the european components initiative (eci) and technology ... · optoelectronica . stm . fbk . tas...

The European Components Initiative (ECI) and Technology non dependence for ESA programmes

Keith Miller

Coordination Engineer,

Materials and Components Technology Division,

ESA ESTEC, The Netherlands

November 2012

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European Landscape for Space EEE components

All European Space Agency programmes are dependent on the continuous access to key EEE technologies and manufacturing processes. A major risk to these programme are the increasing obsolescence within the supply chain.

• Each disruption of the supply chain leads to high requalification costs for space and subsequent delays to ESA space programme schedules.

The two main drivers of obsolescence issues in Europe today are :

• Legal; “environmental driven legislation” (REACH, RoHS) is reducing dramatically the

availability of critical substances in Europe. – Alodine 1200, Hydrazine, GaAs and InP are currently in the pipeline for regulated

usage in Europe or total withdrawal from the European Union market.

• Industrial; continuous pressure for cost reductions in the terrestrial market leads to continuous restructuring of the industrial supply chain. – Space is a niche “low volume” market with a high exposure to changing industrial

landscape. Active measures have been put in place in 2004 via European Component Initiative (ECI) to secure the availability of the European EEE-component supply chain.

MEWS 25:ESA UNCLASSIFIED

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European Components Initiative : Non dependence

European Space Qualified Components ECI Phase 1 - 3

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ForecastQualificationCertificatesForecastQualifiedMaufacturers

Start of ECI I Start of ECI2 Start of ECI3

ECI started in 2004 as a combined effort of the Agency supported and complemented by National Initiatives by the ESA Member states, most notably CNES (France) and DLR (Germany).

ECI Phase 1 (2004-2010) – Target: Reduce the dependence on the supply of

EEE components, through “Pin to Pin” compatible replacements for export (ITAR) restricted devices.

– Key developments: Power Mosfets, Fuses, Relays, RF MMICs, Mixers, PLLs, 1553 ASICs, LEON 2 Microprocessor.


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ECI Phase 2 (2009-2012) – Target: Provide competitive alternatives (cost

and time to market) in Europe. – Key developments: MMICs, PLL(s),

Capacitors, Fuses, Optical connectors. FPGA(s).





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ECI Phase 2 (2009-2012) – Target: Provide competitive alternatives (cost

and time to market) in Europe. – Key developments: MMICs, PLL(s),

Capacitors, Fuses, Optical connectors. FPGA(s).




ECI Phase 3 (2011-2012) – Target: Provide access to strategic

components and technologies. – Key developments: Foundations for DSM

65nm, Large FPGA (2Mgate), High Pin Count assembly technologies, Mixed signal ASICs, Flip-chips.


Industrial Impact of ECI In Europe (When we started)

Value of EEE Components in a comparable individual Satellite

platform (Eurospace Survey 2011)

USA 75%

European 25%

2006

6 MEWS 25:ESA UNCLASSIFIED

Industrial Impact of ECI In Europe (Where we think we are now)



Others 5%

USA 60%

European 35%

USA 75%

European 25%

2006

2011

MEWS 25:ESA UNCLASSIFIED 7

Where we think we are now

Industrial Impact of ECI In Europe (Where we want to be in 5 years)



Others 5%

USA 45%

European 50%

Others 5%

USA 60%

European 35%

USA 75%

European 25%

2006

2011

2017

Target by 2017


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Return on Investment

R&D Phase

Extended Development/ contingencies

Evaluation / Qualification

Product Commercialisation

Initial Investment

Typ 2-3 years Up to 2-3 years Typ 1-2 y Typ 5 -10 years

Typically 10 years !

Typical Strategic New Component Technology Timeline from R&D to Commercialization

Investment must be timed carefully in order to meet the time-to-market requirements of the customers.

ECI

Technology Readiness Level 4

Technology Readiness Level 8


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Balanced Investment - Required Capabilities/ Competencies

e.g. MHS (F) SERMA (F) E2V (F), (CH) HCM(F) Alter (ES) EGGA (CZ)

e.g. Lfoundry (D)/(F), STm (I)/(F), XFab (UK), AMS (A) Infineon (D), ON-Semi (B), IHP (D) Plus start cooperation with foundries in Far East

e.g. ATMEL (F), STm (I), TESAT (D), Alter (ES)

e.g. System Integrators (F),(D),(I),(F),(UK) Equipment Suppliers CAD vendors Design Houses

Analysing the Technology Challenges

• Technology complexity/level of integration is continuously increasing, leading to higher cost of qualification and non-recurring costs for ESA programmes.

• Supply chains are getting more complex, due to industrial outsourcing and legislation leading to supply chain interruptions for ESA programmes.

• Number of qualified technology providers for space is decreasing, due to limited space market and increased regulation/legislation (e.g. REACH, ITAR) leading to increased cost of technology qualification for ESA programmes.

• Need of recurring equipment is increasing emphasising the need to manage medium/long term obsolescence.

• Technology gaps that have existed (Europe/USA/Asia) can be reduced (e.g. GaN, DSM), but they still exist.

Technology Complexity

Qua

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Regulations /Leglislation

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Development/Manufacturing Stage


Geographical distribution

ESA is funded by the European Tax payers of 19 member states. Expanding the European supply chain • Politically its very important to diversify the geographical distribution

of the ECI industrial supply chain. • 2012 : As a result, ECI activities today cover activities at prime and

subcontractor level in the majority of ESA Member States. • Active measures within the ESA Member States continue to identify potential

new suppliers. • As a result of the on-going consultations to identify new suppliers, ESA is

confident that a fair geographical distribution can be achieved which will satisfy the funding providers.

• Looking ahead for the planned technologies to be addressed in the next phase of ECI there are some excellent entry points and opportunities for the new suppliers to enter the market. e.g. Micro and Nano technologies, photonics and III-V materials for power applications.

MEWS 25:ESA UNCLASSIFIED 12

Industry Participation to the ESA - ECI ECI phase 1 Industrial contracts (2004- 2010)

ATMEL Cobham (CTM) OMMIC UMS Peregrine TAS (F) ASTRIUM REL (Deutsch)

STm

ETCA

Schurter

AME(OSI)

ISOCOM

Key: ECI Phase 1 2005-2010


Industry Participation to the ESA - ECI ECI Phase 2 Industrial contracts (2008- 2012)

ATMEL Cobham (CTM) OMMIC UMS Peregrine TAS (F) ASTRIUM REL (Deutsch)

Fraunhofer

AVX

Optoelectronica STm TuV Alter

ETCA Verhaert

Schurter Diamond

AME(OSI)

ISOCOM Tyndall

Key: ECI Phase 1 2005-2010 ECI Phase 2 2008-2012


Industry Participation to the ESA - ECI Status Now : ECI Phase 3 (2011- 2014)

Aeroflex IVF

ATMEL Cobham (CTM) OMMIC UMS Peregrine TAS (F) ASTRIUM Eurofarad TRAD REL (Deutsch) Rakon E2V

Fraunhofer AXON Kabel IDA UMS IHP Rood Technology Infineon

Eggo AVX

Optoelectronica STm FBK TAS (I)

Arquimea TuV Alter

ETCA IMEC Verhaert On-Semi

Schurter Diamond IST

AME(OSI)

NLR

IQE ISOCOM Tyndall

Key: ECI Phase 1 2005-2010 ECI Phase 2 2008-2012 ECI Phase 3 2011-2014


Industry Participation to the ESA - ECI Introducing ECI 4 activities (2013- 2017)

Aeroflex IVF AAC Microtec

ATMEL Cobham (CTM) OMMIC UMS Peregrine TAS (F) ASTRIUM REL (Deutsch) Eurofarad TRAD Rakon E2V

Fraunhofer AXON Kabel IDA UMS IHP Rood Technology Infineon, ATMEL Telefunken, KT, TESAT, KVG Jena, Vishay, Gore Eggo

AVX

Optoelectronica STm FBK TAS (I)

Arquimea TuV Alter Mier IMB DAS CRISA

ETCA Verhaert On-Semi IMEC

Schurter Diamond IST CICOR, Sercalo

AME(OSI) Norspace

NLR

IQE ISOCOM PeregrineNPL, RAL Rakon Astrium AVX

Tyndall

Key: ECI Phase 1 2005-2010 ECI Phase 2 2008-2012 ECI Phase 3 2011-2014 ECI Phase 4 2013-2017

VTT

Theon sensors

Sieberdorf Infineon

Printca

LIP

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ECI Global “Outreach”

Global Market • ECI EEE component developments and global collaboration have established

a global market for European EEE components. • Exports to China, Russia, Israel, Argentina, South Korea, Brazil, USA.

Coordination • European coordination in the development and qualification of strategic technologies

has opened up new opportunities with other major space agencies (e.g. JAXA, NASA, JPL) and:

• avoiding costly duplication of technologies and cost savings through joint development projects

• ESA/CNES/JAXA Rad hard by nature (SOI) FPGA, • Leading to a further expansion of product portfolios. • Maintaining European industry and ESA access to key critical technologies.

ESA-JAXA cooperation (started in 2007) • Simplified export licensing procedures for both JAXA and ESA developed EEE

Components. • Increasing the market potential and promoting of both European and Japanese

suppliers • Second source supply for Power Mosfets, Diodes, POL ,Capacitors, and DC-DC

converters. • Approx 5% of EEE components in a typical European telecoms satellite platform

are now being sourced from Japan (Previously USA). • Comparison JAXA QTS and ESCC specifications is ongoing to improve the European

industry understanding of level of qualification which will lead to a further increase of market sales.


Objectives 2013-2017

The objectives are to further reduce ESA project risks and costs and increasing European competitiveness by:

– Strengthening the European supplier basis;

– by aggregating end user requirements and investing on advance development and qualification of critical technologies.

– Securing an early and unbiased European industry access to critical technologies;

– by actively promoting new EEE-component technologies for end-users.

– Monitoring and mitigating the medium and long term technical and legislative obsolescence risks;

– by identifying and accelerating the technology development of potentially obsolete technologies .

– To achieve the above the following measures are being proposed to our decision makers – Regular national funded “announcements of opportunities “ for the utilisation of new EEE

components in new designs. – Introducing a CleanSpace programme to address legal obsolescence issues created by

environmental legislation.


Coordination with NSA Work-Plans

ESA Programme Requirements

Selection Process

Consolidated CTB WG

Roadmaps

CTB Product Domain Working

Groups inputs

Component Technology

Board

Space Component

Steering Board

ESA TECNET Service Domains



ESA TECNET Service Domains ESA TECNET Service

Domains ESA TECNET Service

Domains CTB Product

Domain Working

Groups inputs


Groups inputs


Groups inputs ESA Prioritized roadmap

SCSB Endorsed Roadmap

Feedback and Consultation

Bilaterals with ESA Member States

ESA – JAXA Coordination

• Component suppliers • Equipment manufacturers • System integrators • End Users • National Space Agencies • ESA • EC

Coordination with External Bodies

ESA-EC- EDA Harmonization

ESA EEE Work-plan

Looking ahead Key Technology roadmaps

ECI phase 4: 2013-… , (still subject to funding approval) 1. Rad hard Large FPGA (2Mgate) 2. Space Qualified 65nm DSM

process 3. European Next Generation Digital

Signal Processor (DSP) 4. Qualified Mixed Signal ASICs

Technology 5. High pin packaging (1000+ pins) 6. European Qualified ADC & DACs 7. Discrete power devices (SiC , GaN) 8. European foundry process and

qualified GaN RF component product set

ESA UNCLASSIFIED – For Official Use

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2013-2020 High Priority Key Technologies

Packaging and assemblies: – Die attach and interconnections (Flip chip qualification hermetic/ non hermetic), – Packaging (High pin count (1000+) Improved thermal performance of hermetic packages), – Optical cables and connectors assemblies, – Package assemblies on PCBs (High pin solder-less interconnects), – PCBs (Embedded components, High speed HDI, Mixed IF/RF, lead free finishing). Silicon : – Digital Technology (Large FPGA, DSP, Digital ASIC, HSSL,M-LVDS), – Mixed Signal (Mixed signal ASIC qualification), – Analog and or Power Technology (ADC/DAC, POL, PWM, GaN Dc-Dc, MOSFETS, Diodes) Passives/ RF passives: – Heaters, thermistors, Xoscillators, HV capacitors/relays, cable assemblies. Photonics: – Image Sensing Detection (CMOS visible range), – RF & Digital comms (10Gbps Emitter/Receiver, Vertical laser, Optical fibre amplifier). Microwave – High Frequency - Low Noise - Low Power Applications (GaAs HEMT) – Mixed Analog/Digital RF Processes (SiGe, SOI GaAs) – High Frequency, Medium to High Power Systems (GaN/SiC) MNT : – RF MEMS (Embedded RF MEMS, Switches, filters, reliability and standardization) – Optical MEMS (MOEMS) (Telecom Crossband Coupler) – Sensors (Pressure sensors)

• Hi-Rel UltraCMOS Phase-Locked Loop Frequency Synthesizers (PLL) Only worldwide source of rad hard PLL free of any export restrictions

• 3 space qualified variants, drop in comparable to US ITAR listed parts • >1000 PLL’s delivered since introduced in 2009 • Key Customers: TAS-F, NT space, TESAT, TOPREL, Spur, Astrium.

• Qualified European Schottky diode wafer fabrication process “BES” • Only European ESCC Space qualified wafer process for GaAs Schottky components

• >150 wafers produced and delivered since 2009. • Key Customers: TAS-F, Astrium, TESAT.

• Hybrid Microwave Mixers (0.5-1500Mhz), amplifiers for active and control functions

• Growing family of Hybrid Mixers (double balance, termination insensitive, image reject )and amplifiers specifically designed and qualified for space applications

• Reducing the costs and lead times (compared to MMICs), as well as allowing tuning to match customer specifications.

• 850 Hybrid mixers ordered/ delivered since 2008. • Key Customers: TAS, TESAT, Mier, CNRS, Sentinel 3, Galileo, Exomars.

• MMIC Mixers (0.7-10Ghz)

• >2500 Double balance MMIC Mixers delivered since 2008 (Sales now in excess of 1.75M€) • Key Customers: TAS, TESAT, Sentinels 1 & 3, Galileo

• Power MOSFETS

• Providing customers with the only European source of space qualified Rad hard “N” Channel MOSFETS

• Relays • Space qualified Hi-Rel relays (2 and 4 poles 15Amps) in T05 package for use in space launchers,

vehicles and all satellite systems • Key Customers Sentinel 3,

ECI- Some Technical and Commercial Success Stories


ECI- Some Technical and Commercial Success Stories

Through the combined efforts of ECI and other Agency development programmes some of the technical success stories include: • Next generation multipurpose processor. (commercially available since 2010 )

• ESCC Qualified LEON2 processor, is now widely used by ESA programmes (GAIA, ProbaV, ISS, Sentinel 1) • Confirmed sales orders for >800 Engineering and Flight Models (exports of 60 FM/ 95 EM (China, USA,

Argentina, Russia). • European Rad hard FPGAs.

• Growing family of ITAR Free FPGAs available in Europe to challenge the USA suppliers which are now all ITAR controlled.

• ESCC evaluation of the 0.18 µm European foundry process • Replacement of the obsolete 0.35 µm which had been relied upon for all space platform and payload ASICs

(0.18 µm is now the standard process used in all new ESA programmes).

• 65nm Technology • Introduction of the first designs using the 65nm technology. • Reducing the identified technology gap from 10-15 years to 5-10 years (Europe/USA).

• GaN Technology

• The GREAT2 initiative has reduced the GaN technology gap for RF applications in Europe from 10 to 4 years compared to US/Japan.

• GaN is rad hard by nature and has a High breakdown voltage, • An In orbit Demonstration is planned on ProbaV

• Space qualified Fuses

• Introduction of an extensive range of PCB and surface mount “non resettable” fuses for space applications • >200 purchase orders since 2008 (>30,000 fuses) including exports to USA, India, Israel, Russia, Japan.


Summary

1. European Space activities are facing an increasing risk of obsolescence related to strategic EEE components, materials and processes which serve as basic building blocks for each space project. Although recurring products and platforms are serving as a way to save on the design and manufacturing costs, but they are also exposing European space projects widely to the volatility of the supply chain. Potentially elevating the schedule and cost risks of the programmes.

2. Through current European strategic activities such as ECI, ESA has shown that the technology gaps that previously existed (Europe/USA/Asia) can be reduced through investment with the suppliers . Component manufacturers have not only been able to capture back some of the market, but are now exporting their devices/ technology outside of Europe.

3. The importance of putting in place comprehensive and structured selection mechanisms for future developments , which address the commercial viability and time to market through global end user involvement in defining the target specifications is a fundamental requirement for the success of the product line.

4. Thank you for your attention.

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