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ENG WBM-2100-032-N1-(Sylarus #966)-2011.05.17.doc

Wafer Beveling Machine

特許申） 4-cassette Specification

Delivery Specification

Ver.1 May 17, 2011

Sylarus Technologies

Approved Checked Created

Distributed by Daito Electron Co., Ltd.

6, Kojimachi 3-chome, Chiyoda-Ku, Tokyo 102-8730 JAPAN

TEL +81(3)3264-0211 FAX +81(3)3221-7509

Manufacturer Daito Electron Co., Ltd. EM Business Department

Machida Techno-Park Oyamagaoka, 2-2-5-6 Machida-shi, Tokyo 194-0215

TEL +81 (42)798-5161 FAX +81(42)798-5160

MODEL WBM-2100

Jonathan Dietz

Cross-Out

Jonathan Dietz

Rectangle

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【1】 Product Name

WAFER BEVELING MACHINE

MODEL: WBM-2100

【2】 Purpose

This numerically controlled machine chamfers circumference and edge of a wafer with high precision.

【3】 Grinding Unit Configuration and Working Principle

A. Circumference Grinding The machine chamfers as-sliced wafers with a metal bonded form wheel (200 mm). The section marked (1) in the figure below will be removed from the wafer.

B. Notch grinding The machine chamfers a wafer notch with a small-diameter metal bonded grinding wheel (groove diameter of 1.8mm).

ウェーハ ①

横型砥石Horizontal Wheel

Wafer

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【4】 Modifications beyond Existing Daitron Beveling Machines

(1) Footprint Comparing the machine with the existing single-axis DEP-200 (2C-S-2C) which measures 2,100 (W) x 1,045 (D) x 1,900 (H), the size of the model WBM-2100 has been reduced as shown in the table below. WBM-2100 (4C-R-4C, main unit only (excluding the operation box) measures 1,200 (W) x 1,300 (D) x 2,150 (H).) Refer to drawing 3B60191 at the end of this document. Comparison with single-axis machine

W [mm] D [mm] H [mm] Area ratio [%] DEP-200 2,100 1,045 1,900 100 WBM-210 800 1,200 2,162 43.7 WBM-2100 1,200 1,300 2,150 71.1

(2) Sturdy Grinding Unit

The entire frame of the machine is made of a single iron-cast structure to minimize wheel vibration during the grinding operation, thereby reducing wafer damage and chipping.

(3) Improved OF linearity

By immobilizing the spindle-side and structuring the Y, θ and Z axes for the wafer-side, rigidity of the spindle side and OF linear precision have both been improved. The drive section has been designed to facilitate maintenance.

(4) Shorter wafer replacement time

Wafer replacement can be done at a rate of 20 sec/2 wafers. The major modification has been to change the stepping motor that had been used for the grinding Y and Z axes to an AC servo motor, which improves replacement speed. Besides, air cylinders which have been used in the transfer system were replaced by electric cylinders.

(5) Wafer Edge Non-contact Alignment Unit

The use of a non-contact method for aligning the wafer edge accommodates wafers that are easily breakable. This as well as improvements made in alignment precision serve to increase yields.

(6) Wafer Size Changes

The alignment method referred to above allows the machine to accept wafers of different sizes by replacing the grinding table, and changing the coolant nozzle position, the alignment sensor position and the recipe. This reduces the amount of down time when changing the wafer size.

(7) Applicable Wafer Sizes

The machine accommodates a wide range of sizes: 4” and 6”

(8) Thickness Measuring Unit Contact type. Capable of single-point measurement at wafer center. Since the grinding table and wafer thickness differential corresponds to the amount of wheel chamfering, it has been possible to improve surface width.

(9) Transfer System

The circular belt transport has been overhauled so that all transport is now performed by vacuum suction, minimizing wafer contamination.

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(10) Linear Guide

The linear guide used in the grinding unit is now an oil-free design that enables long-term, maintenance-free operation.

(11) Improved Wheel Specifications and Maintenance

The 200 mm circumference grinding wheel with standard thickness of 20 mm allows multiple grooves to be added. The spindle position has been moved to the left front of the machine, making replacement work easier and improving maintenance performance. By attaching an air spindle for notch grinding, a wafer notch can be chamfered.

(12) Water Splash Prevention

Bellows-type shutters are located in the grinding unit to prevent water from splashing while wafer grinding is in progress.

(13) Wafer Clean & Dry unit

Simple cleaning and drying of a single side of a wafer

(14) Operation Box The commercial 15-inch LCD touch panel makes processes easier to operate and adjust. Refer to the exterior view diagram at the end of this document.

(15) Setting Up Grinding Conditions

Specific grinding conditions can be entered as digital settings. The range of programmable conditions includes wafer diameter, OF conditions (number of OFs, length, corner R, and θ orientation), number of grinding cycles, grinding speed, grinding width, and grinding wheel position.

(16) Display Unit

Flow rate and pressure (normal/back pressure) metrics are all displayed on the LCD panel for better visibility when checking gauge readings.

(17) Automatic Measurement Function

The machine provides a function for automatically taking thickness measurement, centering and grinding the wafer placed in the wafer tray (1 slot at the machine’s left side). This eliminates the need to insert the wafer into a cassette for performing the measurements and adjustments described above.

(18) Wafer diameter measurement feature The machine measures diameter of a chamfered wafer. (OK/NG quality judgment, measured data

save) (19) Reduced Wiring I/O System

All on/off signals are communicated through a 2-cable wiring system. This results in fewer wires and connectors than in existing I/O wiring, and also simplifies the system since DC power lines and signal lines are connected to a common terminal location. As on the PLC, LEDs are provided for verifying the on/off status of the machine.

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【5】 Specifications № Item Specification Std. OP Remarks

1 Wafer size φ4″,φ6″ OF φ4″,φ6″

2 Wafer crystal axis shape V-notch φ4″,φ6″ Ge

3 Material Glass 300μm-1,000μm

4 Wafer thickness At least 250μm

No. of cassettes 4 cassettes Upper/lower 2 slots x 2

Cassette guide Designed based on customer’s specifications

Setup per cassette Setup of cassette to be used

Can specify 2C-2C or 4C supply/storage cassette

Slot pitch 4.76 mm, 6.35 mm, etc. Parameter setup availableCassette specification No. of slots Max 25 slots Parameter setup available

Drive method Electric cylinder θ axis

Effective angle 250° Drive method Stepping motor R axis

Retracting axis Effective stroke 330mm

Drive method Electric cylinder Z axis

Effective stroke 590mm

5 Center Arm Unit

Wafer retention method Bottom surface suction instrument Linear gauge Pressure 40g or less Resolution 1μm Repeatability ±1μm

Thickness measurement device

No. of meas. points

Single point at center

6 Thickness Measuring Unit

Contact type 1 center-point

Drive method Air cylinder

Alignment method Wafer edge, non contact method

Utilizes the Fine Alignment Unit Capable of OF & IF detection Bottom surface suction

Alignment device Line CCD sensor

Resolution 1 µm

Alignment precision± 30 µm or less (for edge non-contact)

Wafer eccentricity May not conform to spec, depending on actual wafer edge. Some transparent wafers may not be detectable.

Alignment Method

Wafer size change By changing the sensor position

Manual

Drive Electric cylinder Stroke 660mm X axis Resolution 1μm Drive Electric cylinder

Stroke 210mm

7 Alignment Unit

Supply Transfer Unit

Z axis Resolution 5μm

When using WBM-2100

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Wafer transfer method

Directly transferred to the grinding table after fine alignment

Wafer upper surface suction

Drive method AC servo motor Drive range 360°

Alignment θ axis

Resolution 0.001° (360° / 360,000 )

No. of grinding axes 1 axis When using WBM-2100 Drive method AC servo motor Control resolution 0.036° (360° / 100,000 ) Repeat precision ± 1 min.

θ axis

Horizontal runout 10 µm or less Drive method AC servo motor Stroke 185 mm Control resolution 1 µm (2 mm/2,000)

Y axis

Repeat precision ± 2.5 µm Drive method AC servo motor Stroke 50mm Control resolution 0.1 µm (5 mm/50,000)

Z axis

Repeat precision ± 3 µm

For vertical movement

Method Bellows type full cover Drive method Air cylinder

Grinding fluid splash protection Function

With grinding table wash function

Using air & water Can set number of spins

Circum. Output near wheel Change coolant nozzle position when switching wafer size. Coolant nozzle

Notch Output from back of wheel

8 Grinding Unit (Wafer side)

Drain pot Auto drain feature For the grinding table vacuum line

9 Number of grinding axes 1 axis When using WBM-2100

Drive method Motor built-in spindle Inverter motor

Spindle taper runout 2 µm or less

Spindle bearings Angular ball bearings

Spindle lubrication Grease injection

Spindle max. rpm 5,000 rpm When using 200 mm wheel

Max. wheel periphery speed

2,500 m/min or greater

When using 200 mm wheel Max 7-speed Fixed setting

Mountable wheel specifications

φ200mm t=20mm IDφ30mm SUS

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Edge spindle specification High-speed φ200ｍｍ

Wheel mounting nut t=20mm Domed cap nut (1) included

Drive Air turbine

Spindle circum. runout 10μm

Wheel mount method Collet chuck method

Max. spindle rpm 80,000rpm

Max. wheel periphery speed

450m/min When using 1.8mm wheel

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Grinding Unit (Wheel side)

Notch spindle specifications

Mountable wheel specifications

O.D.φ4.2mm±0.1mm I.D.φ1.8mm t=13mm

Mounting axis diameter 3mm

For 1 axis (1 each) When using WBM-2100 12 Grinding table

φ4″ Black ceramic coating

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φ6″ Black ceramic coating Drive method Electric cylinder

X axis Effective stroke

340mm

Drive method Electric cylinder Z axis Effective

stroke 100mm

When using WBM-2100 13 Waste Transfer Unit

Wafer retention method Upper surface suction

Wash nozzle Top surface Washer dryer unit (Single side, simple washing & drying)

Dry nozzle Top and bottom surfaces

θ axis AC servo motor 1,500rpm 14 Washer dryer unit

Wafer retention method Suction to lower surface of wafer

Vacuum suction table for 4” and 6” wafers

Black ceramic coating

Control PC control Grinding unit positioning control method

Screen display 15-inch LCD panel

Input Touch panel Windows screen

Unit Digital setting

Grinding conditions User defined settings

Ground wafer count Counter

15 Electrical box (Control box located in upper part of machine)

Function Saving recipe, machine data USB

Grinding conditions setup

50 programs

No. of grinding cycles

1 - 8 (passes)

No. of OFs 0 - 8 (8 places)

OF length 0 – 60 mm

OF angle -359.999 – +359.999

Corner R 0.01 - 50.00 mm

Grinding speed 1 - 100mm/sec

Wafer diameter According to spindle specification

No. of wheel slots TBD

Wheel periphery speed

According to spindle specification

Notch depth 0.5 - 1.3mm

Notch angle 55° - 125°

Notch bottom R 0.9 - 2.5 mm

16 Setup for wafer grinding conditions

Notch shoulder R 0.01 - 9.99 mm

17 Signal lamp (with buzzer, adjustable (manual) sound volume)

3-color Note 1

18 Safety cover Full cover With interlock φ4″ －－ Supplied by the customer

19 Master wafer φ6″ －－ Supplied by the customer

20 Vacuum suction specification CONVUM specification

Drop in source pressure

Spindle air turbine for notch rough grinding

21 Pressure display (normal/back pressure)

Spindle air bearing for notch rough grinding

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For center arm vacuum

For alignment table vacuum

For supply transfer vacuum

For grinding table suction vacuum

For waste transfer vacuum

For wash/dry table vacuum

For edge grinding coolant

For built-in spindle cooling water

For notch grinding coolant

22 Flow display

Wash water for washer/dryer

Auto thickness measurement

Auto centering measurement 23 Single wafer grinding and automatic measurement functions

Single wafer grinding

1 wafer stage

Normal grinding mode 24 Grinding method Normal grinding

Spiral grinding Diameter meas. before grinding Utilizes the alignment sensor

25 Measurement function Diameter meas. after grinding Utilizes the alignment sensor

26 International standards compliance None 27 Display language English 28 Air gun, water gun, standard tools 1 each (supplied)

29 Cassette For each wafer size －－

Supplied by the customerIf cassettes are not supplied, the machine will perform single-wafer grinding.

30 Grinding wheel (for edge) φ200mm t=20mm SUS －－ Supplied by the user

31 Grinding wheel (for notch) ODφ4.2mm±0.1mm φ1.8mm t=13mm Shaft to be attached: φ3mm

Supplied by the user

Wafer vacuum arm x 1 For center arm 32 Included consumables

Vacuum pad x 3 For waste transfer arm

Options listed above may not be available depending on the combination. Detailed specifications will be determined through

consultation.

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Note 1) Signal lamp status specification (Daitron standard specification) Status definitions

Machine status is divided into the following eight categories: Standby; Maintenance; Auto run; Some cassette end; All

cassette end; Ending; and Error (Warning, Alarm, Emergency), and Warm up.

● Standby

Machine is ready for operation, but there is no activity and no other status is active.

● Maintenance

Maintenance operation from the maintenance screen is in progress.

● Auto run

At least one unit in the machine is running in auto mode and is not in one of the following states.

● Some cassette end

At least one part of the machine is running in auto operation, and at least one cassette is empty or full. In this state,

the operator can switch out a cassette.

● All cassette end

At least one part of the machine is running in auto operation, and all cassettes are full or empty. In this state, auto

operation cannot continue unless the operator either supplies wafers or transfers them.

● Ending

The Stop PBS is pressed during process, and the process is stopped. (All wafers are unloaded before the process is

stopped.)

● Error

An error was detected in an operating part of the machine, and operator involvement is required in order for operation

to continue. When an error occurs, this overrides all of the other states described above.

● Warm up

The grinding unit only or a whole machine is warming up.

Status Indicators

The status display can be changed using the screen below.

* Modification of any of the foregoing shall be worked out through consultation.

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【6】 Grinding Conditions

Confirmation Items: The customer is requested to fill in the blank spaces below with the figures that are being specified.

Incoming Wafers Wafer size [inch] φ4 φ6 Diameter [mm] 100.06±0.05 100.06±0.05 OF length [mm] 31.5±2.0 44.0±2.0 IF length [mm] －－

IF angle relative to OF (clockwise) [ ] －－

Wafer thickness [μm] 260±10 320±10

Processed Wafers Wafer size [inch] φ4 φ6 Diameter [mm] 100.0±0.05 100.0±0.05 OF length [mm] 32.0±1.0 45.0±1.0 IF length [mm] －－

IF angle relative to OF(clockwise) [ ]

－－

【7】 Grinding Precision

Inspection Item Inspection Standard Measurement Instrument Grinding chamfer width precision (Circum., notch)

±40 µm (lapped wafer with 22 chamfering angle)

Edge profiler or microscope

Crystal axis precision

10 min. or less X-ray measuring device or chamfer width measurement after processing

OF linearity 10 µm/57.5 mm Normal grinding

Diameter precision

± 20 µm or less Grinding precision of at least the alignment precision is required to ensure this amount of precision at the wafer diameter. For elliptical incoming wafers, grinding amount must be increased further, in excess of the elliptical dimensions.

Digital calipers

Notch depth precision ± 20 µm or less Edge profiler Notch angle precision ± 0.5° or less Edge profiler Notch bottom R precision ± 0.1 mm Edge profiler Roughness To be determined through discussion To be determined.

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【8】 Production Time

● Wafer change time: At least 20sec- (may be longer depending on the setting for wash/dry time)

● Wafer grinding time is determined by the wafer periphery speed.

Wafer diameter x Wafer grinding time =

Wafer periphery speed+ Wheel movement time

● Cycle time Since loading and unloading are performed during grinding, cycle time is expressed as follows: Cycle time = Grinding time + wafer exchange time

【9】 Wafer Grinding Flow Chart

Cassette loading ・・・ Supply wafers from four cassettes

Wafer loading ・・・ Transport via center arm

Wafer Thickness Measurement

・・・ Wafer thickness measurement

(Contact, Center-point)

Fine alignment ・・・ Fine alignment (edge non-contact)

Wafer diameter measurement (edge non-contact)

Grinding ・・・ Edge grinding (form wheel)

Notch grinding

Wafer Clean & Dry ・・・ Simple washing & drying

Wafer Diameter Measurement

・・・ Diameter measurement

(edge non-contact)

Wafer Transfer ・・・ Transport via center arm

Unloading to cassette ・・・ Storage into four cassettes

(returned to the same slot of the same cassette)

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【10】 General Specifications

1． Size 1,200 (W) x 1,300 (D) x 2,150 (H) mm

(excluding signal tower and operation box)

Exterior View Diagram (DWG. No. 3B60191) is attached. 2． Weight 1,700 kg

Power voltage 3-phase 4-wire, AC460V (power source terminal with cover) Breaker 50A frame for machine’s main power supply;

20A earth leakage circuit breaker 3． Power consumption Rated power consumption: approx. 5 kVA The following specifications are for one axis. 4． Grinding water(pure water) supply

・ Supply pressure 0.2MPa (2.0kgf/cm2) ・ Volume consumed 3L/min ・ Temperature 20C°±2C° (No temperature fluctuations. Processing precision may be

impacted if fluctuation occurs.) ・ Coupling O.D.φ12mm, I.D.φ9mm Nylon tube ・ Connection Rear View Drawing-a

5． Build-in spindle cooling water (Supply) ・ Supply pressure 0.2MPa (2.0 kgf/cm2) ・ Volume consumed 2L/min ・ Temperature Within -5 °C of ambient temperature (no temperature fluctuations) ・ Coupling O.D.φ10mm, I.D.φ6.5mm Urethane tube ・ Connection Rear View Drawing-b

6． Build-in spindle cooling water (Drain to the factory) ・ Connection O.D.φ10mm, I.D.φ6.5mm Urethane tube ・ Connection Rear View Drawing-c

7． Washing water (Supply) ・ Supply pressure 0.2MPa (2.0 kgf/cm2) ・ Volume consumed 1.5L/min ・ Temperature Within -5 °C of ambient temperature (no temperature fluctuations) ・ Coupling O.D.φ12mm, I.D.φ9mm Nylon tube ・ Connection location Rear View Drawing-d

8． Main Air (Supply) ・ Supply pressure 0.55MPa (5.6 kgf/cm2) ・ Volume consumed 595NL/min ・ Coupling O.D.φ16mm, I.D.φ10mm Urethane tube ・ Connection location Rear View Drawing-e

9． Notch spindle air supply ・ Supply pressure 0.55MPa (5.6 kgf/cm2) ・ Volume consumed 160NL/min ・ Coupling O.D.φ12mm, I.D.φ8mm Urethane tube ・ Connection location Rear View Drawing-f

10． Grinding table vacuum generator (Exhaust) ・ Connection O.D.φ12mm, I.D.φ8mm Urethane tube ・ Connection location Rear View Drawing-g

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11． Washing table vacuum generator (Exhaust) ・ Connection O.D.φ12mm, I.D.φ8mm Urethane tube ・ Connection location Rear View Drawing-h

12． Waste transfer arm vacuum generator (Exhaust) ・ Connection O.D.φ12mm, I.D.φ8mm Urethane tube ・ Connection location Rear View Drawing-i

13． Grinding unit & Washing unit (Exhaust) ・ Exhaust volume 1m3/min or more ・ Port diameter VP75 PVC pipe (O.D. 89mm, I.D.77mm) ・ Connection location Rear View Drawing-j

14． Water discharge ・ Connection Hose (O.D.φ62mm, I.D.φ50mm) ・ Connection location Rear View Drawing-k

15． Vacuum source Vacuum generator specification 16． Painting color R4-383 (Daitron standard color); Japan Paint Manufacturers Assoc. (JPMA) 17． Operating environment

・ Temperature 23 C°±2 C°(no daily fluctuations) ・ Humidity 80% or less Note: Depending on the relationship between ambient temperature and humidity, condensation

may still form even if temperature remains within the range given above. Therefore, be advised to maintain a temperature differential of 5C or less between ambient temperature and grinding water

【11】 Warranty Period

For the period of one year after the final inspection at the time of delivery, a malfunction in performance or operation clearly deriving from a defect in the Manufacture’s design or manufacturing shall be repaired at no cost. In regard to software, there may be instances in which a charge will be applied on problems identified after the free warranty period has elapsed.

【12】 Warranty Range

If, during the warranty period described above, a malfunction occurs in the course of normal usage of the product that was in accordance with this operator’s manual, the defective part of such mechanism shall be replaced or repaired at no cost. The following shall be excluded from the warranty range.

(a) Careless handling or erroneous operation by the user (1) Usage that does not conform to the operator’s manual (2) Handling under environmental conditions exceeding the specifications

(b) Cause of the malfunction is due to the fault of someone other than the vendor (c) Modifications or repairs were made by someone other than the vendor (d) Natural or other disasters over which the vendor has no control

【13】 Acceptance Conditions

This machine shall be confirmed and tested on items specified in advance by the customer by Daito Electron Co., Ltd.; EM Business Division at its Machida Factory (initial pre-delivery acceptance inspection) and at the customer’s factory (secondary on-site acceptance inspection) where the same specified items

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shall be confirmed and tested at the customer’s factory for the second and final acceptance. The inspection will be completed at the point when the customer’s representative has confirmed continuous machine operation. Basic conditions for acceptance inspections

(1) These specifications must be fulfilled. (2) There must be no errors throughout continuous loading of 100 wafers. (3) When quality checking 25 processed wafers, all must be within processing tolerances.

【14】 Other

For items not established in these specifications, details shall be worked out through consultations. Changes made by mutual consent shall be submitted as revised specifications. Where no mention is made, Daitron specifications shall apply.

【15】 Additional Notes

Specifications concerning regulations In the event that laws or requirements for specific facilities apply, the machinery and devices described in these specifications shall satisfy the standards established thereby. Examples are the Pollution Prevention Act, Factory Location Law, City Planning Law, Building Standard Law, Electricity Enterprises Law, Occupational Health and Safety Law, Factory Regulations, High Press Gas Safety Law, Poisonous and Deleterious Substance Control Law, Fire Prevention Law, and administrative notices issued by construction-related government agencies.

【16】 Documents to be Submitted (two copies each, regular paper)

1. Final Specifications 2. Inspection Results 3. Operator’s Manual 4. List of Component Parts 5. Consumable Parts List 6. Maintenance Manual 7. Electrical Diagram 8. Parts Manual (Catalogue)

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【17】 Exterior View 1 (4 cassette specification)


【18】 Grinding table approval drawing