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ThinkStation P300

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System Overview

The single­processor P300 workstation uses a Micro Advanced Technology Extended (MATX)motherboard, both 280 watt (W), and an optional 450 watt (W) power supply unit (PSU) for Tower and a240 watt(W) for the Small Form Factor (SFF). The motherboard chipset consists of the Intel® PCHsupporting error­correcting code (ECC) Double Data Rate 3 (DDR3). Maximum memory supported is32GB for UDIMMs. The processor socket is an Intel® LGA1150 GA­C2 level with support for dualcore, quad core, processors from the Intel® Xeon line (E3­1200V3 family of processors).

Section I: System OverviewOperating Systems

PreloadedGenuine Windows 7® Professional 64­bit Genuine Windows 7® Professional 32­bit Genuine Windows8.1® Professional 64­bit Genuine Windows 8.1® 64­bit Genuine Windows 8.1® 64­bit ChinaSupportedRed Hat Enterprise Linux 6.4

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Motherboard ­ P300

Table 1. P300 Motherboard SummaryP300 Motherboard SummaryForm FactorBoard Size 9.6″ x 9.6″ (244mm x 244mm)Layout Custom ATXMotherboard Core

Processor Support

Intel® Xeon™ E3­1200V3 (Haswell Refresh)Intel® i7™ Quad CoreIntel® i5™ Quad CoreIntel® i3™ Dual Core

Socket Type (1) x Intel Socket (LGA1150)Memory Support 1600/1333/1066 MHzVoltage Regulator 87W TDPChipset (PCH) Denlow (Intel C226)HW Monitor N/ASuper I/O IT8731FAudio ALC662VC1­GR/ALC662VD­GR（co­lay）Ethernet Intel L217LM ClarkvilleMemorySlots 4Channels 2Type DDR3 Unbuffered DRAM (UDIMM)ECC Support YesSpeed Up to PC3­12800 (1600MHz)Max DIMM Size 8GB UDIMMMax SystemMemory Up to 32GB UDIMM (w/8GB)

EthernetVendor IntelCount 1EEPROM None (part of SPI flash)Speeds 10/100/1000 Mbps

FunctionsPXEWOLAMT

Connectors (1) x RJ45 on Rear I/OAudioVendor RealtekType Integrated AudioInternal Speaker Yes

Connectors

(3) x Rear 3.5mm Jacks (Line In, Line Out,Microphone In)(2) x Front 3.5mm Jacks (Headphone out,Microphone In)One 14­pin connector cut pin 14

Chipset ALC662Stereo Conversion 24­bit DAC and 24­bit ADCHigh Definition

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Stereo Support

Number of Channels 6Number ofBits/AudioResolution

6 channels of DAC support 16/20/24­bit PCMformat for 5.1 audio solution2 stereo ADC support 16/20­bit PCM format

Sampling Rate(recording/playback)Support 44.1K/48K/96K sample rate

Signal to NoiseRatio DAC SNR>98dBFSA, ADC SNR>90dBFSA

Wavetable Voices 32­voice wavetable(For XP only)Analog Audio Dolby Digital NoneTHX NoneDigital Out(S/PDIF) None

Speaker PowerRating

Int Speaker (1.5W) / Ext 2.0 Speaker (4W) –Tower

VideoOnboard SupportedType IntegratedBus Interface Processor onboardDisplay Interface VGA/DP/DPVideo Resolution(max)

VGA/DP: 2560×1600@60HzDVI/HDMI: 1920×1200@60Hz

Graphics CoverName Intel HD Graphics P4600

Adapter (1) x PCI­E 3.0 16­lane Slot(1) x PCI­E 3.0 16 lane Slot (x4 electrical)

StorageFloppy NoneIDE None

SATA

(2) x SATA Connectors, Gen. 2 (AHCI)(2) xSATA Connectors, Gen. 3 (AHCI)(1) x eSATAConnector, Gen. 2 (eSATA bracket)SATA RAID 0,1, supported natively via IntelController

eSATA (1) x eSATA Connector, Gen. 2, cabled to slot viabracket

SlotsPCIAvailable Slots 1 Full Height, 1 Low Profile (SFF)PIN Count 120 pins connectorsData Bus Width 32bit /33MHz; 133MB/sVoltage 3.3VPCI Express x4 (physical x16)Available Slots 1 Full Height, 1 Low Profile (SFF)PIN Count 164 pins connectorsData Bus Width 8GB/s per Direction; duplex 16GB/sVoltage 12V

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Power (Max) 75W, 45W (SFF)PCI Express x1Available Slots 1 Full Height, 1 Low Profile (SFF)PIN Count 36 pins connectorsData Bus Width 500MB/s per Direction ; duplex 1GB/sVoltage 12VPower (Max) 25WPCI Express x16Available Slots 1 Full Height, 1 Low Profile (SFF)PIN Count 164 pins connectorsData Bus Width 8GB/s per Direction; duplex 16GB/s12V 75W, 45W (SFF)Rear I/OCOM (1) x Serial Port (COM1), (1) x optionaleSATA (1) x eSATA Port (Gen. 2), optional via bracketLPT None

Video 1 VGA2 Display Port

Audio Microphone­In, Line In, Line OutEthernet (1) x RJ45USB 2.0 (2) x USB 2.0 PortsUSB 3.0 (4) x USB 3.0 PortsFront I/O USB 3.0 (2) x USB 3.0 PortsHeadphone (1) x Headphone Line OutMicrophone (1) x Microphone­inInternal I/O

USB 2.0· Front Panel USB Header (2 ports)· Media Card Reader Header· Internal USB connector

PS/2 (1) x 2­port PS/2 Header, ports optional via bracketAudio (1) x Front Panel Mic & Line­Out HeaderCOM2 (1) x Serial Port (COM2)Clear CMOS 3­Pin Clear CMOS HeaderSpeaker 2­Pin Internal Speaker HeaderChassis Intrusion 2­Pin Chassis Intrusion Switch HeaderThermal

Fans Headers(1) x 4­Wire CPU Fan(1) x 4­Wire Rear Fan(1) x 3­Wire Front PCI Fan

Power ConnectorsMain (1) 14­Pin (2×7) ATX StandardVRM (1) 4­Pin (2×2) ATX 12V StandardSecurity

Nuvoton Nuvoton NPCT421LA0WX / STMicroST33ZP24AR28PVQC (co­lay)

Asset ID Rohm BUL08­1FJ­W/FVJ­W / NXPPCA24S08AD

vPro vPro for WS (AMT 9.x)BIOS

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Vendor AMIEthernet

The E32 motherboard implements onboard gigabitEthernet via one Intel L217LM Clarkvillecontroller. This integrated solution has support forthe industry standard functions of Wake on LAN(WOL) and Preboot Execution Environment (PXE).Additionally, for Manageability features, Clarkvillewill support AMT.

AudioThe ALC662­VD chip from Realtek provides E32with stereo audio capability that meets Windows7Premium performance requirements. HD 5.1 audiois supported via jack remapping. There are 2 frontanalog jacks, and 3 rear color­coded (per MS VistaLogo Specification SYSFUND­0041) analog jacks.

ChassisSummary

E32 Chassis is a 25­liter ATX­form factor towermechanical with 2 external 5.25″ drive bays, 1external 3.5″ drive bay, and 2 internal 3.5″ drivebays.The other E32 chassis is a 12.9­liter ATX­formfactor tower mechanical with 1 external 5.25″ drivebays, 1 external 3.5″ drive bay, 1 internal 3.5″ drivebays and 1 optional internal 2.5" drive bay

Chassis Info:

Chassis Info: Tower SFFColor Raven Black paint Raven Black paintForm Factor Tower SFFVolume(Approximate) 25L 12.9L

Orientation Vertical Vertical or horizontalKensington slot Yes YesPadlock loop Yes NoIntrusion switch Yes YesHandles No (Front lip and rear shelf) No5.25" to 3.5" HDDConversionKit,325BT(with1to 2 powerconverter cable)

Yes No

50mm 1 to 2 fanpower converter Yes No

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cableQ4000 bracket325BT Yes No

ChassisDimensions

Height (mm) 425.2 338Height (inch) 16.74 13.31Width (mm) 175 102Width (inch) 6.89 4.02Depth (mm) 431 375Depth (inch) 16.97 14.76Weight (kgs) 12.5 7.8Weight (lbs) 27.56 17.2

NOTE: HxWxD(mm) are based on maximum length, which include: PCI holder,plastic foot

PackagingParameterswithout ExternalSpeaker

Height (mm) 510 505Height (inch) 20.08 19.88Width (mm) 310 215Width (inch) 12.2 8.46Depth (mm) 540 530Depth (inch) 21.26 20.87Weight (kgs) 14 9.23Weight (lbs) 30.86 20.34

1P Thermal Solution

The E32 1P system will utilize a single fansink solution supporting 87W, 69W, 77W, 55W, and 65WCPUs. In addition to the CPU fansink, the E32 1P system will contain a rear system fan, an optional frontPCI fan (to be used only with Inactive powered graphics adapters).

Security & ServiceabilityPhysical Security and ServiceabilityAccess Panel Tool­less side cover removalOptical Drive Tool­lessHard Drives Tool­lessExpansion Cards Tool­lessProcessor Socket Tool­lessColor coded UserTouch Points Yes

Color­coordinatedCables andConnectors

Yes

Memory Tool­less

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System Board Tool­lessGreen ColorPower LED onFront of Computer

Yes

Restore CD/DVDSet

Restore system to original factory shipping image –Can be obtained via Lenovo Support

Cable LockSupport Yes, Optional Kensington Cable Lock

Serial, USB,Audio, Network,Enable/DisablePort Control

Yes

Power­OnPassword Yes

Setup Password YesNIC LEDs(integrated) Yes

Security Chip YesBoot SequenceControl Yes

Padlock Support Yes, loop in rear for optional padlock, prevents sidepanel removal E32 SFF do not support it.

Boot withoutkeyboard and/ormouse

Yes

Operating EnvironmentTemperatureOperatingTemperature 10 degrees C – 35 degrees C (50F to 95F)

Non­operatingTemperature (­40 degrees C – 60 degrees C) (50F to 140F)

Wet bulbtemperature 25 degrees C (max)(Operating)

40 degrees C (max) (Non­Operating)HumidityOperating Humidity 20% ~ 80% (non­condensing)

Non­Operating 20% ~ 90%(non­condensing)Heat Maximum: 955 Btu/hr / 280 WAltitudeOperating –15.2 to 3048 m (–50 to 10,000 ft)Storage –15.2 to 10,668 m (–50 to 35,000 ft)VibrationWith Package 1.04 G at 2 to 200 Hz at 1 octave/minWithout package

Operating 0.27 G at 5 to 500 Hz at 0.5octave/min,Ramdom(without LCD panel)

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Non­Operating 1.04 G at 2 to 200 Hz at 1 octave/minShock

Without package Bottom half­sine pulse with a change in velocity of37.4 cm/sec (14.7 inches/sec)

Operating 45­G faired square wave with a velocity change of441 cm/sec (173.7 inches/sec)

Regulations and Standards

EMC & Safety

FCC DoC forNorth America Yes

VCCI certificationfor Japan Yes

BSMI certificationfor Taiwan Yes

EU/EFTA CEMark & DoC Yes

UL/CUL YesTUV­GS YesIEC60950­1 CBReport/Certificate Yes

Saudi ArabiaICCP(SASO) Yes

China CCCMark　 Yes

Hong Kong SAR(CB report) Yes

Argentina S­mark YesSingapore – PSB YesSouth Africa –SABS Yes

Russia­GOST YesMexico­NOM YesKazakhstan ­GOST­K Yes

Belarus­certificate YesCroatia­certificate YesSerbia –KVALITET Yes

Ukraine –UKrCEPRO Yes

Energy Star5.0/5.2 Yes

PEP(InternalCertification) Yes

China RoHS YesEU RoHS Yes

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EU WEEE YesJapan J­Moss YesCalifornia RoHS YesUSA ChemicalEmission Test Yes

New York RoHS YesJapan EnergySaving Yes

Energy Star

All E32 systems are designed to with the premise of maximizing energy efficiency. The latest version ofthe Energy Star standard is still being defined. Pending ratification of the newest Energy Star spec, theDevelopment team will assess which models will be able to be Energy Star compliant.

EPEAT™

E32 models which are Energy Star compliant (pending ratification of latest Energy Star spec) will alsoqualify for the EPEAT™ Gold rating.

EuP Lot­6 2012E32 systems are complaint with the EuP Lot­6 2012 standard for low power consumption. This isenabled by default for all systems shipping to EMEA, and can be toggled on or off in the system BIOS.

Section II: Supported ComponentsCPU Specifications

E3­1280V3 ( 3.60GHz / 4C / 8M / 1600 / 82w / T / 0GT )E3­1270V3 ( 3.50GHz / 4C / 8M / 1600 / 80w / T / 0GT )E3­1240V3 ( 3.40GHz / 4C / 8M / 1600 / 80w / T / 0GT )E3­1230V3 ( 3.30GHz / 4C / 8M / 1600 / 80w / T / 0GT )E3­1220V3 ( 3.10GHz / 4C / 8M / 1600 / 80w / T / 0GT )E3­1275V3 ( 3.50GHz / 4C / 8M / 1600 / 84w / T / 2GT )E3­1245V3 ( 3.40GHz / 4C / 8M / 1600 / 84w / T / 2GT )E3­1225V3 ( 3.20GHz / 4C / 8M / 1600 / 84w / T / 2GT )Haswell i7­4770 ( 3.40GHz / 4C / 8M / 1600 / 84w / T /2GT )Haswell i5­4670 ( 3.40GHz / 4C / 6M / 1600 / 84w / T /2GT )Haswell i5­4570 ( 3.20GHz / 4C / 6M / 1600 / 84w / T /2GT )Haswell i3­4340 (3.6GHz / 2C / 4M/ 1600 / 54W / 2GT)Haswell i3­4330 (3.5GHz / 2C / 4M / 1600 / 54W / 2GT)Haswell i3­4130 (3.4GHz / 2C / 3M / 1600 / 54W / 2GT)

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Haswell Pentium G3430 (3.3GHz / 2C / 3M / 1600 / 53W /1GT)Haswell Pentium G3420 (3.2GHz / 2C / 3M / 1600 / 53W /1GT)Haswell Pentium G3220 (3.0GHz / 2C / 3M / 1333 / 53W /1GT)Intel processor numbers are not a measurement of higherperformance. Processor numbers differentiate featureswithin each processor family, not across different processorfamilies.Quad, Dual core technologies are designed to improveperformance of multithreaded software products andhardware­aware multitasking operating systems and mayrequire appropriate operating system software for fullbenefits; check with software provider to determinesuitability; Not all customers or software applications willnecessarily benefit from use of these technologies.64­bit computing on Intel® 64 architecture requires acomputer system with a processor, chipset, BIOS, operatingsystem, device drivers, and applications enabled for Intel®64 architecture. Processors will not operate (including 32­bit operation) without an Intel® 64 architecture­enabledBIOS. Performance will vary depending on your hardwareand software configurations

Memory

UDIMMs (non­ECC) 4GB PC3­12800 1600MHz DDR3UDIMM8GB PC3­12800 1600MHz DDR3UDIMMUDIMMs (ECC)2GB PC3­12800E 1600MHz DDR3ECC­UDIMM for China Market Only4GB PC3­12800E 1600MHz DDR3ECC­UDIMM8GB PC3­12800E 1600MHz DDR3ECC­UDIMM

Storage ­ HDD/SSD

3.5" SATA Hard Disk Drive (HDD)500GB SATA ­ 7200 rpm, 6 Gb/s, 3.5"1TB SATA ­ 7200 rpm, 6 Gb/s, 3.5"2TB SATA ­ 7200 rpm, 6 Gb/s, 3.5"3TB SATA ­ 7200 rpm, 6Gb/s 3.5"4TB SATA ­ 7200 rpm, 6Gb/s 3.5"

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3.5" SATA Hybrid Hard Disk Drive(HDD)1TB SATA ­ 7200rpm,(8G Flash) 6Gb/s, 3.5"Hybrid2TB SATA ­ 7200rpm, (8G Flash) 6Gb/s, 3.5"Hybrid2.5" SATA Solid State Drive (SSD)180GB SATA SSD. 6Gb/s. OPAL.2.5" 240GB SATA SSD, 6Gb/s,OPAL. 2.5"480GB SATA SSD, 6Gb/s,OPAL. 2.5"128GB SATA SSD, 6Gb/s, 2.5" Non­OPAL256GB SATA SSD, 6Gb/s, 2.5" OPAL256GB SATA SSD, 6Gb/s, 2.5" Non­OPAL512GB SATA SSD, 6Gb/s, 2.5" Non­OPAL1 TB SATA SSD , 6Gb/s, 2.5" Non­OPAL,Micron

RAID

Supported RAID levels for a system will vary from the stated capabilities of theRAID controller due to dependencies on the number and capacity of physicaldisks in the system and on customer requirements for performance, faulttolerance, or data redundancy.RAID levels and requirements:· RAID 0 (striping) provides increased performance by writing data acrossmultiple drives.· RAID 1 (mirroring) provides fault tolerance by writing the data on twodrives.· RAID 5 (striping with parity) uses distributed parity data to provide faulttolerance more efficiently than RAID 1.

Storage ­ Optical Drive/Removable MediaStorage ­Half HighOpticalDriveDVD­ROM Drive ­16x/48x (SATA)DVD Burner/CD­RWRambo 8 (SATA)Blu­Ray DVDBurner (SATA)Storage ­

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SlimOpticalDriveSlim ODDRambo(SATA) Slim ODD DVDROM(SATA)Slim Blu­Ray ODDDVD Burner(SATA)DVD Burner/CD­RWRambo Drive (9.5mmSlim SATA)Storage ­RemovableMedia9 in 1 SD Media CardReader 29 in 1 media cardreader Kit for 5.25"Multi­purpose I/OBay

Keyboard

Preferred Pro Fullsize Keyboard (USB)Chicony KUF1256 fingerprint KB Win8Lenovo Slim New F5 USB Keyboard For win 8Preferred Pro Fullsize PS/2 KeyboardSmart Card KYB

Pointing Devices

Optical Wheel Mouse (1000 DPI), USB ­ red wheelLenovo USB Laser MouseOptical Wheel Mouse (PS/2)

Graphics Cards

P300 P300 SFFNVIDIA NVS310 (DP,DP) ­ 512MB GDDR3NVIDIA NVS315 (DMS­59) ­ 1GB GDDR3 (ATX)with DMS­59 to Dual DVI (single link) Dongle NVIDIA NVS310 (DP,DP) ­ 512MB GDDR3 LP

NVIDIA NVS315 (DMS­59) ­ 1GB GDDR3 (ATX)with DMS­59 to Dual Display Port Dongle

NVIDIA NVS315 (DMS­59) ­ 1GB GDDR3 (LP)with DMS­59 to Dual DVI (single link) Dongle

NVIDIA Quadro 410(DVI­I­DL,DP) ­ 512M GDDR3NVIDIA NVS315 (DMS­59) ­ 1GB GDDR3 (LP)with DMS­59 to Dual Display Port Dongle

NVIDIA 510 (mini DP x 4) ­2GB GDDR3 NVIDIA Quadro 410(DVI­I­DL,DP) ­ 512MGDDR3 LP

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Nvidia Quadro K420 (DVI, DP) ­ 1 GB DDR3­ ATX NVIDIA 510 (mini DP x 4) ­2GB ­2GB GDDR3LP

NVIDIA Quadro K600 (DVI­I­DL,DP) ­1GBGDDR3

Nvidia Quadro K420 (DVI, DP) ­ 1 GB DDR3 ­LP

Nvidia Quadro K620 (DVI, DP) ­ 2GB DDR3 ATX NVIDIA Quadro K600 (DVI­I­DL,DP) ­1GBGDDR3 LP

NVIDIA Quadro K2000 (DVI­D­DL+DP+DP) ­ 2GBGDDR5 Nvidia Quadro K620 (DVI, DP) ­ 2GB DDR3 LP

NVIDIA Quadro K2000D (DVI­D­DL+DVI­I­DL+miniDP ) ­ 2GB GDDR5 Nvidia Quadro K1200(4miniDP) ­ 4GB DDR5 LP

Nvidia Quadro K2200(DVI/2DP)­4GB DDR5­ ATXNVIDIA Quadro K4000(DVI­I­DL,DP,DP,Stereo3D) ­3GB GDDR5Nvidia Quadro K4200 (2xDP+DVI) ­ 4GB DDR5ATX with short extender

PCI/PCIe Adapters

1394 AdapterIEEE 1394 (Firewire) PCI Express x1Adapter with internal port­with 1 internal port, 1 extrnal portIEEE 1394 (Firewire) PCI Express x1Adapter with internal port (LP)­with 1 internal port, 1 extrnal port USB 3.0 Add­in CardUSB 3.0 Add­in Card High­profile­R1USB 3.0 Add­in Card Low­profile­R1Parallel port CardSunix PCI to Parallel port Card(Chipupdate) ­ (FH)Sunix PCI to Parallel port Card(Chipupdate) ­ (LP)LAN AdapterBitland 88E8070@1000M PCIE ASF NICFH(R )Bitland 88E8070@1000M PCIE ASF NICLP®Intel ® 1Gbps ET Dual Port Server AdapterIntel® 1Gbps Ethernet I340 Quad PortServer Adapter Intel 82574L Gigabit CT2 Desktop EthernetAdapterIntel® Ethernet Server Adapter I350­T2Intel® 1Gbps Ethernet I350­T4 Quad PortGigabit Ethernet AdapterWifi/BlueToothPCI­E 1X Wifi Card ATX Kit (Wilkin Peak2 7260 BN) support win7 and win8.1PCI­E 1X Wifi Card LP Kit(Wilkin Peak 2

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7260 BN) support win7 and win8.1MiscellaneousL1­5.25'' Flex moduleL1­5.25'' Flex module for SFFFront 1394a Cable for 5.25" Multi­purposeI/O BayFront eSATA Cable for 5.25" Multi­purpose I/O Bay

Section III: System Technical SpecificationsPower Supply Specifications

DC Power Supply ­Wattage

450W 92plus Singleoutput

280W 85plusSingle output

240W 92plusSingle output

240W 85plusSingle output

Power Efficiency 92% 85% 92% 85%Manual / Auto­sensingAuto­sensing Auto­sensing Auto­sensing Auto­sensingType 115/230V(50/60Hz) 115/230V(50/60Hz)115/230V(50/60Hz)115/230V(50/60Hz)Wattage 450W 280W 240W 240WAC Input VoltageRange 100­127v/200­240v 100­127v/200­240v 100­127v/200­240v 100­127v/200­240v

AC Input Current (lowac range/high ACrange)

8A/4A 8A/4A 8A/4A 8A/4A

AC Input Frequency 50/60HZ 50/60HZ 50/60HZ 50/60HZAC Holdup Time(50% load) 17MS 17MS 17MS 17MS

Minimum Efficiency 0.89 0.82 0.89 0.82PFC (Active) ACTIVE ACTIVE ACTIVE ACTIVE80 PLUS compliant Yes – Platinum Yes – Silver Yes – Platinum Yes – SilverPower Supply Cable LengthCable 1(SATA PowerCable 200mm +200mm)

Yes No

Cable 2(SATA PowerCable 400mm forODD)

No Yes

Cable 3(SATA PowerCable 200mm forHDD)

No Yes

Cable 4(SATA PowerCable 210mm +170mm + 180mm)

Yes No

Cable 1 (2*7 Pin P1main connector forMB)

280mm 250mm 230mm

Cable 2 (2*2 Pin P2for CPU ) 230mm 230mm 280mm

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Cable 3 (2×3 PIN,P3for Gfx card)

400mm NA NA

DC Parameters+3.3v Output NA NA NA NA+5.0v Output NA NA NA NA

+12.0v Output 12V1/16A,12V2/18A,12V3/12A

12V1/16A,12V2/16A

12V1/12A,12V2/16A

12V1/12A,12V2/16A

+5.0v AuxiliaryOutput 3A 2.5A 1A 2.5A

­12.0v Output 0.2A 0.2A 0.2A 0.2AMax Total Power 450W 280W 240W 240WMax Combined+3.3v/+5.0v Power NA NA NA NA

Max Combined 12.0vPower 435W 270W 233W 233W

19.5V Output NA NA NA NAPower Supply Meets Requirements of:Energy Star 4.0Compliant PowerSupply

Yes Yes Yes Yes

Energy Star 5.0Compliant PowerSupply

Yes Yes Yes Yes

Blue Angel CompliantYes Yes Yes YesUL Certified Yes Yes Yes Yes

ThinkStation Power Calculator

Click here to access the ThinkStation Power Calculator.

BIOS Specifications

Features

WMI Support Compliant with Microsoft WBEM and the DMTF CommonInformation Model

ROM­Based Setup Utility (F1) System Configuration Setup program available at power­on withF1 key

Bootblock Recovery Recovers system BIOS when Flash ROM corrupted.

Replicated Setup Saves System Configuration settings to file that can then be usedreplicated to other systems.

Boot Control Boot control available through ROM­Based Setup Utility or withF12 key at power­on

Memory Change Alert Power­on Error message in event of decrease in system memoryThermal Alert Power­on Error message in event of fan failure

Asset Tag Support ability to set SMBIOS Type 2 Baseboard Asset Tagfield.

System/Emergency ROM FlashRecovery with Video

Support process to recover system BIOS when Flash ROMcorrupted

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Remote Wakeup/Remote Shutdown System admin can power on/off a client computer from remotelocation to provide maintenance

Quick Resume time Support low power S3 (suspend to RAM) and prompt resumetimes

ROM revision level System UEFI (BIOS) version reported in SMBIOS Type 0structure and in BIOS Setup

Keyboard­less Operation System can be booted without a keyboard

Per­port Control Allows I/O ports to be individually enabled/disabled throughROM­based setup or WMI interface

Adaptive Cooling Fans dynamically controlled by system BIOS based ontemperature.

Security User and Administrator passwords can protect boot and ROM­base Setup. Chassis intrusion detection protect

Intel(R) AMT (includes ASF 2.0) Allows system to be supported from a remote location

Intel(R) TXT Intel(R) Trusted Execution Technology provides a securityfoundation to build protections against software base attacks.

Memory modes Supports mirroring, lock step, and sparing memory modes

Windows 8 ready Supports Windows 8 requirements – Secure flash, UEFI v 2.3.1spec

Industry Standard Specification SupportUEFI Unified Extensible Firmware Interface v2.3.1ACPI (Advanced Configuration andpower Management Interface) Advanced Configuration and Power Interface v4.0

ASF 2.0 DMTF Alert Standard Format Specification v2.0ATA (IDE) AT Attachment 6 with Packet Interface (ATA/ATAPI­6)CD Boot "El Torito" Bootable CD­Rom Format Specification, Version 1.0

EHCI Enhanced Host Controller Interface for Universal Serial Bus,Revision 1.0

PCI PCI Local Bus v3.0PCI Firmware Specification 3.0

PCI Express PCI Express Base Specification 3.0SATA Serial ATA Revision 3.0 SpecificationTPM Trusted Computing Group TPM Specification Version 1.2UHCI Universal Host Controller Interface Design Guide, Revision 1.1

USBUniversal Serial Bus Revision 1.1Universal Serial Bus v2.0Universal Serial Bus v3.0

SMBIOS DMTF System Management Spec v2.7.1

Social and Environmental Responsibility

Quality ControlThe company is a member of an eco declaration system that enforces regular independent quality controlHazardous substances and preparationProducts do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalentchromium,0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legalreference and Note B1

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Products do not contain AsbestosProducts do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC),hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride,1,1,1­trichloroethane, methyl bromideProducts do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinatedterphenyl (PCT) in preparationProducts do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10­13 carbon atoms inthechain containing at least 48% per mass of chlorine in the SCCPParts with direct and prolonged skin contact do not release nickel in concentrations above 0.5microgram/cm²/weekREACH Article 33 information about substances in articles is available at:http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environmentBatteriesIf the product contains a battery or an accumulator, it is labeled with the disposal symbol and if itcontainsmore than 0.0005% of mercury (for button cells only) by weight, or more than 0.004% of lead, it shall bemarked with the chemical symbol for the metal concerned, Hg or Pb. Information on proper disposal isprovided in user manualButton cells used in the product do not contain more than 2% by weight of mercury. Other batteries oraccumulators do not contain more than 0.0005% of mercury or 0.002% of cadmiumBatteries and accumulators are easily removable by either users or service providers (as dependent on thedesign of the product). Exception: Batteries that are permanently installed for safety, performance,medicalor data integrity reasons do not have to be "easily removableSafety, EMC connection to the telephone network and labelingThe product complies with legally required safety standards as specifiedThe product complies with legally required standards for electromagnetic compatibilityIf product is intended for connection to a public telecom network or contains a radio transmitter, itcomplieswith legally required standards for radio and telecommunication devicesThe product is labeled to show conformance with applicable legal requirementsProduct packagingPackaging and packaging components do not contain more than 0.01% lead, mercury, cadmium andhexavalent chromium by weight of these together.Plastic packaging material is marked according to ISO 11469 referring ISO 1043The product packaging material is free from ozone depleting substances as specified in the MontrealProtocolFor more information on Lenovo social environmental practices visit:http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment

Manageability

Industry Standard SpecificationsThis product meets the following industry standardspecifications for manageability functionality:· Intel LAN with AMTLenovo ThinkStation is supported on the followingremote manageability software consoles:

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Remote Manageability Software Solutions · Lenovo ThinkManagement Console· LANDesk Management Suite for ThinkVantageTechnologies (www.landesk.com/lenovo)· Microsoft System Center Configuration Manager

System Software Manager

Lenovo ThinkStation supports software managementtools from the ThinkVantage System Update suite:· System Update· Update Retriever· Thin Installer

Service, Support, and Warranty

On­site Warranty and Service: Three­years, limitedwarranty and service offering delivers on­site, nextbusiness­day service for parts and labor and includes freetelephone support 8am – 5pm. Global coverage ensuresthat any product purchased in one country and transferredto another, non­restricted country will remain fullycovered under the original warranty and service offering.

Go to www.lenovo.com/support andwww.lenovo.com/warranty for more details

Section IV: Technical SpecificationsHDD Specifications

3.5" SATA Hard Disk Drive (HDD)500GB SATA ­ 7200 rpm, 6 Gb/s, 3.5"1TB SATA ­ 7200 rpm, 6 Gb/s, 3.5"2TB SATA ­ 7200 rpm, 6 Gb/s, 3.5"3TB SATA ­ 7200 rpm, 6Gb/s 3.5"4TB SATA ­ 7200 rpm, 6Gb/s 3.5"3.5" SATA Hybrid Hard Disk Drive(HDD)1TB SATA ­ 7200rpm,(8G Flash) 6Gb/s,3.5" Hybrid2TB SATA ­ 7200rpm, (8G Flash) 6Gb/s,3.5" Hybrid

3.5" 7200 RPM 3.5" HybridConnector SATA SATATransfer Rate (Gb/sec) 600MB/sec 600MB/secPerformanceSpindle Speed(RPM) 7200 7200Power off to Spindle Stop(sec) 11 max 11 maxDC Power to Drive Ready(sec) 17 max <1Receipt of Start Unit Command to DriveReady(sec) 17 max <1

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Average Latency(msec) 4.16 4.16Power Management

Input(VDC) +5v +­ 5%+12v +­5%

+5v +­ 5%+12v +­5%

Typical(Watts) 8 max 6.7 maxIdle(Watts) 0.75 0.75DimensionsHeight(mm – Max) 26.11 26.11Width(mm) 101.6 101.6Depth(mm – Max) 146.99 146.99Weight(grams) 626 max 535 maxTemperature Operating(C) Ambient 0 to 60 0 to 60Operating(C) Base CastingNon­Operating(C) Ambient ­40 to 70 ­40 to 70Gradient(C per Hour) 30 max 30 maxShockOperating(Gs @ 2ms) 80 max 80 maxNon­Operating(Gs @ 2ms) 350 max 350 max

2.5" SATA Solid State Drive (SSD)180GB SATA SSD. 6Gb/s. OPAL.2.5" 240GB SATA SSD, 6Gb/s,OPAL. 2.5"480GB SATA SSD, 6Gb/s,OPAL. 2.5"128GB SATA SSD, 6Gb/s, 2.5" Non­OPAL256GB SATA SSD, 6Gb/s, 2.5" OPAL256GB SATA SSD, 6Gb/s, 2.5" Non­OPAL512GB SATA SSD, 6Gb/s, 2.5" Non­OPAL1 TB SATA SSD , 6Gb/s, 2.5" Non­OPAL,Micron

180GBSATA SSD.6Gb/s.OPAL.2.5"

240GB SATASSD,6Gb/s,OPAL.2.5"

480GB SATASSD,6Gb/s,OPAL.2.5"

128GBSATASSD,6Gb/s,2.5"Non­OPAL

256GBSATASSD,6Gb/s, 2.5"OPAL

256GBSATASSD,6Gb/s, 2.5"Non­OPAL

512GBSATASSD,6Gb/s,2.5"Non­OPAL

1 TB SATASSD ,6Gb/s,2.5"Non­OPAL

Min SequentialRead 540 MB/s 540 MB/s 540 MB/s 510

MB/s520MB/s

520MB/s

520MB/s

560MB/s

Min. SequentialWrite 490 MB/s 490 MB/s 490 MB/s 300

MB/s280MB/s

280MB/s

460MB/s

510MB/s

Min. RandomRead (8GB 48000 IOPS 48000 IOPS 48000 IOPS 85000 90000 90000 96000 100,000

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Span) IOPS IOPS IOPS IOPS IOPS

Min. RandomWrite (8GBSpan)

80000 IOPS 80000 IOPS 80000 IOPS 65000IOPS

80000IOPS

80000IOPS

80000IOPS

88,000IOPS

Min. Power ­Active 165 mW 165 mW 165 mW 120

mW 120 mW120 mW120 mW150 mW

Min. Power ­Idle 55 mW 55 mW 55 mW 80 mW 50 mW 50 mW 50 mW 70 mW

Min. MTBF 1.2 M hours 1.2 M hours 1.2 M hours 1.5 Mhours

1.5Mhours

1.5Mhours

1.5Mhours

1.5Mhours

Min. HardwareEncryption AES 256 bit AES 256 bit AES 256 bit AES

256 bitAES256 bit

AES256 bit

AES256 bit

AES 256bit

Lithography 16 nm 16 nm 16 nm

Optical Drives SpecificationsCD ­ RW Rambo Drive

HH DVD Recorder Yes YesType External DimensionsINCHES/CENTIMETERS (OfActual Drive Without Bezel­W x H xD)

146±0.5×41.5±0.5×175(Max)

Unit:mm

Speed 16x/40x MaxBay Type Half­HeightColor Business BlackRemovable NoInterface Type and Speed SATA 1.5 Gb/sWeight (max)POUNDS/KILOGRAMS 1Kg

Internal Buffer Size 0.75MB MinAccess Times (typical) 140 msRates

Writes16x DVD+/­R / 8x DVD+RW/ 6x DVD­RW/5x DVD­RAM40x CD­R / 24x CD­RW

Reads 40XCD­ROM/16XDVD­ROMPower Source DC Power Requirements (+5V±5%; 12V±10%)

DC Current Max 2.5A@12VMax 2.0A@5v

DVD ­ ROM Drive

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Type DVD­ROMExternal DimensionsINCHES/CENTIMETERS (OfActual Drive Without Bezel­W x H xD)

146±0.5×41.5±0.5×175(Max)

Unit:mm

Speed 16x/48x MaxBay Type Half­HeightColor Business BlackRemovable NoInterface Type and Speed SATA 1.5 Gb/sWeight (max)POUNDS/KILOGRAMS 1Kg

Internal Buffer Size 196KB MinAccess Times (typical) 140 msRates Writes NA

Reads 48XCD­ROM/16XDVD­ROM

Power Source DC Power Requirements (+5V±5%; 12V±10%)

DC Current Max 2.0A@12VMax 1.5A@5v

Blu­Ray Burner Drive w/ AACS encryption

HH Blu­ray Recorder Yes YesType Blu­ray RecordableExternal DimensionsINCHES/CENTIMETERS (OfActual Drive Without Bezel­W x H xD)

146±0.5×41.5 +0.5/­0.7×184.7±0.5(Max)

Unit:mm

Speed 6x MaxBay Type Half­HeightColor Business BlackRemovable NoInterface Type and Speed SATA 1.5 Gb/sWeight (max)POUNDS/KILOGRAMS 1Kg

Internal Buffer Size 2MB MinAccess Times (typical) 180 msRates

Writes

6x BD­R / 2x BD­RE16XDVD +R / 8XDVD+RW / 4XDVD+RDL16XDVD­R / 6XDVD­RW / 4XDVD­RDL5XDVD­RAM40XCD­R / 24XCD­RW

Reads 6x BD­ROM16XDVD­ROM, 40XCD­ROM

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Power Source DC Power Requirements +5V±5%; 12V±10%

DC Current Max 3.0A@12V,Max 1.9A@5v

DisclaimerAs Blu­Ray is a new format containing new technologies, certain disc, digitalconnection, compatibility and/or performance issues may arise, and do notconstitute defects in the product. Flawless playback on all systems is notguaranteed. In order for some Blu­Ray titles to play, they may require a DVI orHDMI digital connection and your display may require HDCP support. HD­DVD movies cannot be played on this workstation.

SLIM DVD Recorder:

Slim DVD Recorder (SFF Support Only)Type DVD RecordableExternal DimensionsINCHES/CENTIMETERS (OfActual Drive Without Bezel­W x H xD)

126.5±0.4×12.7±0.4×128±0.4(Max)

Unit:mmSpeed 8x MaxBay Type 12.7mm SlimColor Business BlackRemovable NoInterface Type and Speed SATA 1.5 Gb/sWeight (max)POUNDS/KILOGRAMS 0.2Kg

Internal Buffer Size 0.5MB MinAccess Times (typical) 160sRates

Writes

8x DVD+/­R / 6xDVD+/­RW/5x DVD­RAM24x CD­R / 16x CD­RW

Reads 8XDVD­ROM /24XCD­ROM

Power Source DC Power Requirements +5V±5%DC Current Max 2.5A@5vSlim DVD ROMSlim DVD ROM (SFF Support Only)Type DVD ROMExternal DimensionsINCHES/CENTIMETERS (OfActual Drive Without Bezel­W x H xD)

126.5±0.4×12.7±0.4×128±0.4(Max)

Unit:mmSpeed 8x Max

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Bay Type 12.7mm TrayColor Business BlackRemovable NoInterface Type and Speed SATA 1.5 Gb/sWeight (max)POUNDS/KILOGRAMS 0.2Kg

Internal Buffer Size 0.5MB MinAccess Times (typical) 160sRates Writes NA

Reads 8XDVD­ROM /24XCD­ROM

Power Source DC Power Requirements +5V±5%DC Current Max 2.5A@5vSlim – ODD Rambo:Slim ODD Rambo (SFF Support Only)Type BD RamboExternal DimensionsINCHES/CENTIMETERS (OfActual Drive Without Bezel­W x H xD)

126.5±0.4×12.7±0.4×128±0.4(Max)

Unit:mmSpeed 6x MaxBay Type 12.7mm TrayColor Business BlackRemovable NoInterface Type and Speed SATA 1.5 Gb/sWeight (max)POUNDS/KILOGRAMS 0.2Kg

Internal Buffer Size 2MB MinAccess Times (typical) 160sRates

Writes

6x BD­R / 2x BD­RE8XDVD +R /8XDVD+RW /4XDVD+R DL8XDVD­R / 6XDVD­RW / 4XDVD­R DL5XDVD­RAM24XCD­R / 16XCD­RW

Reads6XBD­ROM/8XDVD­ROM /24XCD­ROM

Power Source DC Power Requirements +5V±5%DC Current Max 2.5A@5vSlim Blu­ray recorder:Slim Blu­ray Recorder (SFF Support Only)Type DVD ROM

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External DimensionsINCHES/CENTIMETERS (OfActual Drive Without Bezel­W x H xD)

126.5±0.4×12.7±0.4×128±0.4(Max)

Unit:mmSpeed 8x MaxBay Type 12.7mm SlimColor Business BlackRemovable NoInterface Type and Speed SATA 1.5 Gb/sWeight (max)POUNDS/KILOGRAMS 0.2Kg

Internal Buffer Size 1MB MinAccess Times (typical) 160sRates Writes NA

Reads 8XDVD­ROM /24XCD­ROM

Power Source DC Power Requirements +5V±5%DC Current Max 2.5A@5v

29­in­1 and 9­in­1 Media Card Readers

MEDIA CARD READER 9 in 1 29 in 1Description Description The device connects toa 2×5 two channelUSB header on themotherboard of thesystem. There is noUSB controller cardprovided. Please seethe Disc Formatssection below for a listof flash memory cardformats that aresupported.

The Media cardreader mounts intoour FLEX modulewhich fits into astandared 5.25"Optical bay

Interface Type Interface Type

USB 2.0 (one channeldedicated to theseparate USB port;one channel dedicatedto the flash memorycard slots)

USB 2.0 (onechannel dedicatedto the separate USBport; one channeldedicated to theflash memory cardslots)

Disc Formats Disc FormatsSD xD­H SDHC xD­M

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SDXC Micro SDMini SD Micro SDHCMini SDHC SDMicro SD* SDHCMicro SDHC* SDXCMicro SDXC* Mini SDRS­MMC Mini SDHC

MMC MultiMediaCard(MMC)

MMC MicroReduced SizeMultiMediaCard(RS MMC)

MMC Mobile (MMC Plus)MMC Plus (MMC Mobile)

M2 CompactFlash CardType I (CF Type 1)CF Type 2MicroDrive (MD)Memory Stick (MS)Memory StickSelectMS DuoMS PROMS PRO DuMSPRO­HG DuoMS XS DuoMS XC­HG DuoMS HG Micro*MS XC Micro*MS XC­HG Micro*MMC MicroMemory StickMicro (M2)*

*Available withadapter

*Available withadapter

Graphics Cards

BOARD FEATURES Quadro Quadro Quadro Quadro QuadroK4200 K2200 K1200 K620 K420

Memory Size 4GBGDDR5

4GBGDDR5

4GBGDDR5

2GBDDR3

1GBDDR3

Memory Interface 256­bit 128­bit 128­bit 128­bit 128­bitMemory Bandwidth 173 GBps 80 GBps 80 GBps 29 GBps 29 GBpsNVIDIA® CUDA™ Parallel ProcessorCores 1344 640 512 384 192

Max Power Consumption 108W 60W 45W 41W 41WPower Connector 1 x 6­pinNumber of slots 1 1 1 1 1# Simultaneous Displays2 4 4 4 4 4

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Display Connectors

DVI­I DVI­I mDP DVI­I DVI­IDP DP mDP DP DPDP DP mDP3­pinStereo1 mDP

ECC (Error Correcting Code)OpenGL 4.5 7 4.5 7 4.5 7 4.5 7 4.5 7Shader Model 5 5 5 5 5DirectX 12 8 12 8 12 8 12 8 12 8NVIDIA 3D Vision®ProNVIDIA® Mosaic Technology

Multi­Display Synchronization QuadroSync

NVIDIA SLI® Support5NVIDIA® nView® Desktop ManagementTechnologyHigh­Performance Video I/O61 Optional2 Includes directly attached displays and displays connected through DisplayPort 1.2 hubs5 On SLI Certified Platforms6 Supported via GPUDirect for Video enabled 3rd party I/Oboards7 Product is based on a published Khronos Specification, and is expected to pass the KhronosConformance Testing Process when available. Current conformance status can be found atwww.khronos.org/conformance8 GPU supports DX 12 API, Hardware Feature Level11_09 GPU supports DX 12 API, Hardware Feature Level12_1­ See more at: http://www.nvidia.com/object/compare­quadro­gpus.html#sthash.jnjuI7hK.dpuf

NVS 300 NVS 315 NVS 310

Bus Interface PCI Express x16 PCI Express x16 PCI Express x16PCI Express x1Memory Size 512 MB DDR3 1024 MB DDR3 512 MB DDR3Memory Interface 64­bit 64­bit 64­bitMemory Bandwidth 12.6 GB/s 14 GB/s 14 GB/sForm Factor HH HH HHCUDA Processor Cores 16 48 48Display Connectors DMS59 DMS59 DisplayPort (2)Max. Displays per Board 2 2 2

Max Digital Display Support2560x1600(DisplayPort)

2560x1600(DisplayPort) 2560x1600

1920x1200 (DVI­I) 1920x1200 (DVI­I)Max Analog Display Support 2048x1536 (VGA) 2048x1536 (VGA) 1920x1200OpenGL 3.3 4.1 4.1DirectX 10.1 11 11Shader Model 4 5 5

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CUDA enabled Yes Yes YesPower & Cooling 17.5W ­ Passive 19.5W ­ Active5 19.5W ­ Active5nView Enabled Yes Yes YesDisplayPort Links 26 26 2DVI Links 27 27 24Analog Displays VGA 28 28 29DisplayPort 1.2 Support No Yes YesMax Displays in DP 1.2 MST node N/A 2 2Max Displays in DP 1.2 Stream Cloningmode N/A 8 8

2 Through VHDCI to Quad DisplayPortdongle3 Through VHDCI to Quad DVI­D (Single Link)dongle4 Through DisplayPort to DVI­D industry standardcables5 High reliability, variable speed fansink6 Using DMS59 to DisplayPort CableAdaptor7 Using DMS59 to DVI­I Cable Adaptor8 Using DMS59 to VGA Cable Adaptors9 Through DisplayPort to VGA industry standardcables­ See more at: http://www.nvidia.com/object/nvs­compare­product­specs.html#sthash.uexqazcZ.dpuf