top ten ways to commercialize microtechnology
TRANSCRIPT
Successful MEMS Implementation
in a Downturn: A Top 10 List
Dr. James Wylde
04 Mar 2004
Table of Contents
Bookham Technology
Optical Attenuators
Integrated MEMS Technology
Top ten commercialization tips
Conclusion
COMS2004
Caswell
• Actives R & D
• InP/GaAs wafer fab assembly
Milton, Abingdon
• Headquarters
• ASOC R & D
• ASOC wafer fab and assembly
Bookham (Nov ’02) Intro of NNOC
Paignton (UK)
• Actives and Amps R&D
• Assembly
Zurich (Switzerland)
• Pump chips R&D
• Pump chip wafer fab
Ottawa (Canada)
• InP wafer fab
• Actives R&D
Ottawa (Carling)InP Wafer Fab
R&D
Milton (Oxford)ASOC
PaigntonTx/Rx
EDFA
Zurich+ Poughkeepsie980 Pump laser
CaswellGaAs & InP Wafer FabsMMIC; DBR Tunable Laser
Bookham Locations
Introduction
MEMS became a force in optical telecom in late 1990’s
– Large scale Optical Cross Connect Switches
– Passive Silicon Optical Benches
– Optical Attenuators
2000 – Days of the M&A
– Xros/Nortel: $3.25B
– Coretek/Nortel: $900M
– Cronos/JDSU: CHECK
2002 – Days of the Shutdown
– Xros: closed
– Coretek: closed
– Cronos: sold to MEMSCap for $10M
However, several Optical MEMS efforts have thrived
Optical Attenuators
Nature of fiber is that different wavelengths are attenuated at
different rates through a fiber
“Water Curve”
Optical Attenuators
Links are also amplified @ ~80klm
Different wavelengths can be attenuated and amplified at different
gains
Tx Amplifier Amplifier Rx
Receivers must deal with large changes in power level for various
wavelengths
Optical Attenuators
Typical links used discrete optical attenuators to balance the power
in channels
– Typically expensive ($300 ea) and
– Require 1 - 2m of fiber
– Occupy 3-4 cm2 of board space
Variable Optical Attenuator
Linear
Amplifier e
-Photo-
detector
Market Background
• Competing Technologies (LCD, EO)• MEMS “bad rap”• Industry in survival mode
BUT:
• Customers feeling the same squeeze• Technology barriers to existing solutions
= Opportunity for MEMS
Integrated MEMS Rx
• The PTV/ATV 10G combines a 10Gb/s receiver with a MEMS based VOA in one package
• Enables increased density and lower cost to system vendors (density x2, CR ~300/ch)
Integrated MEMS Rx
Fiber
A
B
C
D
E
F
G
H
I
Integrated MEMS Rx
Performance: “The proof in the pudding”
VMV=0V, 0dB atten
Amplifier well into
overload
VMV=12V, 20dB atten
Signal extinguished
VMV=9V, 5dB atten
Eye recovered
VMV=10V, 8dB atten
Signal attenuated
Integrated MEMS Rx
Performance: “The proof in the pudding”
temp' dependance of VOA attenuation
-40
-35
-30
-25
-20
-15
-10
-5
0
5
10
4 5 6 7 8 9 10 11 12 13
Bias voltage
att
en
ua
tio
n/b
ias c
urr
en
t
Iatt @ 0
0degC
85degC
Iatt @ 25
Iatt @ 85
25degC
Integrated MEMS Rx
#10
Terminology– Everyone has to speak the same language
– 3000 word glossary (MANCEF estimate)
– MST, Micromachine, Microtechnology, Nanotechnology,
MEMS, NEMS, Microsystems!?!?!?!?!?!?!
#9
Reliability– Speak in terms your customer understands
Only in Canada eh?
#8
Standards– Again, talk in terms customers understand
– Telcordia 1221 + 468
– 3 MEMS standards, 100+ semiconductor standards
#7
Specifications– Again, talk in terms customers understand
Be careful of spec creep!
#6
Look for places where small tech works
but other technologies don’t!– LCD, EO competitors!
#5
Integrate with technologies that are
proven!
#4
Need to provide a REAL benefit: cost?
Performance? Size?
#3
Set realistic expectations with customers.
#2
Remember: MEMS Inside doesn’t sell!
#1
Have Fun! Smile!
Conclusion
Integrated devices offer significant space and cost savings
Integration offers design challenges with additional DOF
MEMS Solution viable for unique applications
– Other solutions don’t fit!
Combination of design tools and shortloop experiments
enabled faster TTM
Successful implementation of MEMS by:
– Adapting technology to the required solution
– Identify the market need and design the MEMS to fit the need
A significant challenge to the widespread acceptance of
“small tech” is the lack of a sound reliability model