THEMIS Instrument FM2/FM3 PER Systems-1 Teleconference 8/30/2005

THEMIS

Instrument FM2/3

Pre-Environmental Review

System OverviewEllen Taylor

University of California - Berkeley

THEMIS Instrument FM2/FM3 PER Systems-2 Teleconference 8/30/2005

• Requirement Verification Status• Performance Requirements - MRD Verification and Tracking Process • FM2-FM3 MRD Verification Status• MRD Waivers, Liens and Outstanding Items• Environmental Test Requirements - ETM Verification and Tracking Process• FM2-FM3 ETM Verification Status• ETM Waivers, Liens and Outstanding Items

• Instrument I&T Procedures • List of Procedures, revision process

• Instrument As-Run I&T Flows• FM2 As-Run I&T Flow• FM3 As-Run I&T Flow

• Problem Failure Reports (PFRs)• PFR Statistics• PFR Status

Overview

THEMIS Instrument FM2/FM3 PER Systems-3 Teleconference 8/30/2005

Performance Verification

Mission Requirements Document (MRD) Verification Process• MRD Verification Matrix is available on-line at:

ftp://apollo.ssl.berkeley.edu/pub/THEMIS/1 Management/1.3 Systems Engineering/1. Requirements/thm_sys_001G.1_MRD.xls

• Verification Method Column: provides a short statement on how the requirement will be verified by inspection (I), test (T) or analysis (A)

• Verification Documentation Column: provides the QA plan (I), test procedure (T) or analysis report (A) where the requirement is explicitly inspected, tested or analyzed

• Verification Result Column: provides the dates when the inspection, test or analysis was completed. A separate Verification Result column is provided for each Flight Model

• Color scheme provides indication of whether requirement was verified (GREEN), has yet to be verified (YELLOW), has not been met (RED), or has been waived (GREY).

Example from THEMIS MRD Verification Matrix (thm_sys_001G.1_MRD.xls):

THEMIS Instrument FM2/FM3 PER Systems-4 Teleconference 8/30/2005

MRD Verification Status• 142 Instrument Specific Requirements; 123 Requirements have been verified (GREEN)• 16 Requirements are pending (YELLOW)

No pending requirements are considered liens for Instrument Suite Environmental Test

REQUIREMENT STATUS

IN-13 Survival Temperature Pending Suite TV Test, component TV tests complete

IN-14 Operating Temperature Pending Suite TV Test, component TV tests complete

IN-16 Magnetic Cleanliness Pending Suite Mag Survey, main offenders tested

IN-17 Electrostatic Cleanliness Pending Probe ESC Survey, components evaluated

IN-18 Contamination Pending Suite TV TQCM monitoring, harness has been baked-out

IN-21 Instrument Electrical ICD (IDPU-to-BAU) Pending Probe IDPU Integration, ETU I/F testing on-going

IN-22 Instrument Mechanical ICDs Pending Probe Instrument Integration, Hi-Fi Models integ.

IN.ESA-13 ESA On-orbit Calibration Pending on-orbit calibration, ESA FM2/3 ground cal complete

IN.SST-07, IN.SST-08 SST Calibration Pending FM2/3 calibration, FM1 cal w/modifications complete

IN.DPU-01 IDPU/BAU Command Interface Pending SAI PFB 0051 resolution, ETU I/F testing on-going

IN.DPU-05 FSW Data Compression Pending FSW V.X release, FSW bench test complete

IN.DPU-15 FSW Science TLM (Burst, Triggers) Pending FSW V.X release, FSW bench test on-going

IN.DPU-19 FSW Processing (Spin Fits/Sectors) Pending FSW V.X release, FSW bench test complete

IN.DPU-26 IDPU/BAU Sun Pulse Interface Pending SAI PFB 0052 resolution, ETU I/F testing on-going

IN.DPU-52 IDPU Box Thermal Design Pending IDPU/ESA TV Test, FM1 TV Test complete

THEMIS Instrument FM2/FM3 PER Systems-5 Teleconference 8/30/2005

MRD Verification Status (cont.)

• 3 Requirements have been waived (GREY)

• IN.ESA-08: ESA Dayside Energy Flux

Requirement: The ion ESA geometric factor shall be attenuated in the solar wind to avoid saturation.

Waived: Requirement to measure the solar wind (SW) is met without attenuating the geometric factor. The AMPTEKs count at high enough rate and the angular width of the channels is small enough (1/4 and 1/2 of 22.5deg) to measure the SW speed and ion temperature/density without being saturated. The electron detector is also OK because the SW temperature is high enough to not need narrower view.

• IN.DPU-09: Stored Housekeeping Telemetry

Requirement: The IDPU DCB shall not erase instrument housekeeping telemetry from memory unless commanded to do so

Waived: Requirement to not erase instrument housekeeping telemetry in memory until commanded to do so is met by Probe Bus requirement PB.CDH-27. All instrument housekeeping telemetry (APID 404 and 406) is saved in the Probe BAU memory and erased only on command. Therefore, this is not a requirement on the DCB.

• IN.EFI-11: EFI Noise Level

Requirement: The EFI noise level shall be below 1 x 10^-4 mV/m/sqrt(Hz).

Waived: EFI measured noise level is 2 to 3 x 10^-4 mVm/sqrt(Hz). Slightly higher value does not have a significant impact on science measurement.

• 0 Requirements have not been met (RED)

THEMIS Instrument FM2/FM3 PER Systems-6 Teleconference 8/30/2005

Environmental Test Verification

Environmental Test Matrix (ETM) Tracking• ETM is available on-line at:

ftp://apollo.ssl.berkeley.edu/pub/THEMIS/1 Management/1.3 Systems Engineering/1. Requirements/ETM_TestRecord_7.xls

• ETM has evolved into a record of the test program as-run• Each Instrument hardware item in ETM has fields for test description, test date, and reference

procedure/report. PFR number is also noted if applicable.• Applies to all instrument assemblies, subsystems and systems

Example from THEMIS Environmental Test Matrix (ETM_TestRecord_7.xls):

THEMIS Instrument FM2/FM3 PER Systems-7 Teleconference 8/30/2005

ETM Status

Vibration Testing - Over 80 component Vibration Tests have been completed• FM2/FM3 Vibration Testing Summary (W* indicates Workmanship vib):

COMPONENT SPECIFICATION PROCEDURE Grms DATE

FM2 FGM Sensor (FGS)

FM3 FGM Sensor (FGS)

SAI-TM-2508 (Acc) DLR-MDT-031-05

DLR-MDT-031-06

11.7

11.7

06/28/04 to 07/02/04

06/28/04 to 07/02/04

FM2 FGM Boom (FGB)

FM3 FGM Boom (FGB)

SAI-TM-2430-RevD (Acc) THM-MBS-PRC-001C 11.54

11.54

06/09/05

06/16/05

FM2 SCM Sensor (SCM) FM3 SCM Sensor (SCM)

SAI-TM-2430-RevD (Acc) THM-SCM-SC-TST-23

THM-SCM-SC-TST-33

11.54

11.54

12/10/04 to 12/13/04

02/10/05 to 02/11/05

FM2 SCM Pre-Amp

FM3 SCM Pre-Amp

SAI-TM-2430-RevD (Acc) THM-SCM-PA-TST-21

THM-SCM-PA-TST-31

7.09

7.09

09/20/04 to 09/21/04

02/07/05 to 02/08/05

FM2 SCM Boom (SCB)

FM3 SCM Boom (SCB)

SAI-TM-2430-RevD (Acc) THM-MBS-PRC-001C 11.54

11.54

06/09/05

06/16/05

FM2 IDPU

FM3 IDPU

SAI-TM-2430-RevD (Acc) THM-ESA-PRC-007 7.09

7.09

TBDone 8/30/05

TBDone 9/01/05

FM2 ESA

FM3 ESA

SAI-TM-2430-RevD (Acc) THM-ESA-PRC-007 7.09

7.09

TBDone 8/30/05

TBDone 9/01/05

FM2 SST (x2)

FM3 SST (x2)

SAI-TM-2655 (Acc) THM-SST-PRC-002 12.51

12.51

04/22/05, TBDone W*

05/16/05, TBDone W*

FM2 EFI Axial (x2)

FM3 EFI Axial (x2)

SAI-TM-2430-RevD (Acc) THM-AXB-INT-301 7.09

7.09

02/07/05

02/25/05, 03/15/05 W*

FM2 EFI Spin Plane (x4)

FM3 EFI Spin Plane (x4)

SAI-TM-2430-RevD (Acc) THM-SPB-PRO-423 7.09

7.09

12/06/04, 03/04/05 W*

03/04/05

THEMIS Instrument FM2/FM3 PER Systems-8 Teleconference 8/30/2005

ETM Status (cont.)Thermal Vacuum Testing - Over 100 component TV Tests have been completed• FM2/FM3 TV Testing Summary (note some test temps were increased to ensure no

component would see more extreme temps in Suite TV):

COMPONENT TEST TEMPS PREDICTS PROCEDURE DATE

FM2 FGM Sensor (FGS)

FM3 FGM Sensor (FGS)

-120C to +75C -87C to +53C THM-IWF-003 07/01 - 07/03/04

09/10 - 09/12/04

FM2 FGM Boom (FGB)

FM3 FGM Boom (FGB)

-115C to +75C -94C to +69C THM_MBS-PRC-002B

THM_MBS-PRC-002D

06/23/05

06/27/05

FM2 SCM Sensor (SCM) FM3 SCM Sensor (SCM)

-70C to +45C -59C to +38C THM-SCM-TST-24

THM-SCM-TST-34

12/13 - 12/17/04

02/21 - 02/25/05

FM2 SCM Pre-Amp

FM3 SCM Pre-Amp

-45C to +55C -39C to +40C THM-SCM-TST-22

THM-SCM-TST-32

10/27 - 28/04

02/15 - 02/16/05

FM2 SCM Boom (SCB)

FM3 SCM Boom (SCB)

-115C to +75C -94C to +69C THM_MBS-PRC-002B

THM_MBS-PRC-002D

06/23/05

06/27/05

FM2 IDPU

FM3 IDPU

-40C to +55C -18C to +39C THM-ESA-PRC-016 TBDone 9/05/05

TBDone 9/05/05

FM2 ESA

FM3 ESA

-40C to +55C -20C to +37C THM-ESA-PRC-016 TBDone 9/05/05

TBDone 9/05/05

FM2 SST (x2)

FM3 SST (x2)

-60C to +55C -50C to +12C THM-SST-PRC-003 04/28 - 05/03/05

TBDone

FM2 EFI Axial (x2)

FM3 EFI Axial (x2)

-60C to +75C -41C to +64C THM-AXB-INT-303C

THM-AXB-INT-303D

02/09 - 02/11/05

03/07 - 03/09/05

FM2 EFI Spin Plane (x4)

FM3 EFI Spin Plane (x4)

-55C to +55C -8C to +45C THM-SPB-PRO-424 03/09 - 03/17/05

03/24, 04/04/05

THEMIS Instrument FM2/FM3 PER Systems-9 Teleconference 8/30/2005

I&T Procedures

Integration and Test Procedures• All procedures are available on-line at: ftp://apollo.ssl.berkeley.edu/pub/THEMIS/1

Management/1.3 Systems Engineering/thm_sys_000_DocumentList.xls• Document List provides unique document number, title, POC, revision letter, status and

link to document for all procedures• Procedures are signed off by cognizant engineer, MSE, and MAM prior to being run• If necessary, procedures are redlined during test. Procedures are revised prior to being

run on the next flight model. • MSE and MAM sign as-run I&T procedures after reviewing redlines and test results

Example from THEMIS Document List (thm_sys_000_DocumentList):

THEMIS Instrument FM2/FM3 PER Systems-10 Teleconference 8/30/2005

FM2 As-Run I&T Flow

MAG BoomIntegration

IDPU Board Level Tests

IDPUIntegration

Instrument Payload

Self-Compatibility

• thm-pcb-proc PCB Flight Board Test: 02/09/05 • thm-dcb-proc DCB Flight Board Test: 02/11/05• thm-beb-proc BEB Flight Board Test: 11/08/04• thm-dfb-proc DFB Flight Board Test: 05/18/05*• thm-dcb-proc DAP Flight Board Test: 05/23/05*• thm-lvps-proc LVPS Flight Board Test: 04/13/05

EFIIntegration

SPB DeploySCM

Integration

• thm-idpu-proc-001 PCB Integration: 04/21/05• thm-idpu-proc-003 BEB Integration: 04/26/05• thm-idpu-proc-004 DFB Integration: 04/26/05• thm-idpu-proc-005 DAP Integration: 05/03/05• thm-idpu-proc-006 LVPS Integration: 05/05/05

• thm-int-proc-001 SCM Integration: 05/09/05 • thm-int-proc-003 EFI Integration: 05/17/05 • thm-int-proc-004 SPB Deploy: 06/15/05 PFR 072: SPB Door 2 Failure - OPENED

• thm-int-proc-005 EFI Intercalibration: 06/23/05• thm-int-proc-006 SST Integration: 06/24/05

• thm-int-proc-007 ESA Integration: 07/05/05 • thm-int-proc-008 MAG Boom Integration: 07/08/05 • thm-int-proc-013 Instrument SCT: 07/12/05 PFR 090: SST Sun Pulse - OPENED

Fields Intercalibration

SSTIntegration

ESA Integration

• thm-int-proc-019 DFB AKR: 06/28/05 PFR 085: AKR Noise - OPENED

InstrumentPayload CPT

InstrumentPayload CPT

Coating/StakingBoard Mods

Board Re-Tests• thm-sys-proc-005 Instrument CPT: 07/11/05

LVPS Board, IDPU Box Re-Work

InstrumentPayload CPT

• thm-lvps-proc LVPS Flight Board Test: 08/16/05• PFR 093: DFB Faceplate Damage - OPENED

SPB DeployRe-Test

• thm-sys-proc-005 Instrument CPT: 08/25/05 PFR 085: AKR Noise - CLOSED PFR 090: SST Sun Pulse - CLOSED

DFB AKR, Filter Bank, FFT, and

Derived Quantities

FGM Integration

• thm-int-proc-002 FGM Integration: 04/25/05

• thm-int-proc-004 SPB Deploy: 08/26/05 PFR 072: SPB Door 2 Failure - CLOSED

• thm-sys-proc-005 Instrument CPT: 08/22/05 PFR 092: Resistor damage in LVPS - OPENED

PFR 092: Resistor damage in LVPS - CLOSED PFR 093: DFB Faceplate Damage - CLOSED

THEMIS Instrument FM2/FM3 PER Systems-11 Teleconference 8/30/2005

FM3 As-Run I&T Flow

ESA Integration

IDPU Board Level Tests

IDPUIntegration

InstrumentPayload CPT

• thm-pcb-proc PCB Flight Board Test: 04/20/05• thm-dcb-proc DCB Flight Board Test: 03/17/05• thm-beb-proc BEB Flight Board Test: 02/16/05• thm-dfb-proc DFB Flight Board Test: 05/26/05• thm-dcb-proc DAP Flight Board Test: 06/13/05*• thm-lvps-proc LVPS Flight Board Test: 05/16/05

SPB DeploySCM

IntegrationEFI

Integration

• thm-int-proc-001 SCM Integration: 07/01/05

• thm-idpu-proc-001 PCB Integration: 05/23/05• thm-idpu-proc-003 BEB Integration: 05/25/05• thm-idpu-proc-004 DFB Integration: 06/07/05• thm-idpu-proc-005 DAP Integration: 05/25/05• thm-idpu-proc-006 LVPS Integration: 06/17/05

• thm-int-proc-002 FGM Integration: 05/26/05

• thm-int-proc-003 EFI Integration: 06/28/05 • thm-int-proc-004 SPB Deploy: 06/30/05

• thm-int-proc-005 EFI Intercalibration: 07/05/05• thm-int-proc-006 SST Integration: 07/13/05

• thm-int-proc-007 ESA Integration: 07/20/05• thm-int-proc-008 MAG Boom Integ.: 07/19/05

• thm-int-proc-013 Instrument SCT: 07/25/05

FieldsPhasing Test

DFB AKR, Filter Bank, FFT, and

Derived Quantities

• thm-int-proc-019 DFB AKR: 07/08/05

InstrumentPayload CPT

Instrument Payload

Self-Compatibility

Coating/StakingBoard Mods

Board Re-Tests

• thm-sys-proc-005 Instrument CPT: 07/21/05 PFR 089: 10V drawing more current - OPENED

• thm-sys-proc-005 Instrument CPT: 08/27/05 PFR 089: 10V drawing more current - CLOSED

SSTIntegration

FGM Integration

MAG BoomIntegration

THEMIS Instrument FM2/FM3 PER Systems-12 Teleconference 8/30/2005

PFRs

Problem Failure Reports (PFRs)• PFRs are available on-line at:

ftp://apollo.ssl.berkeley.edu/pub/THEMIS/1 Management/1.3 Systems Engineering/

8. PFRs/thm_pfr_master_list.xls• PFR List includes unique number, title, assembly, POC, status by Flight Model (FM), link to

PFR document.pdf, and a short description of the corrective action• PFR is closed when corrective action has been completed on specified flight unit• Closed PFRs are printed, signed by PM, MSE, MAM and Cog. Engineer and filed

Example from THEMIS Instrument PFR Master List (thm_pfr_master_list.xls):

KEY: X = unit affected, corrective action completed

0 = unit affected, corrective action not completed

- = unit not affected, no corrective action needed

THEMIS Instrument FM2/FM3 PER Systems-13 Teleconference 8/30/2005

PFR Summary

PFR Statistics• 54 PFRs logged since FM1 PER (PFR 039 – PFR 093)• 32 PFRs affected FM2: 29 Closed, 3 Open • 26 PFRs affected FM3: 23 Closed, 3 Open• Open FM2/FM3 PFRs

• PFR 045 PROBLEM: Non sequential sequence count in the packet header of ESA data

RESOLUTION: FSW problem, investigation on-going. Analysis shows problem is most likely due to packet minimum set during test. Very little data affected.

• PFR 065 PROBLEM: Bad, missing or out of order EFI data

RESOLUTION: FSW problem, investigation on-going. Problem is similar as PFR 045 above.

• PFR 067 PROBLEM: Temperature dependence of 28V Actuator Voltage Monitor RESOLUTION: Resistors were changed in the

actuator monitor circuit to correct the amount of current driving the opto-coupler. PFR will be closed

after successful TV test of the IDPU.

• 3 PFRs are Open on FM1 awaiting TV re-testNo Open PFRs are considered liens for Instrument Suite Environmental Test

THEMIS Instrument FM2/FM3 PER Systems-14 Teleconference 8/30/2005

PFR Summary

2 PFRs had system-wide impacts

• PFR 085 AKR Band Noise Floor Exceeded Specification• AKR measurement was listed as an open item at FM1 PER• Problem found during DFB AKR, Filter Bank, FFT and Derived Quantities Test on FM2• IDPU LVPS was modified to move X-axis converter frequency out of measurement range

(from 150kHz to 1.2MHz)• IDPU DFB was modified to include a notch filter • IDPU board modifications were completed on FM2 and FM3 prior to final CPTs• PFR will be discussed further in EFI presentation

• PFR 090 SST Sun Pulse affected SCM Data• SST sun pulse problem was a known issue at FM1 PER• Impact on other Instruments was investigated during Self Compatibility testing on FM2• SCM uses the same converter and showed susceptibility - will be discussed further in

SCM presentation• SST sun pulse suppression circuit (mezzanine boards) was added to SST Sensor

Electronic Assemblies (SEAs) - will be discussed further in SST presentation• IDPU LVPS was modified (resistor change) to account for additional current draw• IDPU and SST modifications were completed on FM2 and FM3 prior to final CPTs