voltage transfer characteristic part 4: asic ... · 6 4-31 antifuses actel: plice (programmable...
TRANSCRIPT
1
4-1
Internet Engineering
Dr. Jarosław SugierDigital Circuits Design
Part 4: ASIC & Programmable
Logic
4-2
0
UO
UI
0=UI1
UO
UI
UI2, 3,4…
U1 U2 U3 …
UO1 2
1. Parameters of a digital circuit
1.1 DC characteristics
Voltage transfer characteristic
4-3
Input / output voltage levels
0
UO
UI
UILmax
UIHmin
UOLmax
UOHmin
UCC
Out
NMH
UOLmax
UOHmin
In
UILmax
UIHmin
NML
4-4
Current-voltage characteristics (I-V plots)
(A) Bipolar devices, e.g. TTL LS
IN:
OUT:
4-5
(B) CMOS devices
– Spartan-II (FPGA)
– XC9500XL (CPLD)
4-6
1.2 AC parameters
(A) Comb. gate
(B) Synchr. flip-flop
UO
UI
tpLH
tpHL
IN
Clk
tS
tH
Q
tCQ
2
4-7
An example: estimate max. operating frequency
D Q
tCQ = 3.5 ns tSU = 2.0 ns tH = 1.0 ns
D QtpLH = 2.0 nstpHL = 1.5 ns
4-8
Standard Cell ASIC
2. Application Specific Integrated Circuits (ASIC)
4-9
+VDD
I1
IN
T1
+VDD
TK
+VDD
F1
+VDD
FM
In
Out
AND
array
OR
array
PLD transistor array
3. Programmable Logic Devices (PLD)
4-10
. . . . . .
. . .
T1 TK
prog.conections
prog.conections
I1 I2 IN . . .
. . . . . .
. . .
F1 FM
. . . . . .
. . .
T1 TK
prog. conections
prog. conections
I1 I2 IN . . .
. . .
F1
. . .
FM
. . .
I1
IN
TK
FM
T1 T2 T3
F1
. . .
F2 . . .
⇓⇓⇓⇓
⇒⇒⇒⇒
4-11
PAL(Programmable Array Logic)
PLE(Programmable Logic Element)
PLA(Programmable Logic Array)
AND array: Progr. Const. Progr.
OR array: Const. Progr. Progr.
4-12
T0
F0
F1
F2
F3
T1 T2 T7
I0
I1
I2
. . .
3.1 Simple PLD
PLE
⇔⇔⇔⇔ ⇔⇔⇔⇔
O0
O1
O2
O3
OE (output enable)
IN OUT
OE
OE = 1 ⇒ OUT = IN (0/1)
OE = 0 ⇒ OUT = Z (HighZ)
3
4-13
PAL16L8
0 3 4 7 8 11 12 15 1 6 19 20 23 24 27 28 31
0
7
0 3 4 7 8 1 1 1 2 1 5 1 6 19 20 23 24 27 28 31
8
1 5
16
2 3
24
3 1
3 2
3 9
4 0
4 7
4 8
5 5
5 6
6 3
I0
I1
I3
I4
I5
I6
I7
I8
I2
O8
I/ O7
I / O6
I/O5
I/O4
I/O3
I / O2
O1
1 1 I 9
N D
VCC1
2
3
4
5
6
7
8
9
1 2
1 3
1 4
1 6
1 7
1 8
1 9
15
2 0
16L8- 5 (-4)
1 0
16 L8
4-14
0 3 4 7 8 11 1 2 1 5 1 6 19 20 23 24 27 2 8 31
0
7
8
15
1 6
23
2 4
I 0
I 1
I 3
I2
O 8
I/O7
I /O6
VC C 1
2
3
4
17
18
19
20
16L8- 5 (-4)1 6L 8
4-15
PAL16R8
0 3 4 7 8 11 12 15 16 19 20 23 24 27 28 31
0
7
0 3 4 7 8 1 1 1 2 1 5 1 6 1 9 2 0 23 24 27 28 31
8
15
16
23
24
3 1
3 2
3 9
4 0
4 7
4 8
5 5
5 6
6 3
16R8-5 (-4)
2
3
4
5
6
7
8
9
1
18D Q
Q
19
17
16
15
14
13
12
11
O8
O7
O6
O5
O4
O3
O2
O1
OE
V
CLK
I1
I2
I3
I4
I5
I6
I7
I8
D Q
QV
D Q
QV
D Q
QV
D Q
QV
D Q
QV
D Q
QV
D Q
QV
G N D
VCC
1 0
20
16R8 ( 4)
4-16
0 3 4 7 8 11 12 15 16 19 20 23 24 27 28 31
0
7
8
15
16
23
24
16R8-5 (-4)
2
3
4
1
18D Q
Q
19
17
O8
O7
O6
V
CLK
I1
I2
I3
D Q
QV
D Q
QV
VCC20
16R8 ( 4)
4-17
PALCE22V10 and PALCE22V10Z Families
0
1
9
SP
AR0 3 4 7 8 11 12 15 16 19 20 23 24 27 28 31 32 35 36 39 40 43
10
20
21
0 3 4 7 8 1 1 1 2 1 5 1 6 1 9 2 0 2 3 2 4 2 7 28 31 32 35 36 39 40 43
CLK/I0 1
(2)
2
(3)I1
3
(4)I2
4
( 5 )I3
5
( 6 )
I4
6
( 7 )
I5
7
( 9 )
I6
8
( 1 0 )
I7
9
( 1 1 )I8
1 0
( 1 2 )I9
1 1
( 1 3 )
I 1 0
1 2
( 1 4 )
G N D
24
(28) VCC
(16)
I1311
34
33
48
4 9
6 5
6 6
8 2
8 3
9 7
9 8
1 1 0
1 1 1
1 2 1
1 2 2
1 3 0
1 3 1
I/O923
(27)
8I/O22
(26)
I/O21
(25)7
I/O20
(24)
6
5I/O19
(23)
4I/O18
(21)
I/O17
(20)
3
I/O16
(19)
2
I/O15
(18)
1
I/O14
(17)
0
D
SP
ARQ
0
1
1 0
1 1
0 0
0 1
D
SP
ARQ
0
1
1 0
1 1
0 0
0 1
D
SP
ARQ
0
1
1 0
1 1
0 0
0 1
D
SP
ARQ
0
1
1 0
1 1
0 0
0 1
D
SP
ARQ
0
1
1 0
1 1
0 0
0 1
D
SP
ARQ
0
1
1 0
1 1
0 0
0 1
D
SP
ARQ
0
1
1 0
1 1
0 0
0 1
D
SP
ARQ
0
1
1 0
1 1
0 0
0 1
D
SP
ARQ
0
1
1 0
1 1
0 0
0 1
D
SP
ARQ
0
1
1 0
1 1
0 0
0 1
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
16564E-006
PALCE22V10
4-18
4
4-19
3.2 Complex PLD
Glo
ba
l in
terc
onn
ect m
atr
ix
PA
L
I/O I/O I/O
MC
MC
MC
PA
L
I/O I/O I/O
MC
MC
MC
PA
L
I/O MC
MC
MC
I/O I/O
PA
L
I/O MC
MC
MC
I/O I/O
4-20
XC9500XL Family (Xilinx)
4-21 4-22
4-23 4-24
5
4-25 4-26
Another user-prog. devices:Field Programmable Gate Arrays (FPGA)
4-27
4. Economics of ASICFixed costs
FPGA G.A. S.C.
Training (days) 2 5 5
$400 / day $800 $2,000 $2,000
Hardware $10,000 $10,000 $10,000
Software $1,000 $20,000 $40,000
Design (10k gates)
gates / day 500 200 200
days 20 50 50
$400 / day $8,000 $20,000 $20,000
Production test design 0 5 days 5 days
0 $2,000 $2,000
NRE 0 $30,000 $70,000
masks 0 (3÷4) $10,000 (15+)$50,000
simulation 0 $10,000 $10,000
test 0 $10,000 $10,000
Second source (5days) (5days) (5days)
$2,000 $2,000 $2,000
Total $21,800 $86,000 $146,000 4-28
Unit costs
FPGA G.A. S.C. unit
Wafer size 6 6 6 inches
Wafer cost 1,400 1,300 1,500 $
Design size 10k 10k 10k gates
Density 10k 20k 25k gates/cm2
Utilization 60% 85% 100%
Die size 1.67 0.59 0.40 cm2
Die / wafer 88 248 365
Defect density 1.10 0.90 1.00 cm-2
Yield 65% 72% 80%
Die cost 25 7 5 $
Profit margin 60% 45% 50%
Price / gate 0.39 0.10 0.08 cents
Part cost 39 10 8 $
4-29
„Time to market”:
Comparison:
4-30
5. Technologies of User-Programmable Devices
Fuses
6
4-31
Antifuses
Actel: PLICE (Programmable Low-Impedance Circuit Element)
QuickLogic: ViaLink
4-32
n+ Source n+ Drain
P-Type Silicon
VPP
VD < VPP
floating gate access gate
thin gate oxide
Fig. Altera
EPROM
FAMOS: Floating gate Avalanche injection MOS transistor
4-33
n+ Source n+ Drain
EEPROM
FLOTOX: Floating gate Thin Oxide MOS transistor
4-34
IC1
TDI TDOTCK TMS
IC2
TDI TDOTCK TMS
IC3
TDI TDOTCK TMS
TMS
TDI
TCK
TDO
JTAG Standard(Joint Test Action Group)
Device chain
4-35
Boundary Scan logic
4-36
State diagram for the TAP controller