topological routing to maximize routability for package ...eda.ee.ucla.edu/pub/c117_ppt.pdf~netlist...
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Topological Routing to Maximize Routability for Package SubstrateTopological Routing to Maximize Routability for Package Substrate
Speaker: Guoqiang ChenAuthors: Shenghua Liu, Guoqiang Chen,
Tom Tong Jing, Lei He, Tianpei Zhang,
Robby Dutta, Xian-Long Hong
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OutlineOutline
Background
Existing work
Problem formulation
Algorithm
Experimental results
Conclusion
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OutlineOutline
BackgroundExisting work
Problem formulation
Algorithm
Experimental results
Conclusion
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Package (2)Package (2)
Package substratePGA (pin grid array)BGA (ball grid array)
Two techniques to mount the die to the substratewire bonding, WBflip chip, FC
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Substrate Routing (1)Substrate Routing (1)
Packaging in BGA with wire-bonding techniquechip is put into the cavity of substratechip I/Os are connected to bonding pads around the cavity substrate routing connects bonding pads with balls
Packaging in BGA with flip-chip techniquere-distribution layer, RDL, routing connects chip I/Os to bump arrayescape routing breaks bumps out to substrate routing layerbreak points lay on the escape boundarysubstrate routing connects break points to balls
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Substrate Routing (2)Substrate Routing (2)
Substrate routing usually has two steps: topological routing and detailed routing
[W. W. Dai, DAC, 1991] discussed detailed routing
This paper studies topological routing
Substrate routing is preferred to be planar, even though multiple routing layers are available
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OutlineOutline
Background
Existing workProblem formulation
Algorithm
Experimental results
Conclusion
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Existing workExisting work[S. S. Chen, ASPDAC, 1999] [Y. Kubo, ISPD, 2005] [C. C. Tsai, IEEE Trans, 1998]
assumed that start-points are located side to side with respect to balls.are NOT flexible enough for SiP and even some one-die packages
[M. F. Yu, ASPDAC, 1995] [M. F. Yu, ICCAD, 1996]use the minimum-cost maximum flow algorithm to solve interchangeable pin routing problemhowever, specifying ball assignment is preferred by designers to consider constraints of PCB
[Y. Kubo, et al, ISPD’05]considered the staggered via assignment in substrate routing,and well solved the two-layer substrate routing problem
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Our Major ContributionsOur Major Contributions
Our algorithm honors flexible locations for start-points, instead of the existing 1.5-dimensional routing
Our substrate router solves the specified-pin-assignment substrate routing problem
It considers the staggered via assignment for multiple-layer substrate routing
end-zone model is proposed
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OutlineOutline
Background
Existing work
Problem formulationAlgorithm
Experimental results
Conclusion
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Staggered via and end-zoneStaggered via and end-zone
When dropping signal viasclose to the positions above assigned destination ballvias need to be staggeredrequired offsets between staggered vias
End-zone includes two cycles with center aligned with the ball
Radii , and where and are the minimal and maximal staggered viapitch in the layer with index i
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Problem formulationProblem formulationGiven
start-points,assigned balls (in the bottom layer),netlist (dened by ball assignment), and obstacles (including the escape area for escape routing, the pre-routed connections, vias, and other obstacles in the layer),
Finda topological routing solution connecting each start-point to any point in the end-zone for the assigned ball
Such thatrouted nets are planarsatisfy the capacity constraints, and have minimal length
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Data StructureData Structure
The substrate routing plane (SRG) is triangle- meshed by constraint Delaunay triangulation (CDT)
Uniformly spreading points are added for particle-insertion-based CDT
Capacity
Congestion
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OutlineOutline
Background
Existing work
Problem formulation
AlgorithmExperimental results
Conclusion
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FrameworkFramework
Iterative scheme is derived from [R. Nair, TCAD, 1987]Only one net is ripped up at a timeEvery net is ripped up and rerouted on every iteration
During iterative schemenet path search by algorithm DS*reorder nets for wire length reduction, based on strategies
whole reordering, and partial reordering
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Net path search algorithm DS*Net path search algorithm DS*
Net path search algorithm DS*based on the heap implementation of Dijstrahonors estimation costhonors dynamic pushinghonors flexible via-staggering in a end-zone
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Dynamic pushing methodologyDynamic pushing methodology
(A, B)-C
A-C-B或B-C-A
C-(A, B)
Dynamic pushing helps tackle the net ordering problem
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Flexible via-staggeringFlexible via-staggering
Flexible via-staggering
reducing wire length
improve success ratio
Define the cost for stopping at end-zone
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Reorder nets for wire length reductionReorder nets for wire length reduction
Reordering algorithmrouting nets frequently results in bent wires caused by pushing,bent wires usually involve unnecessary detours and increase total wire lengthsolve this problem by designing a good order for reroutingwhole reordering strategypartial reordering strategy
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Whole reordering--larger net length ratio firstNet length ratio
is the net length acquired from the latest routing iterationis the distance from start-point to end-point oz
Partial reordering--according to pushing order C-B-A
Whole/Partial reorderingWhole/Partial reordering
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OutlineOutline
Background
Existing work
Problem formulation
Algorithm
Experimental resultsConclusion
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Experimental resultsExperimental results
Comparing with a best know method (BKM) in an industrial design tool, our routing algorithm
leaves 212 failed, a 4.5-times unrouted net number reductionreduces the average wire length by 13.9%
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OutlineOutline
Background
Existing work
Problem formulation
Algorithm
Experimental results
Conclusion
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ConclusionConclusion
Considering high density packaging, we have developed a planar topological router.
Compared with one current industrial router, Our algorithm does not limit start-point locationsallows the routing to finish in a zone or at fixed locationshonors the ball assignment specified for start-points.
A 4.5x unrouted net number reduction and practically more design time reduction
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Thank YouQ&A
Thank YouQ&A
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PGA and BGAPGA and BGA
Comparing with PGA substrate, BGA substrate has the advantages of
higher integrity,higher reliability, lower coupling, cheaper cost, and lower thermal-resistance
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(Cadence)
An example of flip-chip BGAAn example of flip-chip BGA
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Cost functionCost function
Initial
Recursive equations