the fastest e-passport of the world – sesames 2013 winner for new generation eletronic documents...
TRANSCRIPT
The fastest e-passport of the world –SESAMES 2013 winner for new generation eletronic documents
Matthias Bruestle from MaskTech [email protected] Zheng from Infineon Technology [email protected]
Copyright © Infineon Technologies AG 2013. All rights reserved.
Infineon Technologies – leading the security industry for over 25 years
Infineon Chip Card & Security
Infineon provides semiconductor and system solutions, focusing on three central needs of our modern society:Energy Efficiency, Mobility and Security
No. 1 in the chip card security controller market with 24%1 market share in 2012 by revenue.
Innovation leader with numerous product awards:
Sesames Award (Fastest e-Passport, 2013)
Germany's Industry Innovation Award 2010
Nomination German Future Prize 2013
1Source: IHS/IMS, September 30, 2013 "Smart Cards and Smart Card ICs - World"
CC Microcontroller IC Market Share 20131
Infineon24,1%
Page 2
Dec 2013
Awards/Recognitions:
Sesames: Best Hardware
Germany´s Industry Innovation Award
Nomination German Future Prize
Copyright © Infineon Technologies AG 2013. All rights reserved.
MaskTech
Page 3
2013-11-18
#1 independent System on Chip / OS manufacturer for travel & eID documents
German company, founded in 2002
Industries: Government ID, Health Care, Access, Authentication, Public Transport
Common Criteria certified embedded solutions developed in Nuremberg, Germany
Achievements:
Worldwide first ICAO masked OS In over 60 countries ePassports and ID documents (10 in
Asia) >100 million licensed
Copyright © Infineon Technologies AG 2013. All rights reserved.
Why do we need high speed e-passport?
e-Passport should be the only identification document in international traveling
Currently only a carrier of personal identity – only inspection
Information all around cross-border activities has to be digitally managed and recorded
ICAO LDS 2.0 (Logical Data Structure) to be included in DOC9303 will specify data format and secure handling
Complete personal data will increase
High speed processing is mandatory in the futureto ensure quick border crossing
Page 4
2013-11-18
Copyright © Infineon Technologies AG 2013. All rights reserved.
4th Generation ePass goes LDS 2.0
Logical Data Structure 2.0
Page 5
2013-11-18
Specifies a new application independent of current LDS 1.7 to ensure backward compatibility
Application will contain more persistent data groups for
Visas Entry / Exit Stamps Additional Biometric Data not considered in LDS 1.7
To update data on the e-passport PKI authentication will be necessary (EAC2)
With a data capacity like a 60 page passport the complete personal data will be up to 500 kB
Copyright © Infineon Technologies AG 2013. All rights reserved.
Page 6
2013-11-18
Large flexible memory on controller High speed contactless personalization in production High speed contactless readout at the border
Chip requirements
Demand
eID goes Multi Application
Combine several gov’t and commercial applications on one card Driver: added citizen value leveraging gov’t invest Requirement: host many apps flexibly & secure
Page 7
SDW May 2013
Copyright © Infineon Technologi
es AG 2013. All
rights reserved.
Major Trend of electronic ID
Long term security (>10 years)
Certified security (common criteria)
System security (HW, OS, Appl.)
Security
Performance Interoperability Multiple interface Standards compliance
Convenience
ICAO Travelling National eID Mobile eID eVisa, LDS2.0 with
mega data
Multiple Applications
Performance
Security
Memory
Page 8
2013-11-18
Copyright © Infineon Technologi
es AG 2013. All
rights reserved.
3-Stages to Boost Performance Through Contactless Innovation
1. Higher Frame Sizes
Transmit 4 times more bytes per frame Also available for bitrates 106-848kBit/s Increase up to 40% application speed
2. Very High Bitrates
Transmit data 8 times faster (6.8MBit/s) Increase up to 40% application speed
3. Parallel NVM Programming
Program NVM during communication Increase up to 30% application speed
All features are ISO/IEC compliant
Infineon is first to introduce this features
Features available on SLE 78 in 90nmPage
9set date
Copyright © Infineon Technologi
es AG 2013. All
rights reserved.
Copyright © Infineon Technologies AG 2014. All rights reserved.
10
6kB
it/s
2005
ISO7816
Flash Controllers for e-Government Need High Speed Contactless Data-Writing
42
4/8
48
kBit/s
2010
ISO7816
NOW
ISO7816
Flash about to dominate government market as superior solution Large amounts of code and data have to be personalized Contactless interface dominant in many governmental apps
Fast Flash Data-Writing
Page 10
2014-03-11
High Speed contactless writing can outpace contact-based writing already today
Acceleration Toolbox for High Speed Perso
Higher frame sizes for data packages Programming of memory in parallel to
data transmission Data transmission at Very High Bit Rates
(VHBR) up to 6.8 Mbit/s
Modern Flash Controllers Support
Page 11
SDW May 2013
Copyright © Infineon Technologi
es AG 2013. All
rights reserved.
Copyright © Infineon Technologies AG 2013. All rights reserved.
MTCOS ID on SLE 78 with ISO VHBR
World‘s Fastest e-Passport Transaction Time
(1) Measurements based on certified EAC ePassports w full security implementation(2) Measurement based on certifiable EAC ePassport w full security implementation with VHBR Very High Bit Rate data transmission(3) Typical benchmarking hardwares lie at 2~3 seconds currently
Market Average
3.1sec
SLE 66
2007
1.5sec
MTCOSSLE 78
2010
0.8sec
MTCOS - SLE 78 with VHBR
2013
Page 12
2013-11-18
BAC
SAC
SAC
Copyright © Infineon Technologies AG 2013. All rights reserved.
Customer Benefit
SESAMES winner 2013 Best performance enhanced by
VHBR (Very High Bit Rate) enables SAC ePass transition <1 second
Increase transition efficiently by border control up to 22%
World-wide references (>60 countries) of secure ID solutions from MaskTech GmbH
Best fit for future applications like SAC & LDS2.0
10 years lifetime
Claims and Customer Values
Page 13
2013-11-18
Copyright © Infineon Technologies AG 2013. All rights reserved.
Demonstration
Page 14
2013-11-18
Copyright © Infineon Technologies AG 2013. All rights reserved.
Contact
Page 15
2013-11-18
MaskTech GmbH
Nordostpark 16
D-90411 Nuremberg
Germany
www.masktech.com
P: +49 911 955149-0
Infineon Technologies AG
Am Campeon 1-12
D-85579 Neubiberg
Germany
www.infineon.com
P: +49 (0) 89 234 - 0