ucu technology (edited by mmg)

Patent #

UCU Technology™ Universal Contact Unit

Prospectus / Media Kit

Newly Patented Technology Available for Acquisition

Patent # 7,371,973 B1

COPYRIGHT 2010 MILLENNIUM MARKETING GROUP, LTD. ALL RIGHTS RESERVED.

Table of Contents

I Product Opportunity Summary 1

II Competitive Landscape

Competitive Advantages / Breakthrough Opportunity 8

Product Features and Benefits 14

Comparable Established Products 16

Referenced Patented Products 17

Competitive Summary 18

III Industry & Market Analysis Industry Size and Trends 20

Target Market Analysis 23

Distribution Channels 24

IV Product Analysis Product Specifications 26

Patent Value Enhancement 26

VVVV Financial Forecast

Pro Forma 27

VI Licensing Opportunities & Patent Information

Patent Information 31

Patent Owner Background 31

Exhibit Summary 33

Disclosure Statement 37

2


I Product Opportunity Summary

This prospectus will introduce the Universal Contact Unit (UCU) Technology, a newly

patented technology available for licensing. The UCU Technology™ is an independent

branch of the interconnection technologies tree, but is more close to the Solder Bump

technology family. Like the Solder Bump Flip Chip, the UCU Technology™ is a group

process and uses soldering for chip-substrate interconnection. But the difference is

fundamental.

The UCU Technology™ uses micro-via in thin polyimide film as a contact on substrate

and capillary forces to fill the via with a solder paste during heating. Although the bumps

nominally present in this technology there are no real bumps, but small meniscus only.

It leads to a short time of a bumping process with no impact on the silicon surface. The

use of poyimide film yields to extremely low overstress during heating. The UCU

Technology™ affects critical development in various satellite microelectronics sectors

such as polyimid film production and chip packaging equipment.

Capillary allows use of the UCU™-based technologies for a wide range of applications,

including assembly of multiplayer fine resolution Printed Circuit Boards, both flex and

rigid. The UCU™-based PCB is the best substrate for multi-chip modules.

3


UCU™-Based Technologies

Core Technologies Based on UCU Technology™:

• Chip-Substrate Interconnection Technology (CSI). CSI involves applying

fundamental UCU Technology™ principles to the key problem of inexpensive

and reliable chip-substrate interconnection.

• Multi-layer Polyimide Printed Circuit Board Assembly Technology (MLP-

PCB). UCU Technology™ can be used effectively for the assembly of fine

resolution multiplayer PCBs at a very attractive cost.

UCU ™-Based Industrial Technologies:

• Single Chip Module (SCM) Assembly Technology. SCM assembly technology

combines UCU™-Based CSI and MLP-PCB technologies with the aim of

providing cost-effective, robust, and reliable packages, including both CSP and

the highest I/O package families.

• Multi Chip Module (MCM) Assembly Technology. The industry’s future lies in

MCM. The UCU Technology™ will provide the market with MCM assembly

technology, bringing cheap and reliable multi-chip packages into the mass

market. This technology is capable of working simultaneously with chips of

different design rules and pitch size, and can produce MCMs with a small

footprint and very effective use of space.

• Flex Fine-Resolution Multi-Layer PCB. UCU Technology™ enables the

assembly of custom and mass production PCBs with excellent electrical features,

fine design rules, and at a low cost.

• Original Assembly Equipment. Suitable both for SCM and MCM assembly, as

well as for PCB assembly.

• KGD Testing Technology and Fixture. The problem of “Known Good Die” is a

key issue for the packaging and assembly industry. UCU Technology™ offers

original technology to solve this problem.

4


A small series of single and multi-chip modules based on the UCU Technology™ has

been manufactured and successfully tested:

Single Chip Module Packaging and Multi-Chip Module Packaging and Assembly Technology and Services Assembly Technology and Services

UCU™-Based Multi-Chip Modules

The UCU™-based chip-substrate interconnection technologies and fine-resolution PCB

assembly together make MCM assembly straightforward. There is no serious difference

between SCM and MCM assembly from the equipment or design point of view.

• The UCU™-MCM technology can combine IC units with arbitrary pad location

patterns, design rules and I/O numbers with a limited footprint.

• The robustness and simplicity of the technology together with fine-pitch

resolution enables the use of chips from different producers without the need for

redesign.

• The multilevel UCU™-based PCB cuts the size of the MCM footprint and

significantly increases the working clock frequency and other electrical features.

• SCM-designed assembly equipment can be used for MCM assembly without any

need for reconfiguration.

5


Original SCM and MCM assembly Equipment

UCU Technology™ Advantages

• UCU Technology™ uses group soldering operations.

• UCU Technology™ provides high quality and reliability of chip-substrate

interconnection due to better soldering in a capillary.

• UCU Technology™ provides the solution to the problem of immediate visual

testing of the assembly process and its results through the capillary hole in the

thin polyimide layer.

• UCU™-based interconnection has no flux remains.

• Polyimide structure prevents shorts or opens during device work.

• Behavior of a polyimide structure at heating prevents overstress without various

tricks.

• The capillary-based interconnection is very durable. It is practically impossible to

tear the interconnection.

• Absence of collapse during bump formation allows use of UCU Technology™

for the packaging of GaAs-based IC devices.

6


• UCU Technology™ can be universally used both for chip-substrate

interconnection and for assembly of complex PCB layers.

UCU Technology™ BGA-400 Case Study

*Signals and GND layers are separated (better EMI)

*More than 300 signals can be routed in 2 PI layers (in PCB required ~ 4 layers),

because of PI tiny design rules ~ 50ụ (PCB design rules is ~ 300ụ)

7


UCU Technology™ Chip-Substrate Interconnection Process

1) Chip PADs preparation.

2) Covering of contact by tin.

3) Formation of a capillary connection element.

4) Welding alloy.

5) Alignment of a capillary in the substrate with the pad of the chip.

6) Soldering

The target market for the UCU Technology™ is comprised of three major manufacturer

groups: contract packaging services companies, packaging & assembly equipment

manufacturers, and vertically integrated IC production companies.

With a low manufacturing cost, the margins are good for both the manufacturer and

wholesaler. Wholesalers are expected to be eager to place sizable initial and follow up

orders to capitalize on the exclusiveness this value-added product offers.

8


Millennium Marketing Group, Ltd. has been retained by the patent owner to secure a

licensing or sales agreement in order to bring the unique features, quality, effectiveness,

and value of this technology to the marketplace. The first firm to bring this exciting

design to the market will capitalize with a favorable return on investment and enjoy the

commercial benefits well into the future. Currently, we are seeking a partner that can

fully and profitably exploit this rare and lucrative licensing opportunity.

UCU Technology™ At A Glance

Patent Number: United States Utility Patent No. 7,371,973 B1

Industry: Semiconductor

Target Market Size: Semiconductor houses

Packaging foundries

Mobile PC and telecom OEMs

Primary Use: Contact Node

Key Benefits:

� Provides high quality and reliability of chip-substrate interconnection due to

better soldering in a capillary

� Provides the solution to the problem of immediate visual testing of the

assembly process and its results through the capillary hole in the thin

polyimide layer

� Can be universally used both for chip-substrate interconnection and for

assembly of complex PCB layers

9


II Competitive Landscape

Competitive Advantages / Breakthrough Opportunity

The first silicon integrated circuit (IC) was invented in

1958 by Texas Instruments. The chip-substrate

interconnection by wire bonding experienced a

bottleneck when the global IC manufacturing volume

rose from hundreds of thousands in the 1990’s to

approximately 80 billion in 2009.

Wire Bonding Problems

There are some fundamental Wire bonding problems: sequential bonding process and

peripheral contact pads location. In practice, it leads to:

� Limited possible I/O number serviced by the bonding process for usual chip sizes

� Degradation of an interconnection quality with I/O number increase

� Linear growth of a bonding process equipment’s cost with I/O number increase,

or linear growth of an operation time

As a result, Wire bonding is generally used for a connection of chips with an I/O number

below 400. In addition, gold wire is an expensive material from the economical point of

view.

Another matter under discussion is Wire Bonding reliability during device work cycle. A

high degree of heat and mechanical energy in a light vacuum during welding leads to

high levels of hidden dislocations in silicon die. Two adjacent wires may excite a short.

As a result an MTBF (Mean Time Between Failure) value decreases significantly.

How UCU Technology™ Competes With Universally-Recognized Wire bonding Technology

o UCU Technology™ is a group process with extremely high-quality soldering.

10


o Wire bonding is a sequential process. Thus, very high but limited bonding quality

leads to dramatically high packaging cost increases with pad numbers.

o It is impossible to use Wire bonding for area-array pad location.

o It is very expensive to use Wire Bonding in MCM applications.

o UCU™-based assembly equipment, as opposed to WB equipment, is highly

scalable at a reasonable price.

To solve the connection problem, IBM introduced the “Controlled Collapse Chip

Connection” or C4 in the 1960’s, which considerably increased IC’s I/O number.

Solder Bump Flip Chip Problems

The Flip Chip method, unfortunately, also had some

problems. One huge disadvantage of this method is the

silicon wafer bumping, the placement of spherical or

cylindrical solder bumps onto the surface of the silicon

chip. Though there are a lot of different placement

technologies, all of them may damage the chip because

of high temperature and pressure. Some times this

damage may be uncovered during the final testing

procedures, but often it leads to unstable work and shortening of the IC device life cycle.

11


Additional problems would include:

� Impossibility to visually control mutual alignment between the chip and substrate

pads. This requires the use of expensive alignment equipment.

� The soldering remains cannot be removed completely. It causes shorts.

� So-named underfill is used for better thermo-mechanical features of an

interconnection. Even using underfill, the heating-induced overstress in the layer

between the chip and substrate may lead to chip or connection destruction.

� Coarse pitch side

� Limited reliability

� Expensive manufacturing process

� Expensive materials

Because of these problems this Flip Chip technology, even after 35 years, has been

unable to replace the wire bonding connection.

How UCU Technology™ Competes With High-End Solder Bump Flip Chip Technology

o Robust, high-quality technology. It entails insignificant losses from chip damage

during the assembly process and from poor chip-substrate interconnection.

o Fine pitch.

o Low material and operation costs.

o No flux remains.

o No short during the operation of the IC device.

Important SBFC applications are size-driven package families, such as Chip Scale

Packages (CSP) and Wafer Level CSP (WLCSP). UCU Technology™ has better

performance and very attractive cost features for this class of applications.

12


Charts compare the real bumping cost with the good die cost for SBFC and UCU Technology™ processes. It shows the difference between SBFC and UCU Technology™ quality, especially on the high-end market.

13


14


The UCU Technology™ is superior to competitive products because it solves all

serious SBFC problems. Unlike current technology, the UCU Technology™ is based

on small meniscus instead of solder bumps. This prevents a bump’s deformation and

the expensive underfill. The UCU Technology™ affects critical development in various

satellite microelectronics sectors such as polyimid film production and chip packaging

equipment.

15


The proposed design of the UCU Technology™ is a starting point of a new trend and

direction in VLSI and MCM assembly and much more promising than Wire Bond and

Flip Chip technology.

Product Features and Benefits

� Solves all serious SBFC problems

� Based on small meniscus

� Bumps deformation is prevented

� No expensive underfill

� Cost of chip packaging up to 3 times less than the current flip-chip technology

� Affects critical development in various satellite microelectronics sectors such as

polyimid film production and chip packaging equipment

16


� A small series of single and multi-chip modules based on the UCU

Technology™ have been manufactured and successfully tested

� Inexpensive to manufacture and to market

� No contamination

� Soft for GaAS

� High reliability

� Fast local soldering

� Better performance results

� Fine pitch

� Scalable

� High-yield

� Thin

� Multi-Chip Module availability

� Reliable ship-substrate interconnection

� Can be used effectively for the assembly of fine resolution multiplayer PCBs at a

very attractive cost

� Brings high-end area-array chips into the mass market

� UCU™-based PCB assembly technology simplifies the PCB production process

and renders it suitable for any fine-pitch application

� Reliable bumping processes

� Small footprint

� Processing time is less than half that for processing C4 solder bumps

� Soft chip assembly

� No chip damage

� Excellent assembly-process scalability with I/O number

� No extra time is required if I/O number is doubled

� No flux remains post assembly

� High number of heating cycles

� Excellent thermo-mechanical reliability

� High operating frequencies

� Low energy dissipation over very short interconnection distances

17


� Suitable for ultra-high frequency applications (up to 60GHz)

� Low microwave absorption

� Uses group soldering operations

� Provides high quality and reliability of chip-substrate interconnection due to better

soldering in a capillary

� Provides the solution to the problem of immediate visual testing of the assembly

process and its results through the capillary hole in the thin polyimide layer

� Polyimide structure prevents shorts or opens during device work

� Behavior of a polyimide structure at heating prevents overstress without various

tricks

� Very durable. It is practically impossible to tear the interconnection

� Can be universally used both for chip-substrate interconnection and for assembly

of complex PCB layers

Comparable Established Products

18


Referenced Patented Products

The United States Patent and Trademark Office referenced the following patents when

issuing the patent for the UCU Technology™:

U.S. Patent No. 6,100,475, issued August 2000 to Degani et al.

U.S. Patent No. 6,054,761, issued April 2000 to McCormack et al.

U.S. Patent No. 6,013,877, issued January 2000 to Degani et al.

U.S. Patent No. 6,010,769, issued January 2000 to Sasaoka et al.

None of the above referenced patented products offer all the features and benefits of

the UCU Technology™.

19


Competitive Summary

UCU Technology™

Market Comparison

Feature UCU

Technology™ Competitive

Products

Solves all serious SBFC problems YES NO

Based on small meniscus YES NO

Bumps deformation is prevented YES NO

No expensive underfill YES NO

Cost of chip packaging up to 3 times less than the current flip-chip technology

YES NO

Affects critical development in various satellite microelectronics sectors such as polyimid film production and chip packaging equipment

YES NO

A small series of single and multi-chip modules based on the UCU Technology™ have been manufactured and successfully tested

YES NO

Inexpensive to manufacture and to market YES NO

No contamination YES NO

Soft for GaAS YES NO

High reliability YES NO

Fast local soldering YES NO

Better performance results YES NO

Fine pitch YES NO

Scalable YES NO

High-yield YES NO

Thin YES NO

Multi-Chip Module availability YES NO

Reliable ship-substrate interconnection YES NO

Can be used effectively for the assembly of fine resolution multiplayer PCBs at a very attractive cost

YES NO

Brings high-end area-array chips into the mass market

YES NO

20


Feature UCU

Technology™ Competitive

Products UCU™-based PCB assembly technology simplifies the PCB production process and renders it suitable for any fine-pitch application

YES NO

Reliable bumping processes YES NO

Small footprint YES NO

Processing time is less than half that for processing C4 solder bumps

YES NO

Soft chip assembly YES NO

No chip damage YES NO

Excellent assembly-process scalability with I/O number

YES NO

No extra time is required if I/O number is doubled YES NO

No flux remains post assembly YES NO

High number of heating cycles YES NO

Excellent thermo-mechanical reliability YES NO

High operating frequencies YES NO

Low energy dissipation over very short interconnection distances

YES NO

Suitable for ultra-high frequency applications (up to 60GHz)

YES NO

Low microwave absorption YES NO

Uses group soldering operations YES NO

Provides high quality and reliability of chip-substrate interconnection due to better soldering in a capillary

YES NO

Provides the solution to the problem of immediate visual testing of the assembly process and its results through the capillary hole in the thin polyimide layer

YES NO

Polyimide structure prevents shorts or opens during device work

YES NO

Behavior of a polyimide structure at heating prevents overstress without various tricks

YES NO

Very durable. It is practically impossible to tear the interconnection

YES NO

Can be universally used both for chip-substrate interconnection and for assembly of complex PCB layers

YES NO

21


III Industry & Market Analysis

Industry Size and Trends

The Semiconductor Industry Association (SIA) predicts that year-on-year growth for the

semiconductor industry will be approximately 28.4 percent ($290.5 billion) for 2010.

According to the SIA President George Scalise, “Chip sales have been buoyed by

strength in sales of personal computers, cell phones, corporate information technology,

industrial applications, and autos. Unit sales of personal computers are now expected to

grow by 20 percent this year and cell phone unit sales are predicted to be up 10 to 12

percent over 2009 levels.”

“Sales in the first half of 2010 were exceptionally robust, driven by strong demand from

a broad range of end markets,” said SIA President Brian Toohey. “Worldwide

semiconductor sales of US$144.6 billion for the first half of 2010 were more than 50

percent higher than the same period of 2009 when sales were $96.1 billion.”

22


23


SIA reports that global sales of semiconductors in the second quarter of 2010 grew to

US$74.8 billion, an increase of 7.1 percent from the first quarter total of US$69.9 billion.

June 2010 sales of US$24.9 billion were 0.5 percent higher than May when sales were

US$24.8 billion.

Wire Bonding Industry

The Wire Bonding technology has dominated the market for years but is close to

achieving the limit of technology development. This technology has more then 50 years

of industrial experience, with 90 percent of the worldwide market.

24


Solder Bump Flip Chip Industry

The Solder Bump Flip Chip group technology has attempted for about 40 years to

supplant Wire Bonding, with results of approximately only 6 percent of the worldwide

market.

25


UCU Technology™ - Soldering uses coapillar vias in intermediate polyimide films. May

be used by both perteferal and area-arrays pads with any I/O number of pads. The

technology is ready for chip-scale packaging and multi-chips modules.

Target Market Analysis

The target market for the UCU Technology™ is comprised of three major manufacturer

groups: contract packaging services companies, packaging & assembly equipment

manufacturers, and vertically integrated IC production companies.

Contract Packaging Service Companies

This rapidly growing group consists of companies located mainly in Southeast Asia

(except for a few high-end small packaging companies in the U.S. and Europe).

Packaging & Assembly Equipment Manufacturers

Equipment manufacturers are expected to be among those interested in the UCU

Technology™. Such companies as Kulicke & Soffa Industries, Inc. or ASM

International, and many small privately held companies that are focused on specialized

assembly, testing and auxiliary equipment, are expected to be extremely interested in

this advanced technology. This possibly will stimulate additional equipment spending,

satisfy the industry’s requirements, and meet the end market challenge for IC

performance, user functions and reliability.

26


Vertically Integrated IC Production Companies

Vertically integrated companies control the full manufacturing cycle from silicon chip

production to final assembly of a microelectronic device. Typical examples are Intel,

AMD, and the microelectronic subsidiaries of giants such as Siemens. Their main

advantage is R&D and engineering experience, as well as advanced customer support.

Integrated companies are now tending to become “fables”, with a focus on R&D,

marketing and technical support. The UCU Technology™ is capable of bringing new

R&D and engineering value to customers in this group, and of becoming a high-end

packaging subcontractor.

Distribution Channels

The primary distribution channels for the UCU Technology™ are the manufacturers in

the semiconductor industry. With a low manufacturing cost, the margins are good for

both the manufacturer and wholesaler. Wholesalers are expected to be eager to place

sizable initial and follow up orders to capitalize on the exclusiveness this value-added

product offers.

All these manufacturers are prime places for distributing the UCU Technology™, not to

mention their global Internet presence. The introduction of the UCU Technology™ into

their line of products is well timed.

27


UCU Technology™ At A Glance

Patent Number: United States Utility Patent No. 7,371,973 B1

Industry: Semiconductor

Target Market Size: Semiconductor houses

Packaging foundries

Mobile PC and telecom OEMs

Primary Use: Contact Node

Key Benefits:

� Provides high quality and reliability of chip-substrate interconnection due to

better soldering in a capillary

� Provides the solution to the problem of immediate visual testing of the

assembly process and its results through the capillary hole in the thin

polyimide layer

� Can be universally used both for chip-substrate interconnection and for

assembly of complex PCB layers

28


IV Product Analysis

Patent Value Enhancement

A working prototype of the UCU Technology™ can be made available to demonstrate

the design and functionality of the product.

29


V Financial Forecast

o The absence of rigid PCB and underfill costs constitutes a major cost advantage

for UCU Technology™ over the Solder Bump Flip Chip on this market. The UCU

Technology™ is expected to win at least $10 per high-end IC device. The cost

savings per high-end packaging foundry (5 million units per year) will be

approximately $50 million per year.

o The development of UCU™-KGD technology will provide foundries with extra

cost-savings and open the road to the widespread use of inexpensive MCM

technology.

o The UCU™-MCM technology will provide additional savings of $5 per device (or

$25 million per year per high-end packaging foundry) thanks to the absence of

the package itself.

30


o The UCU Technology™ offers advantages over both Wire Bonding and Solder

Bump within the pads number range 400-600. Unlike SB, UCU Technology™

can compete with WB on fine-pitch peripheral array applications.

o We expect to win at least $5 per each 400-I/O chip ($0.0125 per pad) over SB.

Based on annual output per packaging foundry of approximately 12 million units,

this means $60 million of savings per year in a rapidly growing market.

o The UCU™-MCM technology will offer an additional $5 in savings per IC device.

31


o The UCU Technology™ offers cost advantages over Wire Bonding within the

pads number range 150-400 due to the cost of the interconnection.

o We expect to win approximately $0.1 per 200-I/O 10x10 mm 2 chip ($0.0005 per

pad). Based on annual output per packaging foundry of approximately 100 million

units, this means $10 million of savings per year.

o The next and key step is the introduction of the high-end UCU™-MCM

technology to this market.

MCM technology enables significant reductions in the size, weight, power consumption

and cost of the system. The embedded systems market (e.g., car electronics) is one of

the major consumers of such systems. A cost evaluation shows that MCM technology

can decrease the total system cost by 40 percent, from $36 to $21 for a typical AMD

Am186-based system.

Cost Evaluation of the SCM and MCM Assembly Types

32


The embedded-systems output exceeds 100 million units per year and the market will

grow rapidly on the heels of a fall in prices. It is clear that MCM has a very important

role to play in the industry.

It is important to note that financial data presented is based on an estimated production

cost and does not account for manufacturer efficiencies or product modifications; nor do

they account for bulk quantities and content variations, which could dramatically affect

costs and pricing. Therefore, these projections should be considered as illustrative only

of the tremendous marketing potential for this product.

33


VI Licensing Opportunities & Patent Information

Millennium Marketing Group, Ltd. is the exclusive agent to represent the licensing or

transfer of the patent and trademark rights. Millennium is a well-respected international

firm dedicated to the marketing of patented technologies. Our team has over a hundred

years of combined experience in the fields of technology transfer, licensing, and

marketing consultation. Millennium represents dozens of product lines and has

successfully represented numerous award-winning products. With a shared risk

philosophy, Millennium strives to develop mutually beneficial financial arrangements

with manufacturers and/or distributors.

Currently, we are seeking a licensing arrangement involving the patent to make, use,

manufacture, market, and distribute the UCU Technology™. Please contact Scott A.

Norman, President, Millennium Marketing Group, Ltd. at (913) 317–9114 ext. 102 or e-

mail him at [email protected] to discuss this rare and lucrative new

product opportunity.

Patent Information

Dr. Alexandr Ivanovich Taran holds United States Utility Patent No. 7,371,973 B1 filed

on August 2, 2001, and issued on May 13, 2008. This patent for the UCU

Technology™ expires in 2021, commensurate with the filing date. This patent has nine

claims that protect the exclusive design and function of the UCU Technology™.

34


Patent Owner Background

The UCU Technology™ was invented in 1998 as a result of several years of research.

The intellectual property rights for UCU Technology™ belong to Alexander Taran and

Andrey Belov. Dr. Taran is the author of the UCU Technology™ the “Contact Node”.

Mr. Belov is the co-author of the UCU Technology™.

Alexander I. Taran: Alexander Taran graduated St.

Petersburg's State University at 1968 as a physicist. Dr.

Taran has worked in the microelectronic industry for over 27

years. Dr. Taran had served for many years (1974 to 1998)

in Microelectronics Scientific Center (Zelenograd) as Chief

Scientist in the subsidiary Company of Advanced Research

(1990-1998), Head of Laboratory, Project Manager, and

Engineer (1974-1990). At the same time, Dr. Taran held a

project manager position in Computer informational Center

(1986-1990). Dr. Taran’s basic scientific interests include the development of

microelectronic device assembly technologies and the development of embedded

systems. Dr. Taran holds numerous Russian patents.

Andrey A. Belov: Andrey Belov graduated Moscow

Institute of Electronic Technology (Technical University)

http://www.miet.ru/ in 1994 as an engineer (design and

technology of electronic computing devices) and Russian

Economics Academy in Moscow in 1999 as an economist

(Finances and Credits). Andrey Belov is a small investor

in the fields of development, construction, Real Estate

management, microelectronics, art. Andrey Belov is

also a philanthropist. His charity projects are restoration

of the church of "Sign of the God Mother" in Moscow district Khovrino

http://www.znamenie-hovrino.ru/, support of artists, and restoration and construction of

monuments of World War II.

35


Exhibit Summary

Exhibit A - Trade Show Information

Exhibit B - Trade Publication Information

36


Exhibit A -Trade Shows

International Manufacturing

Technology Show

Consumer Electronics Association (CEA) Industry Forum 2010

Dates and Location: Dates and Location:

September 13 – 18, 2010 October 17-20, 2010

McCormick Place Fairmont Hotel

Chicago, IL San Francisco, CA

Immersive Technology Summit 2010

Licensing International Expo 2011

Dates and Location: Dates and Location:

October 21, 2010 June 14 – 16, 2011

Los Angeles Center Studios Mandalay Bay Convention Center

Los Angeles, CA Las Vegas, NV

The tradeshows and trade publications listed are possible marketing tools that we include in the

prospectus because of our belief in the complete marketing program. Although Millennium represents

products at numerous tradeshows and in certain publications, we do not guarantee representation at all of

the listed shows or publications.

37


Exhibit B - Trade Publications

Semiconductor Today

Semiconductor Manufacturing Industry News

EDN: Electronics Design, Strategy, News

Electronic Component News (ECN)

Electronic Products

Electronic Products and Technology (EPT)

Electronics Weekly

Semiconductor International

Wireless Design Online

38


39


Disclosure Statement

Millennium Marketing Group, Ltd. (the “Company”) has prepared the attached business Prospectus (the “Plan”) based upon its current understanding of the industry, expansion plans, markets, technology and other pertinent indicators. The plan contains information to provide prospective investors with a foundation on which to base meaningful discussion with management of the Company. The projected financial information is management’s projection of possible future results and is dependent on many factors over which they are derived. Neither the Company nor any of its representatives makes any express or implied representation or warranty as to the attainability of these projections or the accuracy, completeness or reasonableness of the assumptions. Neither the company nor any of its representatives makes any express or implied representation related to any past, current or future patent infringement claims the Plan represents.

THE COMPANY MAKES NO EXPRESS OR IMPLIED REPRESENTATION OR WARRANTY AS TO THE ACCURACY OR COMPLETENESS OF THE INFORMATION CONTAINED IN THIS PLAN INCLUDING BUT NOT LIMITED TO PATENT INFRINGEMENT CLAIMS OR OTHER PERTINENT INFORMATION. STATEMENTS IN THIS PLAN ARE MADE AS OF THE DATE HEREOF AND ARE SUBJECT TO REVISION AT THE SOLE DISCRETION OF THE COMPANY’S MANAGEMENT. SOME OF THE REVISIONS MAY BE MATERIAL. IN ALL CASES AND NOTWITHSTANDING THE USE OF WORDS SUCH AS “WILL” OR “SHALL” OR ANY DISCUSSION OR CHARACTERIZATION OF FUTURE ACTIONS OR EVENTS, THIS PROSPECTUS IS INTENDED TO BE AN INDICATION ONLY OF THE COMPANY’S CURRENT INTENTIONS. THE DELIVERY OF THIS PLAN SHALL NOT CREATE, UNDER ANY CIRCUMSTANCE, ANY IMPLICATION THAT THERE HAS BEEN NO CHANGE IN THE AFFAIRS OF THE COMPANY AND OTHER INFORMATION CONTAINED HEREIN SINCE THE DATE HEREOF. THE COMPANY MAKES NO EXPRESS OR IMPLIED REPRESENTATION OR

WARRANTY AS TO THE ATTAINABILITY OF THE FINANCIAL PROJECTIONS OR

THE ACCURACY OR COMPLETENESS OF THE INFORMATION HEREIN OR ANY

OTHER WRITTEN OR ORAL COMMUNICATION TRANSMITTED OR MADE

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MATERIALLY FROM ACTUAL RESULTS. ONLY THOSE REPRESENTATIONS AND

WARRANTIES THAT ARE MADE IN A DEFINITIVE AGREEMENT WHEN AND IF

EXECUTED, AND SUBJECT TO ANY LIMITATIONS AND RESTRICTIONS AS MAY

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OFFER TO SELL OR THE SOLICITATION OF AN OFFER TO BUY ANY SECURITIES,

ASSETS, OR PROPERTIES, INCLUDING WITHOUT LIMITATION, ANY PRODUCTS,

PROCESSES, RESEARCH, OR INTELLECTUAL PROPERTY.

Opportunity at a Glance

New Technology: UCU Technology™

Patent: Patent Number 7,371,973 B1

We are seeking a long-term arrangement with a company to manufacture, market,

and/or distribute this new technology based on the acquisition of the intellectual

property rights.

For additional information and potential terms to acquire this innovative technology

contact Scott A. Norman, President, Millennium Marketing Group, Ltd.

Scott A. Norman

President

Millennium Marketing Group, Ltd.

10550 Marty Street

Overland Park, KS 66212

Phone: 913-317-9114

Fax: 913-338-1251

Email: [email protected]

PROFESSIONALLY PREPARED AND REPRESENTED BY

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10550 Marty Overland Park, KS 66212-9946 USA Phone: 913-317-9114 Fax: 913-338-1251

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