the evolution of the power supply architecturesbiakom.com/vicor/architecture-progress.pdf · prm...
TRANSCRIPT
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The Evolution of the Power Supply Architectures
Introduction to FPA and V▪I Chip as Enabling Technology to High Performance Power Systems
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About Vicor
• Founded 1981
• Public listing 1984 (NASDAQ: VICR)
• Headquarters and principal manufacturing in Andover, MA
• Acknowledged pioneer in the power system industry– Introduced first high-density DC-DC “brick” power supply
– Introduced V•I Chips and Factorized Power Architecture
• Leadership in innovation and intellectual property– >100 patents in U.S., Europe & Japan
– Approximately twice the R&D investment of competitors*
* Annual R&D expense as a percentage of revenue
Vicor is leading the next generation of power management
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Three Business Units – One Mission
To deliver differentiated power management solutions for which size, efficiency, speed, flexibility, or total cost of
ownership are critical to the customer.
Brick Business Unit
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Vicor’s Continuum of Power System Solutions
CustomPower Systems
(VAR)
Configurable Power Supplies
Modular Power Components
(Bricks)Brick Business Unit
Next GenerationPower Components
• Unifying characteristics:– Use of proprietary Vicor products and technologies– High power applications– Innovative solutions
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Vicor – Leading evolution of Power Architecture
1st Full-size
Brick at 100 W
Full-size Brick
at 600 W
VI Chips & Factorized
Power Architecture Introduced
Half-size Brick
at 300 W
Quarter-size Brick
at 150 W
VI Chips Established in Blue-Chip Applications
VI BricksIntroduced
1st Half-size
Brick
1988 1997 1997 1998 2003 2006 2008 1984
• Device performance and form factor are key competitive variables– Vicor has consistently led the industry in technical advances
• Customers turn to Vicor for innovative solutions to their specific power needs– Our mass customization model is a significant differentiator
– We do not compete for high volume commodity business
• We are well-positioned to benefit from well-defined trends– Particularly related to power consumption and thermal management
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Architecture Progress
• Centralized Power Architecture– AC – to – load
• Distributed Power Architecture– AC-to-48V, 48-to-load
• Intermediate Bus Architecture– AC-48V, 48-12V, 12V-to-load
5 V1.0 V1.0 VAC inCentralPowerSupply
CentralPowerSupply
DC bus
Isolated DC-DC converter
System boardDC bus
Isolated DC-DC converter
System board
Non-isolated POL converters (niPOLs)
Isolated intermediate bus converter
Semi-regulated DC busSystem board
Non-isolated POL converters (niPOLs)
Isolated intermediate bus converter
Semi-regulated DC busSystem board
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Distributed Power
48 Vdc
niPOL
niPOL
3.3 Vdc
DT=7% DT=28%
12 Vdc
IBA48 Vdc
IBC
3.3 Vdc
niPOL
48 Vdc
Brick
3.3V
¼ Brick
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The Problem
• High distribution losses• Poor dynamic response for high di/dt loads• Shrinking board area space for power devices• Rising utility costs
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The Reason
• Fundamental restrictions in existing power topologies– <1MHz Switching Freq– Duty cycle– Series inductance– Bulk capacitance
• Multiple power conversion stages– Adds size, cost, and may lower overall conversion
efficiencies
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The Solution: FPA with V•I Chips
• Factorized Power Architecture– Separation of power conversion stages: Regulation & Voltage
Transformation• Reduces distribution losses in a system• Reduces duplicated functions in the DC-DC conversion path• Reduces power dissipation at the Point of Load while increasing total system
efficiency
• Flexible building blocks: V•I Chips• Small, powerful components for DC-DC conversion• Provide key advantages to the power designer
– Industry leading power density (size & weight)– High Efficiency– Design flexibility– Speed (fast response)
66
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¼ Brick
FPA – Breaking the Duty Cycle Barrier
0.8 Vdc
FPA 48 Vdc
26V
100%
48 Vdc
niPOL
niPOL
0.8 Vdc
2%
IBA48 Vdc
0.8 Vdc
3.0 Vdc
26%
IBC
niPOL
IBA48 Vdc
0.8 Vdc
40%
2.0 Vdc
IBC
niPOL 7%
12 Vdc
IBA48 Vdc
IBC
0.8 Vdc
niPOL
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Architecture Progress
• Centralized Power Architecture– AC – to – load
• Distributed Power Architecture– AC-to-48V, 48-to-load
• Intermediate Bus Architecture– AC-48V, 48-12V, 12V-to-load
• Factorized Power Architecture– AC-to-48V, 48V-direct-to-load
or, for high power systems– AC-to-380V, 380-48V, 48V-direct-to-load
5 V1.0 V1.0 VAC inCentralPowerSupply
CentralPowerSupply
DC bus
Isolated DC-DC converter
System boardDC bus
Isolated DC-DC converter
System board
Non-isolated POL converters (niPOLs)
Isolated intermediate bus converter
Semi-regulated DC busSystem board
Non-isolated POL converters (niPOLs)
Isolated intermediate bus converter
Semi-regulated DC busSystem board
Isolated POL converters (VTMs)
DC bus
Non-isolated pre-regulators (PRMs)
System board
Isolated POL converters (VTMs)
DC bus
Non-isolated pre-regulators (PRMs)
System boardDC bus
Non-isolated pre-regulators (PRMs)
System board
Higher Efficiency, Sm
aller Size, Lower System
Cost
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PRM Pre-Regulation Module• Pre-Regulation Module (PRM)
– Non-Isolated– Regulated 26V – 55V output– Wide range input– ZVS Buck-Boost topology– ZVS, >1MHz switching frequency– Ideal for powering niPOLs / VRMs
• Performance– 320W in 1.1 in2 package (>68W / cm3)– 1105W/ in3
– >97% efficient at 300W out• Inputs
– 24V (18 – 36)– 30V (18 – 60)– 48V (38 – 55 or 36 – 75)
• Output– Regulated 26V – 55V to VTM
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VTM Voltage Transformation Module• Voltage Transformation Module (VTM)
– Isolated– Voltage transformer / current multiplier– Sine Amplitude Converter Topology– ZVS, ZCS, >1Mhz switching frequency
• Performance– Up to 100A in 1.1 in2 package (>60W / cm3)
• Inputs– Regulated 26V – 55V from PRM
• Output– 0.8V – 55V, up to 100A (13 models)
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V•I Chip Components: BCM• Bus Converter Module (BCM)
– Isolated– Unregulated– Voltage transformer / current multiplier– Sine Amplitude Converter Topology
• ZVS, ZCS, >1Mhz switching frequency– Ideal for powering POLs / VRMs
• Performance– 300W in 7.1cm2 (1.1in2) package– Power Density = >60W/cm3 (>1,000W/in3)– Efficiency = >95%
• 48V Versions (Telecom / Server)– Input : 48V (38-55V)– Output : 1.5 - 55V
• High Voltage Versions (350V distr., 380V post-PFC)– Input : 350V or 380V– Output : 10 – 13V 48V
U.S. and Foreign Patents and Patents Pending
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Factorization
• Separate Regulation and Isolation Functions• Flexibility to locate PRM remotely-saves board
space• Factorized bus at ~48V saves I2R losses• VTM located directly at POL
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Regulation
3 Regulation Options:
1. Local sense – 5%2. Adaptive Loop – 1%3. Remote sense – 0.2%
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Bulk Capacitance Elimination
• Energy stored in a capacitor = ½ CV2
• VTMs have very fast transient response• Equivalent capacitance at VTM input, but 1/k2
smaller• Saves valuable POL board space• Better reliability (fewer bulk capacitors)• Saves cost of populating capacitors
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The “48V to Processor” Challenge• Traditional synch buck PWMs are limited due to FET duty cycle
– 12V : 1.2V may be OK… but 12V : 0.8V or 48V : 1.2V...?
• FPA separates regulation & voltage transformation functions: PRM + VTM– High efficiency 48 : 1.2V transformation at the processor
• Allows power savings upstream– Physical separation of PRM and VTM
• Allows the PRM to be placed remotely, with 94% reduction in distribution losses (W/ohm)• Only the VTM is required to be at the processor, minimize high current traces / losses.• Enables minimal form factor solutions directly at / under the processor
– VTM: High bandwidth bi-directional transformation with low Q• Capacitance: Bulk
– Move from processor to MV factorized bus and reduce to ~ 1/1000 capacitance (1/K2)• Capacitance: Bypass (ceramics)
– Greatly reduced (only needed to support dynamic response within a time scale of 1 uS). – Excellent transient response
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Processor Power Solutions: Baseline System
48 V:12 V IBC and 4 Phase VR powering 1.2 V, 100 A microprocessor.95% efficient and 85% 80.75% efficient from 48 V to 1.2 V load
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48V-to-load Solution: PRM+VTM
PRM (97%) and VTM (91%) 88.3% efficiency from 48V to 1.2V load
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FPA: Fast Transient Response
Move “bulk” capacitance upstream to higher voltageRequires only 1/1000 of original capacitance
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FPA: Flexible•VTM placed directly at load minimizes track loss
•PRM moved to backplane frees valuable space on motherboard
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HV BCM Full V•I Chip solution from PFC load
• B384F120T30 K=1/32 300W 384VIN 12VOUT Released• VIB0002 K=1/8 330W 384VIN 48VOUT Q4’07
0.8-55V375V 48V VFAC V
PFC(e.g. FE375)
HV BCM PRM VTM
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Power & Size Comparison (8x 1.2V, 100A μP array)
Baseline system
FPA systemWith V•I Chips
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The FPA Advantage: Efficiency, Size and $ Running Costs
• Applying FPA in higher power systems highlights the size, efficiency and value of the V•I Chips
• Efficiency 7.7%• Power Loss 31%• Size 45%• Save $30 / €24 per year,
per processor, in energy costs• $380,000 per year, per datacenter
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V•I Chips for Solid State Lighting / Display (LED)
Lighting
Back Light
Displays
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LED Progress – more Lumens per Watt
Cree, APEC 2007
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LED Progress – Industry “Tipping Point”
Cree, APEC 2007
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Constant Current Source• LEDs require constant current• PRM provides constant current with high control accuracy (IOUT + / - 2%)
– “Loss-less” differential current-sense and controlling amplifier into PRM’s voltage control pin
– Independent of VTM choice– Same PRM for any color / size LED
• 300W demonstration systemDual Op-Amp:ISENSE & control
To VTM
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LED Power
• Multiple options to drive LEDs• PRM in constant current mode• PRM-to-VTM driving a series
array• BCM-to-LED driver in a parallel
array• High efficiency• Wide adjustment/intensity
range
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Power Light• PRM+VTM
– Power = 300W– Power Density = 30 W/cm3
– Efficiency = 92%– PDISS / Light = <1W / 1,000 Lumens
• Power dissipated in powertrain per 1,000 Lumens emitted• Assumes 75 Lumens per 1W LED (Cree, APEC 2007)
22,500 Lumens
48V 24V325W 300W
92%
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The Flexibility of FPA
More Application Examples
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Battery Backup Systems
• High voltage and 48V BCM connected in ORing fashion• If primary supply BCM fails,48V backup provides charge• P12125 provides the ORing function
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Regenerative Burn-In
• Burn-in normally can waste excessive energy• BCM can operate in reverse (output-to-input)• BCM ~96% efficient, and recycles burn-in output load• BCM’s input pins produce 48V of input for burn-in
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AC-DC Server Solution
• Complete AC-DC server solution includes Picor products in conjunction with full suite of V•I Chips
• Very efficient• Flexible layout options with FPA
High current driveVarious output voltage levels availableUltra fast transient responseIncludes EMI filtering and ORing functions
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Boost Systems
• Boost 12V to 48V with reverse VTM• PRM regulates the VF • Final stage VTM provides current multiplication
and isolation functions
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Evolution of System Level Power Architectures (the summary)
12V5V3.3V,5A
Centralized Power Architecture (CPA)
ACAC-DC
AC-DC5V
3.3V
2.5V
DC-DCDC-DC
DC-DC
Distributed Power Architecture (DPA)
48VAC
Regulation, Isolation& Transformation
AC-DC5V
2.5V
DC-DC
DC-DC
niPOLniPOL
niPOL
3.3V
1.8VniPOL
Intermediate Bus Architecture (IBA)
48V
12V
12VAC
Isolation,Transformation
Regulation,Transformation
Vicor Product Focus
High VoltagesLow Currents
Large SizeLow Efficiency
CustomInflexible
Tim
e &
Tec
hnol
ogy
Adv
ance
s
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FPA: The Future of System Level Power Architecture
Vicor Product Focus
AC-DC
0.8V,200A
PRMPRM
VTMVTM
1.8V
5V3.3V
BCM niPOLniPOL
Factorized Power Architecture (FPA)
48V12V
VF
VF
AC
Isolation,Transformation
Regulation,Transformation
Isolation,Transformation
Regulation
• Low Voltages• High Currents• Smallest Size• Higher Efficiency• Standard Blocks• Flexible