The Symposium Secretariat Advanced Integrated Analytical Test Services (S) PTE LTD No 9, Kaki Bukit Road #02-16, Gordon Warehouse Building Singapore - 417842 Attention : Mr. Yaadhav Raaj or Ms Nana Tel/Fax no : 6841 1236 / 6841 1237 Email : raj@a-iats.com Website : http://www.a-iats.com/ The General Chair, Organizing Committee R. Gopala Krishnan PhD Prof Michael Pecht Department of Physics, Director, CALCE National University of Singapore University of Maryland, USA Email: phyrgk@nus.edu.sg Technical Chair A/P Tok Eng Soon Department of Physics, National University of Singapore Organizing Committee

Prof Michael Pecht - Director/CALCE, UMD, USA Dr R Gopala Krishnan - Physics, NUS, Singapore Dr Eng Soon TOK - Assoc. Professor, Physics, NUS, Singapore Prof H T Yum - Korea Surfin Consultant Co, Korea Mr C P Kam - President, SSEA, Singapore Dr K Radha Krishnan - Assoc. Professor, School of EEE, NTU, Singapore Dr Lee Teck Heng - Director, TDC, ITE, Singapore Mr Yaadhav RAAJ - MD, A-IATS (S), PTE LTD, Singapore. Mr Alex Wong - MD, FINTEX Industries PTE LTD, Singapore Ms Pauline Shu - CEL Coatings, Singapore Mr Siva - Director, AMKOR Technology, Singapore Mr SHV Ramanan - Senior Manager, UTAC, Singapore Dr R. Mahendiran - Assoc. Professor, Physics, NUS, Singapore Ms Kamalia Binte Abdul Rahim - Senior Manager, Megamart OE PTE LTD Mr G Srayes - MD, Surface Technologies, Chennai, India. Dr T M Sridhar - Asst. Professor, University of Madras, Chennai, India Mr Seunghyun Park - Uyemura International (Singapore) Pte Ltd Mr Lau Kok Yan - Senior Manager, Singapore Test Services, Singapore Mr Mahendra Chaudhari - GM, SHIMADZU, Singapore Mr Ganesh VP - Infineon, Singapore Dr. V. Joseph - Assoc. Professor, Physics, Loyola College, India.

Symposium/Exhibition Venue The technical symposium, table top exhibition, and education courses will be held in 8-11 Dec 2015 appro-priately in UTown Auditorium 1, Level 1, Town Plaza

National University of Singapore

College Ave West, Singapore – 138607

http://utown.nus.edu.sg/about-university-town/town-plaza/

Solder/Microsolder Interconnect.Reliability Relevance

The enhanced reliability of solder-substrate interface in flexible, bendable, and wearable advanced electronic products is becoming a necessity with the inevitable integrated demands of Tsensors, IoT and eHealth. Solder and lead-free solder Interconnects with tighter pitches, higher volumes, and lower costs have been a constant challenge for the micro bonding landscape. In spite of the tremendous amount of R&D work on manufacturing issues associated with lead-free electronic packages and assemblies, by industry, national labs, consortia, and academia world-wide in the last decade, the reliability advancement of lead-free solder interconnects is still scien-tifically significant, industrially important, and socially relevant. This inaugural symposium provides an overview of the technology trends, and development chal-lenges in methods, materials and applications in the solder-joint engineering arena with special emphasis on upcoming technologies for electronic cluster industries. The primary purpose of this symposium is to bring together the solder/surface engineering profes-sionals, and end users from Asia and ASEAN for R&D and business collaboration opportunities in YOUR SINGAPORE. Technology topics to be addressed include:

Micro- structural evolution and interfacial interactions in lead-free solder interconnects (LFSI)

Lead-free solder joint reliability status and trends

Chemical interactions and reliability testing for LFSI

Tin whisker growth on lead-free solder finishes

Accelerated testing methodology for LFSI.

Thermomechanical reliability prediction, DfR, FEM of LFSI.

Characterization and failure analysis of lead- free solder defects.

LFSI reliability outlook at micron landscape.

Surface finishing/coating development

Surface finish at PCB and chip bond

Substrate pad finish ( NiAu, OSP, SoP,ImSn, ENEPIG, nanocoat )

How to be engaged???...

Technical Symposium : Keynote and invited talks to be held on 9th & 10th Dec 2015 from 09:30hrs to

17:30hrs

Education Courses: In order to groom oneself towards solder interconnect reliability, special education

courses will be held on 8th & 11th Dec 2015 from 09:00hrs to 17:30hrs.

Poster Presentation: Interactive poster presentation and table top exhibition on 9th &10 Dec 2015 from

10:00hrs to 17:00hrs

PROGRAM SCHEDULE: (TENTATIVE)

DAY 1

Tuesday, 8th

December 2015, UTown Auditorium 1, Level 1, Town Plaza EDUCATION COURSE I: Solder and Solder-Surface Finish Reliability

Timing Details of Program

08:30 – 08:55 Morning coffee and registration

09:00 – 09:05

Welcome Address Dr. R. Gopala Krishnan Joint Chair of Symposium, Physics, NUS.

09:05 – 10:30

Physics of Failure Based Reliability Practices – I Prof. Michael Osterman

CALCE, University of Maryland, USA.

10:30 – 11:00 Tea Break

11:00 – 12:30

Physics of Failure Based Reliability Practices - II

Prof. Michael Osterman,

CALCE, University of Maryland, USA.

12::30 – 13:30 Lunch break

13:30 – 14:00

Moderator: Dr. R. Gopala Krishnan Copper Clad Solder Ball ( CCSB ) Technology and Impact Prof. Hee Taik Yum, Korea Surfin Consultant Company, Korea.

14:00 – 14:30

Inductive Microheat-Seed Development for Solder Bonding Dr. R. Gopala Krishnan Department of Physics, NUS, Singapore.

14:30 – 15:30

Statistical Analysis of Reliability Test Data Prof. Cher Ming Tan Chang Gung University, Taiwan.

15:30 – 16:00 Tea Break

16:00 – 17:00

Product Qualification and Supply Chain Responsibilities Prof. Michael Pecht Director, CALCE, University of Maryland, USA.

17:00 End of Session

DAY 2

Wednesday 09th

December 2015, Utown Auditorium 1, Level 1, Town Plaza SYMPOSIUM SESSION: Solder & Solder Joint

Timing Details of Program

08:00 – 08:55 Morning coffee, registration, poster set-up and networking

09:00 – 09:15

Welcome Address Dr. R. Gopala Krishnan Joint Chair of Symposium, Department of Physics, NUS. Prof. Michael Pecht Director, CALCE, University of Maryland, USA. Mr. CP Kam President of Singapore Surface Engineering Association.

09:15–10:00

A Perspective of the IPC Report on Lead-free Electronics ( Keynote ) Prof. Michael Pecht Director/CALCE, University of Maryland, USA.

10:00 – 10:30 Tea Break and poster viewing

10:30 – 11:00

Moderator: Lead-free Solder Plating on Copper Ball Prof. Hee Taik Yum Korea Surfin Consultant Company, Korea.

11:00 – 11:30

Fluxless Flip Chip bonding with SnAgCu

Dr. Teck Kheng Lee

Director, Technology Development Centre,

Institute of Technical Education, Singapore.

11:30 – 12:00

Solid-solution Strengthening in Lead Free Solder Solution

Mr. Wayne Ng Chee Weng

Nihon Superior, Singapore.

12:00 – 12:30

Remaining Issues with Pb-Free Electronics

Prof. Michael Osterman CALCE, University of Maryland, USA.

DAY 3 Thursday, 10

th December 2015, UTown Auditorium 1, Level 1, Town Plaza

SYMPOSIUM SESSION: Thin Film Process and Analysis

Timing Details of Program

08:00 – 08:55 Morning coffee, registration and networking

09:00 – 09:10

Welcome Address Prof Eng Soon Tok

MaGIC Laboratory, Department of Physics, NUS, Singapore.

12:30 – 14:00 Lunch and poster presentation/

Poster viewing & judging

14:00 – 14:30

Moderator: The Second Generation Shock Resistant and Thermally-Reliable Low Ag SAC Solder with Mn Mr. Kenny Chiong Kung Chuan Indium Corporation, Singapore.

14:30 – 15:00

Thermal and Magnetic Properties of Nickel Particulates in SAC305 Solder Dr. S W Ong

MaGIC Laboratory, Department of Physics, NUS, Singapore.

15:00 – 15:30

A REACH-complied Pure Gold Process for Soldering/Bonding Applications

Ms. Priscilla Hong

Metalor, Singapore.

15:30 – 16:00 Tea break and poster viewing and judging

16:00 – 16:30

Moderator: Evaluation of Copper Migration during the Die Attach Curing and Second Wire Bonding Process Dr. Jisheng PAN A*STAR, Singapore.

16:30 – 17:00

Dynamic Nanostructure Evolution and Evaluation by Advanced Analytical TEM Prof. Daniel Chua Department of Materials Science & Engineering, NUS, Singapore.

17:00 Symposium Dinner at Sentosa for invited Guest

09:10–10:00

A Focused Laser Beam: Useful Tool for Nanoscience Re-

search ( Keynote )

Prof. Chorng Haur Sow

Head of Physics Department, NUS, Singapore.

10:00 – 10:30 Tea Break and poster viewing

Poster award by President, Institute of Physics, Singapore

10:30 – 11:00

Moderator: Sputtering and Dry Etching Technique for Interposer to achieve High

Density Wiring Mounting

Mr. Tetsushi Fujinaga

ISET, ULVAC Inc., Japan.

11:00 – 11:30

Solder Interconnection : Strength, Weakness & Opportunities for next generation

Mr. Ranjan Rajoo Global Foundries, Singapore.

11:30 – 12:00

Reactive Deposition of Cobalt Disilicide Nanodots and Nanowires Prof. Eng Soon Tok

MaGIC Laboratory, Department of Physics, NUS, Singapore.

12:00 – 12:30

Fabrication and Evaluation of Thin Film based GaN UV Photodetectors

Dr. L. Ravikiran

School of EEE, Nanyang Technological University, Singapore.

12:30 – 14:00 Lunch and poster viewing

14:00 – 14:30

Moderator: Ion Beam Analysis at CIBA

Prof. Thomas Osipowicz

Director, Center for Ion Beam Applications (CIBA),

Department of Physics, NUS, Singapore.

14:30 – 15:00

Quantitative Nano Physical Properties Measurement by Scanning Probe

Microscope

Dr. Wanxin Sun

Bruker Nano Surface, Singapore.

15:00 – 15:30 TB Announced

15:30 - 16:00 Tea Break

16:00 End of Session

DAY 4

Friday, 11th

December 2015, Global Learning Room, Stephen Riady Centre, Utown.

EDUCATION COURSE II: Practical Surface Engineering Process and Interface

Analysis

Timing Details of Program

08:30 – 08:55 Morning coffee and registration

09:00 – 09:05

Welcome Address Prof. Eng Soon Tok, Department of Physics, NUS, Singapore.

09:05 – 10:00 Surface Engineering: Principle, Equipment and Application

10:00 – 11:00

ESCA: Principle and Applications

Dr. Jisheng PAN

A*STAR, Singapore.

11:00 – 11:30 Tea break

11:30 – 12:30

Electron Beam Technology: Tools and Microelectronic Applications

Mr. Teck Beng Tan

Shimadzu, Singapore.

12:30 – 13:30 Lunch break

13:30-14:30

Moderator: Sample preparation: Recent Advances

Mr. Kenny Lim

Struers, Singapore.

14:30 – 15:30

SIMS and Industrial Applications

Dr. Sin Leng Lim

Surface Science Lab, Physics, NUS, Singapore.

15:30 – 16:00 Tea Break and Lab Visit

16: 00 End of Session

Dr. Michael Osterman, Mechanical Engineering, University of Maryland, College Park) is

a Senior Research Scientist and the director of the CALCE Electronic Products and System

Consortium at the University of Maryland. He heads the development of simulation assisted

reliability assessment software for CALCE and simulation approaches for estimating time to

failure of electronic hardware under test and field conditions. Dr. Osterman has assisted com-

panies with transition to lead-free and in simulation based assessment of electronic assem-

blies. In addition, he has lead CALCE in the study of tin whiskers since 2002 and has au-

thored many key articles related to the tin whisker phenomenon. Dr. Osterman served as a

subject matter expert on phase I and II of the Lead-free Manhattan Project sponsored by Of-

fice of Naval Research in conjunction with the Joint Defense Manufacturing Technical Panel

(JDMTP). Further, he has written various book chapters and more than seventy articles in the

area of electronic products and systems reliability. He is a member of ASME, IEEE, and

SMTA.

Dr. Hee Taik Yum, Received Ph.D. from Seoul National University, and for 23rd years, he

worked as a professor of Metallurgical Dept. of SNU. After retired from SNU, open Korea

Surfin Consultant Co., as a consultant until at present. At 1963, established Korea Institute of

Surface Engineering (society) and became first president of this Society. For 29 years, he has

been technical adviser of Samsung Electro-mechanics Co, Ltd, and for 4 years from 2006-

2010, worked as a president of International Union for Surface Finishing(IUSF) and hosted as

a chairman of world congress of Interfinish2008 at Busan, Korea. He has also published sev-

eral books on metal finishing. Recently, he has co-developed with MKE Co., Ltd,, manufac-

turer of gold lead wires and solder balls, on lead-free solder(SAC) electroplating on copper

core balls(CCSB) sizing 120-180 um.

Dr. Gopal Krishnan, Received Doctoral degree from Physics Department/National Uni-

versity of Singapore (NUS) and currently works as Technical Advisor and consultant sup-

porting Scientific Research and Industry Technology Development through advanced analyt-

ical technologies and road mapping. He has founded the Symposium on Surface Engineering

for Industrial Applications at Singapore in 2005 with SSEA and has been the conference

General Chair/Joint-Chair at Singapore, Chennai/India and Russia. He has founded A-IATS/

Singapore (http://www.a-iats.com/) and Surface/Technologies/Chennai/INDIA and play ad-

visory role. Dr Krishnan is also serving as Senior Research Fellow (Adj) at Physics, NUS,

Singapore since 2010 and is reachable at (phyrgk@nus.edu.sg) or http://

www.researchgate.net/profile/Gopal_Krishnan2

Prof. Cher Ming Tan, received his Ph.D. in Electrical Engineering from the University of

Toronto in 1992. He has 8 years of working experiences in reliability in electronic industry

(both Singapore and Taiwan) before joining Nanyang Technological University (NTU) as

faculty member in 1996 till 2014. He is now a Professor in Chang Gung University, Taiwan

and Executive Director of Institute of Reliability Science and Technology, Taiwan. He has

published more than 260 International Journal and Conference papers, and holding 10 patents

ABOUT THE SPEAKERS AND FACILITATORS:

and 1 copyright for reliability software. He has given more than 50 invited talks in Internation-

al Conferences. He has written 5 books and 4 book chapters in the field of reliability. He is

also the Series Editor of Springer Brief in Reliability.

Prof Michael Pecht, has a BS in Acoustics (Physics Department), an MS in Electrical Engi-

neering and an MS and PhD in Engineering Mechanics from the University of Wisconsin at

Madison. He is a Professional Engineer, an IEEE Fellow, an ASME Fellow, an SAE Fellow,

and an IMAPS Fellow. He is a world renowned expert in strategic planning, design, testing, IP

and risk assessment of electronic products and systems. In 2011, he received the University of

Maryland’s Innovation Award for his new concepts in risk management. In 2010, he received

the IEEE Exceptional Technical Achievement Award for his innovations in the area of prog-

nostics and systems health management. In 2008, he was awarded the highest reliability hon-

or, the IEEE Reliability Society’s Lifetime Achievement Award. He previously received the

European Micro and Nano-Reliability Award for outstanding contributions to reliability re-

search, 3M Research Award for electronics packaging, and the IMAPS William D. Ashman

Memorial Achievement Award for his contributions in electronics analysis. He is the editor in

chief of IEEE Access, served as chief editor of the IEEE Transactions on Reliability for eight

years, was chief editor for Microelectronics Reliability for seven years, an associate editor for

the IEEE Transactions on Components and Packaging Technology, and on the advisory board

of IEEE Spectrum. He is the founder and Director of CALCE (Centre for Advanced Life Cy-

cle Engineering) at the University of Maryland, which is funded by over 150 of the world’s

leading electronics companies at more than US$6M/year. CALCE received the NSF Innova-

tion Award in 2009. He is currently a Chair Professor in Mechanical Engineering and a Pro-

fessor in Applied Mathematics at the University of Maryland. He has written more than 20

books on product reliability, development, use and supply chain management and over 500

technical articles. He has also written a series of books on the electronics industry in China,

Korea, Japan, and India. He consults for 22 international companies.

Dr. Jisheng Pan, received his B.Sc. in Physics from Hangzhou University (currently,

Zhejiang University) in 1985 and his M.Sc. in Nuclear Physics in 1988 from Shanghai Insti-

tute of Nuclear Research (currently, Shanghai Institute of applied Physics), Chinese Academy

of Sciences, where he worked for 6 years in nuclear technology. He graduated in 1998 with

his PhD in surface physics from National University of Singapore. Currently, he is a senior

scientist and photoemission spectroscopy (PES) group leader in IMRE. He has also provided

surface analysis and consulting service to many local and international companies in Singa-

pore. Dr. Pan has received many awards including achievement award from A*Star aerospace

programme in 2015, assessor award (silver) from Singapore Accreditation Council (SAC) in

2015, He is a session chairman in European Conference on Surface Science 2015, a technical

assessor for Singapore Accreditation Council (SAC), a technical committee member of ISO/

TC 201 surface chemical analysis, Singapore, one of editors, Journal of Spectroscopy, a mem-

ber of MRS (USA), MRS (Singapore), IPS (Singapore) and NSC (China).

Mr. Teck Beng Tan, is Product Specialist in Shimadzu Asia Pacific for OES, XRF, XRD,

EPMA, SPM and ESCA. He has conducted numerous Application Seminars and Workshops on

Materials Characterization/Failure Analysis/Restriction of Hazardous Substances to greater than

200 companies in countries supported by Shimadzu Asia Pacific. He has an MSc degree in Ma-

terials Science from the National University of Singapore

Mr. Kenny Lim, has graduated with a Bachelor of Business in Administration. He has been

working with Struers/Singapore since May 2007 and trained as a TRAINER, sharing his

knowledge and skills through training courses around this ASEAN region. He is specialized in

sample preparation, especially electronic parts. Currently he serves as an Area Sales Manager at

Struers, Singapore.

Dr. Sin Leng Lim, received his BSc (Honors) and PhD (Physics) degrees from National Uni-

versity of Singapore (NUS). He had many years of experience in technology development with

the semiconductor foundry industry, before resuming current research position with the Surface

Science Laboratory of Physics Department, NUS. His works include academic materials re-

search and industrial consultation services, in the fields of surface and interface analysis. His

main research interest is in the study of semiconductor materials using secondary ion mass

spectrometry (SIMS).

Dr. Teck Kheng Lee, received the B.S. degree in mechanical engineering and the M.S.

degree in materials science and engineering from the National University of Singapore in

1995 and 1999, respectively and the Ph.D. degree in Mechanical and Aerospace Engineer-

ing from the Nanyang Technology University, Singapore, in 2006. He had been with the

semiconductor packaging industry for eighteen years, working from the historical package

of DIP to flip-chip packages, WLCsp and system-in-package. He joined the Institute of Mi-

croelectronics (IME), Singapore, in 1997, researching in the areas of MEMS, CSP, and flip-

chip packaging. In 1999, he joined Micron Semiconductor Asia Pte Ltd as a Senior Tech-

nical Member, responsible for substrate supplier management and leading some research

programs in the field of advanced packaging and material characterization. He is currently

the director of Technology Development Centre (TDC) for ITE College Central, leading a

team of engineers and researchers to support the local industry development in Semiconduc-

tor, Automation, and ICT and electronics sector. Under the leadership, the TDC center have

secured more than 15 grants worth S$4.6M. He has authored and co-authored more than 60

papers in journal and international conferences. Currently, he holds 64 U.S patents, pending

another 20 U.S patents from issuing. He has served as a Technical committee member for

Singapore Chinese Chamber of Commerce (SCCCI), Semiconductor Equipment and Mate-

rials International (SEMI) and Institute of Engineering, Singapore (IES). He is also listed as

Who’s Who in the World 2007, 2013-2015 as well as listed of IBC Leading Engineers of

the World in 2013-2015. Currently, he acts as co-convenor to represent Singapore in re-

viewing IEC standard for Semiconductor and IC packaging.

Mr. Wayne Ng Chee Weng, is Regional Technical Manager of Nihon Superior Co.

Ltd. He is reporting directly to Nihon Superior, Japan headquarter and stationing at Sin-

gapore to oversee the regional markets. He is handling the technical matters of Nihon

Superior products and providing application consultancy to customers. With feedback

from the field, he is helping company to develop products which can fit the market better.

Wayne obtained his first degree in Mechanical-Industrial Engineering with First Class

Honour in 2003 from University of Technology Malaysia. He had furthered his studies in

the same university and graduated with Master of Engineering (Mechanical) with the re-

search project of Integrated Circuit Package Reliability sponsored by Intel Malaysia. He

is certified in PMP and CIT IPC-A-610. Before joining Nihon Superior, he held position

in IC package development department of Infineon Technologies Asia Pacific and prod-

uct reliability and quality management in Micron Semiconductor Asia, Singapore.

Mr. Kenny Chiong Kung Chuan, is the Senior Technical Support Engineer and is

based in Singapore. He provides the technical support in the Southeast Asia region,

which covers Malaysia, Singapore, and Indonesia. Working closely with customers in the

semiconductor and surface mount technology industries, he helps them optimize their

processes, troubleshoots, and offers solutions. Kenny has more than 5 years of experi-

ence, primarily in the areas of PCB assembly and surface mount technology. He earned

his bachelor’s degree in mechanical engineering, majoring in advanced manufacturing

system. Kenny is an SMTA-certified Process Engineer and has earned his Six Sigma

Green Belt.

Dr Ong Sheau Wei, received her Ph.D. from Department of chemistry, National Uni-

versity of Singapore. Her research areas is primarily focus on computational and experi-

mental studies related to surface science and interface analysis of semiconducting materi-

als. She is currently a research fellow with the Electronic Materials Growth and Interface

Characterization (εMaGIC) Laboratory at Department of Physics, NUS. Before returning

to Singapore in 2014, she has worked as a research fellow with National Central Univer-

sity of Taiwan.

Ms. Priscilla Hong, holds a BSc degree in Chemistry, MSc degree in Materials Sci-

ence & Engineering, MSc degree in Safety, Health and Environmental Technology and a

Graduate Diploma in Analytical Chemistry from the National University of Singapore.

She is currently completing the final requirements for her doctoral degree. Priscilla began

her career in Reckitt & Colman, Singapore (currently, Reckitt Benckiser) in Research &

Development. She has worked with her current employer, Metalor Technologies, Singa-

pore, for the past 12years. She is now an Executive Council Member of the Singapore

Surface Engineering Association.

Prof. Daniel Chua, received his PhD from University of Cambridge in 2004 where he

joined the Department of Materials Science and Engineering in 2005. He has been work-

ing in the field of carbon and carbon based materials, growth, processing and applying

these diamond-like coatings, carbon nanotubes, graphene and other nano-carbon related

work in various areas such as ultra-hard coatings, electron emitters and clean energy gen-

erators.

Prof. Sow Chorng Haur, received a B.Sc. Degree (1st Class) in Physics from the Nation-

al University of Singapore (NUS) in 1991. After spending two more years in NUS for re-

search, he received a M.Sc. degree in Physics. He then went on to The University of Chicago

and completed his PhD degree in 1998. During the period in 1999-2000, he worked as a

postdoctoral fellow at Bell Laboratory, Lucent Technologies. He returned and joined the De-

partment of Physics, NUS in 2001. He is now the head of the Department of Physics at NUS.

He has authored and co-authored over 300 papers in the field of nanoscience and nano-

materials. His current research interest include, Colloid Interactions, Nanostructured Func-

tional Materials and their Unique Physical properties, Assembly and Phase Transitions and

Carbon Nanotubes and Graphene. A firm believer of “Science for all”, he developed the

highly interactive Physics Demonstration Laboratory in NUS. The “Demo Lab” has since

received more than 5,000 visitors, playing host to students at levels ranging from Primary

Schools to University. More details are at http://www.physics.nus.edu.sg/staff/sowch.html

Mr. Ranjan Rajoo, is currently a Member of Technical staff, OSAT supply chain manage-

ment / turnkey engineering with Global foundries. Prior to joining he was researcher with A-

star Institute of Microelectronics (IME) for 15 years in Microsystem, Design & Simulation

task. His area of research was 2.5D, 3DIC using TSVs, ultra-thin chip embedding and wafer

level packaging. His expertise are characterization of mechanical & moisture properties of

electronics packaging materials. He has set up new & novel experimental techniques to char-

acterize electronics packaging materials, assembly process interaction & accelerated reliabil-

ity, drop, impact and vibration testing. He has authored and co-authored more than 60 papers

in journal and international conferences. He received 2 outstanding papers in prestigious con-

ferences. He has given invited talks in the area of lead free solder/ Halogen Free printed cir-

cuits boards. Currently, he holds 6 U.S patents and 2 patents have been commercialized. He

is also a member of IEEE, CPMT and IMAPS societies. He‘s in the organizing committee

for EPTC.

Prof. Tok Eng Soon, received his BSc (Honours in Chemistry and Physics) at the National

University of Singapore and PhD in Semiconductor Materials at Imperial College London.

He joined NUS in 1999 as an Assistant Professor with the Department of Materials Science

before moving to the Department of Physics as Associate Professor in 2005. He will continue

his joint appointments with the Department of Physics, Yale-NUS and University Scholars

Programmme.

Dr L Ravikiran, received his M.Tech degree in Materials Science from Indian Institute of

Technology Bombay, India in 2009. He received his Ph.D. degree from the School of Elec-

trical and Electronic engineering, Nanyang Technological University, Singapore 2015, where

he is currently involved as a Post-doctoral researcher. His research interests include molecu-

lar beam epitaxy (MBE) growth of III-N based materials and their characterization for appli-

cations in high electron mobility transistors, UV detectors and gas sensors. He has authored

and co-authored more than 10 international journals and conference presentations during his

brief research stint.

Dr K Radhakrishnan is an Associate Professor in the School of Electrical and Electronic

Engineering at Nanyang Technological University, Singapore. He was the Principal Investi-

gator for several major research projects related to the epitaxial growth of III-V Compound

Semiconductors, devices and circuits over the years, primarily using arsenide and phosphide

based material systems. His current research interests include MBE/MOCVD thin film

growth and characterization of III-nitrides for various applications such as high power RF

devices, UV detectors and gas sensors. His other research interests include synthesis and fab-

rication of oxide based thin film solar cells. He has authored and co-authored more than 200

international journal and conference papers and delivered invited talks at several internation-

al conferences. In 2007, he was one of the recipients of the prestigious Singapore’s Defense

Technology Prize for his technological contributions in MMIC (microwave monolithic inte-

grated circuits) R & D.

Prof. Thomas Osipowicz,

Dr. Wanxin Sun, holds a PhD degree in Physics, M.Eng. and B.Eng. degrees in precision

metrology and instrumentation. During his research career, he accumulated rich experience

in characterization of nanomaterial and nanodevice through microscopic and spectroscopic

techniques, including characterizing semiconductor devices through nano-electric methods,

strain/stress analysis in silicon devices through vibrational spectroscopy at nanometer scale.

His expertise has been recognized by failure analysis community. He has developed several

microscopic techniques, published more than 40 papers in international journals, and has

been inventor of several US patents. He has been invited to give presentation reputable inter-

national conference, including ICMAT, IEEE Nanomedicine, Chinese National Conference

of Dielectric Materials and Devices, Congress of Chinese Chemical Society, Chinese Nation-

al Conference of Light Scattering. Besides his own research/develop work, he is also active

in relevant societies and takes the duty of chairing sessions in relevant international confer-

ences. He is now working with Bruker Nanosurface Division. His main responsibility is to

develop applications of new technologies in scanning probe microscopy and 3D optical mi-

croscopy.

LOCATE your VENUE:

MRT/BUS: From Clementi = Walk to Clementi Bus Stop, Bus Stop No.

17179, from Clementi MRT Station (Exit B). Board Bus 183(towards

Jurong East Temp Interchange). Alight 3 stops later at Bus Stop No.

17099. Walk approximately 8 to 10 minutes to UTown

From Kentridge MRT = Walk to Kent Ridge Bus Stop, Bus Stop

No. 18331, from Kent Ridge MRT Station (Exit A). Board NUS Inter-

nal Bus Shuttle D2. Alight 5 stops later at UTown

Please note that parking at UTown is available at Stephen Riady

Centre's basement car park (postal code: 138607) .

Refer : http://utown.nus.edu.sg/assets/Uploads/Documents/KRC

-Parking-Rates.pdf