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Thermal Image Sensors The Lynred atto640 thermal imaging sensor is ideal for SWaP applications. Manufactured using wafer-level packaging technology and integrated into a 16.5 x 16.5 mm2 SMT package, the atto640 is the smallest 60 Hz sensor on the market with a pixel pitch of 12 μm. The atto640 was developed with more compact systems in mind as an alternative to the popular Pico640 17 μm VGA sensor. It offers all of the features and performance required by leisure, defense, surveillance, and thermography applications. THE SMALLEST VGA 12 µm THERMAL IMAGING SENSOR ON THE MARKET LEISURE THERMOGRAPHY BEST IN CLASS SWAP CHARACTERISTICS CRISP MOVING IMAGES SEAMLESS INTEGRATION INTO VOLUME MANUFACTURING ENVIRONMENTS 640 x 480 – 12 µm 640 TM DEFENSE SURVEILLANCE

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Thermal Image Sensors

The Lynred atto640 thermal imaging sensor is ideal for SWaP applications. Manufactured using wafer-level packaging technology and integrated into a 16.5 x 16.5 mm2 SMT package, the atto640 is the smallest 60 Hz sensor on the market with a pixel pitch of 12 μm.

The atto640 was developed with more compact systems in mind as an alternative to the popular Pico640 17 μm VGA sensor.

It offers all of the features and performance required by leisure, defense, surveillance, and thermography applications.

THE SMALLEST VGA 12 µm THERMAL IMAGING SENSORON THE MARKET

LEISURE

THERMOGRAPHY

BEST IN CLASS SWAP CHARACTERISTICS

CRISP MOVING IMAGES

SEAMLESS INTEGRATION INTO VOLUME MANUFACTURING ENVIRONMENTS

640 x 480 – 12 µm

640TM

DEFENSE

SURVEILLANCE

Thermal Image Sensors

THE SMALLEST VGA 12 µm

PRODUCT PARTNUMBER: ATTO640

“Perfect for compact battery-

operated systems”

• Sharp contrast Thermal sensitivity<60mK or (optional)<50mK (at F/1, 300K, 30Hz)

• Flicker-free image Frame rate up to 60Hz

Thermal time constant < 10ms

• High uniformity Operability > 99.5%

“Capture even the tiniest details ”

SEAMLESS INTEGRATION• Compatible with volume manufacturing

Surface Mount Device (J-Lead44) compatible with standard off-the-shelf socket Wafer Level Packaging & high-volume assembly processes Delivery in JEDEC trays

• QVGA-compatible product platform Footprint compatible with QVGA products: PICO384-053 (17 µm)

and ATTO320 (12 µm)

• Flexible configuration Full access to sensor features (I2C) Free run or external trigger mode

“Ready for volume manufacturing”

The technical specifications and other product information in this document are provided for information only and are subject to change without notice.

640 x 480 – 12 µm

640TM

Recognition distances for human measuring 1.80 m x 0.50 m

1.8

0 m

0.50 m

18 mm lens(12°x 9°)

(8.8°x 6.6°)

(5.5°x 4°)

25 mm lens

40 mm lens

240 m

330 m

530 m

25 mm lens(17.5°x 13°)

(11°x 8.2°)

(5.9°x 4.4°)

40 mm lens

75 mm lens

330m

530m

990m

RÉF

.03

/20

19

/02

/EN

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s:U

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Prin

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in F

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CRISP MOVING IMAGES

• Compact, affordable optics 12µm pixel pitch

• Smallest VGA sensor on the market 16.5 x 16.5 mm2 package

with Lynred wafer-level packaging technology

• Low-power for optimal battery usage 130 mW @ 60Hz (analog output)

BEST IN CLASS SWAP CHARACTERISTICS

0.50m

1.8

0m

LYNRED HEADQUARTERSAvenue de la Vauve - CS 20018

91127 Palaiseau - FrancePhone +33 (0)1 60 92 18 30

[email protected]

DEVELOPMENT AND PRODUCTION CENTERActipole-CS 10021

364, route de Valence38113 Veurey-Voroize - France

Phone +33 (0)4 76 28 77 [email protected]

www.lynred.com