US CMS Silicon Tracker ProjectUS CMS Silicon Tracker ProjectRegina DeminaRegina Demina

KSUKSU

Florida State UniversityFlorida State UniversityMay 11, 2002May 11, 2002

A bit of history

End of 1999 – CDF and DØ silicon detectors (~10 m2 of silicon, ~2M channels) out of SiDet to be installed in collision halls

December 1999 – CMS made a decision to go with all silicon tracker =

68m2(inner barrel and disks) + 164m2(outer barrel and disks) = 232m2

5.1 M + 5.6 M = 10.7 M channels

CDF SVX installation

A natural decision for US institutions to join the silicon effort.

Fermilab B. Flaugher, R. Lipton, P. Rapidis, L. Spiegel, S. Tkaczyk

Kansas State University T.Bolton,R.Demina,W.Kahl,S.Korjenevski, W.Reay, R.Sidwell, N.Stanton

Northwestern University D. Buchholz

Texas Tech University A. Sill

University of California, Riverside Gail Hanson

University of California, Santa Barbara C.Campagnari, D. Hale, J.Incandela

University of Illinois, Chicago L. Chabalina, C. Gerber

University of Kansas P. Baringer, A. Bean, L. Christofek, X. Zhao

University of Rochester R. Eusebi, E. Halkiadakis, A. Hocker, P. Tipton

Si Tracker Group

Two new groups

Will provide important support for the UCSB production line

Silicon tracker in Spring 2000

Single sided, low resistivity silicon sensors as a baseline technology extensively tested by RD20 – rad hard to >10 Mrad Several vendor qualified (6” production lines)

Working front end chip – APV25, some issues to be resolved with multiplexer chip – MUX PLL

Hybrids – two technologies considered Mechanics in excellent state – a lot inherited from MSGC’s Plan to start production in fall 2001

Outer Barrel Space Frame

Spring 2000

Outer Barrel Rods

Silicon modules

Spring 2000

Automated assembly

3 TOB modules/ 30 min

Gantry at CERNSpring 2000

SiTrkr Organization

Schedule Issues

Schedule slipped by ~ a year

Hybrid schedule is a concernDecision on technology was made in September 2000 prototyping was semi-successful might

change the technology

FEDs Initial models for testing of large quantities of FE hybrids and modules expected to be ready in late 2002Optical models for rod testing will be available 6/03

Optical hybrids for assembly of modules into Rods will be available in late 2002

Other critical items are performing better

GantriesPC based test standsProbe stationsSensors

FE Hybrid statusFE Hybrid status

• Industrial hybrid (V0 – unpackaged chips on ceramics) Industrial hybrid (V0 – unpackaged chips on ceramics) production started with 1production started with 1stst Producer. 160 Hybrids delivered Producer. 160 Hybrids delivered (yield 65%) They also say that “the feature size” of hybrid is (yield 65%) They also say that “the feature size” of hybrid is too small for mass production.too small for mass production.

• The 2The 2ndnd producer has still problems with shorts. producer has still problems with shorts.

• Design of the V1 version of the hybrid (packaged chips on Design of the V1 version of the hybrid (packaged chips on ceramic- easier to produce) done. Send order to 1ceramic- easier to produce) done. Send order to 1stst producer. producer.

• 40 substrates hybrids V2 (packaged chips on FR4) received, 40 substrates hybrids V2 (packaged chips on FR4) received, some 10 populated. Hybrids and substrates distributed for some 10 populated. Hybrids and substrates distributed for mechanical and electrical tests. They look ok. mechanical and electrical tests. They look ok. Likely change Likely change in technology choice. in technology choice.

HIP and pinhole effects on APV25

Highly Ionizing Particles produced in nuclear interactions, a rare

phenomenon) can saturate entire APV for ~200 ns Results in inefficiency of ~1.3%

Pinholes Leakage current directly into APV25 Typically disconnected from readout Signal inefficiency of >=2 connected

pinholes/APV Rate of new pinhole development <10/(few

100 wafers=1000 APV’s) Fixes

Change resistor value on hybrid (100 50)

APV inverter off – reduces dynamic range

PSI test beam planned at the end of May to

further study the effect US to provide modules

TOB Module

~20 cm

Build 6,000 TOB modulesCurrent plan 2/3:1/3 at FNAL:UCSB

2 sensors bonded together PA hybrid (4 APV25 chips)

CMS module production

Sensors probed at K-State Automated module assembly system – Gantry - is fully

commissioned at Fermilab Placement accuracy <5um 4 (+3) fully functional modules were delivered to CERN for test

beam studies at PSI.

                 

m3

Module Testing at FNAL

ARCS CMS DAQ

Two test systems are now in operation at SiDet

From R&D to Production

R&D

CMS T

rack

er

production