The Symposium Secretariat Advanced Integrated Analytical Test Services (S) PTE LTD No 9, Kaki Bukit Road #02-16, Gordon Warehouse Building Singapore - 417842 Attention : Mr. Yaadhav Raaj or Ms Nana Tel/Fax no : 6841 1236 / 6841 1237 Email : raj@a-iats.com Website : http://www.a-iats.com/ The General Chair, Organizing Committee Dr. R. Gopala Krishnan Prof. Michael Pecht Department of Physics, Director, CALCE National University of Singapore University of Maryland, USA Email: phyrgk@nus.edu.sg Technical Chair Prof. Tok Eng Soon Department of Physics, National University of Singapore Organizing Committee

Prof Michael Pecht - Director/CALCE, UMD, USA Dr R Gopala Krishnan - Physics, NUS, Singapore Dr Eng Soon TOK - Assoc. Professor, Physics, NUS, Singapore Prof H T Yum - Korea Surfin Consultant Co, Korea Mr C P Kam - President, SSEA, Singapore Dr K Radha Krishnan - Assoc. Professor, School of EEE, NTU, Singapore Dr Lee Teck Kheng - Director, TDC, ITE, Singapore Mr Yaadhav RAAJ - MD, A-IATS (S), PTE LTD, Singapore. Mr Alex Wong - MD, FINTEX Industries PTE LTD, Singapore Ms Pauline Shu - CEL Coatings, Singapore Mr Siva - Director, AMKOR Technology, Singapore Mr SHV Ramanan - Senior Manager, UTAC, Singapore Dr R. Mahendiran - Assoc. Professor, Physics, NUS, Singapore Ms Kamalia Binte Abdul Rahim - Senior Manager, Megamart OE PTE LTD Mr G Srayes - MD, Surface Technologies, Chennai, India. Dr T M Sridhar - Asst. Professor, University of Madras, Chennai, India Mr Seunghyun Park - Uyemura International (Singapore) Pte Ltd Mr Lau Kok Yan - Senior Manager, Singapore Test Services, Singapore Mr Mahendra Chaudhari - GM, SHIMADZU, Singapore Mr Ganesh VP - Infineon, Singapore Dr. V. Joseph - Assoc. Professor, Physics, Loyola College, India.

Symposium/Exhibition Venue The technical symposium, table top exhibition, and education courses will be held in 8-11 Dec 2015 appro-priately in UTown Auditorium 1, Level 1, Town Plaza

National University of Singapore

College Ave West, Singapore – 138607

http://utown.nus.edu.sg/about-university-town/town-plaza/

WELCOME MESSAGE

Welcome to the First Symposium on Solder Interconnect Reliability at NATIONAL UNIVERSITY OF SINGAPORE

The RoHS directive was updated in July 2011 as RoHS 2 , and although it did not restrict any additional materials, the

directive provided deadlines for some exempted applications unless a technical reason was provided for continuing the exemp-

tion. In particular, the RoHS 2 directive required medical devices and monitoring and control instruments to comply with cur-

rent RoHS restrictions by July 2014 and industrial control and monitoring instruments to comply by July 2017. For all other

equipment, unless explicitly excluded, compliance is required by July 2019. The electrical and electronic equipment explicitly

excluded were equipment used in military and space applications, large-scale stationary industrial tools, large-scale fixed instal-

lations, implantable medical devices, transportation applications (except for electric two-wheel vehicles), non-road mobile ma-

chinery, photovoltaic panels designed for permanent use, and equipment designed solely for the purpose of research and devel-

opment . The use of high melting temperature–type solders (i.e., lead-based alloys containing 85% or more lead by weight) re-

mained exempt in the RoHS 2 directive for all applications. However, since all exemptions are bound to expire at some point in

the near future, the electronics industry will need to continually evaluate the options if the exemptions are to expire. Further-

more, today there are numerous types of lead-free solders that are being developed and investigated for next generation applica-

tions.

This symposium addresses the various reliability issues with solder interconnects. These issues include the use of exist-

ing solders in new applications requiring more extreme environmental and operating conditions, as well as longer lifetimes. In

addition, the reliability assessment and concerns with the newly developed solders will be addressed. We look forward to the

state of the art presentations and lively discussion on these important topics.

This inaugural platform at National University of Singapore will provide academics and Industry captains an oppor-

tunity to exchange the latest information on Solder-Surface Finish Joint reliability and allied technology coupled with the in-

dustry -centric education for aspiring 0.5billion students in this region. At the same time, we warmly welcome you to “YOUR

SINGAPORE” – an experience of a lifetime!

Dr. R. Gopala Krishnan

Joint Chair of Symposium

Department of Physics,

NUS

Prof. Michael Pecht

Joint Chair of Symposium

University of Maryland

USA

Mr. C P Kam

President

Singapore Surface

Engineering Association

Solder/Microsolder Interconnect.Reliability Relevance

The enhanced reliability of solder-substrate interface in flexible, bendable, and wearable advanced electronic products is becoming a necessity with the inevitable integrated demands of Tsensors, IoT and eHealth. Solder and lead-free solder Interconnects with tighter pitches, higher volumes, and lower costs have been a constant challenge for the micro bonding landscape. In spite of the tremendous amount of R&D work on manufacturing issues associated with lead-free electronic packages and assemblies, by industry, national labs, consortia, and academia world-wide in the last decade, the reliability advancement of lead-free solder interconnects is still scien-tifically significant, industrially important, and socially relevant. This inaugural symposium provides an overview of the technology trends, and development chal-lenges in methods, materials and applications in the solder-joint engineering arena with special emphasis on upcoming technologies for electronic cluster industries. The primary purpose of this symposium is to bring together the solder/surface engineering profes-sionals, and end users from Asia and ASEAN for R&D and business collaboration opportunities in YOUR SINGAPORE. Technology topics to be addressed include:

Micro- structural evolution and interfacial interactions in lead-free solder interconnects (LFSI)

Lead-free solder joint reliability status and trends

Chemical interactions and reliability testing for LFSI

Tin whisker growth on lead-free solder finishes

Accelerated testing methodology for LFSI.

Thermomechanical reliability prediction, DfR, FEM of LFSI.

Characterization and failure analysis of lead- free solder defects.

LFSI reliability outlook at micron landscape.

Surface finishing/coating development

Surface finish at PCB and chip bond

Substrate pad finish ( NiAu, OSP, SoP,ImSn, ENEPIG, nanocoat )

HIGHLIGHTS OF THE SYMPOSIUM:

Technical Symposium : Keynote and invited talks to be held on 9th & 10th Dec 2015 from 09:00hrs to

16:30hrs

Education Courses: In order to groom oneself towards solder interconnect reliability, special education

courses will be held on 8th & 11th Dec 2015 from 09:00hrs to 17:00hrs.

Poster Presentation: Interactive poster presentation and table top exhibition on 9th &10 Dec 2015 from

10:00hrs to 17:00hrs

PROGRAM SCHEDULE:

DAY 1

Tuesday, 8th

December 2015, UTown Auditorium 1, Level 1, Town Plaza EDUCATION COURSE I: Solder and Solder-Surface Finish Reliability

Timing Details of Program

08:30 – 08:55 Registration

09:00 – 09:05

Welcome Address Dr. R. Gopala Krishnan Joint Chair of Symposium, Physics, NUS.

09:05 – 10:30

Physics of Failure Based Reliability Practices – I Prof. Michael Osterman

CALCE, University of Maryland, USA.

10:30 – 11:00 Tea Break

11:00 – 12:30

Physics of Failure Based Reliability Practices - II

Prof. Michael Osterman,

CALCE, University of Maryland, USA.

12::30 – 13:30 Lunch Break

13:30 – 14:00

Moderator: Dr. R. Gopala Krishnan Copper Clad Solder Ball ( CCSB ) Technology and Impact Prof. Hee Taik Yum, Korea Surfin Consultant Company, Korea.

14:00 – 14:30 Inductive Microheat-Seed Development for Solder Bonding S. Arun Kumar, Dr. R. Gopala Krishnan, Eng Soon Tok Department of Physics, NUS, Singapore.

14:30 – 15:30 Statistical Analysis of Reliability Test Data Prof. Cher Ming Tan Chang Gung University, Taiwan.

15:30 – 16:00 Tea Break

16:00 – 17:00

Product Qualification and Supply Chain Responsibilities

Prof. Michael Pecht

Director, CALCE, University of Maryland, USA.

17:00 End of Session

DAY 2

Wednesday 09th

December 2015, Utown Auditorium 1, Level 1, Town Plaza SYMPOSIUM SESSION: Solder & Solder Joint

Timing Details of Program

08:00 – 08:55 Registration, poster set-up and networking

09:00 – 09:15

Welcome Address & official opening by Guest of Honour: Prof. Sow Chorng Haur Head, Department of Physics, NUS Welcome Address: Dr. R. Gopala Krishnan & Prof. Michael Pecht Joint Chair of Symposium. Mr. CP Kam President of Singapore Surface Engineering Association.

09:15–10:00

A Perspective of the IPC Report on Lead-free Electronics (Keynote) Prof. Michael Pecht Director/CALCE, University of Maryland, USA.

10:00 – 10:30 Tea Break and poster viewing

10:30 – 11:00

Moderator: Dr. R. Gopala Krishnan

Lead-free Solder Plating on Copper Ball

Prof. Hee Taik Yum

Korea Surfin Consultant Company, Korea.

11:00 – 11:30

Fluxless Flip Chip bonding with SnAgCu

Dr. Teck Kheng Lee

Director, Technology Development Centre,

Institute of Technical Education, Singapore.

11:30 – 12:00

Solid-solution Strengthening in Lead Free Solder Solution

Mr. Wayne Ng Chee Weng

Nihon Superior, Singapore.

12:00 – 12:30

Remaining Issues with Pb-Free Electronics

Prof. Michael Osterman CALCE, University of Maryland, USA.

DAY 3

Thursday, 10th

December 2015, UTown Auditorium 1, Level 1, Town Plaza

SYMPOSIUM SESSION: Thin Film Process and Analysis

Timing Details of Program

08:00 – 08:55 Registration and networking

09:00 – 09:10

Welcome Address Prof Eng Soon Tok

MaGIC Laboratory, Department of Physics, NUS, Singapore.

09:10 - 10:00

A Focused Laser Beam: Useful Tool for Nanoscience Research ( Keynote ) Prof. Chorng Haur Sow

Head of Physics Department, NUS, Singapore.

12:30 – 14:00 Lunch and poster presentation/

Poster viewing & judging

14:00 – 14:30

Moderator: Prof. Eng Soon Tok

The Second Generation Shock Resistant and Thermally-Reliable Low Ag

SAC Solder with Mn

Mr. Kenny Chiong Kung Chuan

Indium Corporation, Singapore.

14:30 – 15:00

Thermal and Magnetic Properties of Nickel Particulates in SAC305 Solder

Dr. S W Ong

MaGIC Laboratory, Department of Physics, NUS, Singapore.

15:00 – 15:30

A REACH-complied Pure Gold Process for Soldering/Bonding Applications

Ms. Priscilla Hong

Metalor, Singapore.

15:30 – 16:00

Moderator: Prof. Eng Soon Tok Dynamic Nanostructure Evolution and Evaluation by Advanced Analytical TEM Prof. Daniel Chua Department of Materials Science & Engineering, NUS, Singapore.

16:00 - 16:30 Tea Break and poster viewing/judging &

Assemble for Symposium Dinner at Sentosa for invited Guest

10:00 – 10:30 Tea Break and poster viewing

Poster award by Prof. Sow Chorng Haour, President, Institute of Physics, Singapore

10:30 – 11:00

Moderator: Prof. Eng Soon Tok Sputtering and Dry Etching Technique for Interposer to achieve High Den-

sity Wiring Mounting

Mr. Tetsushi Fujinaga

ISET, ULVAC Inc., Japan.

11:00 – 11:30

Solder Interconnection : Strength, Weakness & Opportunities for next generation

Mr. Ranjan Rajoo Global Foundries, Singapore.

11:30 – 12:00

Reactive Deposition of Cobalt Disilicide Nanodots and Nanowires Prof. Eng Soon Tok

MaGIC Laboratory, Department of Physics, NUS, Singapore.

12:00 – 12:30

Fabrication and Evaluation of Thin Film based GaN UV Photodetectors

Dr. L. Ravikiran

School of EEE, Nanyang Technological University, Singapore.

12:30 – 14:00 Lunch and poster viewing

14:00 – 14:30

Moderator: Dr. Radhakrishnan / Prof. Eng Soon Tok Ion Beam Analysis at CIBA Prof. Thomas Osipowicz

Director, Center for Ion Beam Applications (CIBA),

Department of Physics, NUS, Singapore.

14:30 – 15:00

Quantitative Nano Physical Properties Measurement by Scanning Probe

Microscope

Dr. Wanxin Sun

Bruker Nano Surface, Singapore.

15:00 – 15:30

Evaluation of Copper Migration during the Die Attach Curing and Second Wire Bonding Process Dr. Jisheng PAN A*STAR, Singapore.

15:30 - 16:00 Tea Break / End of Session

DAY 4

Friday, 11th

December 2015, Global Learning Room, Stephen Riady Centre, Utown.

EDUCATION COURSE II: Practical Surface Engineering Process and Interface

Analysis

Timing Details of Program

08:30 – 08:55 Registration

09:00 – 09:05

Welcome Address Prof. Eng Soon Tok, Department of Physics, NUS, Singapore.

09:05 – 10:00 Surface Engineering: Principle, Equipment and Application

10:00 – 11:00

ESCA: Principle and Applications

Dr. Jisheng PAN

A*STAR, Singapore.

11:00 – 11:30 Tea break

11:30 – 12:30

Electron Beam Technology: Tools and Microelectronic Applications

Mr. Teck Beng Tan

Shimadzu, Singapore.

12:30 – 13:30 Lunch break

13:30-14:30

Moderator: Dr. R. Gopala Krishnan

Sample preparation: Recent Advances

Mr. Kenny Lim

Struers, Singapore.

14:30 – 15:30

SIMS and Industrial Applications

Dr. Sin Leng Lim

Surface Science Lab, Physics, NUS, Singapore.

15:30 – 16:00 Tea Break and Lab Visit

16: 00 End of Session

Dr. Michael Osterman, Mechanical Engineering, University of Maryland, College Park) is

a Senior Research Scientist and the director of the CALCE Electronic Products and System

Consortium at the University of Maryland. He heads the development of simulation assisted

reliability assessment software for CALCE and simulation approaches for estimating time to

failure of electronic hardware under test and field conditions. Dr. Osterman has assisted com-

panies with transition to lead-free and in simulation based assessment of electronic assem-

blies. In addition, he has lead CALCE in the study of tin whiskers since 2002 and has au-

thored many key articles related to the tin whisker phenomenon. Dr. Osterman served as a

subject matter expert on phase I and II of the Lead-free Manhattan Project sponsored by Of-

fice of Naval Research in conjunction with the Joint Defense Manufacturing Technical Panel

(JDMTP). Further, he has written various book chapters and more than seventy articles in the

area of electronic products and systems reliability. He is a member of ASME, IEEE, and

SMTA.

Dr. Hee Taik Yum, Received Ph.D. from Seoul National University, and for 23rd years, he

worked as a professor of Metallurgical Dept. of SNU. After retired from SNU, open Korea

Surfin Consultant Co., as a consultant until at present. At 1963, established Korea Institute of

Surface Engineering (society) and became first president of this Society. For 29 years, he has

been technical adviser of Samsung Electro-mechanics Co, Ltd, and for 4 years from 2006-

2010, worked as a president of International Union for Surface Finishing(IUSF) and hosted as

a chairman of world congress of Interfinish2008 at Busan, Korea. He has also published sev-

eral books on metal finishing. Recently, he has co-developed with MKE Co., Ltd,, manufac-

turer of gold lead wires and solder balls, on lead-free solder(SAC) electroplating on copper

core balls(CCSB) sizing 120-180 um.

Dr. Gopal Krishnan, Received Doctoral degree from Physics Department/National Uni-

versity of Singapore (NUS) and currently works as Technical Advisor and consultant sup-

porting Scientific Research and Industry Technology Development through advanced analyt-

ical technologies and road mapping. He has founded the Symposium on Surface Engineering

for Industrial Applications at Singapore in 2005 with SSEA (http://www.aseansurfin.org/)

and has been the conference General Chair/Joint-Chair at Singapore, Chennai/India and Rus-

sia. He has founded A-IATS/Singapore (http://www.a-iats.com/) and Surface/Technologies/

Chennai/INDIA and play advisory role. Dr Krishnan is also serving as Senior Research Fel-

low (Adj) at Physics, NUS, Singapore since 2010 and is reachable at (phyrgk@nus.edu.sg) or

http://www.researchgate.net/profile/Gopal_Krishnan2

Prof. Cher Ming Tan, received his Ph.D. in Electrical Engineering from the University of

Toronto in 1992. He has 8 years of working experiences in reliability in electronic industry

(both Singapore and Taiwan) before joining Nanyang Technological University (NTU) as

faculty member in 1996 till 2014. He is now a Professor in Chang Gung University, Taiwan

and Executive Director of Institute of Reliability Science and Technology, Taiwan. He has

published more than 260 International Journal and Conference papers, and holding 10 patents

ABOUT THE SPEAKERS AND FACILITATORS:

and 1 copyright for reliability software. He has given more than 50 invited talks in Internation-

al Conferences. He has written 5 books and 4 book chapters in the field of reliability. He is

also the Series Editor of Springer Brief in Reliability.

Prof Michael Pecht, has a BS in Acoustics (Physics Department), an MS in Electrical Engi-

neering and an MS and PhD in Engineering Mechanics from the University of Wisconsin at

Madison. He is a Professional Engineer, an IEEE Fellow, an ASME Fellow, an SAE Fellow,

and an IMAPS Fellow. He is a world renowned expert in strategic planning, design, testing, IP

and risk assessment of electronic products and systems. In 2011, he received the University of

Maryland’s Innovation Award for his new concepts in risk management. In 2010, he received

the IEEE Exceptional Technical Achievement Award for his innovations in the area of prog-

nostics and systems health management. In 2008, he was awarded the highest reliability hon-

or, the IEEE Reliability Society’s Lifetime Achievement Award. He previously received the

European Micro and Nano-Reliability Award for outstanding contributions to reliability re-

search, 3M Research Award for electronics packaging, and the IMAPS William D. Ashman

Memorial Achievement Award for his contributions in electronics analysis. He is the editor in

chief of IEEE Access, served as chief editor of the IEEE Transactions on Reliability for eight

years, was chief editor for Microelectronics Reliability for seven years, an associate editor for

the IEEE Transactions on Components and Packaging Technology, and on the advisory board

of IEEE Spectrum. He is the founder and Director of CALCE (Centre for Advanced Life Cy-

cle Engineering) at the University of Maryland, which is funded by over 150 of the world’s

leading electronics companies at more than US$6M/year. CALCE received the NSF Innova-

tion Award in 2009. He is currently a Chair Professor in Mechanical Engineering and a Pro-

fessor in Applied Mathematics at the University of Maryland. He has written more than 20

books on product reliability, development, use and supply chain management and over 500

technical articles. He has also written a series of books on the electronics industry in China,

Korea, Japan, and India. He consults for 22 international companies.

Dr. Jisheng Pan, received his B.Sc. in Physics from Hangzhou University (currently,

Zhejiang University) in 1985 and his M.Sc. in Nuclear Physics in 1988 from Shanghai Insti-

tute of Nuclear Research (currently, Shanghai Institute of applied Physics), Chinese Academy

of Sciences, where he worked for 6 years in nuclear technology. He graduated in 1998 with

his PhD in surface physics from National University of Singapore. Currently, he is a senior

scientist and photoemission spectroscopy (PES) group leader in IMRE. He has also provided

surface analysis and consulting service to many local and international companies in Singa-

pore. Dr. Pan has received many awards including achievement award from A*Star aerospace

programme in 2015, assessor award (silver) from Singapore Accreditation Council (SAC) in

2015, He is a session chairman in European Conference on Surface Science 2015, a technical

assessor for Singapore Accreditation Council (SAC), a technical committee member of ISO/

TC 201 surface chemical analysis, Singapore, one of editors, Journal of Spectroscopy, a mem-

ber of MRS (USA), MRS (Singapore), IPS (Singapore) and NSC (China).

Mr. Teck Beng Tan, is Product Specialist in Shimadzu Asia Pacific for OES, XRF, XRD,

EPMA, SPM and ESCA. He has conducted numerous Application Seminars and Workshops on

Materials Characterization/Failure Analysis/Restriction of Hazardous Substances to greater than

200 companies in countries supported by Shimadzu Asia Pacific. He has an MSc degree in Ma-

terials Science from the National University of Singapore

Mr. Kenny Lim, has graduated with a Bachelor of Business in Administration. He has been

working with Struers/Singapore since May 2007 and trained as a TRAINER, sharing his

knowledge and skills through training courses around this ASEAN region. He is specialized in

sample preparation, especially electronic parts. Currently he serves as an Area Sales Manager at

Struers, Singapore.

Dr. Sin Leng Lim, received his BSc (Honors) and PhD (Physics) degrees from National Uni-

versity of Singapore (NUS). He had many years of experience in technology development with

the semiconductor foundry industry, before resuming current research position with the Surface

Science Laboratory of Physics Department, NUS. His works include academic materials re-

search and industrial consultation services, in the fields of surface and interface analysis. His

main research interest is in the study of semiconductor materials using secondary ion mass

spectrometry (SIMS).

Dr. Teck Kheng Lee, received the B.S. degree in mechanical engineering and the M.S.

degree in materials science and engineering from the National University of Singapore in

1995 and 1999, respectively and the Ph.D. degree in Mechanical and Aerospace Engineer-

ing from the Nanyang Technology University, Singapore, in 2006. He had been with the

semiconductor packaging industry for eighteen years, working from the historical package

of DIP to flip-chip packages, WLCsp and system-in-package. He joined the Institute of Mi-

croelectronics (IME), Singapore, in 1997, researching in the areas of MEMS, CSP, and flip-

chip packaging. In 1999, he joined Micron Semiconductor Asia Pte Ltd as a Senior Tech-

nical Member, responsible for substrate supplier management and leading some research

programs in the field of advanced packaging and material characterization. He is currently

the director of Technology Development Centre (TDC) for ITE College Central, leading a

team of engineers and researchers to support the local industry development in Semiconduc-

tor, Automation, and ICT and electronics sector. Under the leadership, the TDC center have

secured more than 15 grants worth S$4.6M. He has authored and co-authored more than 60

papers in journal and international conferences. Currently, he holds 64 U.S patents, pending

another 20 U.S patents from issuing. He has served as a Technical committee member for

Singapore Chinese Chamber of Commerce (SCCCI), Semiconductor Equipment and Mate-

rials International (SEMI) and Institute of Engineering, Singapore (IES). He is also listed as

Who’s Who in the World 2007, 2013-2015 as well as listed of IBC Leading Engineers of

the World in 2013-2015. Currently, he acts as co-convenor to represent Singapore in re-

viewing IEC standard for Semiconductor and IC packaging.

Mr. Wayne Ng Chee Weng, is Regional Technical Manager of Nihon Superior Co.

Ltd. He is reporting directly to Nihon Superior, Japan headquarter and stationing at Sin-

gapore to oversee the regional markets. He is handling the technical matters of Nihon

Superior products and providing application consultancy to customers. With feedback

from the field, he is helping company to develop products which can fit the market better.

Wayne obtained his first degree in Mechanical-Industrial Engineering with First Class

Honour in 2003 from University of Technology Malaysia. He had furthered his studies in

the same university and graduated with Master of Engineering (Mechanical) with the re-

search project of Integrated Circuit Package Reliability sponsored by Intel Malaysia. He

is certified in PMP and CIT IPC-A-610. Before joining Nihon Superior, he held position

in IC package development department of Infineon Technologies Asia Pacific and prod-

uct reliability and quality management in Micron Semiconductor Asia, Singapore.

Mr. Kenny Chiong Kung Chuan, is the Senior Technical Support Engineer at Indi-

um Corporation which is based in Singapore. He provides the technical support in the

Southeast Asia region, which covers Malaysia, Singapore, and Indonesia. Working close-

ly with customers in the semiconductor and surface mount technology industries, he

helps them optimize their processes, troubleshoots, and offers solutions. Kenny has more

than 5 years of experience, primarily in the areas of PCB assembly and surface mount

technology. He earned his bachelor’s degree in mechanical engineering, majoring in ad-

vanced manufacturing system. Kenny is an SMTA-certified Process Engineer and has

earned his Six Sigma Green Belt.

Dr Ong Sheau Wei, received her Ph.D. from Department of chemistry, National Uni-

versity of Singapore. Her research areas is primarily focus on computational and experi-

mental studies related to surface science and interface analysis of semiconducting materi-

als. She is currently a research fellow with the Electronic Materials Growth and Interface

Characterization (εMaGIC) Laboratory at Department of Physics, NUS. Before returning

to Singapore in 2014, she has worked as a research fellow with National Central Univer-

sity of Taiwan.

Ms. Priscilla Hong, holds a BSc degree in Chemistry, MSc degree in Materials Sci-

ence & Engineering, MSc degree in Safety, Health and Environmental Technology and a

Graduate Diploma in Analytical Chemistry from the National University of Singapore.

She is currently completing the final requirements for her doctoral degree. Priscilla began

her career in Reckitt & Colman, Singapore (currently, Reckitt Benckiser) in Research &

Development. She has worked with her current employer, Metalor Technologies, Singa-

pore, for the past 12years. She is now an Executive Council Member of the Singapore

Surface Engineering Association.

Prof. Daniel Chua, received his PhD from University of Cambridge in 2004 where he

joined the Department of Materials Science and Engineering in 2005. He has been work-

ing in the field of carbon and carbon based materials, growth, processing and applying

these diamond-like coatings, carbon nanotubes, graphene and other nano-carbon related

work in various areas such as ultra-hard coatings, electron emitters and clean energy gen-

erators.

Prof. Sow Chorng Haur, received a B.Sc. Degree (1st Class) in Physics from the Nation-

al University of Singapore (NUS) in 1991. After spending two more years in NUS for re-

search, he received a M.Sc. degree in Physics. He then went on to The University of Chicago

and completed his PhD degree in 1998. During the period in 1999-2000, he worked as a

postdoctoral fellow at Bell Laboratory, Lucent Technologies. He returned and joined the De-

partment of Physics, NUS in 2001. He is now the head of the Department of Physics at NUS.

He has authored and co-authored over 300 papers in the field of nanoscience and nano-

materials. His current research interest include, Colloid Interactions, Nanostructured Func-

tional Materials and their Unique Physical properties, Assembly and Phase Transitions and

Carbon Nanotubes and Graphene. A firm believer of “Science for all”, he developed the

highly interactive Physics Demonstration Laboratory in NUS. The “Demo Lab” has since

received more than 5,000 visitors, playing host to students at levels ranging from Primary

Schools to University. More details are at http://www.physics.nus.edu.sg/staff/sowch.html

Mr. Ranjan Rajoo, is currently a Member of Technical staff, OSAT supply chain manage-

ment / turnkey engineering with Global foundries. Prior to joining he was researcher with A-

star Institute of Microelectronics (IME) for 15 years in Microsystem, Design & Simulation

task. His area of research was 2.5D, 3DIC using TSVs, ultra-thin chip embedding and wafer

level packaging. His expertise are characterization of mechanical & moisture properties of

electronics packaging materials. He has set up new & novel experimental techniques to char-

acterize electronics packaging materials, assembly process interaction & accelerated reliabil-

ity, drop, impact and vibration testing. He has authored and co-authored more than 60 papers

in journal and international conferences. He received 2 outstanding papers in prestigious con-

ferences. He has given invited talks in the area of lead free solder/ Halogen Free printed cir-

cuits boards. Currently, he holds 6 U.S patents and 2 patents have been commercialized. He

is also a member of IEEE, CPMT and IMAPS societies. He‘s in the organizing committee

for EPTC.

Prof. Tok Eng Soon, received his BSc (Honours in Chemistry and Physics, 1st Class) at

the National University of Singapore and PhD in Semiconductor Materials at the Imperial

College London, UK. He joined NUS in 1999 with the Department of Materials Science be-

fore moving to the Department of Physics in 2005. Professor Tok is interested in surface and

interface science related to “Atomic Scale Engineering” of low dimensional structures

formed on Group IV and also III-V semiconducting materials. His research emphasis is on

elucidating growth processes (adsorption, desorption, nucleation, segregation and self-

assembly), reaction kinetics and energetics occurring on surfaces and interfaces of these sem-

iconducting heterostructures. He aims to understand the fundamental relationship between

surface chemistry and physics with materials properties at the atomic scale through his re-

search. He has published over 150 papers within these areas of research. (More details:

http://www.physics.nus.edu.sg/staff/tokes.html).

Dr L Ravikiran, received his M.Tech degree in Materials Science from Indian Institute of

Technology Bombay, India in 2009. He received his Ph.D. degree from the School of Elec-

trical and Electronic engineering, Nanyang Technological University, Singapore 2015, where

he is currently involved as a Post-doctoral researcher. His research interests include molecu-

lar beam epitaxy (MBE) growth of III-N based materials and their characterization for appli-

cations in high electron mobility transistors, UV detectors and gas sensors. He has authored

and co-authored more than 10 international journals and conference presentations during his

brief research stint.

Dr K Radhakrishnan is an Associate Professor in the School of Electrical and Electronic

Engineering at Nanyang Technological University, Singapore. He was the Principal Investi-

gator for several major research projects related to the epitaxial growth of III-V Compound

Semiconductors, devices and circuits over the years, primarily using arsenide and phosphide

based material systems. His current research interests include MBE/MOCVD thin film

growth and characterization of III-nitrides for various applications such as high power RF

devices, UV detectors and gas sensors. His other research interests include synthesis and fab-

rication of oxide based thin film solar cells. He has authored and co-authored more than 200

international journal and conference papers and delivered invited talks at several internation-

al conferences. In 2007, he was one of the recipients of the prestigious Singapore’s Defense

Technology Prize for his technological contributions in MMIC (microwave monolithic inte-

grated circuits) R & D.

Prof. Thomas Osipowicz, is the Director of Centre for Ion Beam Applications (CIBA),

Department of Physics, National University of Singapore. He also holds the position as Dep-

uty Head for Education, Department of Physics, National University of Singapore. For more

details (http://www.ciba.nus.edu.sg/)

Dr. Wanxin Sun, holds a PhD degree in Physics, M.Eng. and B.Eng. degrees in precision

metrology and instrumentation. During his research career, he accumulated rich experience

in characterization of nanomaterial and nanodevice through microscopic and spectroscopic

techniques, including characterizing semiconductor devices through nano-electric methods,

strain/stress analysis in silicon devices through vibrational spectroscopy at nanometer scale.

His expertise has been recognized by failure analysis community. He has developed several

microscopic techniques, published more than 40 papers in international journals, and has

been inventor of several US patents. He has been invited to give presentation reputable inter-

national conference, including ICMAT, IEEE Nanomedicine, Chinese National Conference

of Dielectric Materials and Devices, Congress of Chinese Chemical Society, Chinese Nation-

al Conference of Light Scattering. Besides his own research/develop work, he is also active

in relevant societies and takes the duty of chairing sessions in relevant international confer-

ences. He is now working with Bruker Nanosurface Division. His main responsibility is to

develop applications of new technologies in scanning probe microscopy and 3D optical mi-

croscopy.

Mr. Tetsushi Fujinaga graduated master degree of Graduate School of Science / Osaka

University. After graduation, he started his carrier with TFT array engineer for Liquid Crys-

tal Panel. And then he joined ULVAC, Inc. and started the work for development of CVD

process for electronic devices since 2004. From 2007, he was in charge of the development

of CVD and sputtering process and system for thin film solar cells as a part of turnkey solu-

tion. And joined the development of sputtering system for surface mounting since 2012 and

now he is a challenging seed layer formation with dry process.

Mr. Arun Kumar, graduated in BSc and MSc (Physics) from Loyola College, India. He is

currently a PhD student at ƐMaGIC Lab, Department of Physics, NUS and is working on the

interface and reliability of solder joint for microelectronic packaging. He is also a student

member in Surface Mount Technology Association (SMTA) and Singapore Surface Engi-

neering Association (SSEA). For more details (https://www.researchgate.net/profile/

Arun_Kumar475).

ABOUT THE ORGANIZERS :

1. National University of Singapore: (http://www.nus.edu.sg/)

It s one of the three largest public and autonomous universities in Singapore. Founded in 1905, it is

the oldest institute of higher learning (IHL) in Singapore, as well as the largest university in the coun-

try in terms of student enrolment and curriculum offered. NUS is a research-intensive, comprehen-

sive university with an entrepreneurial dimension.

2. University of Maryland (UMD/CALCE): (http://www.umd.edu/)

Founded in 1856, the University of Maryland is the flagship institution of the University System of

Maryland. Maryland is the largest university in the state and the largest in the Washington Metro-

politan Area. It is a member of the Association of American Universities and competes athletically as

a member of the Big Ten Conference.

3. Singapore Surface Engineering Association (SSEA) (http://www.aseansurfin.org)

The Singapore Metal Finishing Society was founded in November 1981 with the mission to promote

the development of the local electroplating industry. It counts contract platers, academics, surface

finishers, suppliers of chemicals, equipment, technology, analytical lab and test service providers and

PCB manufacturers as its members. The Society is currently a member of the International Union of

Surface Finishing (IUSF), Singapore Manufacturer’s Federation ( SMA) and has a Memorandum of

Understanding (MOU) with the Association of Electronics Industries in Singapore (AEIS).

4. Advanced Integrated Analytical Test Services (A-IATS) (http://www.a-iats.com/)

Advanced, Integrated Analytical and Test Services: Innovative metrology, methodology and char-

acterization are becoming critical for development of nano/micro circuit technology and clean

technology cluster. AIATS enables your 3P variation management (Properties/Process/Product

performance) by linking composition, structure, morphology, roughness, adhesion and hardness

with defect reduction and yield enhancement. The division of TechDoc focuses on market re-

search, Technology roadmapping, Scientific and technical documentation and international con-

ference editing and management. A-IATS recently completed a research collaboration agreement

with NUS in 2010 - 2014 timeline and is also supporting NUS– Industry PhD Program since

2011. Currently, A-IATS is developing magnetic centred solder materials for electronic industry

cluster system.

LOCATE YOUR VENUE:

LOCATE YOUR VENUE:

MRT/BUS: From Clementi = Walk to Clementi Bus Stop, Bus Stop No.

17179, from Clementi MRT Station (Exit B). Board Bus 183

(towards Jurong East Temp Interchange). Alight 3 stops later at

Bus Stop No. 17099. Walk approximately 8 to 10 minutes to

UTown

From Kentridge MRT = Walk to Kent Ridge Bus Stop, Bus

Stop No. 18331, from Kent Ridge MRT Station (Exit A).

Board NUS Internal Bus Shuttle D2. Alight 5 stops later at

UTown

Please note that parking at UTown is available at Stephen Ria-

dy Centre's basement car park (postal code: 138607) .

Refer : http://utown.nus.edu.sg/assets/Uploads/Documents/

KRC-Parking-Rates.pdf

Abstracts

Symposium on

SOLDER INTERCONNECT RELIABILITY

UTown, NUS, Singapore

8th

– 11th

December 2015

DAY 1 (8th Dec 2015)

EDUCATION COURSE I: Solder and Solder Surface Finish Reliability

Physics of Failure Based Reliability Practices Prof. Michael Osterman

CALCE, University of Maryland, USA.

Reliability is the ability of a product to perform as intended (i.e., without failure and within specified per-formance limits) for a specified time, in its life cycle application environment. The physics-of-failure (PoF) ap-proach to reliability utilizes knowledge of the life-cycle load profile, product architecture, and material properties to identify potential failure mechanisms and to reduce product failures through robust design, manufacturing, and product verification practices. Physics-of-failure based product realization methods incorporate reliability into the development process providing a scientific basis for estimating product life under life cycle conditions. This course introduces the classical reliability concepts and relates the concepts to the physics of failure approach. The information provided in this course will be useful for implementing a physics-of-failure methodology for the life cycle of a product. The participants will learn how to develop and migrate to physics-of-failure based reliability assessment programs from current practices. The seminar will introduce the concept of physics of failure and its application in product development. Introduction Device Level Failure Models Assembly Level Failure Mechanism and Models

- PWB Failures - Solder Interconnects

PoF Simulation Assisted Reliability Assessment

Copper Clad Solder Ball (CCSB) Technology and Impact Prof. Hee Taik YUM

Korea Surfin Consulting Company, Korea

Copper Clad Solder Ball (CCSB) has many advantages in advanced interconnect architecture such as

good stand-off between packages, chip damage prevention and lower pad pitch. This novel and innovative con-

ceptualization, undertaken at Korea Technology Co. and MKE Co on the development of electrolytic plating of

the well-known SAC305 solder on copper balls sizing from 120 to 180 um in diameter will be presented and dis-

cussed.

Inductive Microheat-seed Development for Solder Bonding S. Arun Kumar, Dr. R. Gopala Krishnan, Yaadhav RAAJ*, A/P Tok Eng Soon

εMaGIC Laboratory, Physics, NUS, Singapore *A-IATS, Singapore. URL: www.a-iats.com

Low-frequency electromagnetic induction (EMI) based reflow oven process and magnetic-micro seed

(MMS) dispersion are strategically gaining prominence in recent years through the foundational use of

Ferromagnetic ( FMM ) based Sn-based solder system. This novel idea initiated by A-IATS(Singapore) on MAG-

SOLDER development of FMM-SAC305/Cu-BGA solder joint from a cluster of process and analytical tech-

niques such as low-temperature ball-milling, rapid thermal process (RTP), isothermal annealing, cross-section/fine

polishing, XRD, VSM, DSC and SEM-EDX/BSE are compiled and discussed for EMI-centric reflow oven devel-

opment and deployment.

Statistical Analysis of Reliability Test Data Prof Tan Cher Ming,

Chang Gung University, Taiwan

Reliability is crucial to the success of product sales in today competitive market. Reliability test is now a

common routine to most of the manufacturing. However, the analysis of reliability test data is not straight for-

ward since it involves advanced statistics. Although there are many existence software available for the reliability

data analysis, but most of them have inherent assumptions, and without understanding the impact of these assump-

tions, the use of the software could make the analysis results invalid.

This course introduces the various common misconception in the analysis of reliability test data from

which the essential knowledge of reliability statistics will be identified. Various methods of extrapolation of the

test data obtained at accelerated test conditions to normal operating conditions will also be introduced, and the

cautious use of the Arrhenius equation is also emphasized.

Product Qualification and Supply Chain Responsibilities Prof Michael Pecht,

Director/CALCE, UMD, USA

Today, products are changing very rapidly, customers have more choices, tremendous price pressure ex-

ists on suppliers, and there is pressure to test quickly. However, the traditional test and qualification standards are not working. Over the past 10 years, there have been an increasingly large number of products that have passed qualification tests but have failed in the field. The resulting costs of these failures have been in the hundreds of millions of dollars for many companies.

This lecture presents the role of qualification in product development and the responsibilities within prod-uct supply chains. A processes to establish proper qualification methods will be provided. Virtual qualification, accelerated testing, target application requirements, and failure mechanisms and models will be discussed. In addi-tion, various advanced qualification and supply chain techniques, including prognostics and in-situ product moni-toring methods will be overviewed.

DAY 2 (9th Dec 2015)

SYMPOSIUM SESSION: Solder and Solder Joint

A Perspective of the IPC Report on Lead-free Electronics (KEYNOTE) Prof Michael Pecht,

Director/CALCE, UMD, USA

In April 2015, IPC published a report titled “Issues and Outlook for Lead-free Electronics in Military and

Aerospace Applications.” This keynote will discuss and comment on the report in light of the current state of prac-

tice of lead-free usage in high-reliability applications. The keynote will also present challenges for exempted and

excluded companies associated with cost increases, reduced access to emerging lead-free based technologies, the

risk of counterfeit part infiltration, and the proliferation of “refurbished” parts in the supply chain.

Fluxless Flip Chip Bonding with SnAgCu

Dr. Teck Kheng Lee Director, Technology Development Centre, Institute of Technical Education, Singapore

Flip chip technologies have been the building block for high density packaging. Currently, the bonding technologies are facing challenges in scaling the pad pitch limitation due to the slumping of flux and solder paste. This paper review the flip chip interconnect systems for Semiconductor packaging versus fluxless bonding tech-niques of solid liquid interdiffusion bonding by compressive force (SLICF). SLICF is an instantaneous fluxless bonding technique for fine pitch flip chip application.

The various interconnect systems of Au, Cu and Ag bumps are fluxlessflip chip bonded under SLICF with

SnAgCu. Conventional underfill is then applied for the interconnect systems for bonding evaluation. Their inter-

metallics with the various metal interfaces with SAC are studied for bond integrity and reliability. This include

mechanical mean to verify the strength of the bond interface. The SLICF joints passed standard JEDEC reliability

conditions for adoption in assembly. These fluxless joints enables a fine pitch flip chip applications as well as ide-

al for microelectromechanical systems where thermal and stiction are issues for packaging.

Solid Solution Strengthening in Lead Free Solder Solution Mr. Wayne Ng Chee Weng Nihon Superior, Singapore

Among the Pb-free solder solutions, tin/silver/copper (SAC) or tin/copper (Sn/Cu) or tin/silver (Sn/Ag) is still the most popular choice in the electronics industries. However, the high demand in reliability performance has driven the metallurgist or solder supplier to start looking into new solutions which can offer higher solder joint reliability. A difference between the Pb-free solders based on tin, copper and silver and the tin-lead solders that they are replacing is that they do not take advantage of the solid solution strengthening. The two elements that are added to tin, separately or together, to make the most widely used lead-free solders, silver and copper, have almost no solubility in the β-tin matrix and appear in the microstructure only as the intermetallic compounds, Ag3Sn and Cu6Sn5. The dominant strengthening effect in silver-containing lead-free solders is the dispersion of very small particles of Ag3Sn in the tin matrix. However, studies have found that this strengthening effect to be temporary as through the process known as Ostwald ripening the particles coarsen to a size and distribution at which they no longer have any significant inhibiting effect on the dislocation movement. There are two general categories of sol-id solution strengthening additions. Substitutional strengthener atoms are larger than the tin atom and distort the crystal lattice when they replace a tin atom. Interstitial strengthener atoms are smaller than the tin atom and distort the crystal lattice when they occupy the space between the tin atoms. In this paper the authors will report the re-sults of a study on the effect of controlled additions of bismuth to the widely used no silver lead-free solder SN100C®. An optimum level at which complete solid solubility is maintained during extended ageing has been identified and the alloy characterized by DSC and detailed metallography. Basic mechanical properties have been determined and preliminary results obtained on performance in thermal cycling and high speed shear have been consistent with the expectations for solid solution strengthening. Significantly these improved properties have been found to be much more stable during ageing than those imparted by a silver addition and a small reduction in melting temperature might mean that reflow can be completed at a slightly lower peak temperature.

Remaining Issued with Pb-Free Electronics Prof. Michael Osterman

CALCE, University of Maryland, USA

In 2003, the European Union’s Directive on the Restriction of Hazardous Substances (RoHS) mandated the elimination of lead for a large class of electronic products and systems. With a 2006 deadline, the majority of globally produced electronics products shifted from tin-lead to lead-free solders such as tin-silver-copper. At pre-sent, RoHS compliant electronics make-up the overwhelming majority of produced electronic equipment and with the revised European Union Restriction of Hazardous Substances and updated European Union End of Life Vehi-cle directives, an even large group of applications are required to be RoHS compliant this year or by 2019. The shift away from tin-lead has led to substantial research into the replacement materials for tin-lead solder. This work predominately has focused on finding the reliability of tin-silver-copper solder which has become the major replacement solder material.

For lead-free electronics, known risks included tin whisker formation, reduced vibration and shock dura-bility of interconnects, and thermal damage due to elevated assembly temperatures. Further, maturity of assembly process and reliability prediction models was uncertain. Now, nearly a decade later, this presentation will review the current risks with RoHS complaint electronics, discuss modeling approaches, and provide guidelines for im-plementing compliant electronics for critical applications.

The Second Generation Shock Resistant and Thermally-Reliable Low Ag SAC Sol-der with Mn

Mr. Kenny Chiong Kung Chuan Indium Corporation, Singapore

98.5Sn/0.5Ag/1Cu/0.05Mn (SAC0510M) exhibits a melting behavior similar to SAC105. It is two times

better than SAC105 in the dynamic bending test; more than 8 times better in the modified JEDEC drop test; and

more than 40-60% better in the -55°C/125°C thermal cycling test. The reduced hardness and much thinner and

stable IMC layer on Ni are responsible for the superior non-fragility, while the stabilized IMC and microstructure

are responsible for the thermal cycling performance. A thinner IMC layer on Ni is more important than reduced

hardness in improving non-fragility. The thermal cycling performance of SAC0510M may override SAC305. A

high-Tg brittle board causes poor drop test results due to pad cratering.

Thermal and Magnetic Properties of Nickel Particulates in SAC305 Solder Sheau Wei Ong1,2, Bevlyn Y.Z. Tan3, Fenna Hoi3, Monisha Dasarathan3, Harman A. Johll3, S. Arun Kumar1, R.

Gopala Krishnan1 and Eng Soon Tok1,2,# 1Electronic Materials Growth and Interface Characterization (εMaGIC) Laboratory, Department of Physics, Na-

tional University of Singapore, 2 Science Drive 3, Singapore 117551 2Yale-NUS College, College Ave West, Singapore 138527

3National Junior College, 37 Hillcrest Road, Singapore 288913 #Email: phytokes@nus.edu.sg

SAC solder is a popular, environmentally friendly and less hazardous alternative to lead solders

The addition of Ni into SAC solder is of interest as Ni is commonly used as metal surface finish material in elec-tronic packages and the drop test performance improved due to the formation of NiCuSn IMC. The addition of Ni is also known to passivate and reduce Sn whisker formation. While the intermetallic properties are well document-ed, the magnetic properties (saturated magnetization, coercivity, retentivity, hysteresis, anisotropy) of Ni doped SAC solder material are less studied.

In this work, the incorporation of Ni particles in SAC305 via mechanical mixing and pelletization is in-vestigated. From Nomarski optical microscopy and SEM-EDX, we will show that the incorporated Ni particles are found not only at the edges of the SAC grains but are also embedded within the SAC grains. X-ray diffraction analysis also indicates that Ni and SAC peaks are well resolved and no new phases are formed in these pellets formed at weight equivalent of 5 tons. Vibrating sample magnetometry measurements shows that magnetization of Ni-SAC is controlled by the amount of Ni incorporated i.e. composition of Ni in SAC. The Ni saturated mag-netization is thus retained. DSC analyses of these Ni-SAC samples indicate that Ni-Sn reaction occurs upon sub-jecting the sample to just one heating cycle between RT and 300oC. The formation of non-ferromagnetic phases composed of Ni-Sn compounds results in a drastic decrease in magnetization. The implications of these findings on its application in induction heating will be discussed.

A REACH-complied pure gold process for soldering/ bonding applications

Priscilla HONG, Chang Wei YANG Metalor Technologies Pte Ltd., Singapore.

This paper gives a status report on the current situation and applications, highlighting the features and

benefits of the deposits of a pure gold process for microelectronics applications with zero arsenic and zero thalli-

um in the formulation. This pure gold process has maintained all the properties required of such pure gold depos-

its whilst keeping in compliance of REACH restrictions on arsenic and thallium, both chemicals used previously

as a grain refiner in such processes. The physical properties of the deposits are investigated together with process

control guidelines explained. Tests on the deposits have exhibited repeatable results showing full solderability and

100% wetting.

Evaluation of Copper Migration during the Die Attach Curing and Second Wire

Bonding Process Jisheng Pan

Institute of Material Research & Engineering, 2 Fusionopolis Way, Innovis, #08-03, Singapore 138634 Department of Physics, National University of Singapore, 2 Science Drive 3

Singapore 117551

Copper migration on the silver plated surface of the lead-frames with various heat treatments was evaluat-ed by X-ray photoelectron spectroscopy (XPS), transmission electron microscopy (TEM) and atomic force mi-croscopy (AFM) methodologies. Copper migration may introduce copper oxidation and result in the wedge bond-ing failures due to the nonstick on lead (NSOL) phenomenon. Experiment was performed on the two kinds of TQFP lead frames with the stamped and etched manufacturing processes subjected to various heat treatments and bonding conditions to understand the underlying physics. TEM and AFM provided the additional insight of the grain structure and surface roughness of silver. XPS results showed that the etched lead frame was relatively bet-ter one that less copper oxide was detected on the silver surface after annealing process. However, more copper was observed to diffuse onto the silver surface after annealing in the stamped lead frame. In comparison between the stamped and etched lead-frames, the silver plated layer in later one is more efficient in blocking copper diffu-sion—either surface or bulk. Finally a full factorial design of experiment (DOE) with wedge bond pull strength as response was performed to verify the results of XPS, TEM, and AFM. The evaluations based on XPS, TEM, and AFM analyzes can really help to improve the yield of the wedge bonding process and optimize the IC manufactur-ing process window.

Dynamic nanostructure evolution and evaluation by Advanced Analytical TEM

Daniel H.C. Chua 1,* and Masaki Tanemura 2 1 Department of Materials Science & Engineering, National University of Singapore, Singapore

2 Department of Frontier Materials, Nagoya Institute of Technology, Japan * Email: msechcd@nus.edu.sg

Transmission electron microscope (TEM) is among the necessary core instruments used by both industry

and academia. The science and engineering of TEMs have evolved over the time, going beyond seeing individual atoms to in-situ dynamical work. In this talk, we will focus primarily on making applying TEM to carbon-based materials, such as carbon nanotubes, graphene and other low dimensional structures. We will show how the TEM is used to study the fabricated nanostructures and the information used to correlate with other types of physical and chemical tests. We will further show that some of the known fundamental issues such as electromigration can be observed in-situ with the appropriate setup of the TEM.

DAY 3 (10th Dec 2015)

SYMPOSIUM SESSION = Thin Film Process and Analysis

A Focused Laser Beam: Useful Tool for Nanoscience Research (KEYNOTE) Prof Sow Chorng Haur,

Head, Department of Physics, National University of Singapore, Singapore

Nanoscale materials have attracted great interests in recent years. Low dimensional such as nanoparticles,

nanowires, nanorods, nanowalls, nanosheets, and nanojunctions or networks are an important category of nanostructured materials with great potential as important components for nanoscale devices with various interest-ing functions. Thus, in the past decade, many techniques have been developed for the synthesis of such nanostruc-tured materials. In addition, researchers have put in great effort in the studies of hybrid nanomaterials. With these efforts, a wide variety of nanostructured materials have been investigated. These include carbon nanotubes, binary and ternary II-VI alloys, hierarchical metal oxide and etc. After the synthesis of the nanomaterials, it is desirable to be able to further modify the properties of the nanomaterials to improve the functionality of these nanomateri-als. If we can create micro patterns on these as-grown nanomaterials, it will be able to further expand their poten-tial applications. In recent years, efforts involve the alteration of physical and/or chemical properties of nano-materials via the use of a focused laser beam have generated a lot of interests. In this presentation, we will present our efforts in the studies of hybrid nanomaterials with the emphasis on how the focused laser beam can be used as/for (a) Micro Manipulation Tool: Optical Tweezers, (b) Micro patterning and Micro structuring Tool, (c) Micro-Architecturing, (d) Micro-Photocurrent Studies, (e) Micro Photochemical Reaction (f) Micro light-House and (g) Micro-Actuating Tool.

Sputtering and dry etching technique for interposer to achieve high density wiring mounting

Tetsushi Fujinaga Institute for Semiconductor and Electrical Technologies (ISET), ULVAC, Inc.,

Hagizono 2500, Chigasaki-city, Kanagawa-pref., 253-8543, Japan

To evolve electronic device, new approaching method called “More than Moore” gathers attention from

the different viewpoint of “More Moore”. High density surface mount technology is developed as one of “More

than Moore” technology. To realize fine pitch wiring and high density integrated circuit (IC) chip mounting on

printed circuit board, various type of flip chip packaging method like 2.1D, 2.5D, and 3D is investigated. For

these mounting technologies, conventionally wet process is used to form wiring. But to achieve more fine pitch

wiring, dry process has been attracting attention. ULVAC can apply sputtering process for seed layer formation of

Cu electroplated wiring, solder micro bump direct formation on IC chip and Electro Magnetic Interference (EMI)

shielding. Dry etching process is used for smear removal at the bottom of Via, photoresist removal after develop-

ing and etching of seed layer for Cu wiring. In each technique, key points are production cost and substrate tem-

perature control because most of dielectric materials are organic. The features of ULVAC’s sputtering and dry

etching system are substrate cooling system and high deposition/etching rate. ULVAC develops unique sputtering/

dry etching system to achieve low cost and high productivity for high density wiring surface mounting.

Solder Interconnection: Strength, Weakness, Trends & Opportunities for next Generation

Mr. Ranjan Rajoo Global Foundries, Singapore

Solders was in soldering process for more than 4000 years ago a method to join lead water pipes using tin. It’s very difficult to who say first discover how to “glue” metals but most of the impressive achievements are con-tributed by Romans during the periods. Electronics industry have been using lead tin (SnPb) solder to form inter-connection between components to printed circuit board for more than 60 years. With evidence pointing to serious adverse health effects of lead, the ban on the use of lead (and other heavy metals and some flame-retardants) was effective from 1 July 2006. Lead has been ideal for solder and whole electronics industry infrastructure was de-signed around melting point, properties of lead based solder, standardization and it’s inexpensive. Lead free is environment friendly and have no reports of any negative impacts to humans or environment. Currently lead free is have high melting point (+400C compare to SnPb solder eutectic), beside processing & reliability issues, major challenge is selection of appropriate lead free solder alloy composition and standardization. The primary target of this talk is to present strength & weakness of solder interconnection. Emerging trends in high performance con-sumer portable electronics products which driving shrinking of electronics packages and the new opportunities for solder alloys & interconnection will be shared.

Reactive Deposition of Cobalt Disilicide Nanodots and Nanowires Edwin Ong Bin Leong and Eng Soon Tok

Electronic Materials Growth and Interface Characterization (eMaGIC) Laboratory,

Department of Physics, National University of Singapore, 2 Science Drive 3, Singapore 117551,

The structure, growth behaviour and shape evolution of CoSi2 islands formed via Cobalt reactive

deposition on Si (001) substrate are investigated. For heteroepitaxy involving cubic crystal systems with

a lattice mismatch of 1.2%, two very distinctive low dimensional CoSi2 islands are formed on clean Si

(001) surface. The first type of CoSi2 island has a CoSi2(001)-c(2×2) top-facet morphology. These is-

lands grow into Si(001) substrate such that CoSi2(001)//Si(001) and CoSi2[110]//Si[110]. The island

sides are bounded by four CoSi2{111}-Si{111} Type A interfaces along the <110> directions. These is-

lands become less anisotropic and more square-like as growth temperature increases. The second type of

CoSi2 island has a ridge-type morphology that also elongates preferentially along the <110> directions

and it grows into the Si(001) substrate such that CoSi2(221)//Si(001) and CoSi2 //Si . In con-

trast to the square like islands, the ridge islands are bounded by only one CoSi2{111}-Si{111}Type B

interface which breaks the symmetry of its structure with the Si-substrate and leads to the for-

mation of three other less energetically favourable interfaces: CoSi2 -Si , CoSi2

-Si and CoSi2 -Si . Consequently, the structure of ridge islands is highly anisotropic

and becomes more wire-like with increasing temperature. The growth and shape evolution of both types

of islands are found to be influenced by the presence of kinetic energy barriers limiting the incorporation

of adatoms into the length and width of the islands as well as transport of adatoms around the corners of

the islands. Both types of islands do not follow the Tersoff-Tromp strain induced shape transition model.

Fabrication and Evolution of Thin Film based GaN UV Photodetectors Dr. L. Ravikiran

School of EEE, Nanyang Technological University, Singapore

Ultraviolet (UV) photodetectors have drawn great interest in the fields of civil, industrial, military, biolog-

ical and space sectors. Wide band gap semiconductor based UV photodetectors have been considered as advance-ment from Si UV photo detection due to their high responsivity, high speed and robustness. Among wide band gap semiconductors, Gallium nitride has been considered as one of the key material systems for the development of UV photodetectors because of its wide bang gap, high electron saturation velocity and high breakdown field strength that allows high temperature, high frequency and high power operations. Growth of GaN based devices on Si substrate has been a key research area in the last two decades. GaN based devices on silicon substrates have unique advantages such as availability of large wafer sizes, low cost of production and potential integration with existing Si technology. With these advantages, GaN based photodetectors have been fabricated on Si substrate using molecular beam epitaxy (MBE) growth technique.

In this presentation, the focus will be on the growth of GaN on 100-mm Si substrate using MBE growth technique for the fabrication of GaN UV photodetectors. Various challenges in the growth of GaN on Si substrate such as melt back etching, Al/Si inter-diffusion and cracking of GaN epilayers on Si substrate will be discussed in detail. Moreover, optimization of GaN epilayers for smooth surface morphology and good crystal quality is pre-sented. Fabrication details of Metal-semiconductor-Metal (MSM) Schottky based photodetectors will be dis-cussed. Finally, the results of photo responsivity behaviour as a function of wavelength, applied bias, input power and device dimension of MBE grown GaN MSM UV photodetector will be presented.

Ion Beam Analysis at CIBA Prof. Thomas Osipowicz

Director, Center for Ion Beam Applications (CIBA), Department of Physics, National University of Singapore, Singapore.

Short discussion of the expertise and the facilities available for materials science research at CIBA, these

include Rutherford Backscattering (RBS), with high resolution, micron sized focussed beam and channelling ex-

tensions, as well as Proton Induced X ray emission (PIXE) and Nuclear Reaction Analysis (NRA). These tech-

niques allow quantitative and non-destructive depth profiling and the mapping of trace element at submicron lat-

eral resolutions. Examples of recent work will be presented, in order to show the advantages and limitations of

these techniques.

Quantitative Nano Physical Properties Measurement by Scanning Probe Microscope Wanxin Sun

Bruker Nano Surface, 11 Biopolis Way #10-10 The Helios, Singapore 138667

Email: wanxin.sun@bruker.com

Physical properties at nanometer scale, including mechanical, electric and electronic properties, are highly demanded in today’s research on materials for a vast range of applications. Imaging technologies with nanometer spatial resolution are well developed and have been extensively used in material characterization for over two dec-ades. For example, electron microscopes and atomic force microscopes (AFM) are frequently used instruments in nanomaterial characterization. However, none of these techniques convey quantitative material related properties besides topography. Recently, Su et al invented peak force tapping technology [1], where a force-distance curve is measured at each point with more superior force control. This enables quantitative mechanical properties measure-ment at nanometer spatial resolution. Like other cantilever based technologies including multiple harmonics imag-ing and contact resonance mapping, the quantity of sample deformation is not easily measured with high accuracy. By systematically analyzing of error sources and error propagation model in mechanical property measurement, we developed a new method to further improve the accuracy in Young’s modulus measurement. Through a series of application examples on different materials, we showed that peak force based nano mechanical property meas-urement has better resolution than traditional nano indentation. Work function or surface potential at nanometer scale is often required to measure for different applica-

tions. This has been implemented in today’s AFM. However, the spatial resolution is plagued by the large size of

cantilever. Besides resolution, the measurement sensitivities is determined by the quality factor of the cantilever.

In traditional tapping mode or other AC modes, the optimization of sensitivity and scan speed is always compro-

mised. In peak force tapping, the feedback does not rely on the cantilever dynamics. This thus gives us

the freedom for optimization. By adopting frequency modulation detection scheme, we eliminate the ef-

fect of the cantilever. Cooperating with novel probe design, we achieved unprecedented spatial resolution,

sensitivity and repeatability in potential measurement. One example is that we can clearly resolve metal phase

separation with accurate work function measurement in soldering materials and glass metals.

DAY 4 (11th Dec 2015)

EDUCATION COURSE II: Practical Surface Engineering Process and Interface

Analysis

Surface Engineering: Principles, Equipment and Application

ESCA: Principle and Applications Jisheng Pan

Institute of Material Research & Engineering, 2 Fusionopolis Way, Innovis, #08-03, Singapore 138634

Department of Physics, National University of Singapore, 2 Science Drive 3, Singapore 117551

X-ray Photoelectron Spectroscopy (XPS), also known as ESCA (Electron Spectroscopy for Chemical Analysis), is an extremely surface sensitive non-destructive technique that provides quantitative surface chemical state information for all elements except hydrogen and helium. It is the most established (since the mid-1960s) and widely used surface analysis technique. In this presentation, firstly, I will give you some basic knowledge of XPS such as its physical basis, why is the XPS technique surface sensitive? Chemical shifts, angle resolved XPS, quantification of XPS, small area XPS and Imaging XPS, XPS depth profile. Secondly, I will show you the devel-opment of XPS instrumentation and some points in XPS measurement and data process such as charge compensa-tion and referencing for insulators and spectral fitting. Finally, I will give you some examples of its application in material surface and interface analysis such as determination of surface contamination, thickness of thin film, het-erojunction band offsets, material work function and size of nano-particles.

Electron Beam Technology: Tools and Microelectronic Applications Mr. Tan Teck Beng, Shimadzu, Singapore

Electron Beams techniques such as Scanning Electron Microscope (SEM), Electron Probe Micro Analyz-

er (EPMA), Scanning Auger Microscope(SAM), Transmission Electron Microscope(TEM) have been used widely

to characterize materials in Microelectronic. Each of these techniques captures different signals which arises from

the interaction between the electron beam and the material. They therefore reveals different aspect of the materials

in analysis. Such information is often critical in the production as well as failure analysis in microelectronic.

The course will attempt to introduce the different signals that are generated from electron beam interac-

tion and the related properties which can be glean from these signals. Where possible, examples will be given to

illustrate the points. The merits as well as the limitation of these techniques will also be discussed to enable user

to decide which electron beam technique is most relevant to their need.

Sample preparation: Recent Advances Mr. Kenny Lim,

Struers, Singapore

Introduction of Struers A/S - General preparation issue on composite materials - Very hard and soft mate-rial composite, Rounding/Relief, smearing, flatness and scratch - Various steps affecting the final preparation re-sult, Cutting - Selection of cut-off wheel/Clamping of sample/Feed speed and force - Mounting, Edge retention/Resin hardness versus material hardness/Hot press method versus cold mounting - When to consider vacuum im-pregnation - Grinding and Polishing, Positioning of automatic polishing head - Direction of mover head and disc, Flatness - SiC papers versus SiC foils, SiC foils versus Diamond disc - SiC foils versus Rigid disc, Polishing, Dif-ference between soft and hard polishing cloth - Suspension, Various form of diamond suspension and selections - Convention – diamond suspension with lubricant - Integrated – diamond suspension pre-mixed with lubricant - Avoid the use of alumina suspension, Oxide polishing - Achieve scratches free and good micro grain structure, Practical tips.

Secondary Ion Mass Spectrometry (SIMS) and its Applications Dr. Sin Leng Lim

Surface Science Lab, Physics, NUS, Singapore

SIMS is an analytical technique for materials characterization of solid surfaces and thin films, at near sur-face region typically ≤10um. It uses a beam of energetic primary ions to sputter the sample, and detects the sec-ondary ions produced to determine its elemental composition.

In this talk, we will mainly focus on the dynamic SIMS equipment of Surface Science Laboratory at Phys-

ics Department, National University of Singapore (NUS). We will briefly introduce some basic concepts of SIMS,

and share some examples of its applications in both research and industry.

Abstracts

Of

POSTER PRESENTATION

(9th

– 10th

December 2015)

1. Thin film based GaN ultra-violet photodetectors grown on Si by ammonia-MBE

L. Ravikiran1 and K. Radhakrishnan1* 1Centre for Micro-/Nano -electronics (NOVITAS), School of Electrical and Electronic Engineer-

ing, Nanyang Technological University, Singapore.

Ultraviolet (UV) photodetectors have potential applications in various fields such as solar UV monitoring, pollution monitoring, flame detection, nuclear reactor monitoring, chemical and biologi cal sensing, missile plume detection and space to space communication. GaN based UV detectors offer higher responsivity, high temperature, high frequency, high power operation with a potential to operate in challenging environments like space and nuclear reactors. For achieving GaN based UV photo-detectors at lower cost of production and to achieve a unique possibility of integrating with existing silicon technol ogy, GaN based photodetectors need to be fabricated on Si substrate with good crystal quality and photo responsivity performance. In this work, growth of GaN was achieved on 100-mm Si substrate using ammonia-MBE growth technique. Wafers with GaN thickness of 600 nm were achieved without any crack formation on the surface. However, Raman measurements showed that the GaN epilayer is strained with a tensile stress of ~ 450 MPa. The grown wafer showed a mound type surface morphol ogy, a typical characteristic of ammonia-MBE growth mechanism. MSM devices fabricated on these epi layers showed a low leakage current of 0.45 nA at 15 V and exhibited a responsivity of 0.18 A/W at 15 V with a quantum efficiency of ~ 70 %. The MSM devices also exhibited a sharp cut off at 362 nm with UV/visible rejection ration of ~ 170. Moreover, these devices have also demonstrated a good linearity with the applied input power and showed a flat responsivity with input power for bias voltages beyond 7V.

2. Understanding the growth and interface of HfO2-2H-MoS2 Heterostruc-ture

Chang Pang Chen1, Sheau Wei Ong2, Jianwei Chai3, Zheng Zhang3, Shijie Wang3, Jisheng Pan3

and Eng Soon Tok1, 2# 1 Electronic Materials Growth and Interface Characterization (εMaGIC) Laboratory, Depart-

ment of Physics, National University of Singapore, 2 Science Drive 3, Singapore 117551 2 Yale-NUS College, College Ave West, Singapore 138527, Singapore

3 Institute of Material Research and Engineering, A*STAR (Agency for Science, Technology and Research), 3 Research Link, Singapore 117602, Singapore

Layered semiconductor MoS2 has attracted increasing attention in field-effect transistors

device application due to its mobility enhancement by dielectric engineering. To realize the full potential of the high-k/MoS2 heterojunction, however, demands fundamental understanding of the growth process and the resultant heterojunction properties. X-ray Photoelectron Spectroscopy (XPS) is an indispensable tool for understanding the interface chemical reaction and the overlay-er growth mode – critical properties of a heterojunction. In this work, the formation of high-k HfO2 on MoS2 substrate by plasma sputtering deposition is investigated in-situ using XPS. MoO3 and SOx (with 3.5<x<4) are found to be formed at the HfO2/MoS2 interface. The growth of HfO2

on MoS2 is found to occur via a pseudo-layer-by-layer growth mode, which is consistent with Transmission Electron Microscopy (TEM) cross-section imaging of the sample. The valence band maximum of bulk HfO2 (2.5eV) and clean MoS2 (1.2eV) results in 1.3eV valence band off-set at the heterojunction. Our results suggest plasma sputter deposition is a viable single step pro-cess to integrate MoS2 surface functionalization with HfO2 thin film growth.

3. Incorporating Nickel Particulates in SAC305 via Mechanical Mixing Bevlyn Y.Z. Tan1, Fenna Hoi1, Monisha Dasarathan1, Sheau Wei Ong2,3, Harman Johll1, S. Arun Kumar2, R. Gopala Krishnan2 and Eng Soon Tok2,3 1National Junior College, 37 Hillcrest Road, Singapore 288913

2Electronic Materials Growth and Interface Characterization (εMaGIC) Laboratory, Depart-

ment of Physics, National University of Singapore, 2 Science Drive 3,Singapore 117551 3Yale-NUS College, College Ave West, Singapore 138527

The addition of a forth component, especially magnetic elements such as Fe, Co or Ni,

into SnAgCu (SAC) solder has been found to enhance properties such as strength and drop

shock reliability. By magnetizing the SAC solder via their addition, these elements afford the

possibility, and feasibility, of localized induction heating. In this work, we look into the use

of hydraulic pressing to incorporate micro size Ni particulates into SAC 305 solder material.

The homogeneity of surface morphology was evaluated through Optical Microscopy (OM) and

Backscattered Electron with Energy Dispersive X-Ray (BSE-EDX). X-Ray Diffraction (XRD)

was used to examine phase and structure of these pelletized samples. Retention of the Ni mag

netic properties was evaluated through Vibrating Sample Magnetometer (VSM). Our results

show that the physical properties of SAC were not affected by the incorporation of Ni and the

magnetic properties are determined by the amount of Ni present.

4. Impact of Ferromagnetic Ni incorporation into SAC305 by ball milling Xu Ke1, S. Arun Kumar1, G. Yaadhav Raaj2, R. Gopala Krishnan1, G Srayes2 and Eng Soon

TOK1

1Electronic Materials Growth and Interface Characterization (εMaGIC) Laboratory, Department of Physics, National University of Singapore, 2 Science Drive 3, Singapore 117551

2Advanced Integrated Analytical Test Services ( A-IATS ), No 9, Kaki Bukit road 2, #02-16 Gor-don Warehouse BuildingSingapore-417842 (www.a-iats.com)

Low frequency electromagnetic induction-melting (EMI) is a promised improved method in microelectronic packaging localized-soldering process. Ferromagnetic particles are introduced into the solder material as a heat generation seed for EMI heating. A systematic study on the na-ture, distribution and impact of Ni on SAC305 solder material system by low-temperature me-chanical alloying (MA) has been investigated through XRD, SEM-EDX and VSM experimenta-tion. The results suggests elemental Ni forms are existing as particle seed inside SAC305 solder basement. These Ni seeds predominantly response to magnetic field and inductive melt time is derived at around 8 sec at 15KhZ for MA-Centric higher Ni content SAC305 solder. RTP ther-mal process simulation suggests a resulting formation of Non-magnetic phases of Ni3Sn4 after high temperature process with decline in magnetic property and the role of ferromagnetic heat centric Ni is irreversible in the soldering.

5. Impact of Ferromagnetic Fe micro-seed into SAC305 by mechanical alloying S. Arun Kumar1, G. Yaadhav Raaj2, G Srayes2, R. Gopala Krishnan1, Eng Soon Tok1

1Electronic Materials Growth and Interface Characterization (εMaGIC) Laboratory, Department of Physics, National University of Singapore, 2 Science Drive 3, Singapore 117551

2Advanced Integrated Analytical Test Services ( A-IATS ), No 9, Kaki Bukit road 2, #02-16 Gor-don Warehouse BuildingSingapore-417842 (www.a-iats.com) Sn-Ag-Cu (SAC) alloys have been regarded as the most promising alternative for the tra-

ditional Sn-Pb alloy for soldering purposes in electronic packaging. It has been shown that addi-

tion of Ferromagnetic iron (Fe) into SAC alloys can suppress the formation of Ag3Sn during the

solidification process, thus improving the mechanical properties of the solder. Fe has been incor-

porated into SAC305 in different composition via mechanical ball milling process. A battery of

experiments such as XRD, OM, VSM, and DSC has been done. XRD shows no sign of phase

formation. The saturation magnetization and hysteresis loss of the alloy increases linearly with

increasing atomic percentage of Fe present in the solders. From hysteresis and latent heat of fu-

sion data, time taken to melt one gram of sample in a 15 kHz alternating magnetic field has been

determined, which decreases with increasing Fe atomic percentage. It can be thus concluded that

Fe remains as its elemental form after mechanical alloying with SAC305; thus providing en-

hanced magnetic properties of the solder, while decreasing the melting temperature of SAC305

solder.

7. Proton Beam Writing Xinxin XU, Sarfraz QURESHI, Nannan LIU, Fan LIU, Rudy PANG, Pattabiraman Santhana

RAMAN and Jeroen A. van KAN* Centre for Ion Beam Applications, Physics Department, National University of Singapore, Blk

S7, 2 Science Drive 3, Singapore – 117542. Proton beam writing (PBW) is a direct write lithographic technique that is being devel-

oped in CIBA, NUS. Compared with electron beam lithography (EBL), PBW can produce

unique 3D high aspect ratio structures featuring high density, vertical, smooth sidewalls and low

line-edge roughness. Meanwhile, the fabrication of micro/nano fluidic devices has been an

emerging field of research in recent years. A growing number of applications are found in biolo-

gy, chemistry, and medicine e.g. DNA nano-fluidics and particle separation. Polymer materials,

like polydimethylsiloxane (PDMS) and polymethylmethacrylate (PMMA), are very popular for

micro/nano-fluidics because of easy fabrication and low cost. Via PBW different types of molds

were fabricated for rapid polymer fluidic devices replication using nanoimprint lithography. The

main challenge of PBW is its writing speed, due to the low reduced brightness of the current ion

source (~10 A/m2SrV). From theoretical analysis and initial experiments, a nano-aperture elec-

tron impact ion source has the potential to improve the PBW brightness up to ~107 A/m2SrV.

This will make PBW as fast as EBL without cross talk between sub 10 nm lines.

8. Giant Magnetocaloric Effect and Colossal Magnetoresistance in EuTiO3

Km Rubi and R. Mahendiran

2 Science Drive 3, Physics Department, faculty of Science, National University of Singapore, 117551, Singapore

New materials exhibiting large magnetic entropy and adiabatic temperature changes are currently attracting a lot of attention due to their potential applications in magnetic refrigerator. Although, there are a number of studies on magnetocaloric studies on intermetallic alloys and Mn-based oxides, magnetocaloric effect in Ti-based oxides has been hardly reported. EuTiO3 re-mains paraelectric down to the lowest temperature and it orders antiferromagnetically below TN = 5.5 K due to interaction between 4f moments of Eu2+[1]. However, the antiferromagnetic and paraelectric EuTiO3 transforms into ferromagnetic and ferroelectric by tensile strain in EuTiO3

thin film [2]. We report magnetic entropy change (Sm) in the quantum paraelectric EuTiO3

which is an antiferromagnetic below TN = 5.5 K due to ordering of Eu2+:4f7 spins. We find -Sm

= 21.9(40.7) J/kg.K for a field of change of H =2(5) T which are the highest values among the rare earth titanates and Eu-based oxides. It also shows a large relative cooling power of 436 J/kg for DH = 5 T. Our results suggest that EuTiO3 is a potential cryogenic magnetic refrigerant to reach temperature below 20 K. Apart from the giant magnetocaloric effect, EuTiO3 also shows a colossal magnetoresistance (MR) at low temperature. EuTiO3 is an insulator in zero fields at low temperature, but shows an insulator metal transition with an application of external magnetic field. The value of MR reaches -99 % and 43 % at 2 K and 44 K, respectively with an applied field 7 T.

NOTES

NOTES

NOTES

Korea Surfin Consultant Co in January 1977 and Established in January 2013, Ko-

rea Nano Technology Co., Ltd. Later started to develop Pb-free Copper Core Solder

Ball by electroplating with MK Electron Co., Ltd. In August 2013 and in February

2014, developed metal colors by electroplating and imported Plasma Coating on Ti

implant Technology from Swiss. In June 2016, it has developed SURTENT coating

process for linear motion guide.

A-IATS recently completed a research collaboration agreement with NUS in 2010 -

2014 timeline and is also supporting NUS– Industry PhD Program since 2011. Cur-

rently, A-IATS is developing magnetically responsive solder materials for electronic

industry cluster system.

For more details on solder material, contact

Mr. Raaj,

BIZ development

Fax: 65-68411237, E = raj@a-iats.com

www. a-iats.com

Bruker Nano Surfaces provides the critical surface measurements necessary for success with the

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Singapore 417842

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Fintex Industries specializing in surface coating was formed in 1975. Then on, Fintex Industries

flourished in the 1980s, with the boom of the electronic industry, toward the mid-1990s when it

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