w. ebensteindoe review duke universityseptember 1999 trt barrel cooling: electronics motivation: u...

W. Ebenstein DOE ReviewDuke University September 1999

Title: (AIATL_LOGO2.eps)Creator: Adobe Illustrator(r) 6.0CreationDate: (4/3/97) (11:26 AM) TRT Barrel Cooling:

Electronics Motivation:

Overheating of electronics causes premature failure

Requirements: 100 mW per channel Total for type 1(inner) module ~ 30 W Want operating T < 50 ºC

Old Cooling Plan (works @ 60 mW): Heat generated by IC through stamp board through legs/sockets into cooling plate to mounting channel/tubing to cooling fluid


Title: (AIATL_LOGO2.eps)Creator: Adobe Illustrator(r) 6.0CreationDate: (4/3/97) (11:26 AM)

From Lund: ASDBLR & DTMROC dummy boards

(pictured here) Roof boards Readout and display software



Insulated box for performing cooling studies:



1 mm PG cooling plate on type 1 tension plate with Lund mockup electronics (one roof board and two stamp board sets removed)



Results: (60 mW / coolant at 14 ºC) 1.3 mm Aluminum cooling plate:

ASDBLR: 46.5 ºC DTMROC: 48.8 ºC roof boards: 38.8 ºC cooling, tension plates: ~ 27 ºC

1.0 mm Aluminum cooling plate: estimate 4 º higher than above

1.0 mm PG cooling plate: ASDBLR: 49.3 ºC DTMROC: 51.1 ºC roof boards: 39.5 ºC cooling, tension plates: ~ 27 ºC

(Typical range: ± 2 ºC) For 75 mW, add ~9 ºC



New Cooling Plan for 100 mW: Keep old scheme, and:

Make lower cooling plate thinner Add upper cooling plate Plates share cooling tubing

Reasons: Increase in power expected to

come mostly from upper chip (DTMROC)

Too late to make major changes to lower plate design

As always, must minimize material to reduce radiation length



New mockup, showing PG vertical rail connecting cooling plates



New mockup with one roof board removed, showing upper cooling plate



Results: (100 mW - 40/60) “0.6 mm” Aluminum cooling plates:

ASDBLR: 49 ºC DTMROC: 50 ºC roof boards: 28 ºC cooling, tension plates: ºC



Present Activities: Proceeding with two-plate prototype:

0.6 mm thick lower plate 0.6 mm (at min) upper plate 3.3 mm wide PG connection from

cooling tubing to upper plate, attached with metal-filled epoxy

Proceeding with FEA calculation: Will model one (or a few)

electronics stacks with all cooling parts

Steady state - simplifies problem Will be able to parameterize plate

thickness and material properties to validate and optimize design



Summary: Two plate design works at 100 mW

Will fine tune dimensions, material choices from:

results of FEA calculations mockup results with various

configurations measured power consumption of

real electronics changes due to redesign of

board-to-board connection (Lund flex design)

changes due to placement of electronics on stamp boards

w. ebensteindoe review duke universityseptember 1999 trt barrel cooling: electronics motivation: u...

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