the wires
DESCRIPTION
EE4271 VLSI Design. Dr. Shiyan Hu Office: EERC 518. The Wires. Adapted and modified from Digital Integrated Circuits: A Design Perspective by Jan M. Rabaey, Anantha Chandrakasan, and Borivoje Nikolic. Modern Interconnect. Modern Interconnect - II. Interconnect Delay Dominates. 300. - PowerPoint PPT PresentationTRANSCRIPT
EE141© Digital Integrated Circuits2nd Wires1
The WiresThe Wires
Dr. Shiyan HuOffice: EERC 518
Adapted and modified from Digital Integrated Circuits: A Design Perspective by Jan M. Rabaey, Anantha Chandrakasan, and Borivoje Nikolic.
EE4271EE4271VLSI DesignVLSI Design
EE141© Digital Integrated Circuits2nd Wires2
Modern InterconnectModern Interconnect
transmitters receivers
EE141© Digital Integrated Circuits2nd Wires3
Modern Interconnect - IIModern Interconnect - II
EE141© Digital Integrated Circuits2nd Wires4
0.18
Source: Gordon Moore, Chairman Emeritus, Intel Corp.
0
50
100
150
200
250
300
Technology generation (m)
Del
ay (
pse
c)
Transistor/Gate delay
Interconnect delay
0.8 0.5 0.250.25
0.150.35
Interconnect Delay Dominates Interconnect Delay Dominates
EE141© Digital Integrated Circuits2nd Wires5
Wire ModelWire Model
EE141© Digital Integrated Circuits2nd Wires
CapacitorCapacitor
A capacitor is a device that can store an electric charge by applying a voltage
The capacitance is measured by the ratio of the charge stored to the applied voltage
Capacitance is measured in Farads
EE141© Digital Integrated Circuits2nd Wires
33D Parasitic CapacitanceD Parasitic Capacitance
Given a set of conductors, compute the capacitance between all pairs of conductors.
-
-
--
-
- -+
+
++
+C=Q/V
1V
EE141© Digital Integrated Circuits2nd Wires
Simplified ModelSimplified Model
Area capacitance (Parallel plate): area overlap between adjacent layers/substrate
Fringing/coupling capacitance: between side-walls on the
same layer between side-wall and
adjacent layers/substrate
m2m2 m2
m1
m3
EE141© Digital Integrated Circuits2nd Wires9
The Parallel Plate Model (Area Capacitance)The Parallel Plate Model (Area Capacitance)
Dielectric
Substrate
L
W
H
tdi
Electrical-field lines
Current flow
WLt
cdi
di
Capacitance is proportional to the overlap between the conductors and inversely proportional to their separation
EE141© Digital Integrated Circuits2nd Wires
Wire CapacitanceWire Capacitance
More difficult due to multiple layers, different dielectric
m2m2 m2
m1
m3
=3.9
=8.0
=4.0
=4.1
multipledielectric
EE141© Digital Integrated Circuits2nd Wires
Simple Estimation Methods - ISimple Estimation Methods - I
C = Ca*(overlap area)
+Cc*(length of parallel run)
+Cf*(perimeter) Coefficients Ca, Cc and Cf are given by
the fab Cadence Dracula Fast but inaccurate
EE141© Digital Integrated Circuits2nd Wires
Simple Estimation Methods - IISimple Estimation Methods - II
Consider interaction between layer i and layers i+1, i+2, i–1 and i–2
Cadence Silicon Ensemble Accuracy 50%
EE141© Digital Integrated Circuits2nd Wires
Library Based MethodsLibrary Based Methods
Build a library of tens of thousands of patterns and compute capacitance for each pattern
Partition layout into blocks, and match with the library
Accuracy 20%
EE141© Digital Integrated Circuits2nd Wires
Accurate Methods In IndustryAccurate Methods In Industry
Finite difference/finite element method Most accurate, slowest Raphael
Boundary element method FastCap, Hicap
EE141© Digital Integrated Circuits2nd Wires15
Fringing versus Parallel PlateFringing versus Parallel Plate
(from [Bakoglu89])
Coupling capacitance dominates.
EE141© Digital Integrated Circuits2nd Wires
Wire ResistanceWire Resistance
Basic formula R=(/h)(l/w)
: resistivity h: thickness, fixed for a given technology and layer
number l: conductor length w: conductor width
hl
w
EE141© Digital Integrated Circuits2nd Wires
Sheet ResistanceSheet Resistance
Simply R=(/h)(l/w)=Rs(l/w)
Rs: sheet resistance Ohms/square, where h is the metal thickness for that metal layer. Given a technology, h is fixed at each layer.
l: conductor length w: conductor width
l
w
EE141© Digital Integrated Circuits2nd Wires
Typical Rs (Ohm/sq)Typical Rs (Ohm/sq)
Min Typical Max
M1, M2 0.05 0.07 0.1
M3, M4 0.03 0.04 0.05
Poly 15 20 30
Diffusion 10 25 100
N-well 1000 2000 5000
EE141© Digital Integrated Circuits2nd Wires19
Contact and ViaContact and Via
Contact: link metal with diffusion (active) Link metal with gate poly
Via: Link wire with wire
EE141© Digital Integrated Circuits2nd Wires20
Interconnect Interconnect DelayDelay
EE141© Digital Integrated Circuits2nd Wires
Analysis of Simple RC CircuitAnalysis of Simple RC Circuit
)()()(
)())(()(
)()()(
tvtvdt
tdvRC
dt
tdvC
dt
tCvdti
tvtvtiR
T
T
state variable
Inputwaveform
± v(t)CR
vT(t)
i(t)
EE141© Digital Integrated Circuits2nd Wires
Analysis of Simple RC CircuitAnalysis of Simple RC Circuit
Step-input response:
match initial state:
output response for step-input:
v0
v0u(t)
v0(1-e-t/RC)u(t)
)()()(
0 tuvtvdt
tdvRC
)()( 0 tuvKetv RCt
)()1()( 0 tuevtv RCt
0 0)( 0)0( 00 vKtuvKv
EE141© Digital Integrated Circuits2nd Wires
0.69RC0.69RC
v(t) = v0(1 - e-t/RC) -- waveform
under step input v0u(t)
v(t)=0.5v0 t = 0.69RC i.e., delay = 0.69RC (50% delay)
v(t)=0.1v0 t = 0.1RC
v(t)=0.9v0 t = 2.3RC i.e., rise time = 2.2RC (if defined as time from 10% to 90% of Vdd)
For simplicity, industry usesTD = RC (= Elmore delay)
We use both RC and 0.69RC in this course. In textbook, it always uses 0.69RC.
EE141© Digital Integrated Circuits2nd Wires
Elmore DelayElmore Delay
Delay
1. 50%-50% point delay
2. Delay=RC (Precisely,
0.69RC)
EE141© Digital Integrated Circuits2nd Wires25
Elmore Delay - IIIElmore Delay - III
What is the delay of a wire?
EE141© Digital Integrated Circuits2nd Wires26
Elmore Delay – IVElmore Delay – IV
Assume: Wire modeled by N equal-length segments
For large values of N:
Precisely, should be 0.69RC/2
EE141© Digital Integrated Circuits2nd Wires
Elmore Delay - VElmore Delay - V
27
n1 n2
C/2 R C/2
n1 n2
R=unit wire resistance*lengthC=unit wire capacitance*length
EE141© Digital Integrated Circuits2nd Wires
RC Tree DelayRC Tree Delay
28
2 7
2
2
1 1 3.53.5
Unit wire cap=1, unit wire res=1
4
2
7
4
2*(1+3.5+3.5+2+2)=24 24+7*3.5=48.5
24+4*2=32
RC Tree Delay=max{32,48.5}=48.5 Precisely, 0.69*48.5
EE141© Digital Integrated Circuits2nd Wires
More Accurate RLC Delay ModelMore Accurate RLC Delay Model
29
At time t=0, switch is on. This effect is not felt everywhere instantaneously. Rather, the effect is propagated with a speed u. Denote by c0 the speed of light, epsilon the permittivity and mu the permeability of the dielectric of the medium which the wire is in, L and C the unit wire inductance and capacitance, respectively. According to Maxwell’s law,
I=V/R at t=0 is not right since you assume that you can see R with 0 time
EE141© Digital Integrated Circuits2nd Wires
RLC Delay - IIRLC Delay - II
30
Voltage and Current at time t1 and t2
R0 is the resistance you can really see at t1. R cannot be seen yet.
EE141© Digital Integrated Circuits2nd Wires
RLC Delay - IIIRLC Delay - III What is R0? The front of the voltage travels from 0 to l.
Suppose that the distance it moves is dx, the capacitance to be charged is Cdx. The charge is thus dQ=CdxV.
Current I=dQ/dt=CVdx/dt=CVu
where is called characteristic impedance.
EE141© Digital Integrated Circuits2nd Wires
RLC Delay - IVRLC Delay - IV R0 is a function of the medium For Printed Circuit Board (PCB), it is about
50-75 ohm For any x between 0 and l, we always have
Ix=Vx/R0,Il=Vl/R0 when x=l Note that there is a resistor R. We should
have Il=Vl/R
What happens if R!= R0?
EE141© Digital Integrated Circuits2nd Wires
RLC Delay - VRLC Delay - V At load, the wave will be reflected back to the source. The amplitude and polarity of this reflected wave are such that the
total voltage, the sum of incident voltage and reflected voltage, satisfies Il=Vl/R
If the incident voltage is V, denote by pV the reflected voltage, where p is called the reflection coefficient.
If incident current is V/R0, then reflected current is –pV/R0
Thus, (V+pV)/(V/R0–pV/R0)=R.
p=(R/R0-1)/(R/R0+1) R=R0, p=0, no reflection
R=infty, p=1, wire is unterminated R=0, p=-1, wire is short-circuited
There can be multiple rounds of reflections.
EE141© Digital Integrated Circuits2nd Wires
RLC Delay ExampleRLC Delay Example Consider a wire of length l, R0=100 ohm, R=900 ohm driven by the source
resistance (transistor equivalent resistance) Rs= 14 ohm. Source voltage is 12V as a step input at time t=0. We want to compute the waveform at the end of l.
Reflection coefficient
At t=0, V1=12*R0/(R0+Rs)=10V since it cannot see R yet
At t=td=l/u, wave V1 arrives at the end and is reflected as V2=pRV1=8V. The total voltage at the end is V1+V2 =18V
At time t=2td, wave V2 arrives at the source and reflected as V3=pSV2=-0.75*8=-6V
At time t=3td, wave V3 arrives at the end and is reflected as V4=PRV3=-4.8V, so the total voltage at the end is V1+V2+V3+V4=7.2V
Continues this process. Next total voltage at the end is 13.7V. The total voltage at l will converge to 12*R/(R+Rs)=11.7V
Rs=14
EE141© Digital Integrated Circuits2nd Wires
RLC Delay Example - IIRLC Delay Example - II
35
Voltage at the end of l
EE141© Digital Integrated Circuits2nd Wires
When To Use RLC ModelWhen To Use RLC Model
The voltages at first few td have large magnitudes and are quite different from RC model. This is because Rs<R0.
When Rs>>R0, V1 is small and is the reflected voltage V2. The total voltage at the end of the wire will gradually
increase to 11.7V, which is the same as predicted by RC model.
Thus, RLC model should only be used when Rs is small (see also Figure 4-21 in the textbook) since RLC model is expensive to compute.
RLC model can be used when the switching is fast enough since signal transition time is proportional to Rs.
v0v0u(t)
v0(1-e-t/RC)u(t)RC Model, V0=12
EE141© Digital Integrated Circuits2nd Wires
SummarySummary Wire capacitance
Fringing/coupling capacitance dominates area capacitance
Wire resistance RC Elmore delay model for wire
For single wire, 0.69RC/2 RC tree
RLC model for wire Reflection When to use