tpc iroc cooling measurements u.frankenfeld(gsi), s.popescu (cern), h.r.schmidt(gsi)
DESCRIPTION
TPC IROC Cooling measurements U.Frankenfeld(GSI), S.Popescu (CERN), H.R.Schmidt(GSI). Introduction Tests set-up Test results Conclusions. TPC. ITS(pixels). 3. Stringent requirement of 0.1 0 C stability/over the drift distance (~ 2.5 m) - PowerPoint PPT PresentationTRANSCRIPT
January 22, 2003 JCOV executive meeting CERN S.Popescu
TPC IROC Cooling measurements
U.Frankenfeld(GSI), S.Popescu(CERN), H.R.Schmidt(GSI)
• Introduction• Tests set-up• Test results• Conclusions
January 22, 2003 JCOV executive meeting CERN S.Popescu
3
ITS(pixels)
TPC
January 22, 2003 JCOV executive meeting CERN S.Popescu
TPC Requirements
• Stringent requirement of 0.1 0C stability/over the drift distance (~ 2.5 m)
• Measurements needed to understand the heat transfer from FEC to the PADs plane and the thermal behavior of the ReadOut Chambers
• 832W/sector where one sector (IROC + OROC) have 43 + 78 = 121 FEC cards
• In total 30.2 kW must be removed
January 22, 2003 JCOV executive meeting CERN S.Popescu
Set-up of tests
• July and September tests:– Common cooling circuits input for FEC and IROC
– Set-point t=15 0C for cooling circuits and Thermal box
• January test:• Separate cooling circuits
• Set-point t= 19 or 21 0C for cooling circuits (FEC and IROC)
• Set-point t= 21 0C for thermal box
January 22, 2003 JCOV executive meeting CERN S.Popescu
•Thermal box : water cooling system (Lauda)•T1,T2,T3on the Pad plane•T4in the Thermal Box, T5 between FEC•T6in IROC, T7In cool pipe,T8Out cool pipe•T9room temp•T10on the cooled side of FEC envelope•T11the opposite side of FEC envelope
PC W2K
Can
Bu
s
ELMBOPC server
PVSS client2.12
Operational Panel1st ver.
System set-up
PUMP
1) IROC circuit
2) FEC circuit
Lauda System
T4
1)
2)
IROC
T1 T2 T3
T5
T6
T7 T8
T9
Softw
are layout
Th
ermal B
ox T=
15 0C
T=17 0C
NI Labview application
ELMBOPC server
July & September 2003September 2003
January 2004
January 22, 2003 JCOV executive meeting CERN S.Popescu
Position of sensors inside Thermal Box
z
T4 ~ 17cm
~ 37cm
x
y
Air sensorSensors glued on the PADs plane
PADs plane
T1T2T3
~ 10cm ~ 10cm
~ 28.5cm
~ 43cm
~ 10cm
IROC Cooling input line
IROC Cooling output line
FEC coolingInput pipe
FEC coolingOuput pipe
FEC coolingenvelopes
FEC
T10 sensorT11 sensor
January 22, 2003 JCOV executive meeting CERN S.Popescu
FEC cardsLV PS for FEC
IN OUT
Thermal Box T=15 0C
T=15.5 0C
Cooling pipes
Temp sensorsPT1000 2w
January 22, 2003 JCOV executive meeting CERN S.Popescu
InnerReadout Chamber Prototype
Input Cooling circuit
Output Cooling circuit
FEC Cooling circuit OUT
Cha
mbe
r C
oolin
g c
ircu
it
FEC Cooling circuit IN
LV power lines forFEC
T5 T6
T8
T7
January 22, 2003 JCOV executive meeting CERN S.Popescu
ELMB + PT1000 2w connected
AI portPT1000 2w sensors connected Can Bus port
January 22, 2003 JCOV executive meeting CERN S.Popescu
Heat transfer from FEC to PADs plane while powering up of FEC.
t1,t3 sensorsInstalled on thePADs plane
~30 min
Sensor installed between FECs
LV OFF LV ON
T1T2
T4
T8T7
T3T6
T5
January 22, 2003 JCOV executive meeting CERN S.Popescu
Results: -heat transfer from FEC cards to PADs plane ~ 0.18 0C-relaxation time for PADs is approximately 30 minutes
∆ ~ 0.18 0C
January 22, 2003 JCOV executive meeting CERN S.Popescu
Air temperature inside the thermal box
Sensor on Padbehind FEC
∆ ~ 0.18 0C
∆ ~ 0.1 0CSensor on Pad10 cm away
January 22, 2003 JCOV executive meeting CERN S.Popescu
Chamber cooling On Off On
Sensor on IROC Chamber
Room temperature
PadsSensors on In/Out coolingpipes
∆ ~ 4 0C
~ 22 0C
~ 16 0C
∆ ~ 1 0C
January 22, 2003 JCOV executive meeting CERN S.Popescu
Air thermal box
Pad under FEC
Pad
Cooling In
~ 50 minutes relaxation for Chamber
∆ ~ 1.3 0C
January 22, 2003 JCOV executive meeting CERN S.Popescu
FEC Off On
Room temperature
January 22, 2003 JCOV executive meeting CERN S.Popescu
with Flat cable
without Flat cable
LV ONOFF
LV ONOFF
T5 behind FEC
T6 aside FEC
∆ ~ 0.14 0C
∆~ 0.18 0C
T6 aside FEC
T5 behind FEC
Heat transfer to PADs plane by the FEC’s flat cable
January 22, 2003 JCOV executive meeting CERN S.Popescu
Temperature difference fora single FEC outsidethe IROCWithout screws
LV OFFON
Temperature drop measured on a single FEC outside the IROC (while tightening the screws)
LV ON
Heat transfer between the cooling plates transported by screws
∆ ~ 4.5 0C
∆ ~ 5.5 0C
January 22, 2003 JCOV executive meeting CERN S.Popescu
∆ ~ 3.5 0C
Temperature difference between the FEC’s envelopeplates when the board is plugged inside the IROC between 2 other
boards all cooled, but without screws. Conclusion: we reduced by geometry with 2 0C
LV ON OFF
January 22, 2003 JCOV executive meeting CERN S.Popescu
Temperatures evolution during two compensation phases for the FEC cooling circuit
- IROC cooling circuit set point is 21 0C constant- Temperature inside thermal box is 21 0C constant
19 0C 24 0C 24 0C 19 0C
LV OFFON LV OFFON
Phase 1 Phase 2
Sensors on the PADs plane
Room temperature
Sensor between FEC board
Sensors on the FEC cooling envelope
Temperature at the inlet cooling circuit for FEC
19 0C 24 0CLV ONOFF
Phase 3
January 22, 2003 JCOV executive meeting CERN S.Popescu
Phase 224 0C 19 0CLV OFF ON
∆ ~ 0.05 0C
Phase 319 0C 24 0CLV ON OFF
∆ ~ 0.14 0CSensor behind FEC
Sensor behind FEC
Sensor aside FEC
Sensor aside FEC
∆ ~ 0.05 0C
Heating compensatebetter than cooling
January 22, 2003 JCOV executive meeting CERN S.Popescu
Temperatures evolution during two variations of temperature for the IROC cooling circuit
- FEC cooling circuit set point is 21 0C constant- Temperature inside thermal box is 21 0C constant- LV is off
21.2 0C 19.5 0C 21.2 0C19.5 0C
Temperature at the IROC cooling circuit inlet
Temperaturein the IROC (chamber)
~ 50 minutes relaxation for Chamber
January 22, 2003 JCOV executive meeting CERN S.Popescu
Summary• Heat transfer from FEC (LV OFFON) to PADs plane is ~0.2 0C • Relaxation time for PADs (OFF ON) ~30 minutes (independent of flow)• Temperature variation ~ 4 0C of Chamber body for cooling ONOFF or OFF ON (air
temp in average 22 0C and temp of ~ 15.5 0C inside the thermal box and for the FEC cooling circuits)
• On the PADs plane temperature varies with 1.3 0C for a 4 0C variation in temperature of the chamber’s body
• Relaxation time for chamber is ~ 50 minutes for the same transition• Heat influence between cards is ~ 3.5 0C and ~ 2 0C is removed by the neighbor cooled plates • Heat transfer from FEC to PADs plane through the flat cable is negligible (~ 0.04 0C)• The stainless screws are removing ~ 4.5 0C between the cooling plates of the FEC board• With a 5 0C variation in the input temperature of the FEC cooling circuit we reduced the heat
transfer from 0.2 0C to 0.05 0C• The two compensations scenarios are showing that a refined adjustment at the FEC cooling
circuit inlets and keeping a constant temperature at the IROC cooling inlets are recommended • This could be also a proposed method to power up the FEC
January 22, 2003 JCOV executive meeting CERN S.Popescu
FEC’s cooling circuits
ROC’s cooling circuits
Cooling Plant….
Appendix:
January 22, 2003 JCOV executive meeting CERN S.Popescu
Embedded Local Monitor Board ELMB128
1. General-purpose plug-on module (50 x 73 mm2): direct on subdetector FEC or on a general purpose motherboard
2. CANbus interface (Full-CAN controller)
3. CANopen communication protocol
4. In System Programmable also via CAN bus
5. Optional 64 inputs of 16-bit ADC with 7 bit gain
6. General I/O
1. with 18 I/O, 8 Out and 8 IN (or ADC), 3 wire SPI7. Flexible power supply circuits incorporated
8. Radition tolerant up to about 5 Gy and 3*1010 n/cm2 for 10 year
9. Tolerant in magnetic field up to 1.5 T
10. Est. cost is < 100 CHF for ADC +CAN
11. Diagnostic tools available
1. NI Server Explorer(runs on W2K)-> to have a quick look on OPC items
2. Canhost: a more dedicate tool(for diagnostics and configuration of ELMB+ bus)-runs on a MS-Dos window
3. CANalyser : is a universal software for Can bus protocol
• Technical Data
January 22, 2003 JCOV executive meeting CERN S.Popescu
General purpose motherboard (front side)
General purpose motherboard (back side)