valeo scala laser scanner - us 3ds outscale · ©2019 by system plus consulting | valeo scala laser...

©2019 by System Plus Consulting | VALEO SCALA Laser Scanner 1

22 Boulevard Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

LiDAR sensor for automated and autonomous drivingSystem report by David Le Gac & Sylvain HallereauFebruary 2019 – Version 1

VALEO SCALA Laser Scanner


Table of Contents

Overview / Methodology 4

o Executive Summary

o Main Features & Block diagram

o Market Data

o Reverse Costing Methodology

Company Profile 11

o Valeo

Teardown Analysis 13

o Views and Dimensions of the SCALA

o SCALA Opening

o Main Electronic Board

Top Side – Global view

Top Side – Main components markings & identification

Bottom Side – High definition photo

Bottom Side – Components identification

o Laser Unit Board

o Motor Unit Board

o Laser Diode Physical Analysis

Supply Chain

Dimensions

Cross section – optical and SEM images

Process Flow

o Photodiode Physical Analysis

Supply Chain

Dimensions

Cross section – optical and SEM images

Process Flow

o Lenses Physical Analysis

o Mirror Material analysis

Cost Analysis 85

o Main Components Cost

Laser Diode Cost Analysis

o Wafer Cost

o Die Cost

o Packaging and Component cost

Photodiode Cost Analysis

o Wafer Cost

o Die Cost

o Packaging and Component cost

o Accessing the BOM

PCBs Cost

BOM Cost – Electronic Boards

BOM Cost - Housing

Material Cost Breakdown

o Accessing the Added Value (AV) cost

Main Board and System Manufacturing Flow

Details of the Main Board and system AV Cost

Added-Value Cost Breakdowns

o Manufacturing Cost Breakdown

Selling Price 134

o Financial ratios

o Estimation of the Selling Price

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Company services 139


Overview / Introductiono Executive Summaryo Main Featureso Block Diagramo Market Datao Reverse Costing

Methodology

Company Profile

Physical Analysis

Cost Analysis

Selling Price

Related Reports

About System Plus

SCALA Block Diagram

Connector(To FlexRay Bus)



Methodology

Company Profile

Physical Analysis

Cost Analysis

Selling Price

Related Reports

About System Plus

The reverse costing analysis is conducted in 3 phases:

Teardown analysis

• Package is analyzed and measured.• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking.• Setup of the manufacturing process.

Costing analysis

• Setup of the manufacturing environment.• Cost simulation of the process steps.

Selling price analysis

• Supply chain analysis.• Analysis of the selling price.

Reverse Costing Methodology - Components



Methodology

Company Profile

Physical Analysis

Cost Analysis

Selling Price

Related Reports

About System Plus

The reverse costing analysis is conducted in several phases:

Reverse Costing Methodology - System

• The initialization of the analysis

Pictures of the elements to be studied.

Identification of the components.

• Description of the material in the “SYScost+” software

Creation of an “estimation project” of the studied board with SYScost+ software.

Construction of the Bill of Material (BOM).

• Assessing the material

Searching for the price of each reference among distributors and manufacturers.

Assessing the cost of the PCB and of the unaccounted references (unknown by distributors)

The BOM is valued with SYScost+ : price simulation according to the requested quantities.

• Assessing the assembling and test phases

Assembly and test lines are modeled with the SYScost+ software.

The assembly and tests costs are estimated.

• Production cost & selling price

Estimation of the production cost & selling price.

• Report

A report is edited.

SYS.cost+©, is a software tool developed by SYSTEM PLUS CONSULTING to calculate the cost of electronic boards. More information on the software can be found at www.systemplus.fr.

https://www.systemplus.fr/costing-tools/syscost_plus/

https://www.systemplus.fr/

https://www.systemplus.fr/


Overview / Introduction

Company Profile

Physical Analysis o Views & Dimensionso SCALA Openingo Electronic Boardso Laser Diodeo Avalanche Photodiode

Cost Analysis

Selling Price

Related Reports

About System Plus

Global Views of the LIDAR

Global views of the Valeo SCALA.

Total Weight: 625g



Company Profile


Cost Analysis

Selling Price

Related Reports

About System Plus

SCALA Opening

Housing opening

Heated Front Screen107x60x27mm - 27g

Housing

Rotating Mirrors

Connector(To FlexRay Bus) Top Cover

Gore AMF300014Snap-fit Vent



Company Profile


Cost Analysis

Selling Price

Related Reports

About System Plus

SCALA Opening

Housing opening



Company Profile


Cost Analysis

Selling Price

Related Reports

About System Plus

SCALA – Part Collection



Company Profile


Cost Analysis

Selling Price

Related Reports

About System Plus

Main Board – Top Side – Global View



Company Profile


Cost Analysis

Selling Price

Related Reports

About System Plus

Main Board – Top Side – Main Components Identification



Company Profile


Cost Analysis

Selling Price

Related Reports

About System Plus

Laser Unit Board – Top Side – Global View



Company Profile


Cost Analysis

Selling Price

Related Reports

About System Plus

Laser Diode Analysis



Company Profile


Cost Analysis

Selling Price

Related Reports

About System Plus

Package views



Company Profile


Cost Analysis

Selling Price

Related Reports

About System Plus

Package – Cross-Section



Company Profile


Cost Analysis

Selling Price

Related Reports

About System Plus

Photodiode Analysis



Company Profile


Cost Analysis

Selling Price

Related Reports

About System Plus

Package Opening



Company Profile

Physical Analysis

Cost Analysiso Components Cost

Yield Explanations Laser Diode Cost &

Price Photodiode Cost &

Priceo System Cost

Assessing the BOM PCBs Cost Electronics Cost Material Cost Added-Value Cost Manufacturing Cost

Selling Price

Related Reports

About System Plus

Laser diode - Die Cost



Company Profile

Physical Analysis




Priceo System Cost


Selling Price

Related Reports

About System Plus

Laser diode - Component Price



Company Profile

Physical Analysis




Priceo System Cost


Selling Price

Related Reports

About System Plus

Photodiode - Die Cost



Company Profile

Physical Analysis




Priceo System Cost


Selling Price

Related Reports

About System Plus

Photodiode - Component Price



Company Profile

Physical Analysis




Priceo System Cost


Selling Price

Related Reports

About System Plus

PCBs Cost



Company Profile

Physical Analysis




Priceo System Cost


Selling Price

Related Reports

About System Plus

BOM Cost – Main Board



Company Profile

Physical Analysis




Priceo System Cost


Selling Price

Related Reports

About System Plus

BOM Cost – Housing



Company Profile

Physical Analysis




Priceo System Cost


Selling Price

Related Reports

About System Plus

Manufacturing Cost Breakdown



Company Profile

Physical Analysis

Cost Analysis

Selling Priceo Financial Ratioso Selling Price

Related Reports

About System Plus

Estimation of the Selling Price



Company Profile

Physical Analysis

Cost Analysis

Selling Price

Related Reports

About System Plus

Related Reports

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

SYSTEM & RF• LeddarVu8: The first off-the-shelf solid state high-definition LiDAR module from LeddarTech• Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Systems

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

RF• LiDARs for Automotive and Industrial Applications 2018• 3D Imaging & Sensing 2018• VCSELs – Technology, Industry and Market Trends 2018

PATENT ANALYSIS - KNOWMADE

RF• LiDAR for Automotive – Patent Landscape Analysis

https://www.i-micronews.com/produit/lidar-for-automotive-patent-landscape-analysis/


https://www.i-micronews.com/produit/vcsels-technology-industry-and-market-trends/


https://www.i-micronews.com/produit/3d-imaging-sensing-2018/


https://www.systemplus.fr/reverse-costing-reports/continental-srl1-lidar-for-advanced-driver-assistance-systems/


https://www.systemplus.fr/reverse-costing-reports/leddarvu8-the-first-off-the-shelf-solid-state-high-definition-lidar-module-from-leddartech/


https://www.i-micronews.com/produit/lidars-for-automotive-and-industrial-applications-2018/








Highly and fully automated driving isabout to become reality in the very nearfuture. Driven by lower production costsand the emergence of new technologies,LiDAR is becoming a key component ofautonomous cars and we expect thismarket to explode, with 10,000% growthbetween 2018 and 2024.

SCALA was developed via the partnershipbetween Valeo and Ibeo. It is amechanical 3D Scanner Laser capable ofidentifying objects and measuring thedistance in any environment, designed forvehicles with Advanced Driver AssistanceSystems (ADAS) and autonomous cars.

An embedded rotating mirror deflects thebeam emitted by a high-power laser diodethrough an emitting lens and receives thereturned reflections through a condenserlens. A three-element avalanchephotodiode array then captures thereflections. The Time-of-Flight measu-rement of the travel time of this pulseenables the system to determine thedistance from the obstacle.

The laser is a high-power pulsed laserdiode based on edge-emitting laser diodetechnology from laser components. Thethree stacked active layers deliver 75W in150ns. The laser comes in a can package.

The Time-of-Flight is measured by anavalanche photodiode array from FirstSensor manufactured in silicon andassembled in a low cost Printed CircuitBoard (PCB) package with a glass window.

The two main optical components areassembled on the same PCB.

Based on a complete teardown analysis ofthe LiDAR, the report provides the bill-of-material (BOM) and the manufacturingcost of the LiDAR sensor. The report alsoincludes a complete physical analysis ofthe laser diode and the avalanchephotodiode. It also features a completecost analysis and estimates a selling price.

COMPLETE TEARDOWN WITH

• Teardown with detailed photos

• Component identification

• Block diagram

• Laser diode analysis including supply chain, dimensions and cross sections, process flow, wafer and die cost, packaging and component cost

• Avalanche photodiode analysis including supply chain, dimensions and cross sections, process flow, wafer and die cost, packaging and component cost

• PCB cross section and cost analysis

• Complete and priced bill-of-materials

• Manufacturing process flow

• Manufacturing cost analysis

• Estimated sales price

The world’s first automotive-grade LiDAR sensor for automated and autonomous driving.

REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT

Title: Valeo SCALA LiDAR

Pages: 140

Date: February 2019

Format: PDF & Excel file

Price: EUR 3,990

Valeo SCALA Laser Scanner

IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY

TABLE OF CONTENTS

Overview/Introduction

• Executive Summary

• Main Features & Block Diagram

Company Profile

Teardown Analysis

• Views and Dimensions of the SCALA

• SCALA Opening

• Main Electronic Board

• Laser Unit Board

• Motor Unit Board

• Laser Diode Physical Analysis

• Photodiode Physical Analysis

• Lenses Physical Analysis

• Mirror Material analysis

AUTHORS

Cost Analysis

• Main Components Cost

• Laser Diode Cost Analysis

Wafer & die cost

Packaging and component cost

• Photodiode Cost Analysis

Wafer & die cost

Packaging and component cost

• PCBs Cost

• BOM Cost – Electronic Boards & Housing

• Material Cost Breakdown

• Added-Value Cost Breakdowns

• Manufacturing Cost Breakdown

Estimated Price Analysis

• Estimation of the Selling Price

VALEO SCALA LASER SCANNER

RELATED REPORTS

LeddarVu8: The first off-the-shelf solid state HD LiDAR module from LeddarTechLeddarTech’s new LiDAR has no moving parts, giving it the smallest form factor while integrating the latest innovations in LiDAR technology.April 2017 - EUR 3,990*

Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance SystemsContinental consolidates its successful role in ADAS-related equipment with this cost-effective solution for emergency brake assist.October 2017 - EUR 2,990*

LiDARs for Automotive andIndustrial Applications 2018Will automotive change the LiDAR market?May 2018 - EUR 6,490*

He is in charge of reverse costingwith a focus on boards and systems.He previously worked for LacroixElectronics where he was in chargeof components database.

David Le Gac hasjoined System PlusConsulting as a CostEngineer in 2013.

He has more than 10 years ofexperience in power devicemanufacturing cost analysis andhas studied a wide range oftechnologies.

Sylvain Hallereau isin charge of costinganalyses for IC,power and MEMS.

He worked at Atmel Nantes asTechnology Development Engineer forRFID and high voltage applications. Heholds a PhD in Microelectonics andOLED devices.

Laurent Berthelotjoined System PlusConsulting in 2018 asLaboratory Manager.

COSTING TOOLS

REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT

Process-BasedCosting Tools

ParametricCosting Tools

WHAT IS A REVERSE COSTING®?

Reverse Costing® is the process of disassembling a device (or asystem) in order to identify its technology and calculate itsmanufacturing cost, using in-house models and tools.

IC Price+

MEMS CoSim+

MEMS Price+

Power CoSim+

Power Price+

LED CoSim+

3D PackageCoSim+

DisplayPrice+

PCBPrice+

SYSCost+

CONTACTS

Headquarters22, bd Benoni GoullinNantes Biotech44200 NantesFrance+33 2 40 18 09 [email protected]

Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGermany+49 151 23 54 41 [email protected]

America Sales OfficeSteve LAFERRIEREWestern USA+1 [email protected]

Troy BLANCHETTEEastern USA+1 [email protected]

Asia Sales OfficeTakashi ONOZAWAJapan & Rest of Asia+81 3 4405 [email protected]

Mavis WANGGreater China+886 979 336 [email protected]

ABOUT SYSTEM PLUS CONSULTING

System Plus Consulting is specialized

in the cost analysis of electronics

from semiconductor devices to

electronic systems.

A complete range of services and

costing tools to provide in-depth

production cost studies and to

estimate the objective selling price of

a product is available.

Our services:

• STRUCTURE & PROCESS

ANALYSES

• CUSTOM ANALYSES

• COSTING SERVICES

• COSTING TOOLS

• TRAININGS

www.systemplus.fr

[email protected]

Our analysis is performed with our costing tools SYSCost+, IC Price+, LED CoSim+ and PCB Price+.

System Plus Consulting offers powerful costing tools to evaluate the production cost and selling price from

single chip to complex structures.

IC Price+Performs the necessary cost simulation of anyIntegrated Circuit: ASICs, microcontrollers,memories, DSP, smartpower…

SYSCost+Provides all component costs estimation includingPCB, housing and connectors, and a simulation ofthe assembly cost and test process at the board andsystem level.

LED CoSim+Process based costing tool used to evaluate themanufacturing cost per wafer using your owninputs or using the predefined parameters includedin the tool.

PCB Price+Performs the necessary cost simulation of a largetype of PCB substrates according to differenttechnical characteristics such as the material, themetal layers, the type of Vias, etc.

ORDER FORMPlease process my order for “Valeo SCALA Laser Scanner ” Reverse Costing® – Structure, Process & Cost Report Ref: SP19488

Full Structure, Process & Cost Report : EUR 3,990* Annual Subscription offers possible from 3 reports, including this

report as the first of the year. Contact us for more information.

REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORTVALEO SCALA LASER SCANNER

Each year System Plus Consultingreleases a comprehensive collectionof new reverse engineering andcosting analyses in various domains.You can choose to buy over 12months a set of 3, 4, 5, 7, 10 or 15Reverse Costing® reports.

Up to 47% discount!

More than 60 reports released eachyear on the following topics(considered for 2018):• MEMS & Sensors: Accelerometer

– Environment - Fingerprint - Gas - Gyroscope - IMU/Combo -Microphone - Optics - Oscillator -Pressure

• Power: GaN - IGBT - MOSFET - Si Diode - SiC

• Imaging: Camera - Spectrometer• LED and Laser: UV LED – VCSEL -

White/blue LED• Packaging: 3D Packaging -

Embedded - SIP - WLP• Integrated Circuits: IPD –

Memories – PMIC - SoC• RF: FEM - Duplexer• Systems: Automotive - Consumer

- Energy - Telecom

ANNUAL SUBSCRIPTIONS

Return order by: FAX: +33 (0)472 83 01 83MAIL: YOLE DEVELOPPEMENT

75 Cours Emile Zola69100 Villeurbanne – France

*For price in dollars please use the day’s exchange rate *All reports are delivered electronically in pdf format*For French customer, add 20 % for VAT*Our prices are subject to change. Please check our new releases and price changes on www.i-micronews.com. The present document is valid 6 months after its publishing date: February 2019

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COMPANYSERVICES



Company Profile

Physical Analysis

Cost Analysis

Selling Price

Related Reports

About System Pluso Company serviceso Contact

Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>40 reports per year)

Costing Tools

Trainings



Company Profile

Physical Analysis

Cost Analysis

Selling Price

Related Reports

About System Pluso Company serviceso Contact

Contact

NANTESHeadquarter

FRANKFURT/MAINEurope Sales Office

LYONYOLE HQ

TOKYOYOLE KK

GREATER CHINAYOLE

PHOENIXYOLE Inc.

KOREAYOLE

Headquarters21 rue La Noue Bras de Fer44200 NantesFRANCE+33 2 40 18 09 [email protected]

Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]

America Sales OfficeSteve LAFERRIEREPhoenixUSA(310) [email protected]

Asia Sales OfficeTakashi [email protected]

Mavis WANGGREATER [email protected]

KOREAYOLE

www.systemplus.fr

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