TMS320 DSP Device Nomenclature

TMS 320C 542 PGE

PREFIXTMX = experimental device TMP = prototype device TMS = qualified deviceSMJ = MIL-STD-883CSM = High Rel (non-883C)

DEVICE FAMILY320 = TMS320 Family

TECHNOLOGYC = CMOSE = CMOS EPROMF = CMOS Flash EEPROMLC = Low-Voltage CMOS (3.3 V)VC = Low-Voltage CMOS [3 V (2.5 Vor 1.8 V core)]UC= Ultra Low-Voltage CMOS [1.8 V

PACKAGE TYPEN= plastic DIPJ= ceramic DIPJD= ceramic DIP side-brazedGB = ceramic PGA FZ= ceramic CCFN = plastic leaded CCFD = ceramic leadless CCPJ= 100-pin plastic EIAJ QFPPZ = 100-pin plastic LQFP PBK = 128-pin plastic LQFPPQ = 132-pin plastic bumpered QFPPGE = 144-pin plastic LQFP GGU = 144-pin MicroStar BGAPGF = 176-pin plastic LQFPGGW= 176-pin MicroStar BGA

(1.5 V core)]DEVICE

DIP = Dual-In-Line PackagePGA = Pin Grid ArrayCC = Chip CarrierQFP = Quad Flat PackageLQFP = Low Profile Quad Flat PackageBGA = Ball Grid Array

1x DSP:

2x DSP:

2xx DSP:

3x DSP:

4x DSP:

5x DSP:

54x DSP:

6x DSP:

1016141715

2526

203206240204209

303132

4044

505351565257

541545540254254654105435485420549

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