tpl0401x-10 128-taps single-channel digital potentiometer ... · a 10-kΩend-to-end resistance and...

TPL0401A/B-10

I2C INTERFACEWIPER

REGISTERSCL

SDA

GND

VDD

W

H

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,intellectual property matters and other important disclaimers. PRODUCTION DATA.

TPL0401ATPL0401B

SLIS144B –SEPTEMBER 2011–REVISED FEBRUARY 2017

TPL0401x-10 128-TAPS Single-Channel Digital Potentiometer With I2C Interface

1

1 Features1• Single-Channel, 128-Position Resolution• 10-kΩ End-to-End Resistance Options• Low Temperature Coefficient: 22 ppm/°C• I2C Serial Interface• 2.7-V to 5.5-V Single-Supply Operation• ±20% Resistance Tolerance• A and B Versions Have Different I2C Addresses• L Terminal is Internal and Connected to GND• Operating Temperature: –40°C to +125°C• Available in Industry Standard SC70 Packages• ESD Performance Tested per JESD 22

– 2000-V Human-Body Model (A114-B, Class II)

2 Applications• Mechanical Potentiometer Replacement• Adjustable Power Supplies• Adjustable Gain Amplifiers and Offset Trimming• Precision Calibration of Setpoint Thresholds• Sensor Trimming and Calibration

3 DescriptionThe TPL0401x-10 device is a single-channel, linear-taper digital potentiometer with 128 wiper positions.The TPL0401x-10 has the low terminal internal andconnected to GND. The position of the wiper can beadjusted using an I2C interface. The TPL0401x-10 isavailable in a 6-pin SC70 package with a specifiedtemperature range of –40°C to +125°C. The part hasa 10-kΩ end-to-end resistance and can operate witha supply voltage range of 2.7 V to 5.5 V. This kind ofproduct is widely used in setting the voltage referencefor low power DDR3 memory.

The TPL0401x-10 has the low terminal internal andconnected to GND.

Device Information(1)PART NUMBER PACKAGE BODY SIZE (NOM)

TPL0401A-10TPL0401B-10 SC70 (6) 2.00 mm × 1.25 mm

(1) For all available packages, see the orderable addendum atthe end of the data sheet.

Simplified Schematic

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2

TPL0401ATPL0401BSLIS144B –SEPTEMBER 2011–REVISED FEBRUARY 2017 www.ti.com

Product Folder Links: TPL0401A TPL0401B

Submit Documentation Feedback Copyright © 2011–2017, Texas Instruments Incorporated

Table of Contents1 Features .................................................................. 12 Applications ........................................................... 13 Description ............................................................. 14 Revision History..................................................... 25 Device Comparison Table ..................................... 36 Pin Configuration and Functions ......................... 37 Specifications......................................................... 4

7.1 Absolute Maximum Ratings ...................................... 47.2 ESD Ratings.............................................................. 47.3 Recommended Operating Conditions....................... 47.4 Thermal Information ................................................. 47.5 Electrical Characteristics........................................... 57.6 Timing Requirements ................................................ 67.7 Typical Characteristics .............................................. 7

8 Parameter Measurement Information .................. 99 Detailed Description ............................................ 11

9.1 Overview ................................................................. 119.2 Functional Block Diagram ....................................... 119.3 Feature Description................................................. 119.4 Device Functional Modes........................................ 119.5 Programming........................................................... 159.6 Register Maps ........................................................ 19

10 Application and Implementation........................ 2110.1 Application Information.......................................... 2110.2 Typical Application ............................................... 21

11 Power Supply Recommendations ..................... 2311.1 Power Sequence................................................... 2311.2 Power-On Reset Requirements ........................... 2311.3 I2C Communication After Power Up ..................... 2311.4 Wiper Position While Unpowered and After Power

Up............................................................................. 2412 Layout................................................................... 25

12.1 Layout Guidelines ................................................. 2512.2 Layout Example .................................................... 25

13 Device and Documentation Support ................. 2613.1 Documentation Support ........................................ 2613.2 Related Links ........................................................ 2613.3 Receiving Notification of Documentation Updates 2613.4 Community Resources.......................................... 2613.5 Trademarks ........................................................... 2613.6 Electrostatic Discharge Caution............................ 2613.7 Glossary ................................................................ 26

14 Mechanical, Packaging, and OrderableInformation ........................................................... 26

4 Revision History

Changes from Revision A (March 2012) to Revision B Page

• Added Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation section, Power Supply Recommendations section, Layout section, Device andDocumentation Support section, and Mechanical, Packaging, and Orderable Information section....................................... 1

• Changed this data sheet to the new SDA format .................................................................................................................. 1• Removed the obsolete TPL0401C device from the data sheet.............................................................................................. 1• Removed TPL0401C references ........................................................................................................................................... 1• Changed TA max value to 125°C from 128°C ........................................................................................................................ 4• Deleted ILKG ........................................................................................................................................................................... 5• Changed RH typical and max values ...................................................................................................................................... 5• Changed IDD(STBY) measurement point from 85°C to 105°C ................................................................................................... 5• IIN-DIG min and max values increased .................................................................................................................................... 5• Added Rheostat mode parameters ........................................................................................................................................ 5• Corrected typo to tOCF from tICF .............................................................................................................................................. 6• Corrected typo to tVD(DATA) from tVD(ACK) ................................................................................................................................. 6• Updated Typical Characteristics graphs ................................................................................................................................ 7• Updated Resistance Values table ....................................................................................................................................... 12• Added power supply recommendations .............................................................................................................................. 23

Changes from Original (September 2011) to Revision A Page

• Added TPL0401C device to the Datasheet ........................................................................................................................... 1• Added TPL0401C Package ................................................................................................................................................... 1• Added TPL0401C Functional Block Diagram......................................................................................................................... 1

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W

H

GND

VDD 1

2

3

6

SDASCL 4

5

L

3

TPL0401ATPL0401B

www.ti.com SLIS144B –SEPTEMBER 2011–REVISED FEBRUARY 2017


Submit Documentation FeedbackCopyright © 2011–2017, Texas Instruments Incorporated

5 Device Comparison Table

ORDERABLE PART NUMBER END-TO-END RESISTANCE I2C ADDRESSTPL0401A-10DCKR 10 kΩ 0101110TPL0401B-10DCKR 10 kΩ 0111110

6 Pin Configuration and Functions

DCK Package6-Pin SC70Top View

Pin FunctionsPIN

TYPE DESCRIPTIONNO. NAME1 VDD Power Positive supply voltage2 GND — Ground3 SCL I I2C Clock4 SDA I/O I2C Data5 W I/O Wiper terminal6 H I/O High terminal— L I/O Low terminal


4




(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratingsonly, which do not imply functional operation of the device at these or any other conditions beyond those indicated under RecommendedOperating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratingsover operating free-air temperature range (unless otherwise noted) (1)

MIN MAX UNITVDD Supply voltage VDD to GND –0.3 7 VIH, IL, IW Continuous current ±5 mA

VIDigital input pins (SDA, SCL) –0.3 VDD + 0.3 VPotentiometer pins (H, W) –0.3 VDD + 0.3

TJ(MAX) Maximum junction temperature 130 °CTstg Storage temperature –65 150 °C

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing withless than 500-V HBM is possible with the necessary precautions.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing withless than 250-V CDM is possible with the necessary precautions.

7.2 ESD RatingsVALUE UNIT

V(ESD) Electrostatic dischargeHuman-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2500

VCharged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±1000

7.3 Recommended Operating Conditionsover operating free-air temperature range (unless otherwise noted)

MIN MAX UNITVDD Supply voltage 2.7 5.5 VVW,VH, SDA, SCL Terminal voltage 0 VDD VVIH Voltage input high ( SCL, SDA ) 0.7 × VDD VDD VVIL Voltage input low ( SCL, SDA ) 0 0.3 × VDD VIW Wiper current –2 2 mATA Ambient operating temperature –40 125 °C

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics applicationreport.

7.4 Thermal Information

THERMAL METRIC (1)TPL0401x-10

UNITDCK (SC70)6 PINS

RθJA Junction-to-ambient thermal resistance 234 °C/WRθJC(top) Junction-to-case (top) thermal resistance 110.5 °C/WRθJB Junction-to-board thermal resistance 79 °C/WψJT Junction-to-top characterization parameter 7.2 °C/WψJB Junction-to-board characterization parameter 77 °C/WRθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W

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TPL0401ATPL0401B




(1) INL = ((VMEAS[code x] – VMEAS[code 0]) / LSB) – [code x](2) LSB = (VMEAS[code 127] – VMEAS[code 0]) / 127(3) DNL = ((VMEAS[code x] – VMEAS[code x–1]) / LSB) – 1(4) ZSERROR = VMEAS[code 0] / IDEAL_LSB(5) IDEAL_LSB = VH / 128(6) FSERROR = [(VMEAS[code 127] – VH) / IDEAL_LSB] + 1(7) RINL = ( (RMEAS[code x] – RMEAS[code 0]) / RLSB) – [code x](8) RLSB = (RMEAS[code 127] – RMEAS[code 0]) / 127(9) RDNL = ( (RMEAS[code x] – RMEAS[code x–1]) / RLSB ) – 1(10) ROFFSET = RMEAS[code 0] / IDEAL_RLSB(11) IDEAL_RLSB = RTOT / 128

7.5 Electrical CharacteristicsTypical values are specified at 25°C and VDD = 3.3 V (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNITRTOTAL End-to-end resistance 8 10 12 kΩRH Terminal resistance 100 200 ΩRW Wiper resistance 35 100 ΩCH Terminal capacitance 10 pFCW Wiper capacitance 11 pFTCR Resistance temperature coefficient 22 ppm/°C

IDD(STBY) VDD standby current–40°C to +105°C 0.5

µA–40°C to +125°C 1.5

IIN-DIGDigital pins leakage current (SCL,SDA Inputs) –2.5 2.5 µA

SERIAL INTERFACE SPECS (SDA, SCL)

VIH Input high voltage0.7 ×VDD

VDD V

VIL Input low voltage 00.3 ×VDD

V

VOL Output low voltage SDA Pin, IOL = 4 mA 0.4 VCIN Pin capacitance SCL, SDA Inputs 7 pFVOLTAGE DIVIDER MODE (VH = VDD, VW = Not Loaded)INL (1) (2) Integral non-linearity –0.5 0.5 LSBDNL (3) (2) Differential non-linearity –0.25 0.25 LSBZSERROR(4) (5) Zero-scale error 0 0.75 1.5 LSBFSERROR(6) (5) Full-scale error –1.5 –0.75 0 LSBTCV Ratiometric temperature coefficient Wiper set at mid-scale 4 ppm/°C

BW Bandwidth Wiper set at mid-scale,CLOAD = 10 pF2862 kHz

TSW Wiper settling time See Figure 10 0.152 µs

THD+N Total harmonic distortion VH = 1 VRMS at 1 kHz,measurement at W 0.03 %

RHEOSTAT MODE (VH = VDD, VW = Not Loaded)

RINL (7) (8) Rheostat mode integral non-linearity –1 1 LSB

RDNL (9) (8) Rheostat mode differential non-linearity 0.5 0.5 LSB

ROFFSET(10) (11) Rheostat-mode zero-scale error 0 0.75 2 LSB


6




7.6 Timing RequirementsMIN MAX UNIT

STANDARD MODE

fSCL I2C clock frequency 0 100 kHz

tSCH I2C clock high time 4 µs

tSCL I2C clock low time 4.7 µs

tsp I2C spike time 0 50 ns

tSDS I2C serial data setup time 250 ns

tSDH I2C serial data hold time 0 ns

tICR I2C input rise time 1000 ns

tICF I2C input fall time 300 ns

tOCF I2C output fall time, 10 pF to 400 pF bus 300 ns

tBUF I2C bus free time between stop and start 4.7 µs

tSTS I2C start or repeater start condition setup time 4.7 µs

tSTH I2C start or repeater start condition hold time 4 µs

tSPS I2C stop condition setup time 4 µs

tVD(DATA) Valid data time, SCL low to SDA output valid 1 µs

tVD(ACK) Valid data time of ACK condition, ACK signal from SCL low to SDA (out) low 1 µs

FAST MODE

fSCL I2C clock frequency 0 400 kHz

tSCH I2C clock high time 0.6 µs

tSCL I2C clock low time 1.3 µs

tsp I2C spike time 0 50 ns

tSDS I2C serial data setup time 100 ns

tSDH I2C serial data hold time 0 ns

tICR I2C input rise time 20 300 ns

tICF I2C input fall time 20 × (VDD / 5.5) 300 ns

tOCF I2C output fall time, 10 pF to 400 pF bus (VDD / 5.5) × 20 300 ns

tBUF I2C bus free time between stop and start 1.3 µs

tSTS I2C start or repeater start condition setup time 1.3 µs

tSTH I2C start or repeater start condition hold time 0.6 µs

tSPS I2C stop condition setup time 0.6 µs

tVD(DATA) Valid data time, SCL low to SDA output valid 1 µs

tVD(ACK) Valid data time of ACK condition, ACK signal from SCL low to SDA (out) low 1 µs


Temperature (qC)

Res

ista

nce

Cha

nge

(�)

-40 -10 20 50 80 110 130-1

-0.5

0

0.5

1

D005

2.7 V3.3 V5.5 V

Digital Code

TC

(pp

m/q

C)

0 16 32 48 64 80 96 112 1280

30

60

90

120

150

180

210

240

270

300

D006

2.7 V3.3 V5.5 V

Temperature (qC)

FS

Err

or (

LSB

)

-40 -20 0 20 40 60 80 100 120-1

-0.9

-0.8

-0.7

-0.6

-0.5

-0.4

-0.3

-0.2

-0.1

0

D004

2.7 V3.3 V5.5 V

Digital Code

RN

L E

rror

(LS

B)

0 16 32 48 64 80 96 112 128-1

-0.5

0

0.5

1

D003

2.7 V3.3 V5.5 V

Digital Code

INL

Err

or (

LSB

)

0 18 36 54 72 90 108 126-0.15

-0.1

-0.05

0

0.05

0.1

0.15

D001

2.7 V3.3 V5.5 V

Digital Code

DN

L E

rror

(LS

B)

0 18 36 54 72 90 108 126-0.15

-0.1

-0.05

0

0.05

0.1

0.15

D002

2.7 V3.3 V5.5 V

7

TPL0401ATPL0401B




7.7 Typical Characteristics

Figure 1. INL vs Tap Position (Potentiometer Mode) Figure 2. DNL vs Tap Position (Potentiometer Mode)

Figure 3. INL vs Tap Position (Rheostat Mode) Figure 4. Full Scale Error vs Temperature

Figure 5. End-to-End RTOTAL Change vs Temperature Figure 6. Temperature Coefficient vs TAP Position(Potentiometer Mode)


Digital Code

TC

(pp

m/q

C)

0 16 32 48 64 80 96 112 1280

30

60

90

120

150

180

210

240

270

300

D007

2.7 V3.3 V5.5 V

Frequency (Hz)

Mag

nitu

de (

dB)

103 104 105 106 107-60

-54

-48

-42

-36

-30

-24

-18

-12

-6

0

D008

Code 08Code 10Code 20Code 40

8




Typical Characteristics (continued)

Figure 7. Temperature Coefficient vs TAP Position(Rheostat Mode)

Figure 8. Frequency Response


SDA LOAD CONFIGURATION

VDD

R = 1 kL Ώ

C = 50 pF

(see Note A)L

DUTSDA

Two Bytes for READ Wiper Position Register

VOLTAGE WAVEFORMS

1

2

BYTE DESCRIPTION

I C address2

Wiper Position Data

SCL

SDA

StopCondition

(P)

StartCondition

(S)

AddressBit 7

(MSB)

AddressBit 1

R/Bit 0(LSB)

WACK(A)

DataBit 7

(MSB)

DataBit 0(LSB)

StopCondition

(P)

0.7 x VCCI

0.3 x VCCI

Repeat StartCondition

StopCondition

0.7 x VCCI

0.3 x VCCI

tscl tsch

tsp

ticf

ticf

ticr

tsth

ticr tsdstsdh

tocf

tvd(ack)

tvd

tvd

tsts

tsps

tbuf

9

TPL0401ATPL0401B




8 Parameter Measurement Information

A. CL includes probe and jig capacitance. tocf is measured with CL of 10 pF or 400 pF.B. All inputs are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr/tf ≤ 30 ns.C. All parameters and waveforms are not applicable to all devices.

Figure 9. I2C Interface Load Circuit and Voltage Waveforms


SCL

VW

5% VH

tswx

ACKDATA50% VDD

10




Parameter Measurement Information (continued)

A. Code change is from 0×40 to 0×00B. All inputs are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr/tf ≤ 30 ns.

Figure 10. Switch Time Waveform (tSW)


TPL0401A/B-10

I2C INTERFACEWIPER

REGISTERSCL

SDA

GND

VDD

W

H


11

TPL0401ATPL0401B




9 Detailed Description

9.1 OverviewThe TPL0401x-10 has a single linear-taper digital potentiometer with 128 wiper positions and an end-to-endresistance of 10 kΩ. The potentiometer can be used as a three-terminal potentiometer. The main operation ofTPL0401x-10 is in voltage divider mode.

The low (L) terminal of the TPL0401x-10 is tied directly to GND. The high (H) and low (GND) terminals ofTPL0401-10 are equivalent to the fixed terminals of a mechanical potentiometer. The H terminal must have ahigher voltage than the low terminal (GND). The position of the wiper (W) terminal is controlled by the value inthe Wiper Resistance (WR) 8-bit register. When the WR register contains all zeroes (zero-scale), the wiperterminal is closest to its L terminal. As the value of the WR register increases from all zeroes to all ones (full-scale), the wiper moves from the position closest to the GND terminal to the position closest to the H terminal. Atthe same time, the resistance between W and GND increases, whereas the resistance between W and Hdecreases.

9.2 Functional Block Diagram

9.3 Feature DescriptionThe TPL0401x-10 device is a single-channel, linear taper digital potentiometer with 128 wiper positions. Defaultpower up state for the TPL0401x-10 is mid code (0×40). The TPL0401x-10 has the low terminal connected toGND internally. The position of the wiper can be adjusted using an I2C interface. The TPL0401x-10 is available ina 6-pin SOT package with a specified temperature range of –40°C to +125°C. The part has a 10-kΩ end-to-endresistance and can operate with a supply voltage range of 2.7 V to 5.5 V. This kind of product is widely used insetting the voltage reference for low power DDR3 memory. The TPL0401x-10 has the low terminal internal andconnected to GND.

9.4 Device Functional Modes

9.4.1 Voltage Divider ModeThe digital potentiometer generates a voltage divider when all three terminals are used. The voltage divider atwiper-to-H and wiper-to-GND is proportional to the input voltage at H to L (see Figure 11).


HW H LD

V (V V ) 1128

§ ·§ · � u �¨ ¸¨ ¸

© ¹© ¹

W WL H LD

V V (V V )128

� u

H

L

W

VHW

VH - VL

VWL

12




Device Functional Modes (continued)

Figure 11. Equivalent Circuit for Voltage Divider Mode

For example, connecting terminal H to 5 V, the output voltage at terminal W can range from 0 V to 5 V.Equation 1 is the general equation defining the output voltage at terminal W for any valid input voltage applied toterminal H and terminal L (GND).

(1)

The voltage difference between terminal H and terminal W can also be calculated in Equation 2.

where• D is the decimal value of the wiper code (2)

Table 1 shows the ideal values for DPOT with end-to end resistance of 10 kΩ. The absolute values of resistancecan vary significantly but the Ratio (RWL/RTOT) is extremely accurate.

The linearity values are relative linearity values (that is, linearity after zero-scale and full-scale offset errors areremoved). Consider this when expecting a certain absolute accuracy because some error is introduced when thedevice gets close in magnitude to the offset errors.

Note that the MSB is always discarded during a write to the wiper position register. For example, if 0x80 iswritten to the wiper position register, a read returns 0x00. Another similar example is if 0xFF is written, then 0x7Fis read.

Table 1. Resistance Values TableSTEP HEX RWL (KΩ) RHW (KΩ) RWL/RTOT

0 0x00 0.00 10.00 0.0%1 0x01 0.08 9.92 0.8%2 0x02 0.16 9.84 1.6%3 0x03 0.23 9.77 2.3%4 0x04 0.31 9.69 3.1%5 0x05 0.39 9.61 3.9%6 0x06 0.47 9.53 4.7%7 0x07 0.55 9.45 5.5%8 0x08 0.63 9.38 6.3%9 0x09 0.70 9.30 7.0%10 0x0A 0.78 9.22 7.8%


13

TPL0401ATPL0401B




Table 1. Resistance Values Table (continued)STEP HEX RWL (KΩ) RHW (KΩ) RWL/RTOT

11 0x0B 0.86 9.14 8.6%12 0x0C 0.94 9.06 9.4%13 0x0D 1.02 8.98 10.2%14 0x0E 1.09 8.91 10.9%15 0x0F 1.17 8.83 11.7%16 0x10 1.25 8.75 12.5%17 0x11 1.33 8.67 13.3%18 0x12 1.41 8.59 14.1%19 0x13 1.48 8.52 14.8%20 0x14 1.56 8.44 15.6%21 0x15 1.64 8.36 16.4%22 0x16 1.72 8.28 17.2%23 0x17 1.80 8.20 18.0%24 0x18 1.88 8.13 18.8%25 0x19 1.95 8.05 19.5%26 0x1A 2.03 7.97 20.3%27 0x1B 2.11 7.89 21.1%28 0x1C 2.19 7.81 21.9%29 0x1D 2.27 7.73 22.7%30 0x1E 2.34 7.66 23.4%31 0x1F 2.42 7.58 24.2%32 0x20 2.50 7.50 25.0%33 0x21 2.58 7.42 25.8%34 0x22 2.66 7.34 26.6%35 0x23 2.73 7.27 27.3%36 0x24 2.81 7.19 28.1%37 0x25 2.89 7.11 28.9%38 0x26 2.97 7.03 29.7%39 0x27 3.05 6.95 30.5%40 0x28 3.13 6.88 31.3%41 0x29 3.20 6.80 32.0%42 0x2A 3.28 6.72 32.8%43 0x2B 3.36 6.64 33.6%44 0x2C 3.44 6.56 34.4%45 0x2D 3.52 6.48 35.2%46 0x2E 3.59 6.41 35.9%47 0x2F 3.67 6.33 36.7%48 0x30 3.75 6.25 37.5%49 0x31 3.83 6.17 38.3%50 0x32 3.91 6.09 39.1%51 0x33 3.98 6.02 39.8%52 0x34 4.06 5.94 40.6%53 0x35 4.14 5.86 41.4%54 0x36 4.22 5.78 42.2%55 0x37 4.30 5.70 43.0%56 0x38 4.38 5.63 43.8%57 0x39 4.45 5.55 44.5%


14




Table 1. Resistance Values Table (continued)STEP HEX RWL (KΩ) RHW (KΩ) RWL/RTOT

58 0x3A 4.53 5.47 45.3%59 0x3B 4.61 5.39 46.1%60 0x3C 4.69 5.31 46.9%61 0x3D 4.77 5.23 47.7%62 0x3E 4.84 5.16 48.4%63 0x3F 4.92 5.08 49.2%

64 (POR Default) 0x40 5.00 5.00 50.0%65 0x41 5.08 4.92 50.8%66 0x42 5.16 4.84 51.6%67 0x43 5.23 4.77 52.3%68 0x44 5.31 4.69 53.1%69 0x45 5.39 4.61 53.9%70 0x46 5.47 4.53 54.7%71 0x47 5.55 4.45 55.5%72 0x48 5.63 4.38 56.3%73 0x49 5.70 4.30 57.0%74 0x4A 5.78 4.22 57.8%75 0x4B 5.86 4.14 58.6%76 0x4C 5.94 4.06 59.4%77 0x4D 6.02 3.98 60.2%78 0x4E 6.09 3.91 60.9%79 0x4F 6.17 3.83 61.7%80 0x50 6.25 3.75 62.5%81 0x51 6.33 3.67 63.3%82 0x52 6.41 3.59 64.1%83 0x53 6.48 3.52 64.8%84 0x54 6.56 3.44 65.6%85 0x55 6.64 3.36 66.4%86 0x56 6.72 3.28 67.2%87 0x57 6.80 3.20 68.0%88 0x58 6.88 3.13 68.8%89 0x59 6.95 3.05 69.5%90 0x5A 7.03 2.97 70.3%91 0x5B 7.11 2.89 71.1%92 0x5C 7.19 2.81 71.9%93 0x5D 7.27 2.73 72.7%94 0x5E 7.34 2.66 73.4%95 0x5F 7.42 2.58 74.2%96 0x60 7.50 2.50 75.0%97 0x61 7.58 2.42 75.8%98 0x62 7.66 2.34 76.6%99 0x63 7.73 2.27 77.3%100 0x64 7.81 2.19 78.1%101 0x65 7.89 2.11 78.9%102 0x66 7.97 2.03 79.7%103 0x67 8.05 1.95 80.5%104 0x68 8.13 1.88 81.3%


SCL

SDA

START

Condition

STOP

Condition

Data Transfer

15

TPL0401ATPL0401B




Table 1. Resistance Values Table (continued)STEP HEX RWL (KΩ) RHW (KΩ) RWL/RTOT105 0x69 8.20 1.80 82.0%106 0x6A 8.28 1.72 82.8%107 0x6B 8.36 1.64 83.6%108 0x6C 8.44 1.56 84.4%109 0x6D 8.52 1.48 85.2%110 0x6E 8.59 1.41 85.9%111 0x6F 8.67 1.33 86.7%112 0x70 8.75 1.25 87.5%113 0x71 8.83 1.17 88.3%114 0x72 8.91 1.09 89.1%115 0x73 8.98 1.02 89.8%116 0x74 9.06 0.94 90.6%117 0x75 9.14 0.86 91.4%118 0x76 9.22 0.78 92.2%119 0x77 9.30 0.70 93.0%120 0x78 9.38 0.63 93.8%121 0x79 9.45 0.55 94.5%122 0x7A 9.53 0.47 95.3%123 0x7B 9.61 0.39 96.1%124 0x7C 9.69 0.31 96.9%125 0x7D 9.77 0.23 97.7%126 0x7E 9.84 0.16 98.4%127 0x7F 9.92 0.08 99.2%

9.5 Programming

9.5.1 I2C General Operation and Overview

9.5.1.1 START and STOP ConditionsI2C communication with this device is initiated by the master sending a START condition and terminated by themaster sending a STOP condition. A high-to-low transition on the SDA line while the SCL is high defines aSTART condition. A low-to-high transition on the SDA line while the SCL is high defines a STOP condition. SeeFigure 12.

Figure 12. Definition of START and STOP Conditions


SCL

SDA

MSB Bit Bit Bit Bit Bit Bit LSB

Byte: 1010 1010 ( 0xAAh )

1 0 1 0 1 0 1 0

SDA line stable while SCL line is high

ACK

ACK

16




Programming (continued)9.5.1.2 Data Validity and Byte FormationOne data bit is transferred during each clock pulse of the SCL. One byte is comprised of eight bits on the SDAline. See Figure 13. A byte may either be a device address, register address, or data written to or read from aslave.

Data is transferred Most Significant Bit (MSB) first. Any number of data bytes can be transferred from the masterto slave between the START and STOP conditions. Data on the SDA line must remain stable during the highphase of the clock period, as changes in the data line when the SCL is high are interpreted as control commands(START or STOP).

Figure 13. Definition of Byte Formation

9.5.1.3 Acknowledge (ACK) and Not Acknowledge (NACK)Each byte is followed by one ACK bit from the receiver. The ACK bit allows the receiver to communicate to thetransmitter that the byte was successfully received and another byte may be sent.

The transmitter must release the SDA line before the receiver can send the ACK bit. To send an ACK bit, thereceiver shall pull down the SDA line during the low phase of the ACK/NACK-related clock period (period 9), sothat the SDA line is stable low during the high phase of the ACK/NACK-related clock period. Consider setup andhold times. Figure 14 shows an example use of ACK.


SCL

SDA

1 2 3 4 5 6 7 8 9

NACK

Data Byte N

STOPCondition

MSBD7 D6 D5 D4 D3 D2 D1

LSB

D0

SCL

SDA

1 2 3 4 5 6 7 8 9

STARTCondition

MSBA6 A5 A4 A3 A2 A1 A0

LSB

ACK

Device Address

R/W

17

TPL0401ATPL0401B




Programming (continued)

Figure 14. Example Use of ACK

When the SDA line remains high during the ACK/NACK-related clock period, this is a NACK signal. There areseveral conditions that lead to the generation of a NACK:• The receiver is unable to receive or transmit because it is performing some real-time function and is not ready

to start communication with the master.• During the transfer, the receiver gets data or commands that it does not understand.• During the transfer, the receiver cannot receive any more data bytes.• A master-receiver is done reading data and indicates this to the slave through a NACK.

Figure 15 shows an example use of NACK.

Figure 15. Example Use of NACK

9.5.1.4 Repeated StartA repeated START condition may be used in place of a complete STOP condition follow by another STARTcondition when performing a read function. The advantage of this is that the I2C bus does not become availableafter the stop and therefore prevents other devices from grabbing the bus between transfers.


S A6 A5 A4 A3 A2 A1 A0 0

Device (Slave) Address (7 bits)

B7 B6 B5 B4 B3 B2 B1 B0 A

Register Address N (8 bits)

D7 D6 D5 D4 D3 D2 D1 D0 A

Data Byte to Register N (8 bits)

A P

START R/W=0 ACK ACK ACK STOP

Write to one register in a device

Master controls SDA line

Slave controls SDA line

18




Programming (continued)9.5.2 Programing with I2C

9.5.2.1 Write OperationTo write on the I2C bus, the master sends a START condition on the bus with the address of the slave, as wellas the last bit (the R/W bit) set to 0, which signifies a write. After the slave responds with an acknowledge, themaster then sends the register address of the register to which it wishes to write. The slave acknowledges again,letting the master know that it is ready. After this, the master starts sending the register data to the slave until themaster has sent all the data necessary (which is sometimes only a single byte), and the master terminates thetransmission with a STOP condition. See Figure 16.

Figure 16. Write Operation

9.5.2.2 Read OperationReading from a slave is very similar to writing, but requires some additional steps. in order to read from a slave,the master must first instruct the slave which register it wishes to read from. This is done by the master startingoff the transmission in a similar fashion as the write, by sending the address with the R/W bit equal to 0(signifying a write), followed by the register address it wishes to read from. When the slave acknowledges thisregister address, the master sends a START condition again, followed by the slave address with the R/W bit setto 1 (Signifying a read). This time, the slave acknowledges the read request, and the master releases the SDAbus but continues supplying the clock to the slave. During this part of the transaction, the master becomes themaster-receiver, and the slave becomes the slave-transmission.

The master continues to send out the clock pulses, for each byte of data that it wishes to receive. At the end ofevery byte of data, the master sends an ACK to the slave, letting the slave know that it is ready for more data.When the master has received the number of bytes it was expecting (or needs to stop communication), it sendsa NACK, signaling to the slave to halt communications and release the bus. The master follows this up with aSTOP condition. Figure 17 shows the read operation from one register.


S

START

Read from one register in a device with single register

A6 A5 A4 A3 A2 A1 A0


1 A

ACK

D7 D6 D5 D4 D3 D2 D1 D0

Data Byte from Register (8 bits)

NA

NACK

P

STOPR/W=1

S A6 A5 A4 A3 A2 A1 A0 0


AA

START R/W=0 ACK ACK

Read from one register in a device

P

STOP

S A6 A5 A4 A3 A2 A1 A0


START

1 A

ACK

D7 D6 D5 D4 D3 D2 D1 D0

Data Byte from Register N (8 bits)

Read from one register in a device (Repeated Start)

NA

NACK

P

STOP

S A6 A5 A4 A3 A2 A1 A0 0


AA

START ACK ACK

Sr A6 A5 A4 A3 A2 A1 A0


Repeated START

1 A

ACK

D7 D6 D5 D4 D3 D2 D1 D0

Data Byte from Register N (8 bits)

B7 B6 B5 B4 B3 B2 B1 B0


B6 B5 B4 B3 B2 B1 B0


NACK STOP

NA PB7

R/W=1

R/W=0 R/W=1

19

TPL0401ATPL0401B




Programming (continued)

Figure 17. Read Operation from One Register

Figure 18. Short Read Operation

The TPL0401x-10 has 1 register, and it is not a requirement that the register address be sent before a read. Ashorter read allows the user to simply send a read request to the device address as shown in Figure 18.

9.6 Register Maps

9.6.1 Slave AddressTable 2 and Table 3 show the TPL0401A-10 and TPL0401B-10 bit address repectively.

Table 2. TPL0401A-10 Bit AddressBIT 7(MSB)

BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0(LSB)

0 1 0 1 1 1 0 R/W

Table 3. TPL0401B-10 Bit AddressBIT 7(MSB)

BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0(LSB)

0 1 1 1 1 1 0 R/W


B2 B1 B0B5 B4 B3B7 B6

20




9.6.2 Register AddressFollowing the successful acknowledgment of the address byte, the bus master sends a command byte as shownin Figure 19, which is stored in the Control Register in the TPL0401x-10. The TPL0401x-10 has only 1 register,but requires the command byte be sent during communication.

Figure 19. Register Address Byte

Table 4 shows the TPL0401x-10 register address byte.

Table 4. Register Address ByteREGISTER ADDRESS BITS REGISTER

ADDRESS(HEX)

REGISTER PROTOCOL POWER-UPDEFAULTB7 B6 B5 B4 B3 B2 B1 B0

0 0 0 0 0 0 0 0 0x00 Wiper Position Read/Write byte 0100 0000(0×40)

See Table 1 for more information on the wiper position register values. Note that the MSB is always discardedduring a write to the wiper position register. For example, if 0x80 is written to the wiper position register, a readreturns 0x00. Another similar example is if 0xFF is written, then 0x7F is read.


DDR3 DIMM1

1.5 V

+

-

1 k

1 kDPOTTPL0401A/B-10 OP-AMP

VREF


21

TPL0401ATPL0401B




10 Application and Implementation

10.1 Application InformationThere are many applications in which voltage division is needed through the use of a digital potentiometer suchas the TPL0401x-10; this is one example of the many. In conjunction with many amplifiers, the TPL0401x-10 caneffectively be used in voltage divider mode to create a buffer to adjust the reference voltage for DDR3 DIMM1Memory.

10.2 Typical Application

Figure 20. DDR3 Voltage Reference Adjustment

10.2.1 Design RequirementsTable 5 lists the design parameters for this example.

Table 5. Design ParametersPARAMETER EXAMPLE VALUEInput voltage 1.5 V

VREF 0 V to 0.75 V

10.2.2 Detailed Design ProcedureThe TPL0401x-10 can be used in voltage divider mode with a unity-gain op amp buffer to provide a clean voltagereference for DDR3 DIMM1 Memory. The analog output voltage, VREF1 is determined by the wiper settingprogrammed through the I2C bus.

The op amp is required to buffer the high-impedance output of the TPL0401x-10 or else loading placed on theoutput of the voltage divider affects the output voltage.


TPL0401A/B Code (Digital Input)

VR

EF (

V)

0 8 16 24 32 40 48 56 64 72 80 88 96 104 112 120 1280

0.2

0.4

0.6

0.8

D001

22




10.2.3 Application CurveThe voltage, 1.5 V, applied to terminal H of TPL0401x-10 determines the voltage that is buffered by the unity-gain op amp and divided as the DDR3 DIMM1 voltage reference. By using the TPL0401x-10, and dividing the 1.5V, a maximum of 0.75 V is applied to the buffer and passed to the voltage divider. The output voltage thenranges from 0 V to 0.75 V.

Figure 21. TPL0401-10 Digital Input vs Reference Voltage for DDR3 DIMM Memory


SDA

VDD VDD MIN

120 µsx

START ADDR

VDD

Ramp-Up Re-Ramp-Up

Time to Re-Ramp

Time

Ramp-Down

tFT tRTtRT

tTRR_GND

23

TPL0401ATPL0401B




(1) Not tested. Specified by design.

11 Power Supply Recommendations

11.1 Power SequenceProtection diodes limit the voltage compliance at SDA, SCL, terminal H, and terminal W, making it important topower up VDD first before applying any voltage to SDA, SCL, terminal H, and terminal W. The diodes are forward-biasing, meaning VDD can be powered unintentionally if VDD is not powered first. The ideal power-up sequence isVDD, digital inputs, and VW and VH. The order of powering digital inputs, VH and VW does not matter as long asthey are powered after VDD.

11.2 Power-On Reset RequirementsIn the event of a glitch or data corruption, the TPL0401-10 can be reset to its default conditions by using thepower-on reset feature. Power-on reset requires that the device go through a power cycle to be completely reset.This reset also happens when the device is powered on for the first time in an application.

Figure 22. VDD is Lowered to 0 V and then Ramped Up to VDD

Table 6 specifies the performance of the power-on reset feature for the TPL0401-10 for both types of power-onreset.

Table 6. Recommended Supply Sequencing and Ramp Rates at TA = 25°C (1)

PARAMETER MIN MAX UNITtFT Fall rate See Figure 22 0.0001 1000 mstRT Rise rate See Figure 22 0.0001 1000 mstRR_GND Time to re-ramp (when VDD drops to GND) See Figure 22 1 μs

11.3 I2C Communication After Power UpIn order to ensure a complete device reset after a power up condition, the user must wait 120 µs after power upbefore initiating communication with the TPL0401x-10. See Figure 23 for an example waveform.

Figure 23. Recommended Start Up Sequence


24




11.4 Wiper Position While Unpowered and After Power UpWhen DPOT is powered off, the impedance of the device is undefined and not known.

Upon power-up, the device returns to 0×40h code because this device does not contain non-volatile memory.


TPL0401A/B-10

Via to GND Plane

Via to VDD Power Plane

06

03

Ca

p

04

02

Ca

p

VDD

GND

SCL SDA

W

H

25

TPL0401ATPL0401B




12 Layout

12.1 Layout GuidelinesTo ensure reliability of the device, follow common printed-circuit board (PCB) layout guidelines:• Leads to the input must be as direct as possible with a minimum conductor length.• The ground path must have low resistance and low inductance.• Use short trace-lengths to avoid excessive loading.• It is common to have a dedicated ground plane on an inner layer of the board.• Terminals that are connected to ground must have a low-impedance path to the ground plane in the form of

wide polygon pours and multiple vias.• Use bypass capacitors on power supplies and placed them as close as possible to the VDD pin.• Apply low equivalent series resistance (0.1-μF to 10-μF tantalum or electrolytic capacitors) at the supplies to

minimize transient disturbances and to filter low-frequency ripple.• To reduce the total I2C bus capacitance added by PCB parasitics, data lines (SCL and SDA) must be as short

as possible and the widths of the traces must also be minimized (for example, 5 to 10 mils depending oncopper weight).

12.2 Layout Example

Figure 24. Layout Recommendation


26




13 Device and Documentation Support

13.1 Documentation Support

13.1.1 Related DocumentationFor related documentation, see the following:• I2C Bus Pullup Resistor Calculation• Understanding the I2C Bus• TPL0401 Evaluation Module User's Guide

13.2 Related LinksThe table below lists quick access links. Categories include technical documents, support and communityresources, tools and software, and quick access to order now.

Table 7. Related Links

PARTS PRODUCT FOLDER ORDER NOW TECHNICALDOCUMENTSTOOLS &

SOFTWARESUPPORT &COMMUNITY

TPL0401A Click here Click here Click here Click here Click hereTPL0401B Click here Click here Click here Click here Click here

13.3 Receiving Notification of Documentation UpdatesTo receive notification of documentation updates, navigate to the device product folder on ti.com. In the upperright corner, click on Alert me to register and receive a weekly digest of any product information that haschanged. For change details, review the revision history included in any revised document.

13.4 Community ResourcesThe following links connect to TI community resources. Linked contents are provided "AS IS" by the respectivecontributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms ofUse.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaborationamong engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and helpsolve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools andcontact information for technical support.

13.5 TrademarksE2E is a trademark of Texas Instruments.All other trademarks are the property of their respective owners.

13.6 Electrostatic Discharge CautionThese devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foamduring storage or handling to prevent electrostatic damage to the MOS gates.

13.7 GlossarySLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

14 Mechanical, Packaging, and Orderable InformationThe following pages include mechanical, packaging, and orderable information. This information is the mostcurrent data available for the designated devices. This data is subject to change without notice and revision ofthis document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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PACKAGE OPTION ADDENDUM

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Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status(1)

Package Type PackageDrawing

Pins PackageQty

Eco Plan(2)

Lead finish/Ball material

(6)

MSL Peak Temp(3)

Op Temp (°C) Device Marking(4/5)

Samples

TPL0401A-10DCKR ACTIVE SC70 DCK 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 (7TD, 7TV)

TPL0401B-10DCKR ACTIVE SC70 DCK 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 (7UD, 7UV)

(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substancedo not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI mayreference these types of products as "Pb-Free".RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of

PACKAGE OPTION ADDENDUM

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Addendum-Page 2

OTHER QUALIFIED VERSIONS OF TPL0401A-10, TPL0401B-10 :

• Automotive: TPL0401A-10-Q1, TPL0401B-10-Q1

NOTE: Qualified Version Definitions:

• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

http://focus.ti.com/docs/prod/folders/print/tpl0401a-10-q1.htmlhttp://focus.ti.com/docs/prod/folders/print/tpl0401b-10-q1.html

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device PackageType

PackageDrawing

Pins SPQ ReelDiameter

(mm)

ReelWidth

W1 (mm)

A0(mm)

B0(mm)

K0(mm)

P1(mm)

W(mm)

Pin1Quadrant

TPL0401A-10DCKR SC70 DCK 6 3000 180.0 8.4 2.41 2.41 1.2 4.0 8.0 Q3

TPL0401B-10DCKR SC70 DCK 6 3000 180.0 8.4 2.41 2.41 1.2 4.0 8.0 Q3

PACKAGE MATERIALS INFORMATION

www.ti.com 3-Aug-2017

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TPL0401A-10DCKR SC70 DCK 6 3000 202.0 201.0 28.0

TPL0401B-10DCKR SC70 DCK 6 3000 202.0 201.0 28.0

PACKAGE MATERIALS INFORMATION

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Pack Materials-Page 2

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TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.

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1 Features2 Applications3 DescriptionTable of Contents4 Revision History5 Device Comparison Table6 Pin Configuration and Functions7 Specifications7.1 Absolute Maximum Ratings7.2 ESD Ratings7.3 Recommended Operating Conditions7.4 Thermal Information7.5 Electrical Characteristics7.6 Timing Requirements7.7 Typical Characteristics

8 Parameter Measurement Information9 Detailed Description9.1 Overview9.2 Functional Block Diagram9.3 Feature Description9.4 Device Functional Modes9.4.1 Voltage Divider Mode

9.5 Programming9.5.1 I2C General Operation and Overview9.5.1.1 START and STOP Conditions9.5.1.2 Data Validity and Byte Formation9.5.1.3 Acknowledge (ACK) and Not Acknowledge (NACK)9.5.1.4 Repeated Start

9.5.2 Programing with I2C9.5.2.1 Write Operation9.5.2.2 Read Operation

9.6 Register Maps9.6.1 Slave Address9.6.2 Register Address

10 Application and Implementation10.1 Application Information10.2 Typical Application10.2.1 Design Requirements10.2.2 Detailed Design Procedure10.2.3 Application Curve

11 Power Supply Recommendations11.1 Power Sequence11.2 Power-On Reset Requirements11.3 I2C Communication After Power Up11.4 Wiper Position While Unpowered and After Power Up

12 Layout12.1 Layout Guidelines12.2 Layout Example

13 Device and Documentation Support13.1 Documentation Support13.1.1 Related Documentation

13.2 Related Links13.3 Receiving Notification of Documentation Updates13.4 Community Resources13.5 Trademarks13.6 Electrostatic Discharge Caution13.7 Glossary

14 Mechanical, Packaging, and Orderable Information