA / MOSI 1J11 Insert Address Select1 1J12 Insert Address Select0 1J13 Insert SPI Select 1J14 Remove IRQ 1J15 Pin 1-2 SDIN = on-board 1J16 Pin 1-2 WCLK = on-board 1J17 Pin 1-2 BCLK = on-board 1J18 Pin 1-2 MCLK = on-board 1J19 Pin 1-2 SCL = on-board 1J20 Pin 1-2 SDA = on-board 1J22 Remove Reset 1

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1 2 3

Mono Setup www.ti.com




Table 2. Default Jumper Settings (continued)JUMPER SETTING DESCRIPTION CHANNEL

J24 Insert WP = 1, write protect EEPROMJ25 Remove DOUT 2

J26 Insert P1 = 0, select USB for on-board digitalaudio

J27 Insert P0 = 0, select USB for on-board digitalaudio

J30 Pin 1-2 IOVDD Select = 3.3 V 2J32 Pin 1-2 SDIN = on-board 2J33 Pin 1-2 WCLK = on-board 2J34 Pin 1-2 BCLK = on-board 2J35 Pin 1-2 MCLK = on-board 2J36 Pin 1-2 SCL = on-board 2J37 Pin 1-2 SDA = on-board 2J38 Insert DVDD 1.8V 2J39 Insert AVDD 1.8V 2J41 Insert IOVDD Setting from J30 2J42 Remove Reset 2J43 Remove SCL / SS 2J45 Remove SDA / MOSI 2J46 Insert Address Select1 2J47 Remove Address Select0 2J48 Insert SPI Select 2J49 Remove IRQ 2J51 Insert ICC =1, inter-chip communicationJ52 Insert ICC =1, inter-chip communicationJ53 Insert ICC =1, inter-chip communication

Figure 3. 3-Pin Jumper

Please refer to Figure 5 for default jumper settings.

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5 Dual MonoDual Mono mode is a stereo configuration where each device independently processes the data stream ithas been assigned for Smart Amp tuning. Each device is capable of processing left, right, or bothchannels.1. Install PurePath Console 3 with the TAS2557EVM plug-in.2. Connect speakers to both J44 and J8 on the EVM.3. Attach a 5.0 V/ 5.0 A power supply to connector J29 (inner = 5V, outer = GND).4. Connect the EVM to a Windows 7+ PC with a micro-USB cable (J23). It will enumerate as a USB-

AudioEVM device (sound card).

Figure 4. TAS2557EVM Dual Mono Setup

5. Select Dual Mono configuration in PPC3 and proceed with characterization per the PPC3 User’s guide.6. Play the test tone as shown in Figure 2.

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Digital Audio Interfaces www.ti.com




6 Digital Audio InterfacesThe various digital audio interfaces on the TAS2557EVM can be selected through hardware settings andsoftware settings. Several headers close to the TAS2557 device allow access to the following digital audiosignals:• J3: Data Out (DOUT) from the TAS2557 (For example, current and voltage sense data.)• J15: Data In (DIN) to the TAS2557• J16: Word Clock or Frame Sync (WCLK)• J17: Bit Clock (BCLK)• J18: Master Clock (MCLK) (This is optional if TAS2557 PLL is not used.)

J3 has two pins:• Digital data (for example, I and V sense data) from the TAS2557 device• Ground

J15, J16, J17, and J18 have three pins:• Digital audio signals from the EVM• Digital audio signals to the TAS2557• Ground

A jumper inserted in position 1-2 connects the TAS2557 to the digital audio signals from the board (forexample, USB or Learning Board 2). Replacing the jumper with a connector from an external sourceconnects the TAS2557 to the external source (for example, AP or PSIA).

The selection between the two on-board digital audio sources (USB or Learning Board 2) is controlled by:

(a) Hardware: J26,J27• J26 = inserted, J27 = inserted; Selects USB• J26 = inserted, J27 = removed; Selects Learning Board 2

(b) Software: The PPC3 GUI controls the digital audio routing during speaker characterization. This haspriority over the hardware settings from point a.

The secondary digital audio interface from the TAS2557 device is directly available through J5.

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www.ti.com Digital Audio Interfaces




6.1 Digital Audio Interface Selection

6.1.1 USBThe TAS2557EVM contains a microcontroller (TAS1020B) that acts as a USB HID and USB-class audiointerface. To select USB, insert both J26 and J27 and insert J15, J16, J17, and J18 in the 1-2 position.This is shown in Figure 5.

Figure 5. USB Audio Selection

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6.1.2 Direct (AP/PSIA)Remove the jumpers from J15, J16, J17 and J18 for Channel 1 (or J32, J33, J34, and J35 for Channel 2)and connect the external digital audio source (for example AP or PSIA) to pin 2 of each head. Pin 3provides a convenient ground connection. This is shown in Figure 6.

Figure 6. Direct (AP/PSIA) Audio Selection

7 Hardware Documentation

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+3.3V

10.0kR17

10.0kR18

27.4

R2727.4

R26

1.50kR25

47pFC46

47pFC45

Q115.0k

R20

3.09k R23

100pFC47

1000pF C48

GND GND

GND

GND

+3.3V

GND

SCL-USBSDA-USB

+3.3V

+3.3V +3.3V

100k

R29

GND

S1

+3.3V

USB RESET

MRESET

+3.3V

+5V-USB

PUR

DPDM

0.1µF16V

C49

SDIN-USB

FB1

FB2

GND

GND

4.99k

R16

GND

+3.3V

TP12

SCL

TP13

SDA

SCL

SDA

I2C2.00kR9

DNPDNP 2.00k

R10

DNPDNP

SCL-USBSDA-USB

IOVDD

MCLK-USB

I2S-USB49.9R19

49.9R2149.9R2249.9R24

SDIN-USB

CSYNCCSCLK

CDATO

MCLK01

10.0kR15

J24

WP

NC1

NC2

A23

VSS4

SDA5

SCL6

WP7

VCC8

U2

24LC256-I/MS

VBUS1

D-2

D+3

ID4

GND5

67

89

J23USB-IN

6MHz

VCC4

E/D1

GND2

OUT3

Y1

SDA_B1

GND2

VCCA3

SDA_A4

SCL_A5

OE6

VCCB7

SCL_B8

U3

TCA9406DCUR

GND

USB_I2CENFROM LB2 CONN

+3.3V

USB_I2CEN IOVDD

IOVDD IOVDD

SCL-USB

SDA-USB

I2C-USB

0

R41

MCLK-USB1A

1

GND2

2A3

2Y4

VCC5

1Y6

U15

SN74LVC2G34DRLR

GND

+3.3V

1A1

GND2

2A3

2Y4

VCC5

1Y6

U16

SN74LVC2G34DRLR

1A1

GND2

2A3

2Y4

VCC5

1Y6

U17

SN74LVC2G34DRLR

1A1

GND2

2A3

2Y4

VCC5

1Y6

U18

SN74LVC2G34DRLR

MCLKIN-LB2

BCLKIN-LB2

LRCLKIN-LB2

SDIN0-LB2

I2S

LEARNING BOARD2

LRCLK-USB

BCLK-USB

SDOUT-USB

SDOUT-USB

BCLK-USB

LRCLK-USB

MCLKIN-LB2

SDIN0-LB2

BCLKIN-LB2

LRCLKIN-LB2

MRESET

PLLFILO1

AVDD2

MCLKI3

DVSS4

PUR5

DP6

DM7

DVDD8

MRESET9

TEST10

EXTEN11

RSTO12

P3-013

P3-114

P3-2/XINT15

DVSS16

P3-317

P3-418

P3-519

NC20

DVDD21

NC22

P1-023

P1-124

P1-225

P1-326

P1-427

DVSS28

P1-529

P1-630

P1-731

CSCHNE32

DVDD33

CSYNC35

CDATI36

CSCLK37

CDATO38

MCLKO139

MCLKO240

RESET41

VREN42

SDA43

SCL44

AVSS45

XTALO46

XTALI47

PLLFILI48

CRESET34

U4

TAS1020BPFBR

GND

GND

BlueD1USB LOCK 360

R28

+3.3V

GND

+3.3V

0.1µF16V

C350.1µF16V

C360.1µF16V

C370.1µF16V

C380.1µF16V

C390.1µF16V

C430.1µF16V

C330.1µF16V

C340.1µF16V

C400.1µF16V

C410.1µF16V

C42

IOVDD

0.1µF16V

C44

GND

0.1µF16V

C590.1µF16V

C560.1µF16V

C570.1µF16V

C580.1µF16V

C60

DECOUPLING

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7.1 TAS2557EVM SchematicsFigure 7 through Figure 12 show the schematics for the TAS2557 EVM.

Figure 7. TAS2557EVM USB Block

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GND

+5.0V

SCL-USBSDA-USB

GND

GND

GND

IOVDD

10.0kR38

0R330R320R310R30

MCLK

SCLK

LRCLK

SDIN

GND

MCLKSDINSCLKLRCLK

MCLK-USB

I2S-USBSDOUT-USB

BCLK-USB

LRCLK-USB

MCLK-USB

SDOUT-USB

BCLK-USB

LRCLK-USB

WCLK-from-LB2

SDOUT3-from-LB2

BCLK-from-LB2

SDIN-USB

SDIN-USB

47k

R36

2.2k

R35

GND

47k

R34

2.2k

R37

GNDGND

1 2

3 4

5 6

7 8

9 10

11 12

13 14

15

17

19

21

23

25

27

29

31

16

18

20

22

24

26

28

30

32

33 34

J28

+3.3V

+3.3V

+3.3V

+3.3V

+3.3V

GND

+3.3V

GND

1A1

GND2

2A3

2Y4

VCC5

1Y6

U10

SN74LVC2G34DRLR

GND

+3.3V

A1

B2

Y3

GND4

Y5

A/B6

G7

VCC8

U9

SN74LVC2G157DCTR

RESET1

P02

P13

P24

P35

GND6

P47

P58

P69

P710

INT11

SCL12

SDA13

VCCP14

VCCI15

ADDR16

U8

TCA6408ARSVR

GNDGNDI2C

EXPANDER

DECOUPLING

0.1µFC50

+3.3V

GND

0.1µFC53

+3.3V

GND

0.1µFC54

GND

0.1µFC51

+3.3V

GND

0.1µFC52

GND

IOVDD

DIR115

DIR216

A11

A22

A33

A44

DIR35

DIR46

OE7

GND8

B49

B310

B211

B112

VCCB13

VCCA14

U6

SN74AVC4T774RSVR

10.0kR39

I2S/MIX-MUX

WCLK-DUT

BCLK-DUT

MCLK-DUT

DOUT-MIXMUX

DIN-DUT

I2C-USB

USB_I2CEN

USB_I2CEN

DIR115

DIR216

A11

A22

A33

A44

DIR35

DIR46

OE7

GND8

B49

B310

B211

B112

VCCB13

VCCA14

U11

SN74AVC4T774RSVR

GND GND

DIN1

BCLK1

WCLK1

IOVDD+3.3V

LRCLK-to-LB2BCLK-to-LB2


WCLK-from-LB2

BCLK-from-LB2

MCLK-from-LB2

SDOUT3-from-LB2

IOVDD

J26

P1

J27

P0

S12

1B16

1B25

1A7

2B413

2B312

1B43

1B34

2B110

2B211

2A9

GND8

VCC16

1OE1

2OE15

S014

EP17

U5

SN74CB3Q3253RGYR

S12

1B16

1B25

1A7

2B413

2B312

1B43

1B34

2B110

2B211

2A9

GND8

VCC16

1OE1

2OE15

S014

EP17

U7

SN74CB3Q3253RGYR

10.0kR43

GND

0.1µFC55

GND

IOVDD

1

2

3

4

5

U14 SN74LVC1G125DCKR

+3.3V

GND49.9R45SDOUT3-from-LB2

10.0kR44

+3.3V

MCLKIN-LB2

SDIN0-LB2

BCLKIN-LB2LRCLKIN-LB2


+3.3V

SCL-USB

SDA-USB

I2S

LEARNING

BOARD 2

MCLKIN-LB2

SDIN0-LB2

BCLKIN-LB2

LRCLKIN-LB2

MCLK-from-LB2

SDOUT1-from-LB2SDIN2-to-LB2

SDOUT1-from-LB2SDIN2-to-LB2

SDOUT1-from-LB2

49.9R1LRCLK-MM





Figure 8. TAS2557EVM Input Muxes and Translators

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GND

GND

GND

10kR50

10kR51

0.1µFC61

0.1µFC62

0.1µFC63

0.1µFC64

GND

0.1µFC65

GND

GND

A1

B2

Y3

GND4

Y5

A/B6

G7

VCC8

U19

SN74LVC2G157DCTR

A1

B2

Y3

GND4

Y5

A/B6

G7

VCC8

U21

SN74LVC2G157DCTR

S12

1B16

1B25

1A7

2B413

2B312

1B43

1B34

2B110

2B211

2A9

GND8

VCC16

1OE1

2OE15

S014

EP17

U20

SN74CB3Q3253RGYR

GND GND

GND

+3.3V

+3.3V

+3.3V

+3.3V

+3.3V

SDATA-MM1SDATA-MM2

SCL-USBSDA-USB

LRCLK-MM

SCL-USB

SDA-USBI2C-USB

DOUT-MIXMUX

RESET3

P04

P15

P26

P37

GND8

P49

P510

P611

P712

IRQ13

SCL14

SDA15

VCCP16

VCC1

A02

U22

XRA1206IG16-F10kR52

+3.3V

TO

SCL-USB

GND

SDATA-MM1

SDATA-MM2

DOUT-MIXMUX

DIR115

DIR216

A11

A22

A33

A44

DIR35

DIR46

OE7

GND8

B49

B310

B211

B112

VCCB13

VCCA14

U24

SN74AVC4T774RSVR

GNDGND

IOVDD +3.3V

From LB2 LRCLK-MM

DOUT-DUT2

DOUT-DUT1

From DUTS LB2/USB

0.1µFC93

GND

IOVDD





Figure 9. TAS2557EVM Output Muxes and Translators

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INM1

GND

BCLK2-1

WCLK2-1

DIN2-1

RESET1

10.0kR6

IOVDD

GND

ADR1-1_MISOADR0-1_SCLK

SPI_SELECT1

IRQ_GPIO4-1

RESET1SPI-SEL

ADR

IRQ

IOVDD

ADR1-1_MISO

ADR0-1_SCLK

SPI_SELECT1

IRQ_GPIO4-1

GND

MOSI

SSSCL1_SS

SDA1_MOSI

ASI2

ASI1

10.0kR2

IOVDD

10.0kR3

IOVDD

10.0kR4

IOVDD

10.0kR5

IOVDD

GND

DOUT2-1

1 2

3 4

5 6

7 8

J5

PSIA

1 2 3

J15

1 2 3

J16

1 2 3

J17

1 2 3

J18

1 2 3

J19

1 2 3

J20

ICC-GPI3

ICC-GPIO10ICC-GPIO9

BCLK2-1

WCLK2-1

DIN2-1

DOUT2-1

GND

MCLK1

BCLK1

WCLK1

DIN1

DOUT-DUT1

SCL

SDAI2C

I2S

TP6

GND

GND

TP7

GND

GND

LB2CONN DIN1

BCLK1

WCLK1

J9

J10

J11

J12

J13

J14

SCL1_SSSDA1_MOSI

J3

10.0kR11

10.0kR12

10.0kR13

10.0kR14

ICCICC-GPI3

ICC-GPIO9

ICC-GPIO10

WCLK-DUT

BCLK-DUT

MCLK-DUT

DIN-DUT

J22RESET1

0.1µFC20

GND

DOUT-DUT1MIX

MUX

TO

DUT2DIN1

BCLK1

WCLK1

MCLK1

ASI1MCLK1

BCLK1

WCLK1

DIN1

DOUT-DUT1

0.1µFC9

1µFC10

2.2uH

L1

0.01µFC14

1000pFC21

DNPDNP

GND

GND GND

GND GND

GNDGND

0.1µF16V

C3

1000pFC22

DNPDNP

+5.0V

TP14VBST1

SPEAKEROUT

GND

22µF16V

C4

22µF16V

C5

1.00kR7

DNPDNP

4700pFC23

DNPDNP

GND

1.00kR8

DNPDNP

4700pFC24

DNPDNP

GND

TP8OUTM1DNP

TP9OUTP1DNP

VBAT1

GND

22µF16V

C8

J2

0R42

0R46

DNP DNP

VBOOST1

SPK1+

SPK1-

SW1

ADDR = 0x98(ADR1=L, ADR0=L)

J8

OUT1

SW1VBAT1

0.1µFC11

1µFC12

10µFC13

GND GND GND

+1.8V

J4

DVDD1

0.1µFC16

1µFC17

10µF

C15DNP

DNP

GND GND GND

+1.8V

J6

AVDD1

DVDD1

AVDD11µFC19

0.1µFC18

GND GND

IOVDD

J7

IOVDD1

IOVDD1

DIN1

BCLK1

DOUT-DUT1

MCLK1

WCLK1

TP1MCLK1

TP2BCLK1

TP3WCLK1

TP4DIN1

TP5DOUT1

DIN1

BCLK1

DOUT-DUT1

MCLK1

WCLK1

TP10NC1

TP11NC2

PGND_BA1

PGND_BA2

VBATA3

ICC_GPIO9A4

WCLK1_GPIO2A5

DOUT1_GPIO3A6

SWB1

SWB2

ICC_GPIO10B3

ICC_GPI3B4

DIN1_GPI1B5

BCLK1_GPIO1B6

VBOOSTC1

VBOOSTC2

INPC3

DGNDC4

DIN2_GPIO8C5

DVDDC6

SPK_MD1

VREGD2

INMD3

IOGNDD4

IRQ_GPIO4D5

MCLK_GPI2D6

PGNDE1

VSENSE_PE2

AGNDE3

SDA_MOSIE4

WCLK2_GPIO6E5

DOUT2_GPIO7E6

SPK_PF1

VSENSE_MF2

SCL_SSZF3

AVDDF4

ADR0_SCLKF5

BCLK2_GPIO5F6

NC2G1

NC1G2

ADR1_MISOG3

SPI_SELECTG4

RESETG5

IOVDDG6

U1

TAS2557YZR

0.1µFC1

0.1µFC2

INP1





Figure 10. TAS2557EVM Channel 1 Schematic

http://www.ti.com


GND GND

GND

VBOOST2

DIN1-2

BCLK1-2

DOUT-DUT2

MCLK1-2

WCLK1-2

SPEAKEROUTJ44

OUT21000pFC82

DNPDNP

GND GND

1000pFC83

DNPDNP

1.00kR61

DNPDNP

4700pFC85

DNPDNP

GND

1.00kR62

DNPDNP

4700pFC86

DNPDNP

GND

TP25OUTM2 DNP

TP26OUTP2DNP

DNP DNP

0R54

0R55

SPK2+

SPK2-

2.2uH

L2

SW2

SW2

TP15VBST2

0.1µF16V

C7122µF16V

C72

0.01µFC76

0.1µFC69

1µFC70

GND GND GND

22µF16V

C68

VBAT2TP27

VBAT2

ADDR = 0x9A(ADR1=L, ADRO=H)

SPI-SEL

ADR

IRQ

ADR1-2_MISO

ADR0-2_SCLK

SPI_SELECT2

IRQ_GPIO4-2

GND

MOSI

SSSCL2_SS

SDA2_MOSI

J43

J45

J46

J47

J48

J49

ASI1

GND

MIX

MUX

DIN1-2

BCLK1-2

DOUT-DUT2

MCLK1-2

WCLK1-2

1 2 3

J32

1 2 3

J33

1 2 3

J34

1 2 3

J35

SCL

SDAI2C

J25

I2S

DIN1

BCLK1

WCLK1

MCLK1

DOUT-DUT2

1 2 3

J36

1 2 3

J37

MCLK1-2

BCLK1-2

WCLK1-2

DIN1-2

DOUT-DUT2

TP16MCLK2

TP17BCLK2

TP18WCLK2

TP19DIN2

TP20DOUT2

TP21

GND

GND

TP22

GND

GND

MCLK1-2

BCLK1-2

WCLK1-2

DIN1-2

DOUT-DUT2

BCLK2-2

WCLK2-2

DIN2-2

ASI2

DOUT2-2

ICC-GPI3_2

ICC-GPIO10_2ICC-GPIO9_2

ADR1-2_MISOADR0-2_SCLK

SPI_SELECT2

IRQ_GPIO4-2

SCL2_SSSDA2_MOSI

GND

RESET2

10.0kR60

IOVDD

RESET2

J42RESET2

0.1µFC84

GND

IOVDD

10.0kR56

10.0kR57

10.0kR58

10.0kR59

GND

1 2

3 4

5 6

7 8

J40

PSIA

BCLK2-2

WCLK2-2

DIN2-2

DOUT2-2

10.0kR47

IOVDD

10.0kR48

IOVDD

10.0kR49

IOVDD

10.0kR53

IOVDD

VBAT2

ICC ICC-GPIO9

ICC-GPIO10

ICC-GPI3

J51ICC10

J52ICC9

J53ICC3

ICC-GPI3_2

ICC-GPIO10_2ICC-GPIO9_2 INP2

INM2

GND

GND GND GND

+1.8V

GND GND GND

+1.8V

DVDD2

AVDD2

GND GND

IOVDD

IOVDD2

J38

10µFC75

0.1µFC73

1µFC74

DVDD2

AVDD2

J39

10µF

C77DNP

DNP1µFC79

0.1µFC78

J41

1µFC81

0.1µFC80

IOVDD2

TP23NC1

TP24NC2

PGND_BA1

PGND_BA2

VBATA3

ICC_GPIO9A4

WCLK1_GPIO2A5

DOUT1_GPIO3A6

SWB1

SWB2

ICC_GPIO10B3

ICC_GPI3B4

DIN1_GPI1B5

BCLK1_GPIO1B6

VBOOSTC1

VBOOSTC2

INPC3

DGNDC4

DIN2_GPIO8C5

DVDDC6

SPK_MD1

VREGD2

INMD3

IOGNDD4

IRQ_GPIO4D5

MCLK_GPI2D6

PGNDE1

VSENSE_PE2

AGNDE3

SDA_MOSIE4

WCLK2_GPIO6E5

DOUT2_GPIO7E6

SPK_PF1

VSENSE_MF2

SCL_SSZF3

AVDDF4

ADR0_SCLKF5

BCLK2_GPIO5F6

NC2G1

NC1G2

ADR1_MISOG3

SPI_SELECTG4

RESETG5

IOVDDG6

U23

TAS2557YZR

0.1µFC88

0.1µFC87





Figure 11. TAS2557EVM Channel 2 Schematic

http://www.ti.com


C25

IN1

2

EN3

NR4

OUT5

GND

U13TPS73618DBVR

1µFC7

0.1µFC27

10µFC6

1µFC28

0.1µFC30

0.01µFC29

+3.3V

+1.8V

360

R40

GND

Green

D2

3.3V

GNDGND

GND

GND

GND

GNDGND

GND

GND

GND

+1.8V

+3.3V

IOVDD1

3

2

J29

+5V

+5.0V

IN1

OUT2

3

NR4

EN5

6

GND

U12TPS73733DCQ

1µFC26

GND

+5V

1 2 3

J30

IOVDD SEL

+3.3V

VBAT

VBAT1

0.1µF10V

C32

GND

22µF16V

C31

GND

GND

J31

VBAT1

VBAT2

0.1µF10V

C67

GND

22µF16V

C66

GND

GND

J21

VBAT2

VBAT1 VBAT2Hi Current Shunt

J1

J50

+5V

GND

100µFC90

GND

100µFC92

GND

0.1µFC89

GND

0.1µFC91

GND





Figure 12. TAS2557EVM Power Supply

http://www.ti.com






7.2 TAS2557 EVM Printed Circuit Board Layout

Figure 13. Top Overlay

Figure 14. Top Solder Mask

http://www.ti.com






Figure 15. Top Layer

Figure 16. Copper Layer 2

http://www.ti.com








http://www.ti.com







Figure 20. Bottom Layer

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Figure 21. Bottom Solder Mask

Figure 22. Drill Drawing

http://www.ti.com






Figure 23. Board Dimensions

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7.3 TAS2557EVM Bill of Materials

Table 3. TAS2557EVM Bill of Materials

DESIGNATOR QTY VALUE DESCRIPTION PACKAGE REFERENCE PART NUMBER MANUFACTURER ALTERNATE PARTNUMBER

ALTERNATEMANUFACTURER

!PCB 1 Printed Circuit Board AAP077 Any - -

C1, C2, C9, C11, C16, C18, C20, C27, C30,C32, C50, C51, C52, C53, C54, C55, C67,

C69, C73, C78, C80, C84, C87, C88, C89, C9126 0.1uF CAP, CERM, 0.1uF, 10V, +/-

10%, X7R, 0402 0402 GRM155R71A104KA01D MuRata - -

C3, C71 2 0.1uF CAP, CERM, 0.1 µF, 16 V, +/-10%, X7R, 0402 0402 GRM155R71C104KA8

8D MuRata - -

C4, C5, C8, C31, C66, C68, C72 7 22uF CAP, CERM, 22 µF, 16 V, +/-10%, X5R, 0805 0805 C2012X5R1C226K125

AC TDK - -

C6, C13, C15, C75, C77 5 10uF CAP, CERM, 10 µF, 10 V, +/-20%, X5R, 0603 0603 C1608X5R1A106M08

0AC TDK - -

C7, C10, C12, C17, C19, C26, C28, C70, C74,C79, C81 11 1uF CAP, CERM, 1 µF, 6.3 V, +/-

20%, X5R, 0402 0402 C1005X5R0J105M050BB TDK - -

C14, C25, C29, C76 4 0.01uF CAP, CERM, 0.01uF, 6.3V,+/-10%, X7R, 0402 0402 GRM155R70J103KA0

1D MuRata - -

C21, C22, C48, C82, C83 5 1000pF CAP, CERM, 1000pF, 50V,+/-5%, C0G/NP0, 0402 0402 GRM1555C1H102JA0

1D MuRata - -

C23, C24, C85, C86 4 4700pF CAP, CERM, 4700 pF, 50 V,+/- 10%, X7R, 0402 0402 GRM155R71H472KA0

1D MuRata - -

C33, C34, C35, C36, C37, C38, C39, C40,C41, C42, C43, C44, C49, C56, C57, C58,

C59, C6018 0.1uF CAP, CERM, 0.1uF, 16V, +/-

10%, X7R, 0402 0402 GRM155R71C104KA88D MuRata - -

C45, C46 2 47pF CAP, CERM, 47pF, 25V, +/-5%, C0G/NP0, 0402 0402 GRM1555C1E470JA0

1D MuRata - -

C47 1 100pF CAP, CERM, 100pF, 50V, +/-5%, C0G/NP0, 0402 0402 GRM1555C1H101JA0

1D MuRata - -

C61, C62, C63, C64, C65, C93 6 0.1uF CAP, CERM, 0.1 µF, 25 V, +/-5%, X7R, 0603 0603 06033C104JAT2A AVX - -

C90, C92 2 100uF CAP, AL, 100 µF, 16 V, +/-20%, 0.4 ohm, SMD SMT Radial E EEE-FC1C101P Panasonic - -

D1 1 Blue LED, Blue, SMD Blue LED SMLP12BC7TT86 Rohm - -

D2 1 Green LED, Green, SMD LED_0805 LTST-C171GKT Lite-On - -

FB1, FB2 2 220 ohm 2.2A Ferrite Bead, 220 ohm@ 100MHz, SMD 0603 MPZ1608S221A TDK - -

H1, H2, H3, H4 4 - Machine Screw, Round, #4-40x 1/4, Nylon, Philips panhead Screw NY PMS 440 0025 PH B&F Fastener Supply - -

H5, H6, H7, H8 4 - Standoff, Hex, 0.5"L #4-40Nylon Standoff 1902C Keystone - -

H9 1 -

Custom Cable For ConnectingStereo EVM Boards. IDC34Ribbon Cable With OffsetPins.

IDC34 Custom Cable CBL007 Any Shop - -

H10 1 - Double Sided Tape forApplying Speakers to Boards Double Sided Tape 1/2-5-9495LE 3M (TC) - -

J1 1 - JUMPER TIN SMD 6.85x0.97x2.51 mm S1911-46R Harwin - -

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Table 3. TAS2557EVM Bill of Materials (continued)



J2, J3, J4, J6, J7, J9, J10, J11, J12, J13, J14,J22, J24, J25, J26, J27, J38, J39, J41, J42,J43, J45, J46, J47, J48, J49, J51, J52, J53

29 - Header, 2.54 mm, 2x1, Tin,TH Header, 2.54 mm, 2x1, TH TSW-102-07-T-S Samtec - -

J5, J40 2 - Header, 100mil, 4x2, Tin, TH Header, 4x2, 100mil, Tin PEC04DAAN Sullins Connector Solutions - -

J8, J44 2 - Terminal Block, 5.08mm, 2x1,TH

Terminal Block, 5.08mm,2x1, TH 0395443002 Molex - -

J15, J16, J17, J18, J19, J20, J32, J33, J34,J35, J36, J37 12 1x3 Header, 100mil, 3x1, Gold,

TH PBC03SAAN PBC03SAAN Sullins Connector Solutions - -

J21, J31, J50 3 - Terminal Block, 5 mm, 2x1,Tin, TH

Terminal Block, 5 mm, 2x1,TH 691 101 710 002 Wurth Elektronik eiSos - -

J23 1 -Connector, Receptacle,Micro-USB Type AB, R/A,Bottom Mount SMT

Connector, USB Micro AB DX4R205JJAR1800 JAE Electronics - -

J28 1 - Header (shrouded), 2.54 mm,17x2, Gold, TH

Header (shrouded), 2.54mm, 17x2, TH N2534-6002-RB 3M - -

J29 1 - Power Jack, mini, 2.5mm OD,R/A, TH Jack, 14.5x11x9mm RAPC712X Switchcraft - -

J30 1 - Header, 2.54 mm, 3x1, Tin,TH Header, 2.54 mm, 3x1, TH TSW-103-07-T-S Samtec - -

L1, L2 2 2.2uHInductor, Shielded,Composite, 2.2uH, 3.7A, 0.02ohm, SMD

4x2x4mm XFL4020-222MEB Coilcraft - -

LS1, LS2 2 - Dynamic Speaker 9x16mm SPS0916B-J-01 AAC Technologies - -

Q1 1 0.3V Transistor, NPN, 40V, 0.15A,SOT-23 SOT-23 MMBT2222A Fairchild Semiconductor - -

R1, R19, R21, R22, R24, R45 6 49.9 RES, 49.9 ohm, 1%, 0.063W,0402 0402 CRCW040249R9FKE

D Vishay-Dale - -

R2, R3, R4, R5, R6, R11, R12, R13, R14, R15,R38, R39, R43, R44, R47, R48, R49, R53,

R56, R57, R58, R59, R6023 10.0k RES, 10.0k ohm, 1%,

0.063W, 0402 0402 CRCW040210K0FKED Vishay-Dale - -

R7, R8, R61, R62 4 1.00k RES, 1.00 k, 1%, 0.063 W,0402 0402 CRCW04021K00FKE

D Vishay-Dale - -

R16 1 4.99k RES, 4.99k ohm, 1%,0.063W, 0402 0402 CRCW04024K99FKE

D Vishay-Dale - -

R17, R18 2 10.0k RES, 10.0 k, 1%, 0.063 W,0402 0402 CRCW040210K0FKE

D Vishay-Dale - -


D Vishay-Dale - -


D Vishay-Dale - -


D Vishay-Dale - -

R26, R27 2 27.4 RES, 27.4 ohm, 1%, 0.063W,0402 0402 CRCW040227R4FKE

D Vishay-Dale - -

R28, R40 2 360 RES, 360 ohm, 5%, 0.063W,0402 0402 CRCW0402360RJNE

D Vishay-Dale - -

R29 1 100k RES, 100k ohm, 1%, 0.063W,0402 0402 CRCW0402100KFKE

D Vishay-Dale - -

http://www.ti.com









R30, R31, R32, R33 4 0 RES, 0 ohm, 5%, 0.063W,0402 0402 CRCW04020000Z0ED Vishay-Dale - -

R34, R36 2 47k RES, 47 k, 5%, 0.063 W,0402 0402 CRCW040247K0JNE

D Vishay-Dale - -

R35, R37 2 2.2k RES, 2.2 k, 5%, 0.063 W,0402 0402 CRCW04022K20JNE

D Vishay-Dale - -

R41 1 0 RES, 0, 5%, 0.063 W, 0402 0402 CRCW04020000Z0ED Vishay-Dale - -

R42, R46, R54, R55 4 0 RES, 0, 5%, 0.1 W, 0603 0603 CRCW06030000Z0EA Vishay-Dale - -

R50, R51, R52 3 10k RES, 10 k, 5%, 0.1 W, 0603 0603 CRCW060310K0JNEA Vishay-Dale - -

S1 v - Switch, Tactile, SPST-NO,0.05A, 12V, SMT Switch, 4.4x2x2.9 mm TL1015AF160QG E-Switch - -

SH1, SH2, SH3, SH4, SH5, SH6, SH7, SH8,SH9, SH10, SH11, SH12, SH13, SH14, SH15,

SH16, SH17, SH18, SH19, SH20, SH21, SH22,SH23, SH24, SH25, SH26, SH27, SH28, SH29,SH30, SH31, SH32, SH33, SH34, SH35, SH36,

SH37, SH38, SH39, SH40, SH41, SH42

42 1x2 Shunt, 100mil, Gold plated,Black Shunt SNT-100-BK-G Samtec 969102-0000-DA 3M

TP1, TP2, TP3, TP4, TP5, TP8, TP9, TP10,TP11, TP12, TP13, TP14, TP15, TP16, TP17,TP18, TP19, TP20, TP23, TP24, TP25, TP26

22 Orange Test Point, Miniature, Orange,TH Orange Miniature Testpoint 5003 Keystone - -

TP6, TP7, TP21, TP22 4 Black Test Point, Miniature, Black,TH Black Miniature Testpoint 5001 Keystone - -

TP27 1 - Test Point, Miniature, Red,TH Red Miniature Testpoint 5000 Keystone - -

U1, U23 2 -

5.7-W Class-D Mono AudioAmplifier with Class-H Boostand Speaker Sense, YZ0042-C01 (DSBGA-42)

YZ0042-C01 TAS2557YZR Texas Instruments TAS2557YZT Texas Instruments

U2 1 - EEPROM, 256KBIT, 400KHZ,MSOP8 MSOP-8 24LC256-I/MS Microchip - -

U3 1 -

TCA9406 Dual Bidirectional 1-MHz I2C-BUS and SMBusVoltage Level-Translator, 1.65to 3.6 V, -40 to 85 degC, 8-pin US8 (DCU), Green (RoHS& no Sb/Br)

DCU0008A TCA9406DCUR Texas Instruments Equivalent Texas Instruments

U4 1 TAS1020BPFB IC, USB Streaming Controller PQFP48 TAS1020BPFB TI - None

U5, U7, U20 3 -

Dual 1-of-4 FET Multiplexer /Demultiplexer 2.5-V / 3.3-VLow-Voltage High-BandwidthBus Switch, RGY0016A

RGY0016A SN74CB3Q3253RGYR Texas Instruments - Texas Instruments

U6, U11, U24 3 -

4-BIT DUAL-SUPPLY BUSTRANSCEIVER WITHCONFIGURABLE VOLTAGETRANSLATION AND 3-STATE OUTPUTS,RSV0016A

RSV0016A SN74AVC4T774RSVR Texas Instruments - None

http://www.ti.com









U8 1 -

Low-Voltage 8-Bit I2C andSMBus I/O Expander, 1.65 to5.5 V, -40 to 85 degC, 16-pinUQFN (RSV), Green (RoHS &no Sb/Br)

RSV0016A TCA6408ARSVR Texas Instruments Equivalent None

U9, U19, U21 3 -Single 2-Line to 1-Line DataSelector Multiplexer,DCT0008A

DCT0008A SN74LVC2G157DCTR Texas Instruments - None, Texas Instruments,

Texas Instruments

U10, U15, U16, U17, U18 5 - DUAL BUFFER GATE,DRL0006A DRL0006A SN74LVC2G34DRLR Texas Instruments - None

U12 1 -

Single Output LDO, 1 A,Fixed 3.3 V Output, 2.2 to 5.5V Input, with Reverse CurrentProtection, 6-pin SOT-223(DCQ), -40 to 125 degC,Green (RoHS & no Sb/Br)

DCQ0006A TPS73733DCQ Texas Instruments Equivalent None

U13 1 -

Single Output Low NoiseLDO, 400 mA, Fixed 1.8 VOutput, 1.7 to 5.5 V Input,with Reverse CurrentProtection, 5-pin SOT-23(DBV), -40 to 85 degC, Green(RoHS & no Sb/Br)

DBV0005A TPS73618DBVR Texas Instruments Equivalent None

U14 1 - Single Bus Buffer Gate With3-State Output, DCK0005A DCK0005A SN74LVC1G125DCK

R Texas Instruments SN74LVC1G125DCKT Texas Instruments

U22 1 -

8-BIT I2C/SMBUS GPIOEXPANDER WITHINTEGRATED LEVELSHIFTERS, TSSOP-16

4.5x1.2x5.1 mm XRA1206IG16-F Exar - -

Y1 1 - Oscillator, 6MHz, 3.3V, SMD 2.5x1x2.5mm 625L3I006M00000 CTS Electrocomponents - -

FID1, FID2, FID3 0 - Fiducial mark. There isnothing to buy or mount. Fiducial N/A N/A - -

R9, R10 0 2.00k RES, 2.00 k, 1%, 0.063 W,0402 0402 CRCW04022K00FKE

D Vishay-Dale - -

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STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES1. Delivery: TI delivers TI evaluation boards, kits, or modules, including demonstration software, components, and/or documentation

which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the termsand conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions.1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility

evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are notfinished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. Forclarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditionsset forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software

1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or productionsystem.

2 Limited Warranty and Related Remedies/Disclaimers:2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software

License Agreement.2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM

to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatmentby an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in anyway by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications orinstructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or asmandated by government requirements. TI does not test all parameters of each EVM.

2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during thewarranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects torepair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shallbe warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) daywarranty period.

3 Regulatory Notices:3.1 United States

3.1.1 Notice applicable to EVMs not FCC-Approved:This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kitto determine whether to incorporate such items in a finished product and software developers to write software applications foruse with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unlessall required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not causeharmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit isdesigned to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority ofan FCC license holder or must secure an experimental authorization under part 5 of this chapter.3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTIONThis device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may notcause harmful interference, and (2) this device must accept any interference received, including interference that may causeundesired operation.Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority tooperate the equipment.

FCC Interference Statement for Class A EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment isoperated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if notinstalled and used in accordance with the instruction manual, may cause harmful interference to radio communications.Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required tocorrect the interference at his own expense.

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

FCC Interference Statement for Class B EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residentialinstallation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordancewith the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interferencewill not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, whichcan be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or moreof the following measures:

• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.• Consult the dealer or an experienced radio/TV technician for help.

3.2 Canada3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210

Concerning EVMs Including Radio Transmitters:This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:(1) this device may not cause interference, and (2) this device must accept any interference, including interference that maycause undesired operation of the device.

Concernant les EVMs avec appareils radio:Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitationest autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doitaccepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concerning EVMs Including Detachable Antennas:Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna typeand its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary forsuccessful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna typeslisted in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibitedfor use with this device.

Concernant les EVMs avec antennes détachablesConformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type etd'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillageradioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotroperayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Leprésent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans lemanuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antennenon inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation del'émetteur

3.3 Japan3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に

輸入される評価用キット、ボードについては、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page

3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certifiedby TI as conforming to Technical Regulations of Radio Law of Japan.

If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law ofJapan to follow the instructions below with respect to EVMs:1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal

Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule forEnforcement of Radio Law of Japan,

2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect toEVMs, or

3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japanwith respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please notethat if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.

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http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page


【無線電波を送信する製品の開発キットをお使いになる際の注意事項】開発キットの中には技術基準適合証明を受けていないものがあります。技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用

いただく。2. 実験局の免許を取得後ご使用いただく。3. 技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。日本テキサス・イ

ンスツルメンツ株式会社東京都新宿区西新宿６丁目２４番１号西新宿三井ビル

3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

SPACER4 EVM Use Restrictions and Warnings:

4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOTLIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.

4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handlingor using the EVM, including without limitation any warning or restriction notices. The notices contain important safety informationrelated to, for example, temperatures and voltages.

4.3 Safety-Related Warnings and Restrictions:4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user

guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable andcustomary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to inputand output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, orproperty damage. If there are questions concerning performance ratings and specifications, User should contact a TIfield representative prior to connecting interface electronics including input power and intended loads. Any loads appliedoutside of the specified output range may also result in unintended and/or inaccurate operation and/or possiblepermanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting anyload to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuitcomponents may have elevated case temperatures. These components include but are not limited to linear regulators,switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using theinformation in the associated documentation. When working with the EVM, please be aware that the EVM may becomevery warm.

4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with thedangers and application risks associated with handling electrical mechanical components, systems, and subsystems.User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronicand/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safelylimit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility andliability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors ordesignees.

4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes allresponsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility andliability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and localrequirements.

5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurateas possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites asaccurate, complete, reliable, current, or error-free.

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6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THEDESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHERWARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANYTHIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.

6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS ANDCONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANYOTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRDPARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANYINVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OFTHE EVM.

7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITSLICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANYHANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATIONSHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANYOTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.

8. Limitations on Damages and Liability:8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,

INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESETERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HASBEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITEDTO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODSOR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALLBE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.

8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATIONARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVMPROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDERTHESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCEOF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS ANDCONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.

9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not ina resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicableorder, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),excluding any postage or packaging costs.

10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating tothese terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive reliefin any United States or foreign court.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2016, Texas Instruments Incorporated

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IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latestissue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of salesupplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s termsand conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessaryto support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarilyperformed.TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI components or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alterationand is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altereddocumentation. Information of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or servicevoids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirementsconcerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or supportthat may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards whichanticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might causeharm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the useof any TI components in safety-critical applications.In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the partieshave executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI componentswhich have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products ApplicationsAudio www.ti.com/audio Automotive and Transportation www.ti.com/automotiveAmplifiers amplifier.ti.com Communications and Telecom www.ti.com/communicationsData Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computersDLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-appsDSP dsp.ti.com Energy and Lighting www.ti.com/energyClocks and Timers www.ti.com/clocks Industrial www.ti.com/industrialInterface interface.ti.com Medical www.ti.com/medicalLogic logic.ti.com Security www.ti.com/securityPower Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defenseMicrocontrollers microcontroller.ti.com Video and Imaging www.ti.com/videoRFID www.ti-rfid.comOMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.comWireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2016, Texas Instruments Incorporated

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