the noνa apd readout chip
TRANSCRIPT
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The NOνA APD Readout Chip
Tom ZimmermanFermilab
May 19, 2006
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NOνA Detector Readout Requirements• Record neutrino signal from detector APDs (APD gain ~ 100, C ~ 10pF)• MIP ~ 25 pe gives 2500e input signal• Need low noise front end (< 200 e)• 10 us long beam spill every 2 seconds• Beam spill arrival known to +/- 10 us • Integrate APD signals in 500 ns buckets during a 30 us window• After acquisition, perform Dual Correlated Sampling (DCS) and digitize
to extract pulse height and timing• LSB ~ 100e, max. input = 100Ke: 10-bit dynamic range• Measurement resolution required = a few percent
Original proposed ASIC(“Pipeline” version)
Integrator Shaper Analog pipeline(64 deep)
10-bit ADC(Wilkinson)
DigitalReadout
Write clock500 ns
Read clock~ 5 us
Continuousreset adjust
Hard reset
Continuousreset adjust
Hard reset
APDs32
Output clock
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“Pipeline” version design
10
CK
D
10
Sh
ift
Reg
iste
r
10
GAIN
BW
FE RST FE RST
Compare Count Latch
10-BIT GRAY COUNTER
IN
RAMP GEN.
CONTROL LOGIC
Vref
(One channel of 32 shown)
Writ
e R
ead
Control Section (common to all channels)
Ram
p
Cou
nt Previous
Channel
Next Channel
Integrator: 10 mV/fC
Shaper: programmablegain, shaping
Analog pipeline, 64 deep (32 us)
10-bit ADCDigital output
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Alternate ASIC configuration (“Mux” version)• Would also like to detect supernova neutrino signal (capture 10s of seconds)• Requires near 100% live time (continuous acquisition and digitization)• Use four 8:1 analog multiplexers with external ADCs. Multiplex and
digitize at 8 X [sample freq.] = 8 X [1/500ns] = 16 MHz. Perform DCS and additional processing digitally in FPGA
• Risk: coupling to low noise front end from continuous digitize/readout
Integrator Shaper
Continuousreset adjust
Hard reset
Continuousreset adjust
Hard reset
APDs32 32
8
8
8
8
8:1 Mux
8:1 Mux
8:1 Mux
8:1 Mux
S.E. to diff.output amps
Mux clock
10-bitADC
10
FPG
A
ASIC
10-bitADC
10
10-bitADC
10
10-bitADC
10
Quad ADC
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Which approach for NOνA ?
• Baseline approach: “Mux” ASIC with external ADCs, allowing 100% live time. Required: ASIC + Quad ADC + FPGA.
• Backup approach: “Pipeline” ASIC, allowing separate acquire/digitize cycles if necessary. Required: ASIC + FPGA.
• Prototype ASIC: integrate both approaches on one chip, giving maximum flexibility for optimizing the APD readout strategy. Use TSMC 0.25 micron process.
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10
CK
D
10
Sh
ift
Reg
iste
r
10
10
GAIN
BW
FE RST FE RST
INTEGRATOR SHAPER
SAMPLING PIPELINE (64 deep)
READ AMP
ADC COMPARATOR
ADC COUNT LATCH
10-BIT GRAY COUNTER
APD READOUT CHIP
IN
RAMP GEN.
CONTROL LOGIC
Vref
RingCk RampCntl
(One channel of 32 shown)
GrayCk
Writ
e R
ead
Control Section
Next Ch.
Digital Readout DATA OUT
10
Prev. Ch.
Ram
p
Coun
t
OutCk
Enab
le P
ipel
ine
1
of 4
Ana
log
Rea
dout
s (8
ch.
eac
h)
Serial Program Register
ChipReset
SRCk
Shift Data Clock
ShiftIn Prog. bits
ReadWrite
S.E. to Diff.
ANALOG MUX CNTL.
MUX1
MUX1
Prog. bits
Gain, BW, ...
8 1
NOνA prototype ASICMux versionanalog output
Pipeline versiondigital output
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Integrator• 1 LSB ~ 100e: use 10 mV/fC (CFB = 0.1pF), followed by shaper gain (x2-x10)• 500 ns sample time: M1 is PMOS to avoid significant 1/f noise contribution.• M1 (PMOS) source is referred to VDD, not ground.• Where to refer APD capacitance for best PSRR?• If IBIAS is fixed, then Vgs1 is constant, so Vin = VDD. If CAPD grounded:
Vout/ VDD = Vout/ Vin = CAPD/ CFB = 100 (disaster!!)• If CAPD is referred to VDD:
– Tight input loop (minimizes pickup)– Vout/ VDD = 1 (better!!)
VDD
Vout
CFB
Iin?
CAPD
0.1p
10p
IBIAS
Vgs1Vin
<<IBIAS
M1
10 mV/fC
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• But what about CSTRAY to ground (bond pad, bondwire, etc.)? Ruins PSRR.• Use M2 with Vgs = VDD to generate IBIAS.
Two advantages:– 1. For a given IBIAS, max. Vgs2 yields min. gm2, lowest M2 noise.– 2. IBIAS changes with VDD. Now Vin = ( VDD)[1 - (gm2/gm1)].
If (CSTRAY/CAPD) = (gm2/gm1), then Vout = 0!! (to 1st order).• Typically (gm2/gm1) ~ 0.05:
M2 noise contribution ~ 2%Optimum CSTRAY ~ 0.5pF
• Unavoidable CSTRAY is of order 0.5pF!• Add small programmable input C to gnd.• Make IBIAS (M2 width) programmable.• Tweak for best PSRR!• Assumes same C’s on all channels.
VDD
Vout
CFB
CAPD
0.1p
10p
VDD
CSTRAY
?
Bias current source, Vgs2 = VDD
IBIAS
Iin
Vgs1+Vin
M1
M2
<<IBIAS
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VDD = 20 mV (externally forced transient)
Integrator outputs for 3 different values of Cstray
Cin = 15 pF (to VDD) + Cstray (to gnd, programmable)
Tweak Cstray for best VDD immunity!
Integrator output response to VDD transient
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Shaper
10p 2 – 48K
Vref(0.3V)Cin
Cfb
Vref
1 – 4.5 pF
8R
R
Vout
VinRin
Vref
falltimeadjust
5 x M1
1V range(0.3-1.3V)
110 mV range (0.3-0.41V)(divider keeps M1 linear)
“hard” reset
“continuous” reset
M1
risetimeadjust
gain adjust(x2.2 – x10)
• Risetime set by (RinCin), programmable. Not affected by gain setting.• Voltage gain set by (Cin/Cfb), programmable. Not affected by risetime setting.• External adjustment for falltime. Falltime affected by gain setting (Cfb).• Falltime independent of signal magnitude.
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Shaper output programmable risetime
16 settings give risetime from 57 ns to 446 ns
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Shaper output programmable gain
8 settings give shaper gain from x2.2 to x10.No significant effect on risetime.
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Shaper output with finite fall time
4 values of Vout: 120, 300, 600, 1200 mV(normalized)
(feedback divider gives relatively stable falltime for different output amplitudes)
Vout = 1200 mV
Vout = 120 mV
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Mux Version: single-ended shaper output converted to differential output to drive ADC
Vout+(0.75-1.75V)
common modefeedback
Vout-(1.75-0.75V)
RCM
RCM
VDD/2(1.25V)
R
R
2R
2R
Shapers
Ch. 1
Ch. 2
Ch. 8
Mux 1
Mux 8
0.3 - 1.3V(Vref = 0.3V)
0.8V(Vref + 0.5V)
Differential gain = 2.Output common mode stays at VDD/2.
Single-ended to diff. conversion
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S.E. to diff. amplifier response for different amplitudes (scaled)
30 mV
Vout+ (positive amplifier output)
60 mV
120 mV
240 mV
400 mV1000 mV
nominal amp bias
2X nominal amp bias
10 ns/divCompletely settled in < 40 ns
Vout =
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Differential output [(Vout+) – (Vout-)] for max. amplitude (2V)
0 pFCout =
10 pF20 pF30 pF
400 mV/div
10 ns/div
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VDD = 0.3 mV (from operating the mux).(1 mV/div)
Tweak Cstray for best integrator immunity!Optimum Cstray depends on Cin to VDD.
unbondedchannels
bonded channel,Cin = 15 pF to VDD
Mux readout for 3 different programmed values of Cstray.(10 mV/div)
unbondedchannels
Multiplexer readout with VDD transientVariations at integrator outputs (amplified by shaper) appear at mux output.
Ch. 0 1 2 3 4
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Pipeline Version: 64 deep pipeline + on-chip multichannel Wilkinson ADC
10
CK
D
10
Sh
ift
Reg
iste
r
10
10
SAMPLING PIPELINE (64 deep)
READ AMP
ADC
Vref W
rite
Read
Next Ch.
Prev. Ch.
Ram
p
Gra
y C
ount
Shaper output
READOUT (1 channel shown)
COMPARATOR
Shift
D
ata
LATCH
Read amp out V1V2
Compare Reset
Ramp
Gray Counter Clock
V
V
Comparator flips andlatches Gray count
Digitize V = (V2 – V1):
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Two digitize options• Option 1: cell only
V1 = Read amp reset voltage (Vref) alwaysV2 = Pipeline cell voltage (Vref + excursion due to shaper output)The ADC directly digitizes the shaper signal level sampled by each cell of the pipeline. The signal is always positive with respect to Vref.
• Option 2: DCSV1 = Pipeline cell (n-1) voltageV2 = Pipeline cell (n) voltage
The ADC digitizes the difference between two neighboring pipeline cell voltages (dual correlated sampling). Continuous shaper reset should not be used , since only positive differences can be digitized.
cell 0cell 1
cell 2
Vref
Digitizecell 0
Digitizecell 1
Digitizecell 2
cell 0
cell 1cell 2
Digitize(1 – 0)
Digitize(2 – 1)
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Two acquire/digitize modes
• Mode 1: Separate acquisition and digitization:First acquire signals by filling the pipeline, then stop acquisition.Digitize and readout all pipeline cells.
• Mode 2: Concurrent acquisition and digitization:Acquisition and digitization occur simultaneously (with latency). Range or resolution must be sacrificed in order to digitize every 500 ns.
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Progress to date
• The chip is completely functional.• MUX version: performance is adequate and meets all specs.• PIPELINE version: only the “Separate acquisition and digitization” mode
has been tested. The on-chip ADC digitizes dual correlated samples as desired.
• The DCS digitize option was used to measure noise. • “Concurrent acquisition and digitization” mode not yet studied. Coupling
from digital back end to analog front end???
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Noise Measurements
Conditions:• Integrator input transistor bias current = 1mA• Shaper rise time constant = 206 ns (hard reset, infinite fall time)• Shaper gain = X10 (integrator + shaper = 100 mV/fC)• Dual correlated sample (t = 1000 ns)• Noise downstream from integrator (shaper + ADC) = 41 electrons
(for shaper gain = 10). Subtract this noise from the measurement to get only the integrator noise contribution.
• Many different variations of input transistor W/L.
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49e + 8.4e/pF1540/123e + 10.2e/pF620/121e + 7.9e/pF1540/.68e + 9.5e/pF620/.619e + 7.5e/pF1540/.45e + 8.4e/pF880/.47e + 9.4e/pF620/.414e + 7.3e/pF1540/.329e + 7.7e/pF1200/.326e + 8.5e/pF880/.32DCS noise (e) W/L
• Noise slope measurement is accurate• Noise intercept not as accurate (stray
wiring C ~ 7pF subtracted out)
• The measured noise is lowerthan the simulated noise! High confidence in measurements.
• SVX3 chip noise measurements with NMOS input transistor (TSMC 0.25 u) showed “excess”noise at shorter channel lengths (used L = 0.8u). PMOS shows no such behavior – shorter is better (should have tried L = 0.25u!).
Best: 10 pF noise = 87e20 pF noise = 160e
Integrator Noise Measurements