transciucers'99 digest of technical papers …digest of technical papers volume 2 session 3a1,...
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The 10th International Conferenceon Solid-State Sensors and Actuators
TRANSCIUCERS'99
Digest of Technical PapersVolume 2
Session 3A1, Wednesday, June 9- Session 4D4, Thursday, June 10
June 7 -10,1999Sendai, Japan
Session 3C2 OPTICAL AND TACTILE IMAGERSWednesday, June 9, 10:40 am-12:00 pm
3C2.1 Single Chip CMOS Imagers and FlexibleMicroelectronic Stimulators for a RetinaImplant SystemM. Schwarz, R. Hauschild, B.J. Hosticka, J.Huppertz, T. Kneip, S. Kolnsberg, L.Ewe,H.K. Trieu, Fraunhofer Institute ofMicroelectronic Circuits and Systems,Germany 956
3C2.2 Time-Domain Correlation Image Sensor:First CMOS Realization and EvaluationAkira Kimachi, Shigeru Ando, The Universityof Tokyo, Japan 958
3C2.3 A VLSI Optical Sensor Which Counts theNumber of ObjectsMasatoshi Nishimura, Katsuyuki Sunamura,Sankyo Co., Ltd., Japan, Jan Van der Spiegel,University of Pennsylvania, USA 962
3C2.4 Intelligent CMOS Fingerprint SensorsStefan Jung, Christofer Hierold, ThomasScheiter, Paul Werner von Basse, RolandThewes, Karl Goser, Werner Weber, SiemensAG, Germany 966
Session 3D2 GYROSCOPES 2Wednesday, June 9,10:40 am-12:00 pm
3D2.1 Lateral Gyroscope Suspended by TwoGimbals Through High Aspect Ratio ICPEtchingK.Y. Park, H.S. Jeong, S. An, S.H. Shin,Samsung Electro Mechanics Co., C.W. Lee,KAIST, Korea 972
3D2.2 Vibrating Gyroscope Consisting of ThreeLayers of Polysilicon Thin FilmsToshiyuki Tsuchiya, Yasuyuki Kageyama,Hirofumi Funabashi, Jiro Sakata, ToyotaCentral Research and DevelopmentLaboratories, Inc., Japan 976
3D2.3 Design and Performance of a PiezoelectricMicrogyroscopeSin-Luen Cheung, Wei Ma, Howard CamLuong, Shi-Wei Ricky Lee, The Hong KongUniversity of Science and Technology, China
9803D2.4 Testing of a Micro-Rotating Gyroscope
C. Shearwood, K.Y. Ho, H.Q. Gong, NanyangTechnological University, Singapore 984
Session 3A3 MEMS DA CONVERTERS AND DATASTORAGE APPLICATION
Wednesday, June 9, 3:40 pm- 5:40 pm
3A3.1 Intricate Mechanisms-on-a-Chip Enabledby 5-Level Surface Micromachining(Invited)M. Steven Rodgers, Jeffry J. Sniegowski,James J. Allen, Samuel L. Miller, James H.Smith, Paul J. McWhorter, Sandia NationalLaboratories, USA 990
3A3.2 Micro Electro Mechanical Digital-to-Analog Converter (MEMDAC)Hiroshi Toshiyoshi, Makoto Mita, GenHashiguchi, Hiroyuki Fujita, The Universityof Tokyo, Dai Kobayashi, Tokyo DenkiUniversity, Junji Endo, Yasuo Wada, HitachiLtd., Japan 994
3A3.3 Mechanical Digital-to-Analog ConvertersRichard Yeh, Robert A. Conant, Kristofer S.J.Pister, University of California at Berkeley,USA 998
3A3.4 Mechanical Performance of an IntegratedMicrogimbal / Microactuator for DiskDrivesLilac Mullcr, J.M. Noworolski, R.T. Howe,A.P. Pisano, University of California atBerkeley, USA 1002
3A3.5 Milli-Scale Mirror Actuator with BulkMicromachined Vertical CombsHee-Moon Jeong, Jae-Joon Choi, Kyu YongKim, Ki Bang Lee, Jong Up Jeon, Y. EugenePak, Samsung Advanced Institute ofTechnology, Korea 1006
Session 3B3 MICRO GAS SENSORS
Wednesday, June 9, 3:40 pm- 5:40 pm
3B3.1 CMOS Capacitive Chemical Microsystemwith Active Temperature Control forDiscrimination of Organic VaporsC. Hagleitner, A. Koll, R. Vogt, O. Brand, H.Baltes, ETH Zurich, Switzerland 1012
3B3.2 Array-type Micro-machined Gas SensingSystemMotoshi Tajima, Kubota Co., Ltd, TakehitoNakai, Hochiki Co,, Ltd, Nobuyuki Yoshiike,Matsushita Electric Industrial Co., Ltd, YaowuMo, Yuzo Okawa, Kazuki Natukawa,Technology Research Institute of OsakaPrefecture, Japan 1016
3B3.3 CMOS Resonant Beam Gas Sensor withIntegrated PreamplifierD. Lange, C. Hagleitner, O. Brand, H. Baltes,ETH Zurich, Switzerland 1020
3B3.4 Boron-doped Diamond Thin Film Sensorfor Detection of Various SemiconductorManufacturing GasesT. Takada, T. Fukunaga, New Cosmos ElectricCo., Ltd., K. Hayashi, Y. Yokota, T.Tachibana, K. Miyata, K. Kobashi, KobeSteel, Ltd., Japan 1024
3B3.5 Fabrication and Sensing Characteristics ofMicro Gas Sensor for Nitrogen Oxides GasDetectionDae-Sik Lee, Jun-Woo Lim, Sang-Mun Lee,Hyun-Ho Kim, Jeung-Su Huh, Duk-DongLee, Kyungpook National University, Korea
10283B3.6 A New Low Power SiC/HfB,-Based
Microhotplate with Integrated IDC forMetal Oxide Gas SensorsF. Solzbacher, C. Imawan, H. Steffes, E.
Obermeier, Technical University Berlin, H.Moller, Daimler Benz AG, Germany 1032
Session 3C3 INTERFACE AND SYSTEMS ISSUESWednesday, June 9, 3:40 pm- 5:40 pm
3C3.1 A Passive Telemetry System with aCapacitive Silicon Sensor Suitable forBlood Pressure MeasurementsS. Chatzandroulis, D. Tsoukalas, Institute ofMicroelectronics, Greece, P. A. Neukomm,ETH Zentrum, Switzerland 1038
3C3.2 Telemetric Artificial Skin for Soft RobotMitsuhiro Hakozaki, Katsuhiko Nakamura.Hiroyuki Shinoda, Tokyo University ofAgriculture and Technology, Japan 1042
3C3.3 Biochemical IC Family for General MicroChemical SystemsKoji Ikuta, Shoji Maruo, Tetsuya Fujisawa,Tadahiro Hasegawa, Nagoya University, Japan
10463C3.4 Environmental Recognition Devices
O. Tohyama, S. Maeda, K. Abe, M.Murayama, T. Tachibana, Mitsubishi CableIndustries, Ltd., Japan 1050
3C3.5 The Interface and System Considerationsof Microactuators for Magnetic Disk DriveL.-S. Fan, J. Hong, T.S. Pan, S. Pattanaik, T.Hirano, T. Semba, S. Chan, IBM AlmadenResearch Center, USA 1054
3C3.6 In-Pipe Wireless Micro RobotTakanari Sasaya, Takayuki Shibata, NobuakiKawahara, DENSO Corporation, Japan 1058
Session 3D3 MICROPHONES & FLUIDIC SENSORSWednesday, June 9, 3:40 pm- 5:40 pm
3D3.1 A High Performance MEMS Thin-FilmTeflon Electret MicrophoneWen H. Hsieh, Tze-Jung Yao, Yu-Chong Tai,California Institute of Technology, USA 1064
3D3.2 All-surface-micromachined Si MicrophoneFalvio Pardo, R. Boie, G. Elko, R Sarpeshkar,D.J. Bishop, Lucent Technologies, USA 1068
3D3.3 Surface Micromachined Driven ShieldedCondenser Microphone with a SacrificialLayer Etched from the BacksideM. Ikeda, Matsushita CommunicationIndustrial Co., Ltd., N. Shimizu, MatsushitaResearch Institute Tokyo Ltd., MasayoshiEsashi, Tohoku University, Japan 1070
3D3.4 A Fully Integrated Shear Stress SensorXuan-Qi Wang, Zhigang Han, Fukang Jiang,Thomas Tsao, Qiao Lin, Yu-Chong Tai,Vincent Koosh, Rodney Goodman, JamesLew, Chin-Ming Ho, UCLA, USA 1074
3D3.5 A New Edge-Detected Lift Force FlowSensorNiklas Svedin, Edvard Kiilvesten, GoranStemme, Royal Institute of Technology,Sweden 1078
3D3.6 Measurement of Mechanical Properties ofEar Drum, Middle Ear Exudate and EarMembranesM. Nakao, T. Okusa, Y. Hatamura, TheUniversity of Tokyo, Japan 1082
Session 4A1 BULK MICROMACHININGThursday, June 10, 9:00 am -10:20 am
4A1.1 Fabrication of Mechanical Structures in p-type Silicon Using Electrochemical EtchingH. Ohji, K.Tsutsumi, Mitsubishi ElectricCorporation, Japan, P. J. French, DelftUniversity of Technology, The Netherlands
10864A1.2 The Effects of Thermal Treatment of CZ-
and FZ-silicon on Crystal Defect Formationand the Etching Behavior DuringAnisotropic Etching in KOH-solutionsA. Hein, S. Finkbeiner, H. Muenzel, J. Marek,Robert Bosch GmbH Reutlingen, E.Obermeier, Technical University of Berlin,Germany 1090
4A1.3 Fabrication of Narrow Gaps and SmallHoles Using High Boron DiffusionKenichiro Suzuki, Robert Rumpf, NECCorporation, Japan 1094
4A1.4 Three-Dimensional Hollow Microneedleand Microtube ArraysD.V. McAllister, F. Cros, S.P. Davis, L.M.Matta, M.R. Prausnitz, M.G. Allen, GeorgiaInstitute of Technology, USA 1098
Session 4B1 BIOMONITORING
Thursday, June 10, 9:00 am -10:20 am
4B1.1 Insect Meets Microelectronics: A BioFET asa First Step to Bioelectronic MicrosystemsS. Schiitz, J. Czynski, H.E. Hummel, Justus-Liebig-Universitat, M.J.Scheming, P. Schroth,P. Kordos, H. Liith, Institut fur Schicht-undIonentechnik, Germany 1104
4B1.2 Random Fluidic Self-Assembly ofMicrofabricated Metal Particles for theImmobilization of BiomaterialYuji Murakami, Kotaro Idegami, HidenoriNagai, Akira Yamamura, Kenji Yokoyama,Eiichi Tamiya, Japan Advanced Institute ofScience and Technology, Japan 1108
4B1.3 Integrated Flow Sensor for In-situMeasurement and Control of AcousticStreaming in Flexural-Plate-WaveMicropumpsNam-Trung Nguyen, Audra H. Meng, JustinBlack, Richard M. White, University ofCalifornia at Berkeley, USA 1112
4B1.4 A Method for Reducing Fouling at theSensor-Sample Interface in MedicalApplicationsJ.V. Hatfield, CM. Gregory, S. Higgins,UMIST, P.J. Vadgama, University ofManchester, UK 1116
Session 4C1 MICROFLUIDIC DEVICESThursday, June 10, 9:00 am -10:20 am
4C1.1 The Bubble Spring and Channel (BSaC)Valve: An Actuated, Bi-Stable MechanicalValve for In-Plane Fluid ControlJohn D. Evans, Dorian Liepmann, Universityof California, Berkeley, USA 1122
4C1.2 An AC MagnetohydrodynamicMicropump: Towards a True IntegratedMicrofluidic SystemAsuncion V. Lemoff, Abraham P. Lee, RobinR. Miles, Charles F. McConaghy, LawrenceLivermore National Laboratory, USA 1126
4C1.3 Micromachined Injector for DNA MassSpectrometryPh. Luginbuhl, P.-F. Indermuhlc, M.-A.Gretillat, F. Willemin, N.F. de Rooij,University of Neuchatel, D. Gerber, G.Gervasio, J.-L. Vuillcumicr, Institute ofPhysic, D. Twerenbold, GenSpec SA, M.Diiggelin, R. Guggenheim, University ofBasel, Switzerland 1130
4C1.4 Microfluidic Applications of UltrasonicFlexural Plate WavesJustin P. Black, Richard M. White, Universityof California at Berkeley, USA 1134
Session 4D1 MECHANICAL DYNAMICS
Thursday, June 10, 9:00 am -10:20 am
4D1.1 Mechanical Behavior of UltrathinMicrocantileverJinling Yang, Takahito Ono, MasayoshiEsashi, Tohoku University, Japan 1140
4D1.2 Multi-dimensional MEMS MotionCharacterization Using Laser VibrometryKimberly L. Turner, Peter G. Hartwell, N.C.MacDonald, Cornell University, USA 1144
4D1.3 Gas Damping and Spring Effects onMEMS Devices with Multiple Perforationsand Multiple GapsM.G. da Silva, M. Deshpande, K. Greiner,J.R. Gilbert, Microcosm Technologies Inc.,USA H48
4D1.4 Finite-Difference Large-Displacement Gas-Film ModelTimo Veijola, Helsinki University ofTechnology, Finland 1152
Session 4A2 TRANSFER & SELF ASSEMBLYTECHNIQUES
Thursday, June 10, 10:40 am -12:00 pm
4A2.1 Performance Evaluation of Batch-Transferred Surface MicromachinedResonatorsAngad Singh, Dubravka Bilic, Roger T.Howe, University of California at Berkeley,USA 1158
4A2.2 Photoresist-Assisted Micromechanical-Component Transfer Technique
Terunobu Akiyama, Patrick Balmer, UrsStaufer, Nico F. de Rooij, University ofNeuchatel, Switzerland 1162
4A2.3 Three-Dimensional Micro Self-AssemblyUsing Bridging FlocculationT. Nakakubo, I. Shimoyama, The Universityof Tokyo, Japan 1166
4A2.4 Fluidic Microassembly Using PatternedSelf-Assembled Monolayers and ShapeMatchingUthara Srinivasan, Roger T. Howe, DorianLiepmann, University of California atBerkeley, USA 1170
Session 4B2 MICRO CHEMICAL SENSORSThursday, June 10,10:40 am -12:00 pm
4B2.1 Integrated Clark-type Oxygen SensorArray Using a Pulsed Plasma DepositedPTFE-Like FilmGlen W. McLaughlin, Anthony F. Flannery,Christopher W. Storment, Gregory T.A.Kovacs, Stanford University, USA 1176
4B2.2 Development of Thin-Film Liquid-JunctionAg/AgCl Reference Electrodes and TheirApplication to One-Chip Micro ChemicalSensorsH. Suzuki, H. Shiroishi, University ofTsukuba, S. Sasaki, I. Karube, The Universityof Tokyo, Japan 1180
4B2.3 Capacitive Microsensors for BiochemicalSensing Based on Porous SiliconTechnologyM.J. Schdning, M. Thust, P. Kordos, H. Liith,Forschungszentrum Julich GmbH, J.W.Schultze, Heinrich-Heine-Universitat,Germany 1184
4B2.4 A Biochemical CMOS Integrated Multi-Parameter MicrosensorF. Van Steenkiste, D. Maes, K. Baert, L.Hermans, R. Mertens, IMEC, E. Lauwers, J.Suls, G. Gielen, W. Sansen, ESAT-MICAS,Belgium, W. Gumbrecht, Ph. Arquint, K.Abraham-Fuchs, Siemens AG, Germany 1188
Session 4C2 ARRAYED ACTUATORS FORCONVEYANCEThursday, June 10,10:40 am -12:00 pm
4C2.1 Electromagnetic Micro-Parts Conveyerwith Coil-Diode ModulesHaruo Nakazawa, Yasumasa Watanabe,Osamu Morita, Masaharu Edo, MasayukiYushina, Eiichi Yonezawa, Fuji ElectricCorporate Research and Development, Ltd.,Japan II92
4C2.2 An Inverted Scratch-Drive-ActuatorsArray for Large Area Actuation of ExternalObjectsYoshio Mita, Toshihiko Oba, Makoto Mita,Gen Hashiguchi, Hiroyuki Fujita, TheUniversity of Tokyo, Japan, Patrice Minotti,Universite de Franche-Comte, France 1196
4C2.3 Realization of a Fluidic Switching Elementand its Application to a Pneumatic ActuatorSystemT. Hirata, T. Akashi, Sumitomo HeavyIndustries Ltd., Japan, O.T. Guenat. N.F. deRooij, University of Neuchatel, Switzerland
11984C2.4 A Walking Silicon Micro-Robot
Thorbjb'rn Ebefors, Johan Ulfstedt Mattsson,Edvard Kalvesten, Goran Stemme, RoyalInstitute of Technology, Sweden 1202
Session 4D2 MICROPROBES AND SURFACECHARACTERIZATIONThursday, June 10,10:40 am -12:00 pm
4D2.1 Dissipation Microscopy Based onElectronic DragT.D. Stowe, T.W. Kenny, Stanford University,D. Rugar, IBM Almaden Research Center,USA, D. Thomson, University of Manitoba,Canada 1208
4D2.2 Microscopic Four-Point ConductivityProbesP. B0ggild, C.L. Petersen, F. Grey, TechnicalUniversity of Denmark, T. Hassenkam, T.Bj0rnholm, University of Copenhagen,Denmark, I. Shiraki, S. Hasegawa, Universityof Tokyo, Japan 1212
4D2.3 Thermal Actuator Based MEMS TribologyEzekiel J.J. Kruglick, Kristofer S.J. Pister,University of California Berkeley, USA 1214
4D2.4 Anisotropically Etched SurfaceMorphology of Single-Crystal Silicon as aFunction of OrientationMitsuhiro Shikida, Kenji Tokoro, DaisukeUchikawa, Masahiro Kato, Kazuo Sato,Nagoya University, Japan 1218
Session 4A3 MULTILAYER STRUCTURES AND NEWMATERIALS
Thursday, June 10,1:40 pm - 3:20 pm
4A3.1 Combustion Tests in the 6-Wafer StaticStructure of a Micro Gas Turbine EngineAmit Mehra, Ian A. Waitz, Martin A. Schmidt,Massachusetts Institute of Technology, USA
1224
4A3.2 Interconnect Layer with AdvancedMultiple Feedthrough Metallization for anIntegrated Microphone for Hearing AidApplicationsMatthias Heschel, Peter T. Tang, Jochen F.Kuhmann, Siebe Bouwstra, TechnicalUniversity of Denmark, Kurt Rasmussen,Microtronic A/S, Denmark 1228
4A3.3 Two-Photon Three-DimensionalMicrofabrication for the Production ofMovable Micromechanism with 0.5Micrometer ResolutionShoji Maruo, Koji Ikuta, Nagoya University,Japan 1232
4A3.4 Structural and Electrical Properties ofHighly Oriented PZT Thin Films Depositedby Facing Target SputteringXin-Shan Li, Shanghai University, China,Kaoru Yamashita, Masanori Okuyama, OsakaUniversity, Tsumehisa Tanaka, YoshihikoSuzuki, Technology Research Institute ofOsaka Prefecture, Japan 1236
4A3.5 A New Mechanical CharacterizationMethod for Microactuators Applied toShape Memory FilmsKirk P. Seward, Massachusetts Institute ofTechnology, Peter Krulevitch, Harold D.Ackler, Philip B. Ramsey, LawrenceLivermore National Laboratory, USA 1240
Session 4B3 ACOUSTIC CHEMICAL SENSORS
Thursday, June 10,1:40 pm - 3:20 pm
4B3.1 One-Chip Multi-Channel Quartz CrystalMicrobalance (QCM) Fabricated By DeepRIET. Abe, M. Esashi, Tohoku University, Japan
12464B3.2 Acoustically Amplified Chemical QCM-
Sensor with Frequency and AttenuationOutputRalf Lucklum, R. Borngraeber, P. Hauptmann,Otto-von-Guericke-University, Germany 1250
4B3.3 Prediction of QCM Gas Sensor ResponsesUsing A Computational Chemistry MethodK. Nakamura, T. Nakamoto, T. Moriizumi,Tokyo Institute of Technology, Japan 1254
4B3.4 Novel Zero Temperature-Coefficient Love-Wave SensorsBernhard Jakoby, Jeroen Bastemeijer, MichaelJ. Vcllekoop, Delft University of Technology,The Netherlands 1258
4B3.5 Estimation of Components andConcentration in Mixture Solutions ofElectrolytes Using a Liquid Flow Systemwith SH-SAW SensorToshihisa Yamazaki, Jun Kondoh, YoshikazuMatsui, Showko Shiokawa, ShizuokaUniversity, Japan 1262
Session 4C3 MILLIMETER WAVE AND RELAYAPPLICATION
Thursday, June 10,1:40 pm - 3:20 pm
4C3.1 A Micromachined Cavity Resonator formm-Wave Oscillator ApplicationsChungwoo Kim, Insang Song, Cimoo Song,Sukhan Lee, Samsung Advanced Institute ofTechnology, Changyul Cheon, University ofSeoul, Youngwoo Kwon, Seoul NationalUniversity, Korea 1268
4C3.2 A Tunable Millimeter-Wave Filter UsingCoplanar Waveguide and MicromachinedVariable CapacitorsJae-Hyoung Park, Hong-Teuk Kim,Youngwoo Kwon, Yong-Kweon Kim, SeoulNational University, Korea 1272
4C3.3 A Microactuated Millimeter Wave PhaseShifterT.D. Kudrle, H.P. Neves, D.C. Rodger, N.C.MacDonald, Cornell University, USA 1276
4C3.4 Micromechanical Relay with ElectrostaticActuation and Metallic ContactsM.-AGretillat, F. Gretillat, N.F. de Rooij,University of Neuchatel, Switzerland 1280
4C3.5 Electrostatic Diamond Micro SwitchM. Adamschik, S. Ertl, P. Schmid, E. Kohn,University of Ulm, P. Gluche, A. Flbter,GFDmbH Ulm, Germany 1284
Session 4D3 ACCELERATION AND VIBRATIONSENSORS
Thursday, June 10, 1:40 pm - 3:20 pm
4D3.1 Performance Enhancement for theMicromachined Tunneling AccelerometerCheng-Hsien Liu, Aaron Barzilai, OlaleyeAjakaiye, Thomas W. Kenny, StanfordUniversity, Howard K. Rockstad, JetPropulsion Laboratory, USA 1290
4D3.2 A Low-Noise Digital Accelerometer UsingIntegrated SOI-MEMS TechnologyMark A. Lemkin, Thor N. Juneau, William A.Clark, Trey A. Roessig, Integrated MicroInstruments, Inc., Tim J. Brosnihan,University of California Berkeley, USA 1294
4D3.3 Accelerometer with Electrically TunableSpectral SensitivityE. Cretu, M. Bartek, R.F. Wolffenbuttel, DelftUniversity of Technology, The Netherlands
12984D3.4 A Silicon Bulk Micromachined Crash
Detection Sensor with SimultaneousAngular and Linear SensitivityJ. Mizuno, K. Nottmeyer, Y. Kanai, O.Berberig, T. Kobayashi, ZEXEL Corporation,M. Esashi, Tohoku University, Japan 1302
4D3.5 Fiber-Optic Vibration Sensor Based onFrequency Modulation of Light-ExcitedOscillatorsJ. David Zook, William R. Herb, C.J. Bassett,Terry Stark, Jeff N. Schoess, Mark L. Wilson,Honeywell Technology Center, USA 1306
Session 4A4 BONDING TECHNOLOGYThursday, June 10, 3:40 pm - 5:40 pm
4A4.1 Localized CVD Bonding for MEMSPackagingG.H. He, Liwei Lin, Y.T. Cheng, TheUniversity of Michigan, USA 1312
4A4.2 A New Fabrication Method for Low-Pressure Package with Glass-Silicon-GlassStructure and Its StabilityTetsuzo Hara, Shinji Kobayashi, KunikiOhwada, Murata Mfg. Co., Ltd., Japan 1316
4A4.3 Anodic Bonding of Evaporated GlassStructured with Lift-Off Technology forHermetically Sealing
S. Sassen, W. Kupke, K. Bauer,DaimlerChrysler AG, Germany 1320
4A4.4 A Novel Technological Process for Glass-to-Glass Anodic BondingA. Berthold, P.M. Sarro, M.J. Vellekoop, DelftUniversity of Technology, The Netherlands, L.Nicola, Universita degli Studi di Trento, Italy
13244A4.5 Integration of Dissimilar Materials by
Room-Temperature-Ture Wafer BondingUsing Ar Beam Surface ActivationHideki Takagi, Ryutaro Maeda, MechanicalEngineering Laboratory, AIST, Naoe Hosoda,Tadatomo Suga, The University of Tokyo,Japan 1328
4A4.6 Condition Optimization, ReliabilityEvaluation of SiO,-SiO, HF Bonding and itsApplication for UV Detection Micro FlowCellH. Nakanishi, T. Nishimoto, M. Kanai,Shimadzu Corporation, T. Saitoh, K.Nakamura, S. Shoji, Waseda University, Japan
1332
Session 4B4 ENZYME SENSORS ANDIMMUNOSENSORS
Thursday, June 10, 3:40 pm - 5:40 pm
4B4.1 Micro-Fluidic Chips for HeterogeneousAssays in Clinical DiagnosticsK. Fluri, E. Verpoorte, N.F. de Rooij,University of Neuchatel, Switzerland 1338
4B4.2 Dehydration Sensor: Estimation of BloodOsmosis by Biosensor FusionY. Ikariyama, O. Takei, S. Yamauchi, S.Toyama, National Rehabilitation Center forthe Disabled, Japan 1340
4B4.3 Ag-SiO2-Au Thin Film for the Stabilizationof the Signal of SPR-Based ImmunosensorShigeru Toyama, Yoshihito Ikariyama,National Rehabilitation Center for theDisabled, Narumasa Doumae, Ron Usami,Kouki Horikoshi, Toyo University, Japan 1344
4B4.4 Genetically Engineered Cell-BasedBiosensors for Specific Agent ClassificationB.D. DeBusschere, A.M. Aravanis, A.J.Chruscinski, K.R. Hedgepath, D.A.Borkholder, B.K. Kobilka, G.T.A. Kovacs,Stanford University, USA 1348
4B4.5 The Study of Glucose Sensor Based onMicrodialysis Technique for ContinuousGlucose Monitoring SystemYe Xuesong, Zhejiang University, China 1352
4B4.6 Electrochemical Sensor Based on Enzyme-Induced Degradation of Thin PolymerFilmsClaire Sumner, Andrea Sabot, Steffi Krause,University of Sheffield, UK 1356
Session 4C4 MICROACTUATORSThursday, June 10, 3:40 pm - 5:40 pm
4C4.1 Resonator Integrated Cantilever forScanning Force MicroscopeDong-Weon Lee, Takahito Ono, MasayoshiEsashi, Tohoku University, Japan 1360
4C4.2 Simple, High Actuation Power, ThermallyActivated Paraffin MicroactuatorE.T. Carlen, C.H. Mastrangelo, University ofMichigan, USA 1364
4C4.3 Fabrication of a Micro SyringeS.W. Lee, W.Y. Sim, S.S. Yang, AjouUniversity, Korea 1368
4C4.4 Multi Degrees of Freedom Electro-ThermalMicroactuatorsJ. Jonsmann, O. Sigmund, S. Bouwstra,Technical University of Denmark, Denmark
I3724C4.5 Fabrication and Measurement of an
Improved Micro Electrostatic TorsionalActuatorJerwei Hsieh, Weileun Fang, National TsingHua University, Taiwan 1376
4C4.6 A New Visualizing Technique for Micro-Channels Using Micronsized Focal Spot ofX-RaysourceNaruo Watanabe, Akira Koide, YoshihiroNagaoka, Ryo Miyake, Takao Terayama,Hitachi Ltd., Japan 1380
Session 4D4 OSCILLATORS, FILTERS ANDRESONATORS
Thursday, June 10, 3:40 pm - 5:40 pm
4D4.1 A Micromachine-Based Low Phase-NoiseGHz Voltage-Controlled Oscillator forWireless CommunicationsDarrin J. Young, Bernhard E. Boscr,University of California at Berkeley, Joo L.Tham, Conexant Systems, USA 1386
4D4.2 Anneal-Activated, Tunable, 68MHzMicromechanical FiltersArk-Chew Wong, John R. Clark, Clark T.-C.Nguyen, University of Michigan, USA 1390
4D4.3 Optimization of Characteristics of anAcoustic Absorber Using an Array of HighAspect Ratio Micro HoleSatoshi Konishi, Mitsuhiro Yoda, Yuji Hikida,Ritsumeikan University, Japan 1394
4D4.4 Synchronisation and Collective Behaviourin a Network of Non-Linear Resonators: ANew Approach to Redundant SensingJan Bienstman, Joos Vandewalle, RobertPuers, Katholieke Universiteit Leuven,Belgium 1398
4D4.5 Novel Burst Technology for Closed LoopDetection and Excitation of ResonantSilicon SensorsThierry Corman, Peter Enoksson, Kjell Noren,Goran Stemme, Royal Institute of Technology,Sweden 1402
4D4.6 A Mechanically Controlled OscillatorW. Geiger, H. Sandmaier, W. Lang, HSG-IMIT,Germany 1406
POSTER SESSION 2
(Posters will be on display Wednesday andThursday)
Session 3P1 MATERIALS AND FABRICATIONTECHNOLOGY
Wednesday, June 9, 1:40 pm- 3:20 pm
- Processes and Devices -
3P1.1
3P1.2
3P1.3
3P1.4
3P1.5
3P1.6
3P1.7
3P1.8
3P1.9
3P1.10
An Experimental Study of MicrofabricatedNickel Spark PlugsDan S. Kercher, Pahnit Seriburi, Mark G.Allen. Georgia Institute of Technology, USA
1412The Effects of the Anodic Bonding on theElectrical Characteristics of the p-nJunctionsA. Cozrna Lapadatu, H. Jakobsen, SensoNorasa, Norway, R. Puers, Katholieke UniversiteitLeuven, Belgium 1416Laterally Driven Accelerometer Fabricatedin Single Crystalline SiliconO. Ludtke, V. Biefeld, A. Buhrdorf, J. Binder,Universiteit of Bremen, Germany 1420Low Cost Post-CMOS Integration ofElectroplated Microstructures for InertialSensingM. Wycisk, T. Toennesen, J. Binder,University of Bremen, S. Michaelis, H.-J.Timme, Siemens Semiconductors, Germany
1424UV-LIGA Process for High Aspect RatioStructure Using Stress Barrier and C-shaped Etch HoleHyun-Kee Chang, Yong-Kweon Kim, SeoulNational University, Korea 1428Polymer High Aspect Ratio StructuresFabricated with Hot EmbossingHolger Becker, Ulf Heim, JenoptikMikrotechnik, Germany 1432Surface Energy as a Function of Self-Biasin Oxygen Plasma Bonded Silicon WafersDonato Pasquariello, Mikael Lindeberg,Christer Hedlund, Klas Hjort, UppsalaUniversity, Sweden 1436Nickel Wire Bonding for High-TemperaturePackaging of SiC DevicesRavi K. Burla, A. Azzam Yasseen, ChristianA. Zorman, Mehran Mehregany, Case WesternResearve University, USA 1440Wafer Level Packaging of Silicon PressureSensorsH. Krassow, F. Campabadal, E. Lora-Tamayo,CNM-CSIC, Spain 1444Fabrication of High FrequencyMicroscanners by Using Low Temperature
Silicon Wafer BondingK. Hiller, M. Wiemer, R. Hahn, C. Kaufmann,S. Kurth, K. Kehr, T. Gessner, W. Dotzel, A.Milekhin, M. Fredrich, D. Zahn, TechnicalUniversity of Chemnitz, Germany 1448
3P1.11 LIGA Spinnerets for MicrofiberY. Cheng, B.-Y. Shew, C.-H. Lin, T.-P. Hung,Synchrotron Radiation Research Center, G.-J.Hwang, Tsing Hua University, C.-L. Kuo, S.-C. Tseng, D.-S. Lee, G.-L. Chang, YunlinUniversity of Science and Technology, Taiwan
1452
3P1.12 Thick Buried Oxide in Silicon (TBOS): AnIntegrated Fabrication Technology forMulti-Stack Wafer Bonded MEMSProcessesR. Ghodssi, L.G. Frechette, S.F. Nagle, X.Zhang, A.A. Ayon, S.D. Senturia, M.A.Schmidt, Massachusetts Institute ofTechnology, USA 1456
3P1.13 DRIE-Processed Silicon Carriers forVertical Optical AlignmentJohan Holm, Henrik Ahlfeldt, MagnusSvensson, Christian Vieider, IndustrialMicroelectronics Center, Sweden 1460
3P1.14 Fabrication and Characterization of aNanometer-Scale Si Wire Structure forSensor ApplicationsH. Fujii, S. Kanemaru, T. Matsukawa, J. Itoh,Kobe Steel Ltd., Japan 1464
3P1.15 Assembly of Micro Optical ComponentsUsing Magnetic ActuationYong Yi, Chang Liu, University of Illinois,USA 1466
3P1.16 Low-Temperature Anodic Bonding toSilicon NitrideS. Weichel, R. de Reus, S. Bouiadat, PA.Rasmussen, O. Hansen, Technical Universityof Denmark, K. Birkelund, H. Dirac, DanfossA/S, Denmark 1470
3P1.17 Rapid Prototyping System Using a DigitalMicromirror DeviceK. Takahashi, J. Setoyama, SaitamaUniversity, Japan 1474
3P1.18 Batch Transfer Assembly of Micro-Components Onto Surface and SOI MEMSMichel M. Maharbiz, Roger T. Howe,Kristofer S.J. Pister, University of Californiaat Berkeley, USA 1478
3P1.19 VHARM: Sub-Micrometer ElectrostaticMEMSJ. Mark Noworolski, University of Californiaat Berkeley, Michael Judy, Analog Devices,Inc., USA 1482
3P1.20 Suspended Carbon Bridges as OnchipTunable ResistorsTing-Yuan Wang, Amit Lai, University ofWisconsin, USA 1486
3P1.21 A Micromachined Silicon SubmountPackage for Vertical Emission of EdgeEmitting Laser Diodes
Jin-Shown Shie, Shi-Han Yu, National ChiaoTung University, Taiwan 1490
3P1.22 Packaging and Calibration of aPiezoresistive Pressure Sensor for HighAccuracy at Low Temperatures andPressuresJ.K. Reynolds, T.W. Kenny, StanfordUniversity, D.C. Catling, NASA Ames, R.C.Blue, Jet Propulsion Lab., N. Maluf, LucasNovaSensor, USA 1494
Session 3P2 MECHANICAL SENSORSWednesday, June 9, 1:40 pm- 3:20 pm
- Ultrasonic and Others -
3P2.1 Micromachined Capacitive UltrasonicImmersion Tranducer ArrayX.C. Jin, S. Calmes, C.H. Cheng, F.L.Degertekin, B.T. Khuri-Yakub, StanfordUniversity, USA 1500
3P2.2 Transient Sub-nm-DisplacementInvestigations of MicromachinedUltrasonic Transducer Arrays for HighFrequenciesLutz. Thieme, Holger DaBler, WolfgangManthey, Chemnitz University of Technology,Germany 1504
3P2.3 A Flat Type Touch Probe Sensor Using PZTThin Film VibratorT. Kanda, T. Morita, M.K. Kurosawa, T.Higuchi, The University of Tokyo, Japan 1508
3P2.4 Lamb Wave Sensor with Tensile ZnO forLiquid Property SensingS. Roller, O. Brand, H. Baltes, ETH Zurich,B. Jakoby, P.M. Sarro, M. Vellekoop, TUDelft, Switzerland 1512
3P2.5 "Serial Flow®": The Connectable FlowSensor for Array Sensing - A PracticalSolution to Cost-Sensitive RealApplications -Takeshi Abe, Tokyo Gas Co., Ltd., KazuyoshiSugimoto, Kanomax Research Institute, Japan
1516
- Accelerometer -
3P2.6 Laterally Capacity Sensed AccelerometerFabricated with Anodic Bonding and HighAspect Ratio EtchingZhixiong Xiao, Guoying Wu, DachengZhang, Yilong Hao, Zhihong Li, PekingUniversity, Min Chen, Changde Zhao,Tsinghua University, China 1518
3P2.7 A High Aspect Ratio AccelerometerFabricated Using Anodic Bonding,Dissolved Wafer, and Deep RIE ProcessesS. Cunningham, S. Tatic-Lucic, J. Carper, J.Lindsey, L. Spangler, Ford Microelectronics,Inc., USA 1522
3P2.8 Micromachined Shutter and Low-voltageElectronics for Optical Displacement/Acceleration Sensing
Franck Chollet, Tang XiaoSong, Liu AiQun,Ha YaJun, Li Ming Fu, National University ofSingapore, Singapore 1526
3P2.9 Piezoresistive Micro Accelerometer forHigh G Shock Using Air Damping EffectT. Mineta, Y. Watanabe, S. Kobayashi,Yamagata Research Institute of Technology,K. Shibata, Yamagata Kyowa ElectronicInstruments Co., Ltd., M. Esashi, TohokuUniversity, Japan 1530
3P2.10 Electronic Tunnelling Accelerometer forHigh ResolutionT. Strobelt, H.J. FaiBt. H. Sandmaier, W.Lang, HSG-IMIT, O. Nagler, F. Kozlowski,Fraunhofer Institute for Solid StateTechnology, Germany 1534
3P2.11 Integrated Resonant Accelerometer Basedon Rigidity ChangeOsamu Tabata, Takeshi Yamamoto,Ritsumeikan University, Japan, Ashwan A.Seshia, Roger T. Howe, University ofCalifornia at Berkeley, USA 1538
3P2.12 Three-Axis Earthquake Sensor UsingDirect Bonding of LiNbO, CrystalsH. Tajika, K. Nishihara, K. Nomura,Matsushita Electric Components, T. Ohtsuchi,Matsushita Electric Industrial Co., Ltd., M.Touji, Matsushita Nittoh Electric, Japan 1542
3P2.13 A Novel Resonant Accelerometer ; VariableElectrostatic Stiffness TypeByeung-Leul Lee, Chang-Hoon Oh, Kuk-jinChun, Seoul National University, Yong-SooOh, Samsung Advanced Institute ofTechnology, Korea 1546
3P2.14 Acceleration Switch with Extended HoldingTime Using the Squeeze Film EffectTadao Matsunaga, Akebono Brake IndustryCo., Ltd., Kazuyuki Minami, MasayoshiEsashi, Tohoku University, Japan 1550
3P2.15 A Two-DOF Inclination Sensor Based on aShellfish's Balancing OrganR. Nagato, H. Hosaka, K. Itao, The Universityof Tokyo, K. Sakamoto, HOYAComp., Japan
15543P2.16 Electrostatically Levitated Micro Motor for
Inertia Measurement SystemKeisuke Fukatsu, Takao Murakoshi, TokimecInc., Masayoshi Esashi, Tohoku University,Japan 1558
- Gyroscopes -
3P2.17 A New Miniaturized Tunneling-Based Gyrofor Inertial Measurement ApplicationsR.L. Kubena, D.J. Vickers-Kirby, R.J. Joyce,F.P. Stratton, D.T. Chang, HRL Laboratories,LLC, USA 1562
3P2.18 Direct Measurement of MechanicalCoupling in Microgyroscope Using a Two-Dimentional Laser Displacement MeterHiroshi Kawai, Masaya Tamura, KunikiOhwada, Murata Manufacturing Co., Ltd.,Japan 1566
3P2.19
3P2.20
3P2.21
3P2.22
3P2.23
3P2.24
3P2.25
3P2.26
3P2.27
3P2.28
(iCORS - a Bulk MicromachinedGyroscope Based on Coupled ResonatorsU. Breng. W. Gutmann, P. Leinfelder, B.Ryrko, S. Zimmermann, LITEF GmbH, D.Billep, T. GeBner, K. Hiller, M. Wiemer,Chemnitz University of Technology, Germany
1570Micromechanical LIGA-GyroscopeK. Schumacher, O. Kromer, U. Wallrabe, J.Mohr, V. Saile, Forschungszcntrum KarlsruheGmbH, Germany 1574The Silicon Angular Rate Sensor SystemMARS-RRW. Geigcr, J. Merz, T. Fischer, B. Folkmcr, H.Sandmaier, W. Lang, HSG-IMIT, Germany
1578A Novel Micromachined Vibrating Rate-Gyroscope with Optical Sensing andElectrostatic ActuationO. Bochobza-Degani, E. Socher, Y.Ncmirovsky, Technion, D.J. Sc, i, RAFAEL,Israel 1582Parallel Beam GyroscopeHiroshi Sato, Toshio Fukuda, Fumihito Arai,Nagoya University, Kouichi Itoigawa, TokaiRika Co., Ltd., Japan 1586High Aspect Ratio Ring GyroscopesFabricated in [100] Silicon on Insulator(SOI) MaterialM.E. McNie, Defence Evaluation & ResearchAgency, J.S. Burdess, A.J. Harris, J. Hedley,M. Young, University of Newcastle, UK 1590A Bulk Micromachined Vibratory LateralGyroscope Fabricated with Wafer Bondingand Deep Trench EtchingZhihong Li, Zhenchuan Yang, Zhixiong Xiao,Yilong Hao, Ting Li, Guoying Wu, YangyuanWang, Peking University, China 1594Experimental Investigation of FlatlySupported Vibratory Gyro-Sensor UsingQuartz Crystal Trident-Type Tuning ForkResonatorNorihiko Shiratori, Yoshiro Tomikawa,Yamagata University, Kazumasa Ohnishi,Alps Electric Co., Ltd., Japan 1598Miniature Bi-Axial Gyro-Sensor UsingDisk-Type ResonatorNorihiko Shiratori, Yoshiro Tomikawa,Yamagata University, Minoru Hatakeyama,Shigeya Okada, MIYOTACo., Ltd., Japan ... 1602Silicon Vibrating Gyroscopes with a LargeReference Motion Using a ParallelogramAmplifierA. Sayah, Y. Ansel, P. Renaud, M.A.M. Gijs,Swiss Federal Institute of Technology (EPFL),Switzerland 1606
- Pressure and Force -
3P2.29 A New High Temperature Pressure SensorBased on a Thermal Read-out PrincipleU.A. Dauderstadt, CM.A. Ashruf, P.J. French,
Delft University of Technology, TheNetherlands 1610
3P2.30 Linearisation of the Response of a SurfaceMicromachined CMOS FET PressureSensor Using Membrane TouchdownEamon Hynes, Mike O'Neill, DonalMcAuliffe, Analog Devices, Helen Berney,William A. Lane, Ger Kelly, Martin Hill,National Microelectronics Research Center,Ireland 1614
3P2.31 Compensated Differential Pressure SensorRealised by Triple-Stack Fusion BondingST. Moe, K. Schj0lberg-Henriksen, D.T.Wang, E. Lund, J. Nysa;ther, L. Furuberg, T.Fallet, R.W. Bernstein, SINTEF Electronicsand Cybernetics, Norway 1618
3P2.32 Probe-Type Microforce Sensor forMicroactuators and CalibrationYasushi Onoe, Osayasu Kikuchi, YokogawaElectric Corporation, Japan 1620
3P2.33 A New Force Sensor Utilizing Combinationof Three-Axis Stress ComponentsKazuya Sawa, Yasutada Tanimoto, ToshiyukiToriyama, Susumu Sugiyama, RitsumeikanUniversity, Japan 1624
3P2.34 Piezoresistive Cantilevers withFemtonewton Force ResolutionJ. A. Harley, T. D. Stowe, T. W. Kenny,Stanford University, USA 1628
Session 3P3 CHEMICAL SENSORSWednesday, June 9, 1:40 pm- 3:20 pm
3P3.1 Techniques to Control Sensitivity andSelectivity of Multichannel Taste SensorUsing Lipid MembranesHidekazu Ikezaki, Yoshikazu Kobayashi,Rieko Toukubo, Yoshinobu Naito, AkiraTaniguchi, Anritsu Corporation, Kiyoshi Toko,Kyushu University, Japan 1634
3P3.2 Detection of Suppression of Bitterness byPhospholipids Using Electronic TongueSou Takagi, Kiyoshi Toko, Kyushu University,Koichi Wada, Toshimitsu Ohki, BoehringerIngelheim Co., Japan 1638
3P3.3 Odor Sensing System UsingPreconcentrator with VariableTemperatureY. Isaka, T. Nakamoto, T. Moriizumi, TokyoInstitute of Technology, Japan, J.W. Grate,Pacific Northwest National Laboratories, USA
16423P3.4 Development of a Portable Dry Rot
Detector - The H2ENJ.V. Hatfield, A.R. Daniels, D. Snowden, K.C.Persaud, P.A. Payne, UMIST, UK 1646
3P3.5 Feature Extraction of the Multi Gas SensorResponses Using Genetic AlgorithmTatsuhiko Nishikawa, Kanazawa MunicipalSenior High School of Technology, TakahiroHayashi, Hidetaka Nambo, Haruhiko Kimura,Kanazawa University, Takashi Oyabu,
Kanazawa University of Economics, Japan1650
3P3.6 Aggregation of Sensory Input forBiologically Inspired Gas SensingDenise Wilson, Ronald Kalim, University ofWashington, USA 1652
3P3.7 A Novel Micro-Electronic MechanicalSystem for Anti-Fatigue of Electronic NoseLi Rong, Wang Xiaoxiang, Wang Ping,Zhejiang University, China 1656
3P3.8 Detection of Substances Using SurfacePlasmon Resonance with Lipid LBMembrane Including ProteinsToshiaki Adachi, Kiyoshi Toko, KyushuUniversity, Japan 1660
3P3.9 A New Type LiCI Dew Point HygrometerProbe Fabricated with a Composite ofPorous Polymer and the SaltY. Sakai, M. Matsuguchi, H. Makihata, EhimeUniversity, S. Obara, T. Ogura, T. Kuroiwa,Yamatake Co. Ltd., Japan 1664
3P3.10 Comparative Study on Thin-Film andThick-Film MnWO4 Humidity SensorsWenmin Qu, Wojtek Wlodarski, YongxiangLi, RMIT University, Australia, Jorg-UweMeyer, Patrick Keller, Fraunhofer-Institute forBiomedical Engineering, Germany 1668
3P3.11 Highly-Durable Humidity SensorFabricated on a Sapphire SubstrateIsao Nakajima, Yoshiaki Mizusawa, TatsuyaYokoyama, Kazuhiro Hara, Tokyo DenkiUniversity, Japan, Supratic Chakraborty,University of Kalyani, India 1672
3P3.12 A Robust High-Speed Capacitive HumiditySensor Integrated on a Polysilicon HeaterUksong Kang, Kensall D. Wise, TheUniversity of Michigan, USA 1674
3P3.13 Hydrogen Sensing Properties of SnO2
Varistors Loaded with SiO2 by SurfaceChemical Modification withDiethoxydimethylsilaneT. Hyodo, Y. Baba, Y. Shimizu, M. Egashira,Nagasaki University, K. Wada, SaseboNational College of Technology, Japan 1678
3P3.14 Gas-Sensor Devices Based on PotentialControl: State of the Art and TrendsJ. Kappler, W. Gopel, University of Tubingen,Germany 1682
3P3.15 Improvement of Gas Sensing Properties ofMoO3 Thin Films Using Ti-Overlayers forthe Application in NH3 Gas SensorsC Imawan, F. Solzbacher, H. Steffes, E.Obermeier, Technical University Berlin,Germany 1686
3P3.16 Nanocrystalline TiO2 Thin Films Preparedby the Sol-Gel Process for Alcohol SensingG. Sberveglieri, E. Comini, G. Faglia,University of Brescia, Italy, M.Z. Atashbar,Y.Li, W. Wlodarski, M.K. Ghantasala, RMITUniversity, Australia 1690
3P3.17 Toward the Realization of Intelligent GasSensing System Utilizing Nonlinear
Dynamic ResponseK. Kato, Y. Kato, K. Takamatsu, T. Udaka, T.Nakahara, Y. Matsuura, Figaro EngineeringInc., K. Yoshikawa, Kyoto University, Japan
, 16943P3.18 Amperometric CO2 Sensor Based on
Sodium Ion Conductor (NASICON)Kengo Shimanoe, Yoji Teramoto, NorioMiura, Noboru Yamazoe, Kyushu University,Japan 1698
3P3.19 Improvement on Solid-Electrolyte CO,Sensors by Means of Designing anAppropriate Operating SystemKaoru Ogino, Yazaki Meter Company Ltd.,Hozumi Futata, Yazaki Company Ltd., Japan
17003P3.20 A CO2 Sensor Based on a Ag4RbyAg2CO,
Cell Operable at Room TemperatureI. Goto, Y. Eguchi, K. Yoshida, T. Ishihara, Y.Takita, T. Takeuchi, Oita University, Japan ... 1702
3P3.21 Solid Electrolyte CO2 Sensor UsingPerovskite-type Oxide ElectrodeYouuichi Shimizu, Nami Yamashita, KyushuInstitute of Technology, Japan 1704
Session 3P4 BIOSENSORS AND MICROSYSTEMS
Ikuo Satoh, Kanagawa Institute ofTechnology, Japan 1728
3P4.8 Chemical Cross Talk in Flow-typeIntegrated Enzyme SensorsM. Suzuki, H. Akaguma, Kyushu Institute ofTechnology, Japan 1732
3P4.9 A FET-type Glucose Sensor with FastResponse and High SensitivityCharacteristicsChae-Hyang Lee, Young-Chul Lee, Byung-Woog Cho, Byung-Ki Sohn, KyungpookNational University, Hwa-Il Seo, KoreaUniversity of Technology & Education, Korea
17343P4.10 The Responses of A Re-Usable Enzymatic
Biosensor to Several Organophosphorousand Carbamate PesticidesS. Okazaki, H. Nakagawa, S. Asakura,Yokohama National University, Japan ...
3P4.11 Lead Ion-selective Membrane ElectrodeBased on l,10-Dibenzyl-l*|0|liaza-18-Crown-6 _ rt ^W l *M. F. MtTus|\i,W. Alizadeh, S. Sahari, TarbiatIViJsiarTes University, M. Shamsipur, RaziUniversity, Iran
1738
Wednesday, June 9, 1:40 pm- 3:20 pm Session 3P5 ACTUATORS
3P4.1 A New and Flexible Covalent BindingConcept for Surface Acoustic WaveBiosensors Using Dextran as anIntermediate LayerN. Barie, M. Rapp, ForschungszentrumKarlsruhe, GmbH, Germany, H. Sigrist,Centre Suisse d'Electronique et deMicrotechnique, Switzerland 1708
3P4.2 Simultaneous Arterial-, Venous-, andSubcutaneous Metabolite Monitoring withHighly Stable BiosensorsG. Jobst, I. Moser, G.A. Urban, Albert-Ludwigs-Universitat, Germany 1712
3P4.3 Development of High Integrated Pico-literPCR DeviceH. Nagai, Y. Murakami, E. Tamiya, JapanAdvanced Institute of Science andTechnology, Japan 1714
3P4.4 Reaction Chamber for PCR Made byMicrofabrication TechnologiesSeiji Kondo, Kyoichi Kano, Etsuo Shinohara,Olympus Optical Co., Ltd., Japan 1718
3P4.5 Release of Specific DNAs from a DNA Chipby Using Photothermal DenaturationKazunori Okano, Kenji Yasuda, Hitachi, Ltd.,Shin'ichi Ishiwata, Waseda University, Japan
17223P4.6 Surface Plasmon Biosensor Based on
Surface-Bound Au ParticlesH. Takei, M. Himmelhaus, Hitachi, Ltd.,Japan 1726
3P4.7 Alkaline Phosphatase as a Sensing Elementfor Heavy Metal Ions After Long-TermStoring
Wednesday, June 9, 1:40 pm- 3:20 pm
- Novel Micro Actuators -
3P5.1 A Cylindrical Shaped Micro UltrasonicMotor Utilizing PZT Thin FilmTakeshi Morita, Minoru KuribayashiKurosawa, Toshiro Higuchi, The University ofTokyo, Japan 1744
3P5.2 Development of a New Type PiezoelectricMicromotorY. Suzuki, K. Tani, T. Sakuhara, SeikoInstruments Inc., Japan 1748
3P5.3 New Integrated Axle Fabrication forPiezoelectric Motors Based on a Rotor ClipAssembling OperationL. Dellmann, S. Gautsch, G.-A. Racine, N. F.de Rooij, University of Neuchatel,Switzerland 1752
3P5.4 Optimum Silicon Slider Design for 50 MHzSAW Linear MotorMasaya Takasaki, Minoru KuribayashiKurosawa, Toshiro Higuchi, The University ofTokyo, Japan 1756
3P5.5 Design, Fabrication and Characterizationof Piezoelectric Multi-Layer CantileverMicroactuators for the Minimum InitialDeflectionMyeong-Jin Kim, Young-Ho Cho, KoreaAdvanced Institute of Science andTechnology, Korea 1758
3P5.6 Batch Fabrication of Stacked PiezoelectricMicroactuators by Using Silicon MoldProcessS.N. Wang, J.-F. Li, M. Esashi, Tohoku
3P5.22
University, K. Wakabayashi, Olympus OpticalCo., Ltd., Japan 1762
3P5.7 Current-Controlled Bi-Directional 3P5.19Electrothermal Actuated VibromotorMinfan Pai, Norman C. Tien, CornellUniversity, USA 1764
3P5.8 SMA Microgripper with IntegratedAntagonism 3P5.20E. Just, M. Kohl, W. Pfleging,Forschungszentrum Karlsruhe GmbH,Germany, S. Miyazaki, University of Tsukuba,Japan 1768
3P5.9 Measurement of Power-Speed Product ofElectrostatic ActuatorsL. Castaner, A. Rodriguez, J. Pons, Universitat 3P5.21Politecnica de Catalunya, Spain, S.D.Senturia, Massachusetts Institute ofTechnology, USA 1772
- Micro Fluidic Devices -
3P5.10 A Thermopneumatic PeristalticMicropumpCharles Grosjean, Yu-Chong Tai, Caltech,USA 1776
3P5.11 Fabrication of a ThermopneumaticMicropump with a Corrugated p+ 3P5.23DiaphragmO.C. Jeong, S.S. Yang, Ajou University, Korea
17803P5.12 Ejection Characteristics of Micromachined
Acoustic-Wave Liquid Ejector 3P5.24He Wang, Eun Sok Kim, University of Hawaiiat Manoa, USA 1784
3P5.13 A Micromachined Helmholtz Resonator forGeneration of Microjet Flows 3P5.25Babak Amir Parviz, Luis P. Bernal, KhalilNajafi, University of Michigan, USA 1788
3P5.14 Electrolytic and Thermal BubbleGeneration Using AC Inductive PoweringBo K. Choi, Min Ma, Christopher White, 3P5.26Chang Liu, University of Illinois at Urbana-Campaign, USA 1792
3P5.15 The "Spring Valve" Mechanical CheckValve for In-Plane Fluid ControlJohn D. Evans, Dorian Liepmann, Universityof California, Berkeley, USA 1796 3P5.27
3P5.16 Design, Fabrication, and Demonstration ofa Vaporizing Liquid Attitude ControlMicrothrusterA.P. Wallace, E.V. Mukerjee, K. Yan, R.L.Smith, S.D. Collins, University of California, 3P5.28Davis, USA 1800
3P5.17 A Silicon Microvalve for the ProportionalControl of FluidsKirt R. Williams, Nadim I. Maluf, E. NelsonFuller, Richard J. Barron, Dominik P. Jaeggi,Bert P. van Drieenhuizen, Lucas Nova Sensor,USA 1804 3P5.29
3P5.18 Thin Film Shape Memory Microvalves withAdjustable Operation TemperatureM. Kohl, D. Dittmann, E. Quandt, B. Winzek,
Forschungszentrum Karlsruhe GmbH,Germany 1808A New Magnetically Actuated Microvalvefor Liquid and Gas Control ApplicationsDaniel J. Sadler, Kwang W. Oh, Chong H.Ahn, Shekhar Bhansali, H.ThurmanHenderson, University of Cincinnati, USA ... 1812Characterization and Optimization ofMono-Crystalline In-Plane OperatingCheck ValvesR.E. Oosterbroek, J.W. Berenschot, S.Schlautmann, T.S.J. Lammerink, G.J.M.Krijnen, M.C Elwenspoek, A. van den Berg,University of Twente, The Netherlands 1816MEMS Micro-Valve for Space ApplicationsI. Chakraborty, W.C. Tang, D.P. Bame, T.K.Tang, Jet Propulsion Laboratory. USA 1820
- Micro Actuators Applications -
Third Harmonic Double-Ended TuningFork ResonatorDubravka Bilic, Roger T. Howe, University ofCalifornia at Berkeley, William A. Clark, TreyA. Roessig, Integrated Micro Instruments,USA 1824Drive Amplitude Dependence ofMicromechanical Resonator SeriesMotional ResistanceJun Cao, Clark T. -C. Nguyen, University ofMichigan, USA 1826Innovative Micromachined MicrowaveSwitch with Very Low Insertion LossChienliu Chang, Peizen Chang, NationalTaiwan University, Taiwan 1830Low Threshold PolysiliconMicromechanical SwitchesM.E. McNie, K.M. Branson, D.O. King,A.R.D. Jones, Defence Evaluation & ResearchAgency, UK 1834Monolithic Piezo-Electric Actuator forHead PositioningS. Kondo, S. Yoshimura, K. Yaguchi, Y.Miyata, J. Numazawa, NHK Science &Technical Research Laboratories, M. Suzuki,M. Esashi, Tohoku University, Japan 1838Thermal Engineering of Doped Single-Crystal Silicon Microcantilevers for HighDensity Data StorageM. Asheghi, W.P. King, B.W. Chui, T.W. Kenny,K.E. Goodson, Stanford University, USA 1840Development of Double Scanning ProbeMicroscope Combined with Monolithic 2DNanoscannerBeomjoon Kim, Moussa Hoummady, Jean-Michel Friedt, Christian Bonjour, Institut desMicrotechniques de Franche-Comte, France
1844Active and Self-Detecting Cantilever withOn-Chip CMOS Electronics for ScanningForce MicroscopyTerunobu Akiyama, Urs Staufer, Nico. F. de
3P5.30
3P5.31
Rooij, University of Neuchatel, Dirk Lange,Christoph Hagleitner, Oliver Brand, HenryBaltes, ETH Zurich, Andreas Tonin,University of Basel, Switzerland 1848AFM Probe with Piezoresistive Read-outand Highly Symmetrical WheatstoneBridge ArrangementJ. Thaysen, A. Boisen, O. Hansen, S.Bouwstra, Technical University of Denmark,Denmark 1852Trajectory Safety Subsystem on a Chip(TSSC)Marc A. Polosky. David W. Plummer, Ernest J.Garcia, Charles Sullivan, Scott Holswade, DaleKemper, Sandia National Laboratories, USA
Mitsuhiro Shikida, Nagoya University, Japan
1856
LATE NEWS
LN.1
LN.2
LN.3
LN.4
LN.5
LN.6
LN.7
Measurement and Modeling of Thermal-Electrical Runaway in Silicon CantileversBenjamin W. Chui, Mehdi Asheghi, Y.Sungtaek Ju, Kenneth E. Goodson, ThomasW. Kenny, Stanford University, H. JohnMamin, IBM Almaden Research Center, USA
Simulations of the Impact of Three-Dimensional Substrate Surfaces on BoronDepletionRobert Rumpf, Kenichiro Suzuki, NECCorporation, JapanPeroxidase-Mimic Activity of Plasma-Polymerized Phthalocyanine DerivativesShigeru Kurosawa, National Institute ofMaterials & Chemical Research, HidenobuAizawa, Jun Miyake, National Institute forAdvanced Interdisciplinary Research, NaokiKamo, Hokkaido University, MinoruYoshimoto, Kagoshima University, JapanChange in Etching Rate and SurfaceMorphology of (110) Silicon; Effects ofDissolved Silicon Concentration in KOHEtchantMitsuhiro Shikida, Kazuo Sato, Masahiro Kato,Daisuke Uchikawa, Nagoya University, Japan
1862
1864
1866
1868Observation of Facet Growth on (110)Plane during an Anisotropic KOH EtchingMitsuhiro Shikida, Kazuo Sato, Masahiro Kato,Daisuke Uchikawa, Nagoya University, Japan
Highly-Sensitive High Aspect RatioAccelerometer with CMOS PrecisionCapacitive Interface CircuitA. Burstein, J. DeNatale, Rockwell ScienceCenter, Thousand Oaks, W.J. Kaiser,University of California, Los Angeles, USA
1870
1872Fingerprint Sensor with an ArrayedMicroheater ElementsKazuo Sato, Tadashi Kadowaki, Han Jisone,
1874
1876
1878
1880
LN.8 Contactless Actuation of Bending andTorsional Vibrations for 2D-Optical-Scanner ApplicationA. Gamier, T. Bourouina, H. Fujita, THiramoto, E. Orsier, University of Tokyo,Japan, J.-C. Peuzin, Laboratoire deMagnetisme Louis Necl CNRS, France
LN.9 Olfactory Video Camera: Gas/Odor FlowVisualization System Using an Array ofMinitualized QCM Gas SensorsT. Nakamoto, T. Tokuhiro, H. Ishida, T.Moriizumi, Tokyo Institute of Technology,Japan
LN.10 Smoke Sensor Using Mass ControlledLayer-by-Layer Self-Assembly ofPolyelectrolytes FilmsMasayoshi Yamada, Seimei Sha Shiratori,Keio University, Japan
LN.11 A Low-Cost, Micromachined, IntegratedCMOS SpectrometerGaylin M. Yee, Nadim I. Maluf, Gregory T.A.Kovacs, Stanford University, USA 1882
LN.12 Nanoscaled Interdigitated Gold Electrodesfor Impedimetric ImmunosensingW. Laurcyn, F. Frederix, P. Van Gerwen,Inleruniversity Microelectronics Center(1MEC), G. Maes, KULeuvcn, Belgium 1884
LN.13 Two-Dimensional Cantilever Arrays withIntegrated Through-Wafer InterconnectsE.M. Chow, H.T. Soh, H.C. Lee, J.D. Adams,S.C. Minne, G. Yaralioglu, A. Atalar, C.F.Quate, T.W. Kenny, Stanford University, USA
1886LN.14 Reusable Microfluidic Coupler with PDMS
GasketN.J. Mourlas, D. Jaeggi, N.I. Maluf, G.T.A.Kovacs, Stanford University, USA 1888
LN.15 Mesoscopic Sampler Based on 3D Array ofElectrostatically Activated DiaphragmsCleopatra Cabuz, Eugen I. Cabuz, William R.Herb, Tom Rolfer, David Zook, HoneywellInc., USA 1890
LN.16 Electroactive Polymer (EAP) Actuation ofMechanisms and Robotic DevicesY. Bar-Cohen, S. Leary, Jet PropulsionLaboratory, J.O. Harrison, J. Smith, NASALaRCUSA 1892
LN.17 Thin Tube-Type Bending Actuator UsingPlanar S-Shaped Shape Memory AlloySpringsAn-Su Lim, Seung-Ki Lee, DankookUniversity, Korea 1894