usm mini tgl chem eng briefing

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9th May 2015

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USM-Mini-TGL-Chem-Eng-Briefing

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Page 1: USM Mini TGL Chem Eng Briefing

9th May 2015

Page 2: USM Mini TGL Chem Eng Briefing

Course Content

Agenda & Program Flow

Team Grouping & Challenge Statement

Judging Criteria

Scope & Mode Presentation

Pitching Guideline

Q&A

Page 3: USM Mini TGL Chem Eng Briefing

Agenda: 20th November

Time Activity

8:00am-8:30am Registration/Breakfast

8:30am-12:30pm Proposal Preparation & Mentoring

12:30pm-2:30pm Lunch/Break

2:30pm Submission of Proposal Slides to Mentors/CREST rep

2:45pm-4:45pm Pitching Session

4:45pm-5:15pm Closing Ceremony

Page 4: USM Mini TGL Chem Eng Briefing

• Teams of 5 members

• Team will be assign Team number and 1 Challenge Statement

Form Teams

• Time period: 2 weeks

• Discuss and identify a product/design on Challenge Statement

• Prepare proposal (ppt format)

• Max 7 - 10 slides

Project • Team leader forward ppt to mentor/CREST rep by 2.30pm 20th Nov

• Team presents to panel of judges

• 7 minutes presentation

• 3 minutes Q&A

Pitching

Program Flow

Page 5: USM Mini TGL Chem Eng Briefing

Team Grouping

Panel Team

Number Name Challenge Statement

PANEL 1

1

QUAH JIA XIN Penchem (PCH 01):

THIEN YU JIE UV and weather degradation of transparent epoxy polymers under outdoor applications

DHIVIAN A/L T NITHIASELVAN

MUHAMMAD SYAFIEQ BIN ABD HALIM

NURUL FATIRAH BINTI MOHD SHUKOR

2

TONG SIEW HUI Penchem (PCH 02):

SYED ZULFADLI BIN SYED PUTRA

Synthesis of silicone polymer with high refractive index greater than 1.7

LYE YU YANG

KEE LI EN

NURLINA BINTI GAFOOR

3

LEE WEN JIE Penchem (PCH 01):

TEO LEONG HER UV and weather degradation of transparent epoxy polymers under outdoor applications

NUR SYAHIRAH ADIBAH BINTI PAKIR

WONG HUI YIN

NURUL FARHANA BINTI SHAHBUDIN

4

KOH MING HOOI Penchem (PCH 02):

DINA LIYANA BINTI MOHAMED ROSHDIN MURAD

Synthesis of silicone polymer with high refractive index greater than 1.7

AHMAD RIDHWAN BIN MOHD YUNUS

SITI ZUBAIDAH BINTI ABU SEMAN

LAU BOON KEY

Page 6: USM Mini TGL Chem Eng Briefing

Team Grouping

Panel Team

Number Name Challenge Statement

PANEL 1

5

SIEW SEOK LI Penchem (PCH 01):

AHMAD FUZAMY BIN MOHD ABD FATAH

UV and weather degradation of transparent epoxy polymers under outdoor applications

NURUL EZATI BINTI MAT SIDEK

MOHAMMAD HASIF BIN YAACOB

CHOW LILY

6

LAW LI CHIN Penchem (PCH 02):

TAN YEE LING

Synthesis of silicone polymer with high refractive index greater than 1.7

MUHAMMAD HAZWAN BIN RAHAMATHULLA

ELAINE OOI CHIN WEN

HASIF BIN MIOR HAKIM

7

LOH KAR WOON Penchem (PCH 01):

NOOR IZZATTY SHAMIRA BINTI SAMSUDIN

UV and weather degradation of transparent epoxy polymers under outdoor applications

MUHAMAD SHARAFEE BIN SHAMSUDIN

CHIN ZHI YAN

T. PARRIMALAN A/L THIRUCHELVAN

8

ONG HUI SIN Penchem (PCH 02):

NORATASYA BINTI ROSLI

Synthesis of silicone polymer with high refractive index greater than 1.7

SYAFIQAH BINTI MAD ZIN

MUHAMAD NU'AIM BIN SOFIAN

CHIN WAI SING

Page 7: USM Mini TGL Chem Eng Briefing

Team Grouping Panel

Team Number

Name Challenge Statement

PANEL 2

9

GOH SENG SHI CREST (CR 01):

PAVEETHRA BHAI A/P MURUGAN Renewable polymer for industry application (electronics, food packaging)

MOHAMAD AZZAM BIN CHE RAHIM

RASYID BIN HASSAN

LEE LYE QING

10

SOON KAH AIK CREST (CR 02):

SYAHAZMIR BIN AHMAD SHAH

In-molding polymerisation for semiconductor packaging

SITI NUR FAZURA BINTI HALIM

CHAN PEI JUAN

EZA EDAYU BINTI ZALAZILAH

11

LIEW SAN SIANG CREST (CR 01):

NUR AMIRAH HANI BINTI MOHD AZMI Renewable polymer for industry application (electronics, food packaging)

SITI NATASHA BINTI ABDUL AZIZ

TAN JUN YING

MUHAMMAD ASWAR BIN MD.EUSOFF

12

LIM ZHI HUEI CREST (CR 02):

SYUIB AMEER BIN HAJI AZAMAN

In-molding polymerisation for semiconductor packaging

NUR HAJAR BINTI ROSELY

NUR MUNIRAH AQMA BINTI MAZALI

SELVENTHIRAN A/L DASARATAAN

Page 8: USM Mini TGL Chem Eng Briefing

Team Grouping

Panel Team Number Name Challenge Statement

PANEL 2

13

WONG WIN YEE CREST (CR 01):

CHONG YU NONG Renewable polymer for industry application (electronics, food packaging)

NUR DINA BINTI ZAULKIFLEE

VASYANTHAN A/L PANDIYAN

NURUL AZRIN BINTI ABDUL RAHIM

14

LIM WEI MEI CREST (CR 02):

KAVITRRA A/P RAJENDRAM

In-molding polymerisation for semiconductor packaging

EKMAL HARRIS BIN ABDUL MALEK

MOHD KHAIRI BIN OTHMAN

KONG KA MAN

15

CHAN CHUH YIING CREST (CR 01):

MOHAMED FADHIL BIN MOHAMED VAISUL Renewable polymer for industry application (electronics, food packaging)

MARYAM MUNIRAH BINTI SUHAIMI

KONG WEI QING

NURUL 'AQILAH BINTI ABDUL RAHMAN

16

OOI ZI SHING CREST (CR 02):

NG SOK YENG

In-molding polymerisation for semiconductor packaging

SITI NORHASLIZA BINTI AHMAD

EU KEAN WEI

MUHAMAD HAFEEDZ ISKANDAR BIN MOHD ALIAS

Page 9: USM Mini TGL Chem Eng Briefing

Challenge Statements

No Challenge Statement

1

Penchem (PCH 01):

UV and weather degradation of transparent epoxy polymers under outdoor applications

Background:

Transparent epoxies are often used in electronic devices like LEDs for outdoor applications. Current epoxy materials can hardly withstand the harsh sunlight and wet weather conditions of tropical countries for more than a year.

Expected Deliverables:

• Develop clear, transparent epoxy resin and formulation thereof for long term (> 5 years) outdoor applications. • Describe clear plan with timeline to research, develop, validate performance and scale up the new resin and formulation.

2

Penchem (PCH 02):

Synthesis of silicone polymer with high refractive index greater than 1.7

Background:

Transparent silicones are often used as lens material in LEDs for high power lighting applications. Current silicone materials have refractive index of 1.5 or less. Higher refractive index lens material will enable the LED device to extract light more effectively and hence be brighter.

Expected Deliverables:

• Design and synthesize a clear, transparent heat or UV curable silicone vinyl resin with high refractive index greater than 1.7 for very high brightness LED applications. • Describe clear plan with timeline to research, design, synthesis, formulate, validate performance and scaling up the new resin and formulation.

Page 10: USM Mini TGL Chem Eng Briefing

Challenge Statements

No Challenge Statement

3

CREST (CR 01):

Renewable polymer for industry application (electronics, food packaging)

Background:

Use of petroleum based resin like Bisphenol-A based resin is widely known in electronic industry and food containers. This compound is known as toxic and potentially cause to cancer in human. With the advancement of renewable polymers from natural resources, could we develop an alternative to the petroleum based rain and reduce human interaction with the toxic materials?

Expected Deliverables:

• Properties and performance comparison of renewable polymers to petroleum based polymers used in electronic and food packaging industry • Strategy, polymer design, synthesis and formulation of renewable polymer for electronic or food packaging application • Describe clear plan with timeline to research, design, synthesis, formulate, validate performance and scaling up the new resin and formulation.

Page 11: USM Mini TGL Chem Eng Briefing

Challenge Statements

No Challenge Statement

4

CREST (CR 02):

In-molding polymerisation for semiconductor packaging

Background:

• As electronic product getting more sophisticated and smaller, so does the size of semiconductor packages. As the size getting smaller, the challenges to produce reliable product increases. Problems related to incomplete molding, crack die and delamination are possible challenges due to miniaturisation especially with the using of B-stage epoxy holding compound to protect the die and electronic circuits. • A new method with low viscosity monomers and oligomers could be an alternative to the B-stage epoxy holding compound used for semiconductor encapsulation.

Expected Deliverables:

• Understanding of current semiconductor molding process and its limitations for the advanced packaging i.e. 2D and 3D packaging. • Strategy, design of equipment and materials for in-molding polymerisation of semiconductor packages. • Describe clear plan with timeline to research, design, synthesis, formulate, validate performance of in-mold semiconductor packages.

Page 12: USM Mini TGL Chem Eng Briefing

Judging Criteria

Design

W:3x

Presentation

W: 1x

Innovation

W:3x

Project Value

W:3x

Page 13: USM Mini TGL Chem Eng Briefing

Scope

Project

Duration: • 1 - 2 semester/Internship Period • Time Management

Outcome/Expectation: • Design Project/Prototype/Proof of Concept • Detailed explanation on design and implementation • Project Scheduling & Problems

Effort: • Teamwork • Contribution from each member’s expertise • Presentation in English. In terms of content, organization

& clarity, presentation style and appropriateness & effectiveness

Contribution: • 10%

Page 14: USM Mini TGL Chem Eng Briefing

14

• Identification Research/ground visits to find out and

understand problems

Research into company background, products, customers, technology

Motivation/Requirements from user/community

• Analysis Depth to which the problem was analysed and

researched

Supported by Data/Statistics

Target Users/ Environment

Occupation, end product, ecosystem Outdoor, indoor Specific place/application Size and condition of area

Problem Definition

Scope

Page 15: USM Mini TGL Chem Eng Briefing

15

• Innovation

Better solutions that meet new requirements and/or unarticulated needs

Materials/Components

Choice of materials/components – suitability to design (size, electrical parameters, easy to purchase)

Software/Hardware/Process/Materials/ Structure

Cost of components (Bill of Materials)

• Elegance

Usability, Simplicity of design and robustness of solution

Design

Scope

Page 16: USM Mini TGL Chem Eng Briefing

16

• Effectiveness

Accuracy and consistency of solution in solving identified problems

Challenges/Problems that might arise

User/Electrical safety Limitation on distance, speed Cost/time/green technology Competing products/technology

• Ease of Implementation

Ease of implementation and maintenance of the solution

Ease of being accepted by target population

Impact

Scope

Page 17: USM Mini TGL Chem Eng Briefing

17

• Marketability

How much impact the community/industry needs?

How big is the market? Internal/External customer Marketability of product in Malaysia, global

market/market segment

Financial Cost, Selling Price, uniqueness, economical aspect Competing technology/market

Project Management Project Scheduling – Gantt Chart

Project Value

Scope

Page 18: USM Mini TGL Chem Eng Briefing

18

A

B

C

A B

Mode of Presentation

Flowchart, Circuit Diagram, Block Diagram, Mechanical Drawing, Picture, Safety, Real Environment

Page 19: USM Mini TGL Chem Eng Briefing

Heat Sink

Design HeatSink

To cool a device by dissipating into surrounding

Electrical Load

+ -

- ++

Piping System (heat

source)Heat Sink

Cathode Anode

Cold Collector

Hot Emitter

Generator Mode of Presentation

Page 20: USM Mini TGL Chem Eng Briefing

Bill of Materials

Components Number Price per Unit

(RM) Total(RM)

PIR sensor 2 25.00 50.00

Ultrasonic sensor 2 39.00 78.00

Resistor 20 0.05 1.00

Arduino Uno Board 1 70.00 70.00

Switch 1 1.00 1.00

LED lights 20 0.10 2.00

Total Cost 202.00

Mode of Presentation

Page 21: USM Mini TGL Chem Eng Briefing

• Submission of soft copy presentation slides by 2.30pm 20th November to mentor/CREST rep. Presentation via CREST laptop.

• Be punctual • All team members must be present during pitching • Team members are required to introduce their names

and discipline of studies via 1st slide • 7 minutes to pitch • 3 minutes for Q&A • Feedback will be given each panel of judges • Announcement of Winner during closing

Pitching Guideline

Page 22: USM Mini TGL Chem Eng Briefing

Tips on Resume Writing

Clearly state the following in your resume:

Purpose of application i.e. Internship/Fresh Graduate Hiring

Availability Date Intern: Internship Period (please specify start and end date of internship)

Fresh Graduate: Date Available to Start Work (it does not have to be after convocation, it may be after your final examination/viva)

Full Name, Home Address, Mobile Number and E-mail address

University, Discipline of Study and Current CGPA State education details only from SPM level

Please include description/list of types of projects that you have completed (keep it straight to the point, elaborate more on your Internship/FYP project)

i.e. Individual/Group/Design Projects, Internship Project, Final Year Project

Please clearly specify the Hardware/Software/Materials/Tools that you have utilize in the projects in order to display your technical skills/knowledge.

If you have completed your internship/have relevant industry working experience State the name of the company, your department and your roles & responsibilites/projects. Specify

the start & end date of your internship/employment.

Include your extra-curricular activities (keep it brief)