vtx electronics integration
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VTX Electronics Integration. E.J. Mannel Columbia University June 9, 2008. Outline. Ground Plan Power Systems Slow Control DCM-2 Status Rack Allocation Design and Safety Reviews Schedule Issues and Concerns. Ground Plan. - PowerPoint PPT PresentationTRANSCRIPT
Columbia UniversityIN THE CITY OF NEW YORK
VTX Electronics Integration
E.J. MannelColumbia University
June 9, 2008
Columbia UniversityIN THE CITY OF NEW YORK
June 9, 2008Eric J. Mannel
Outline Ground Plan Power Systems Slow Control DCM-2 Status Rack Allocation Design and Safety Reviews Schedule Issues and Concerns
Columbia UniversityIN THE CITY OF NEW YORK
June 9, 2008Eric J. Mannel
Ground Plan Pixel, Strip and FVTX systems electrically
isolated from each other Star ground plan Shield around beam pipe Exterior enclosure shield Single Point connections to PHENIX clean
ground Floating Power Supplies Optical connections to PHENIX DAQ
Columbia UniversityIN THE CITY OF NEW YORK
June 9, 2008Eric J. Mannel
Pixel Grounding PlanBarrel End Cap Magnet Bridge
3.0V Pixel Bus Supply
5.0V Spiro
Bias Supply-Floating(50V Max)
Rack
Safety Ground
PHENIX Clean Ground
Pixel ½ LadderNorth
1.8VCommon Rtn
+ Bias
LVDO
LVDO
Barrel 1 Stave
Inter-Barrel ShieldNorth
1K-10K
Filte
r
Pixel ½ LadderSouth
1.8VCommon Rtn
+ Bias
LVDO
LVDO
Barrel 2 Stave
Inter-Barrel ShieldSouth
1K-10K
Filte
r
Thermal Plane
Support Structure
Support Structure
SPIRO
SPIRO
Columbia UniversityIN THE CITY OF NEW YORK
June 9, 2008Eric J. Mannel
Bias Power System Bias Power Systems
Mini-Pod evaluation system from Wiener/ISEG 0-500 V floating supplies Precision voltage/current monitoring Two crates required for VTX:
Crate 1: Pixels, 4 modules- 64 Channels Crate 2: Strips, 3 modules- 48 Channels
Performance evaluation on pixel ½ ladder March-May '08
Integration evaluation June-July '08 PHENIX DAQ/ONCS Groups, ISU Summer Students
Columbia UniversityIN THE CITY OF NEW YORK
June 9, 2008Eric J. Mannel
Wiener/ISEG Mini-Pod System
Low frequency noise, random spikes (2mV p-p)
High frequency noise, ~70KHz (10mV p-p) Tested with prototype 1.5cm pixel ½ ladder Meets VTX performance requirements
Columbia UniversityIN THE CITY OF NEW YORK
June 9, 2008Eric J. Mannel
Slow Control Systems Regular meetings with PHENIX DAQ/ONCS
group on slow control issues. PHENIX DAQ/ONCS group will participate
in bias supply integration evaluation, June-July '08
PHENIX DAQ/ONCS group working with C. Pancake on PIXEL FEM slow control integration, June-July '08
Columbia UniversityIN THE CITY OF NEW YORK
June 9, 2008Eric J. Mannel
Detector Collection Module (DCM-2) Status
The DCM is the PHENIX standard interface between the detector front end electronics and PHENIX DAQ.
Optical interface development complete FE3 Daughter board operational with current DCM Currently being used for HBD Available for system chain tests
BNL R&D funding for DCM-2 design and prototype fabrication in place- Q3 FY08.
Design work starting with fabrication completion expected by Q4 FY09
Detector Upgrade Rack AllotmentsD. Lynch
2 Racks assigned to VTX
Location ~10 meters from VTX
Sufficient space for VTX power crates and patch panels.
Columbia UniversityIN THE CITY OF NEW YORK
June 9, 2008Eric J. Mannel
Electronic and Safety Reviews Procedures in place for internal reviews of
electronics system designs starting at Pre-production stage.
Requires submission of: Schematics Layout Files Relevant Data Sheets/Manuals Q/A Procedures
Upon answering all issues from review, design is released for production
Columbia UniversityIN THE CITY OF NEW YORK
June 9, 2008Eric J. Mannel
Electronic and Safety Reviews Currently
SPIRO Module has passed production review and preliminary safety review
PIXEL Bus has passed preproduction review Working with PHENIX PM and CA-D Experimental
Safety Committee to have global safety review for PIXEL system- Fall '08
Columbia UniversityIN THE CITY OF NEW YORK
June 9, 2008Eric J. Mannel
Schedule-Calender Year Electronics Design Reviews as required Pixel System Safety Review: 3Q '08 Bias Supply Procurement: 4Q '08 Pixel Power Supply Design: 3-4Q '08 Pixel Power Supply Procurement: 2Q '09 DCM-2s for Pixel system delivered: 3Q '09 Cable/Fiber Planning/Installation: 1-3Q '09 Rack Installation: 2-3Q '09
Columbia UniversityIN THE CITY OF NEW YORK
June 9, 2008Eric J. Mannel
Issues and Concerns Verifying noise performance of pixel/strip
ladders in combined test. Power system design needs to proceed
quickly. Rack space and cable plan highly
integrated with other PHENIX upgrades. Design schedule for DCM-2 tight for
reading out Pixel system in Run-10.
Columbia UniversityIN THE CITY OF NEW YORK
June 9, 2008Eric J. Mannel
Conclusions Ground plan developed and being fine
tuned. Design of power systems has started.
Evaluation of Bias Supply system in progress Procedure for design and safety reviews.
Production SPIRO board review completed Preproduction pixel bus completed Plans for comprehensive pixel safety review in
progress
Columbia UniversityIN THE CITY OF NEW YORK
June 9, 2008Eric J. Mannel
Conclusions-2 Slow control integration plan is being
developed. Close collaboration with DAQ/ONCS group Evaluation Bias supply system this summer
Work on DCM-2s is about to begin Working with PHENIX integration on rack
allocation.
Columbia UniversityIN THE CITY OF NEW YORK
June 9, 2008Eric J. Mannel
Backup Slides
Columbia UniversityIN THE CITY OF NEW YORK
June 9, 2008Eric J. Mannel
Pixel Ground Plan Ground one end of the stave to one ½ ladder.
Barrel 1 to north ½ ladder. Barrel 2 to south ½ ladder.
Provide for a shield between barrels 2 and 3. Option for aluminized mylar between barrels 2 and 3.
Floating Power supplies Shared returns between ½ Ladders for LV
Optical connections to Pixel FEM
Columbia UniversityIN THE CITY OF NEW YORK
June 9, 2008Eric J. Mannel
Stripixel Ground Plan Each ladder isolated from support
Separate analog, digital and bias returns floating at s upply.
Quadrants within barrel have common point at power board
Power boards tied to PHENIX clean ground Optical Connection to FEM
Columbia UniversityIN THE CITY OF NEW YORK
June 9, 2008Eric J. Mannel
ROC
ROC
AnalogBias
Digital
AnalogBias
Digital
Ladder
ROC
ROC
AnalogBias
Digital
AnalogBias
Digital
Ladder
LVDO
LVDO
Filter Bias Supply
LVDO
LVDO
Filter Bias Supply
FuseBlock PHENIX
High PowerLV System
Power Distribution Card
Columbia UniversityIN THE CITY OF NEW YORK
June 9, 2008Eric J. Mannel
DCM II Function Collect FEM data Zero suppressed data Data Error/ Event Alignment checking
Alignment checking via L1 data or/and adjacent data link
Pocketsized data Possibility for data processing First stage of event building
– we need to handle possible link errors associate with increasing radiation. It may not be practical any more to stop run when one link drop out during the run.
Columbia UniversityIN THE CITY OF NEW YORK
June 9, 2008Eric J. Mannel
DCM II Block DiagramOptics+
De-serializer5 eventbuffer
Zero sup-pression
Eventbuffer
Optics+De-serializer
5 eventbuffer
Zero sup-pression
Eventbuffer
MU
X
receiver buffer
MU
X
Data
processing
Event
Buffer
Optics+De-serializer
5 eventbuffer
Zero sup-pression
Eventbuffer
Optics+De-serializer
5 eventbuffer
Zero sup-pression
Eventbuffer
MU
X
receiver buffer
Data link
inD
ata link out
640Mbytes/sec
ALTERA STRATIX I EP1S30
ALTERA STRATIX I EP1S30
FEM DCM link 80 MHz 16 bits/word 1.6Gbits/sec8b/10b encoding methodchoose Ti’s TLK2501 as de-serializer
STRATIX has 2 Mbits for event data buffer1 Mbits for processing buffer30K logical elementold DCM has 1K Logical element per
optical link
ALTERA STRATIX II EP2S60
320 Mbytes/sec
STRATIX II has 1 Mbits for event data buffer1.5 Mbits for processing buffer20K - 60 K logical elementfaster than STRATIX I
8 optical links per DCM
L1 data
Alignment
Alignment