Thermal Management in Electronic Components –Can Polymers Replace Metals or Ceramics?

Aravind Chander, Senior Research Analyst,

Technical Insights, Chennai,

June 3, 2008

2

Focus Points

• Introduction to Thermally Conductive Polymers (TCPs)

• Technology Challenges and Drivers

• Current Trends and Future Trends

• Material Technologies Analysis

• Technological Innovations in this Arena

• Key Industry Participants

3

Introduction

• Electronic devices are getting smaller and thinner

• Conventional plastic components overheat often and develop

localized "hot spots"

• Development of TCP’s has paved way to significant breakthrough

for thermal management applications as they carry the same heat transfer capacity as metals or ceramics

• TCP’s have good chemical resistance and give up heat faster

during molding than conventional plastics

4

ManufacturingCost

Thermal Fatigue and

Heat Dissipation

Elevated Temperature

Challenges – Thermally Conductive Polymers

Note: Size of the ball is not related toimportance or weight of the factor

Due to the polymer properties such as High CTE and Low

Thermal Conductivities.

The increase in activities of the components has led to demand for more powerin order to maintain the existing performance.

Lack of NewPolymer

Compounds

Concern for Passive

Component Manufacturers

high-temperature conditions

for a long period of time

can damage or change

their organic properties.

There is a demand for newer compoundsthat could compete with the existing

thermoplastic compositions.

Demand for More Power

High initial cost is the biggest obstacle to wider acceptance of

thermally conductive compounds.

5

Continuedfocus onWeight

Reduction

Drivers – Thermal Conductive Polymers

Easy material

process ability Polymers, particularly bio-based polymeric compounds are gaining importance which

can be effectively recycled with no harmful effect on the environment.

Polymers can be more easily custom manufactured to a wider rangeof sizes and shapes when compared to conventional materials.

This enables them to be deployed for a broader range of applications.

Note: Size of the ball is not related toimportance or weight of the factor

Compounds can be used as encapsulates in

electronic component packaging making it suitable for smaller and thinner without

compromising onmechanical properties.

Excellent Mechanical

Properties

Weight reduction by means of using plastics for manufacturing safer, lighter and high performance devices.

Miniaturization

of electroniccomponents

Recyclability

Thermally Conductive Polymers possess higher flexural strength, tensile

stiffness, and low-impact strengths.

6

Current Trends

Laser Diode Encapsulation is in

the developmental phase

High viscosities make molding

over a large surface area

difficult

Carbon nanofibers and boron

nitride filler is gaining more

attraction

Custom-molded heat

sinks on circuit boards

Thermally conductive adhesives

for lighting application

Current

Trends

7

Future Trends

Elastomers is expected to get

more treatment

Tailorable CTEs with low

manufacturing cost

PCB itself can act as heat sink

New compounds from

natural resources high

temperature stability

Composites will target flip chips

and solder joint applications

Future

Trends

8

Parameters for Technology Performance

Temperature range

Mechanical Strength

Processing ease and

Workability

Chemical resistance

CTE

Technology

Performance

9

Parameters for Application Potential

Cost

Miniaturization of

components

Design

Thermal Stability

Light Weighted ness

Application

Potential

10

Technology Performance Vs Application Potential (Present Scenario)

Electronics Sector- Present Scenario

Silicone

Carbon Nanofibres

Epoxies

AcrylicsUrethanes

0

5

10

0 5 10Technology Performance

Ap

plicati

on

Po

ten

tial

11

Technology Performance Vs Application Potential(7- 10 years from Now)

Electronics Sector-10 years from now

Silicones

Carbon Nanofibres

Epoxies Acrylics

Urethanes

0

5

10

0 5 10

Technology Performance

Ap

pli

cati

on

Po

ten

tial

12

Noteworthy Innovations

� Development of a polycarbonate compound (Nemcon- H) by Ovation Polymers Inc.

� National Starch and Chemical Company, NJ, USA have demonstrated fusible particles can enhance thermal conductivity.

� A broad range of Vectra liquid crystal polymer (LCP) grades using several polymer systems with various fillers and reinforcements was developed by Ticona Technical Polymers, KY, US

� Development of a new thermally conductive line of compound by Dow Corning Corporation, US.

� Development of a series of boron nitride filler grades under the name PolarTherm by Momentive Performance Materials GmbH.

13

Key Industry Participants

Pronat

Industries Ltd.

Cool Polymers Inc

Ovation PolymersFujipoly American CorporationCYTEC IncCast-Coat Inc

TimtronicsDiemat Inc.Ticona Technical Polymers

MomentivePerformance Materials

Kunze Folien GmbHShin-Etsu

Chemical Co. Ltd

14

Your Feedback is Important to Us

Growth Forecasts?

Competitive Structure?

Emerging Trends?

Strategic Recommendations?

Other?

Please inform us by taking our survey.

What would you like to see from Frost & Sullivan?

15

For Additional Information

Steve LeeStrategic Account ManagerChemicals, Materials and Food, Asia Pacific(65) 6890 0914steve.lee@frost.com