tracker upgrade mechanical/thermal engineering

TK Upgrade Workshop June 09, Summary on Engineering / A.Onnela

Tracker Upgrade Mechanical/Thermal Engineering

3 June meeting theme: Modules and Structures • News on Phase 1 BPIX Upgrade Mechanics & Modules, R. Horisberger. S. Koenig / PSI• Update on the Phase 1 FPIX Half Disk Design, S. Kwan / FNAL • Phase 1 FPIX Mechanics - Plans for module assembly, K. Arndt / Purdue• Phase 2 Outer Tracker Module analysis, S. Kyre / UCSB


BPIX module design

• Reduction / optimisation of components from present version


BPIX prototypes and test structures• Barrel model structure in carbon-fibre• Module support with clamps

• Thermal tests due to start in PSI, Lyon, CERN


FPIX• Present Planned Phase 1

MODULE LAYOUT

12 identical half-disks

only 2x8 modules

One 2x8 module placed on each side of a substrate for all outer and inner radius blades

Substrate uses Thermal Pyrolytic Graphite – material with excellent in-plane thermal conductivity

Inner half-disk

Outer half-disk

Simon Kwan, Fermilabon behalf of the USCMS Pixel Mechanics R&D group


FPIX• Outer (inner) half-disk assembly with Edge Cooling Concept


0.7 mm thick carbon fiber ring for support

uses only

3.0 mm thick CC ring for cooling and support

uses

Cf skin to enclose the tubing

Ss tubing

Machined groove to house

tubing

One piece ring made of CC


FPIX• Half-disk assembly with Edge Cooling Concept


Cf supporting spokes

Configuration (1)Heat sink on outer edge onlyHDI being the outermost within module

0.06 cf + 0.88 TPG + 0.06 cf Blade150% heat load, 7.3W per blade; sensor: 0.6 W; ROC: 6.7 W

∆T = 5.2Cacross model

∆T = 3.4CAcross sensor


FPIX• Module development – Various Integrated Module/Panel Concepts under

study, here one example

• Equipment for automated module assembly under development

Kirk Arndt, Purdueon behalf of the USCMS Pixel Mechanics R&D group

2x8 BBM

TBM TPGHDI

2x8 BBM

TPG

HDI pigtail


FPIX• Module development - Adhesives study

Kirk Arndt, Purdueon behalf of the USCMS Pixel Mechanics R&D group

• Requirements for adhesive:– Thermal conductivity: > 0.2 W/m-K

– Soft: shear modulus < 50 N/mm^2

– Conformable to 50 micron non-flatness

– Radiation hard

– Electrically non-conductive

– Curing at room temperature

– Not flowing during application: adhesive confined within chip

– Good wetting properties

– Not creeping after curing

– Allow integrated module replacement without damaging the support

• Status– Begun a market survey of adhesives for pixel integrated module

assembly with potential to meet requirements for SLHC (including adhesives used in current LHC detectors – ALICE, ATLAS, CMS, LHCb and TOTEM)

– 6 primary candidate adhesives selected for further testing so far

– Building mechanical grade samples using candidate adhesives for evaluation of mechanical properties before and after irradiation

FPIX adhesive sample for tensile testing after

irradiation


Phase 1 FPIX Time-scale and milestones

• Module and disk conceptual design and studies are ongoing baseline conceptual mechanical and electrical design this summer.

• Small prototype development for testing will follow.

• Goal to build full-scale prototypes for thermal and mechanical tests in early 2010.

Time scale for Phase 1 TDR (Spring 2010)

USCMS Pixel Mechanics R&D group


Phase 2 Outer Modules

• First thermal analysis based on module design shown in April 09 tracker week

• This is the start, and too early to refer to the first results. Need to work on module and support geometry, materials, power of components, cooling contacts, etc.

• Bonding tests (inclined and long bonds) planned at UCSB

Susanne Kyre, UCSB


Summary• Design of Phase 1 BPIX and FPIX modules and structures advancing

well. – Important gains (~ factor 2) in material budget seem achievable

• BPIX design: basic concept same as in present detector, but important changes in support design, cooling pipe.– Prototyping of BPIX structures on-going, thermal tests about to start– Cooling pipe to structure gluing requires verification (common topic within

the Tracker)

• FPIX design: important changes in the mechanics concept: outer/inner disk, edge cooled modules. – Many details to be worked out, and prototyped, but seems in good track.– Performance of the edge cooling to be tested.

• Module – coolant deltaT’s likely to be different in BPIX and FPIX due differences in cooling pipe position vs. modules– Is this a problem?

• Work on the Phase 2 outer module mechanical/thermal engineering started


On the Tracker-wide Mechanical/Thermal Engineering

1. Need to ensure coherent references on requirements (thermal, precision/accuracy), choice of materials (glues, cooling pipes, …), quality control, etc.

2. A lot of experience and know-how within the collaboration (and within other similar projects) – enhance communication and organization of documentation– Common entry web page(s) pointing to group pages. Email lists.

• 1 &2 to be tackled by the Tracker Upgrade Engineering coordinators: A. Onnela, H. Postema, K. Arndt, R. Schmitt, S. Koenig

• Tracker-wide Mechanical/Thermal Engineering meetings to be held every two months– Within ‘Tracker monthly’ or other suitable– We too need afternoon slots!

• Tracker Upgrade Project Office (D. Abbaneo, S. Kwan) meets weekly/bi-weekly, and calls sessions on specific topics, including engineering.

tracker upgrade mechanical/thermal engineering

Documents

developmenttk upgrade

cerntk upgrade workshop

bpix upgrade mechanics

kyre ucsbtk upgrade

automated module assembly

fermilabon behalf

purdueon behalf

outer tracker module