transient electronics 1)motivation, perspective 2 ... rogers ectc 2019.pdf · an alternative future...
TRANSCRIPT
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John A. Rogers – Northwestern UniversityDepartments of Materials Science and Engineering,
Electrical and Computer Engineering, Chemistry,Biomedical Engineering, Mechanical Engineering,
Feinberg School of Medicine – Neurological Surgery
Louis Simpson and Kimberly Querrey ProfessorSQI and Center for Biointegrated Electronics
Transient Electronics
1) Motivation, Perspective
2) Materials, Device Designs, Manufacturing
3) Ecoresorbable RFID, Electronic Medicines
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The Dominant Future for Electronics: Smaller, Faster, Cheaper
Industrial Personal
Past Present Future
Smaller, FasterCheaper
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An Alternative Future for Electronics: Bio / Eco Resorbable, Transient
Bio / Eco ResorbableIndustrial Personal
Past Present Future
Science 337, 1640 (2012).
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Transient Electronics – electronic systems that dissolve,
resorb or otherwise physically disappear at
programmed rates or at triggered times
Definition – Transient Electronics
Science 337, 1640 (2012).
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1) Zero/Reduced E-Waste Consumer Electronics
2) Temporary Therapeutic / Diagnostic Implants
3) Resorbable Environmental Monitors / Sensors
4) Hardware Secure (non-recoverable) Electronics
5) Hardware Reconfigurable Electronics
Transient Electronics – Application Opportunities
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Candidate Semiconductors for Transient Electronics
Carbon nanotubes:High mobility, ‘robust’ High temp. growth, electr.heterogeneity
0.1 1 10 100 1,000 10,000
Polymers:Solution processing Low performance
Small molecules:Performance similar to a-SiVacuum dep.
Single crystals:Study of intrinsic charge transportFragile, challenging integration
Si GaAsa-Si?
poly-Si
graphene:High mobilityHigh temp. growthSemi-metallic
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Dissolution of Si Nanomembranes at Phys. pH, Temp.
Science 337, 1640 (2012).
pH ~7.4
Si + 4 H2O Si(OH)4 + 2 H2
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Silicon Can Dissolve by Hydrolysis
Si for Transient Electronics:Si thickness: 35 nm (ultrathin, top SOI)dissolution time: 10 days
req’d volume of water: 0.4 mL (~1 cm2)
Si for Conventional Electronics:Si thickness: 700 m (bulk wafer)dissolution time: 600 years
req’d volume of water: 8 L (~1 cm2)
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Current Portfolio of Transient Electronic Materials
Semic.ZnOIGZOpoly-Sia-Sinp-SiGeSiGe
Dielectr.SiOxSiNxMgOSOG
Substr.silkPLGAPLAPCLPOCcollagenpolyanhydridemetal foils
Interconn.MgZnWMoFepastes
Adv. Mater. 26, 3905 (2014).Adv. Func. Mater. 24, 645 (2014). Adv. Func. Mater. 23, 4087 (2013).
Small 9, 3398 (2013).
Adv. Mater. 25, 3526 (2013).
Adv. Health. Mater. 3, 515 (2014).
Adv. Mater. 26, 3905 (2014).ACS Nano 8, 5843 (2014). APL 105, 013506 (2014)Adv. Func. Mater. 24, 4427 (2014).
Adv. Mater. 26, 7371 (2014).Adv. Mater. 26, 7637 (2014).
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Transient Si MOSFETS and Logic Gates
0 1 2 3 4 50
5
10
15
20
Vd (V)
I d(m
A)
5V
3V
1V1 2 30
1
2
3
0
2
4
6
8
Vin (V)
V out
(V)
Gai
n
~ 400 cm2/Vson/off ~ 106
Science 337, 1640 (2012).
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Transient Electronics – Test PlatformSi, SiO2, Mg, MgO and silk
Science 337, 1640 (2012).
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Science 337, 1640 (2012).
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Mg ~300 mg, Si ~10 mg
Mg ~100 µg, Si ~ 3 µg
Perspective on Elemental Content
Transient Electronics
Rec. Daily Intake
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Transient, Water-Activated Mg Primary Battery
-Mg
+Mo
Polyanhydrides1 cm
0 2 4 6 8 10 120.0
0.4
0.8
1.2
1.6
2.0
2.4
Volta
ge (V
)
Time (hour)
Mg-Mo 4 stacking cells
5d
15d19d
Discharge current density: 0.1 mA/cm2
Adv Mater (2014)
Dissolution in Water
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Transient Battery Power for Radios, LEDs
Adv Mater (2014)
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Transient Electronics from a 90 nm CMOS Foundry
Appl. Phys. Lett 106, 014105 (2015).
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Transient SOI CMOS from a Commerical Foundry (X-Fab Intl)
PNAS 114, E5522 (2017).
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Rapid, Precise Materials/Device Assembly via Printing
1) Form undercut microdevices, anchored at endpoints
2) Transfer them to a target substrate by printing
3) Interconnect to form systems
PNAS 107, 17095 (2010).Nature Mater 5, 33 (2006).
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Semiconductor Device ‘Printer’
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anchor with PR;undercut etch AlAs
unpublishedScience 325, 977-981 (2009).
Processing and Printing of AlInGaP -ILEDs
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5 mm
AlInGaP -ILEDs Printed Onto Plastic (1600; 100% yield)
Science 325, 977 (2009)
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Production Scale Transfer Printers
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Transient SOI Electronics on Flexible PLGA Substrates
PNAS 114, E5522 (2017).
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Dissolution / Disintegration of Transient CMOSComplete dissolution ~20 days: everything except BOX is eliminated in 6 days.
0 d 1 d 3 d 5 d
Adv. Mater. 11, 1704955 (2018).
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Day 1 Day 20
Day 45
Transient Biosensors
Transient Biosensors
Transient Biosensorsno longer visible
• Full dissolution in 45 days.• No abnormalities or adverse effects.
In Vivo Bioresorption of an Array of Transient Devices
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Printable Transient Conductors: W in Wax for RFID Tags
Adv. Func. Mater. 28, 1801819 (2018).
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Current Future
Wired operation → Restricted movement
Non-degradable → Secondary surgery Bioresorbable → Eliminate extraction
Fully sutured → Safe, minimal risk
http://violetsjourney.blogspot.com/2012/02/icp-monitoring.html
Wireless operation → Free movement
External interface → Infection / hemorrhage
Intracranial Monitors for TBI
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Bioresorbable Intracranial Pressure Sensors for TBI
Nature 530, 71 (2016).
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Nature 530, 71 (2016).
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In-vivo Wireless Monitoring – Pressure and Temperature
Nature 530, 71 (2016).
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Electronic Medicines – Active Project Areas
Programmable Drug Release -- therapeutic
Pacemakers – recovery
Intracranial monitors -- recovery
Nerve Stimulators – accelerated healing
Bone Stimulators – accelerated healing
Thermal Therapy – anti-bacterial
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Prof. Y. Huang (NU) – mechanicsProf. P. Ferreira (UIUC) – manuf.
Prof. I. Efimov (GWU) – cardiacProf. R. Murphy (WU) -- TBIProf. Z. Ray (WU) – neuroregenProf. M. MacEwan (WU) -- regen
Senior Collaborators
Engineering Science
Clinical Medicine
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Research Team