The reference inspection system in the market

Leading wafer producers rely on qualified solar wafers from Hennecke More than 80% of all solar wafers in the world are inspected by Hennecke WIS Highly accurate measurement and control systems lead to highest level of process controlling

The crucial measurement technology that adds real value to a Manufacturing Execution System (MES)

Enhancement of proven technology ensures best wafer inspection

Highest accuracy

Highest throughput with highest measurement accuracy 0.6 sec/wafer cycle time Certified and highly qualified solar wafers secure net earnings Lowest breakage rate minimizes operating costs Accurate measurement process maximizes the benefit of automated wafer inspection

Customization and available upgrades turn the modular HE-WI-06s into a long lasting investment

Highest precision and best uptime – made by Hennecke

Fast and fully automated change of all sizes and formats including diamond wire and slurry

Maximized uptime due to highly reliable, qualified and industry proven modularized technologies

The HE-WI-06s is fully dwc compatible (automatic adjustment to “changing shiny wafer” surfaces)

Optional advanced dwc Saw Mark 2 measurement Optional transflection technology (TFC) reliably detects µ-cracks

Wafer Inspection System HE-WI-06sWafer quality control – Best technology for most reliable inspection results

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Wafer Inspection ModulesHE-WI-06s

The following parameters are measured with highest accuracy:

Thickness / TTV Saw Mark / Roughness

Edge defect Chip Resistivity*

*optional

Photoluminescence module HE-PL-02

Applications Analysis of ingot casting Incoming QC in cell fab Prediction of wafer efficiency

Strengths Segregation of multicrystalline wafers Unmatched picture quality at full throughput 14 bit color depth

Key features Machine: integrated into Hennecke wafer inspection and sorting system or stand-alone solution

Wafer type: mono, mono-like and multi wafers

Grinding ScanningMeasuring Cropping Slicing /

CleaningQuality control

Cell productionGluing

Stain µ-cracks / Inclusions Geometry Sori, Bow Lifetime* P/N type* TFC*

Perpendicular Edge Detection module HE-PED-03

High accuracy analysis of wafer edges Hennecke unique feature: inspection of chamfers

No manual inspection of wafers needed any more

Camera

Laser

Wafer

Filter

Wafer

Edge defect

Detection of chipping

Detection of breakage

Loading devices

Double indexer HE-DI-03

Fewer operators needed Semi-automatic module Magazine suitable for three carriers with 25 wafers each or two carriers with 50 wafers each

Optional: adaptable for the use of carriers with up to 120 wafers

Alternating unloading process Easy upgrade for existing systems

Double indexer HE-DI-04

Like HE-DI-03, including automated carrier flipping device

Loading & Sorting

Grinding ScanningMeasuring Cropping Slicing /

CleaningQuality control

Cell productionGluing

Sorting devices

Sorting module HE-WS-04

Fewer operators needed Wafer sorting according to measured quality Polysterene boxes for all relevant wafer sizes 6 single boxes are mounted on two sides One additional output for breakage is available at the end of the last module

Operators have to replace full box(es) with empty one(s)

Easy upgrade for existing systems Up to 3 modules can be added to a WIS

Sorting module HE-WS-05

Like HE-WS-04, but up to 3 single boxes are replaced by quad boxes (stack of 4 regular boxes) to increase sorter capacity

2820 1200 350

5485

1115

100

0 ±

20

OptionsSaw Mark measurement

Saw Mark 2 including roughness (up to 3 lines on each wafer side)

Optional Saw Mark 1 with up to 10 lines on each wafer side (Matrix Saw Mark)

High speed automation and measurement

Increase of effective throughput Reduction of CAPEX and expenses for large factories

MES

Connection to various Manufacturing Execution Systems (MES) possible

Transflection technology

New transflection technology based on NVCD detects µ-cracks on all wafers

InGaAs camera ensures higher sensitivity Set-up utilizes the characteristics of wave guides Installable inside the WIS or as additional module Reduced number of Saw Mark patterns Cracks are visible over the full length Best performance on dwc and multi-wafers

Grinding ScanningMeasuring Cropping Slicing /

CleaningQuality control

Cell productionGluing

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Meyer Burger (Switzerland) AG, sales@meyerburger.com, www.meyerburger.comDesigned and manufactured by Hennecke Systems GmbH

Standard technology

Transflection technology