technology days english seminar program · seminar 2 02.00 – 03.30 pm recent advancements in thin...
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smtconnect.com
Nuremberg, 7 – 9 May 2019
Solutions for Electronic Assemblies and Systems
Technology DaysEnglish Seminar ProgramPractical knowledge to take you into the future!
Tuesday, 7 May 2019
Welcome Session (in German)
09.30 – 10.00 am VDMA Geschäftsklimaumfrage des Elektronik-Maschinenbaus
Grußwort: Prof. Dr. Klaus-Dieter Lang, Fraunhofer IZM Daniel Müller, VDMA Electronics Volker Pape, Viscom AG
Coffee break
Seminar 1 (in German)
10.15 – 11.45 am Verbindungstechniken: Löten, Sintern, TLPB – für höhere Betriebstemperaturen
Dr. Matthias Hutter, Fraunhofer IZM Constanze Weber, Fraunhofer IZM
Special Session 1
12.00 – 12.25 pm Automotive PCBA & No-Clean Solder Paste – Enhanced Electrical Reliability for High-Power Components
Karthik Vijay, Indium Corporation
Lunch
Special Session 2
01.00 – 01.25 pm High Reliability Lead-Free Alloys for Performance Critical Applications
Ralph Christ, Alpha Assembly Solutions Germany GmbH
Seminar 2 (in German)
01.30 – 03.00 pm Herausforderungen bei der Verarbeitung von kritischen LGA-Bauelementen
Dr. Hans Bell, Rehm Thermal Systems GmbH Henryk Maschotta, Thales Deutschland GmbH Dr. Heinz Wohlrabe, TU Dresden
Coffee break
Seminar 3
03.15 – 04.45 pm Implementation of a low melting point soldering alloy in electronics assembly
Steven Teliszewski, Interflux Electronics NV
Wednesday, 8 May 2019
Special Session 1 (in German)
08.30 – 08.55 am Substrate für Schaltungsträger: Basiseigenschaften und Metallisierungen zur Ankontaktierung
Prof. Dr. Martin Schneider-Ramelow, Fraunhofer IZM
Seminar 1 (in German)
09.00 – 12.00 pm Lieferspezifikation und Designrules für drahtgebondete Substrate und Baugruppen
Stefan Schmitz, Bond-IQ GmbH Dr. Josef Sedlmair, Uwe Nacke, F & K DELVOTEC Bondtechnik GmbH
(including coffee break)
Special Session 2 (in German)
12.15 – 12.40 pm Stretchable und Conformable PCB / Electronics als neue Herausforderung für den Elektronikentwickler – TWINflex-Stretch
Dr. Jan Kostelnik, Würth Elektronik GmbH & Co. KG
Lunch
Special Session 3
01.30 – 01.55 pm Nan Ya millimeter-wave, high reliability materials for automotive radar and safety applications
Gavin Chen, Nan Ya Plastics Corp.
Seminar 2
02.00 – 03.30 pm Recent Advancements in Thin and Thick Film Technology Dr. Alexander Kaiser, Cicor Reinhardt Microtech GmbH
Dr. Günter Reppe, RHe Microsystems GmbH
Wednesday, 8 May 2019
Special Session 3
08.30 – 08.55 am Miniaturization Trends Dr. Ning-Chen Lee, Indium Corporation
Seminar 4
09.00 – 12.00 am Reliability of Solder Joints Dr. Ning-Chen Lee, Indium Corporation (including coffee break)
Lunch
Seminar 5
02.00 – 05.00 pm DFM for Advanced Soldering Technology Dr. Ning-Chen Lee, Indium Corporation (including coffee break)
Soldering Technologies Substrate Technologies
Media partners Supported byChair
Prof. Dr. Klaus-Dieter Lang Fraunhofer IZM
More information about the committee at smtconnect.com
At a glance
Participation fees
Svenja SpeidelConference Assistant Tel.: +49 711 [email protected]
Mesago Messe Frankfurt GmbHRotebühlstraße 83 – 8570178 Stuttgartmesago.com
Organizer
Booking until 4 April 2019
Booking from 5 April 2019
1 Seminar (1,5hrs) 210.00 EUR 260.00 EUR
1 Seminar (3hrs) 380.00 EUR 470.00 EUR
1-Day ticket 575.00 EUR 720.00 EUR
2-Day ticket 920.00 EUR 1,150.00 EUR
Welcome Session & Special Sessions inclusive inclusive
All fees plus 19% VAT. On-site registration: plus 30.00 EUR per person.Contractual conditions at smtconnect.com/registration
Your services
Participation at the presentations booked incl. seminar handout(s) Entry to the Welcome Session on 7 May 2019 Coffee breaks and lunch on the day booked Exhibition season ticket Ticket for the Welcome Party on 7 May 2019
Entitlement to services only after payment of the participation fee.
Your contact