30. Mai 2012 0 Strictly Confidential

Strictly Confidential

The Precision Company

Corporate Presentation

(May.2012)

30. Mai 2012 1 Strictly Confidential

Key Corporate Facts!

Head Office: Tokyo, Japan.

Established: March, 1949.

Paid-in Capital: US$ 80 Million.

Sales 2009/2010: US$335 Million.

Sales 2010/2011: US$615 Million.

Sales 2011/2012: US$720 Million.

Exchange listing: Tokyo, Japan.

Securities code: 7729.

Employees: ~1600 (31/03/2012)

Key Business: Sales & Manufacture Capital

Equipment.

Managing Directors: Mr. Ota (President & CEO)

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Fast Fab to Market

Accretech Semiconductor

Accretech equipment

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Accretech - A Global Organisation!

Semiconductor Manufacturing Equipment

High Precision Measuring Instruments

Accretech (Europe) GmbH

Accretech (China) Co., Ltd.

Accretech (Malaysia) Sdn.Bhd.

Accretech (Singapore) Pte.Ltd.

Tokyo Seimitsu Co.,

Ltd., Japan

Accretech USA, Inc.

Accretech Vietnam Office Accretech Thailand Office

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Semiconductor

Business Unit

- Wafer Prober Systems

- Dicing Systems

- Polish Grinding systems

- Wafer Inspection

- Edge Grinding (Tosei)

Admin & Finance

Eckard Merz (Vice President)

Wolfgang Bonatz ( President & COO )

Established: 1989

Employees: 50

Headquarter: Munich

Board of Directors:

Mr. Ryuichi Kimura

Mr. Wolfgang Bonatz

Accretech (Europe) GmbH

Metrology

Business Unit

- Surface Measurement Systems

- Contour Measurement Systems

- Inline Gauges (Tosei)

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Sales

Daniel VERVIER

- Wafer Prober Systems

- Dicing Systems

- Polish Grinding systems

- Edge Grinding (Tosei)

Admin & Finance

Annick Lehnebach

Wolfgang Bonatz ( President )

Established: 1993

Employees: 7

Location: Crolles

Accretech (Europe) GmbH french office

Customer Support

- Grgoire MARECHAL (Supervisor)

- Francky DINH (Engineer)

- J-P SCOLARI (Engineer)

- Stphane LEPROVOST Engineer)

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Industry

First!

Industry

First!

Accretech - Key Products

PG-300-RM

Polish Grinding

(W-GM-5200) Edge Grinding

MAHOH

Laser Dicing

UF3000EX / UF3000EX-e

UF2000 / UF200R

(ChaMP)

(WIN-WIN 50)

Wafer

Inspection

Industry

First!

(HRG 300) Grindier

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Diced Frames

Mo

un

ted

Fra

me

s

Probed Frames

Probed Wafers High Yield

Thin Wafer Processing Complete Solution

Functional

Wafer Probe & Sort

Grind & Polish to 30m

Mount Wafers to Frames

Functionaly Probe

& Sort Framed Wafers

Dice Framed Wafers

Blade or Laser

Final Probe & Sort

of Diced Wafers Diced, Tested, Sorted

Framed Wafers

WIN-WIN 50 - UV Brightfield

Patterned Wafer Inspection

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Diced Frames

Mo

un

ted

Fra

me

s

Probed Frames

Probed Wafers High Yield

Thin Wafer Processing Complete Solution

Functional

Wafer Probe & Sort

Grind & Polish to 30m

Mount Wafers to Frames

Functionaly Probe

& Sort Framed Wafers

Dice Framed Wafers

Blade or Laser

Final Probe & Sort

of Diced Wafers Diced, Tested, Sorted

Framed Wafers

WIN-WIN 50 - UV Brightfield

Patterned Wafer Inspection

NEW FP3000 NEW FP3000

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Accretech Dicing Demo Center Munich

What can we offer to our customers?

Sample dicing

Dicing service

Process optimization

Dicing blade evaluation

Mahoh Laser dicing of

sensitive MEMS-Devices

.

Mahoh Laser Dicing

(Clean room class 1000)

Blade Dicing Tools

Laser dicer ML200

ML Separator

Measuring tools

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Thank You

Merci !