we’re a “how to design, package & assemble complex medical ... · we invested in advanced...
TRANSCRIPT
Wersquore a ldquohow to designpackage amp assemblecomplex medical amp biotechdevicesrdquo company that puts apremium on service
Microelectronic subassemblies
Class II amp Ill implantables amp wearables
Custom sensors amp transducers
Microfluidic ultrasound amp disposable devices 4084960222
High-resolution imaging arrays
Cameras amp diagnostic equipment
Figure 1 Overall Heterogeneous Assembly Process
Letrsquos conquer your device design packaging and assembly hurdles together Wersquoll work with you one-on-one starting from whatever you bring us even if itrsquos just concept drawings to solve challenges like these
bull Build an assembly operation to run the increased number and type of processes required by unique devices with a high quantityvariety of components
bull Accommodate unusual electrical requirements such as very high currents (hundreds of amps) low currents (picoamps) low voltages or extreme electronic and noise minimization
bull Reduce assembly temperature below 240degC ndash sometimes as low as 40degC
bull Place parts with high accuracy and precision
bull Seal interfaces to prevent liquids from leaking when the volume for analysis is small or the liquid is potentially harmful to the device user or environment
bull Modify equipment fixtures and processes to economically build a small number of units while planning for the ramp to production volumes
bull Provide systems to track monitor gather store and report information required for medical devices
Implantable RFID Chips
Heterogeneous assembly services as specialized as your devices To offer heterogeneous assembly services we mastered combining a wide variety of electronic and microelectronic assembly technologies like wafer backgrinding and sawing multiple die-attach processes mechanical component attach low temperature processes overmolding test etc We invested in advanced equipment for SMT chip-on-board flip chip sealing and more Developed the skills to achieve accurate placement minimal voiding adhesive flow control etc In the contract manufacturing sector for 35+ years wersquove become one of the few companies offering heterogeneous services to get your devices to market faster
Heterogeneous Assembly Process Overview
Specialized Parts
SMT Assembly From
SMT Process
Wafer Processing Through Die Attach amp Wire Bond Flow
Specialized Part Placement amp Attach
4084960222
Quality and compliance is evident in everything we do bull Class 100 and Class 1000 cleanrooms
bull Pre-production support control plans custom manufacturing processes
bull Medical market process verifications
bull Vendor audits and qualifications
bull IQ OQ and PQ for processes and equipment
bull pFMEA development
bull FDA Title 21 Part 820 FDA compliance
bull Certified operator training program
bull S-2020 ESD compliance
bull Full lot traceability and C-of-Cs
bull Tight quality and environmental controls for consigned and turnkey materials
ISO 90012015 Certified ISO 134852016 Certified IPC-A-610 Class 3
Standard or custom packages and devices bull Air cavity plastic QFNs overmolded plastic QFNs
and DFNs
bull Overmolded legacy packages (PDIP SOIC SSOP)
bull Chip-on-Board
bull Flexible circuits
bull Solder-sealed hermetic (side brazed flat packs ceramic pin grid arrays)
bull Glass-sealed (CERDIP CERQUAD CERPACK)
bull Ball grid array (tinlead lead free SAC305)
bull MCM RF modules CSP MEMS
bull SIPS 2D 25D 3D stacked die MCM
bull Image sensors
bull Optoelectronics and photonics
bull Class IIIII medical or implantables
bull Biomedical lab-on-a-chip and sensor microelectronics
bull Microfluidic devices
ndash
ndash
ndash
ndash
ndash
ndash
ndash
ndash
ndash
ndash
ndash
SERVICES
Processing packaging amp heterogeneous assembly bull Wafer thinning and dicing
Wafers up to 300mm (12 inches)
Backgrinding to as thin as 25 um
Pre-saw die-attach film application
Dual-spindle saws for complex dicing
Custom thinning and sawing for AlN glass and ceramic
ldquoPizzardquo wafers and shuttle-die processing
Controlled water resistivity
bull Si SiGe GaN InP wafer processing
bull Die plating
bull Die attach film (electrically or thermally conductive and non-conductive)
bull Automated die attach with better than 10 micron accuracy
bull Flip chip and micro BGA placement
bull Fine-pitch wirebonding (Au ball AI wedge Au wedge)
bull Precision encapsulation and dispense
bull Overmolding of die on lead frames or substrates
bull Laser marking
bull Lead trimming forming and finishing
bull Specialized cleaning processes (plasma ultrasonic aqueous with or without saponifiers)
bull Automated SMT lines
High-speed chip shooter
gt= 01005 component placement
Water-soluble and ldquono cleanrdquo solder flux options
RoHS-optimized reflow ovens
bull Class 100 1000 and 10000 humidity-controlled cleanrooms
Engineering bull Custom-engineered process flows
bull Fixture and tooling design
bull Package design
bull Material selection expertise
bull Microelectronics miniaturization
bull Seamless transition from prototype to production
Test amp measurement bull Statistical process control metrics
bull Laser vision solder paste measurement
bull X-ray
bull CSAM
bull XRF
bull Fine and gross leak test
bull Ball and die shear
bull Wire bond pull
bull Automated optical inspection
Production bull Supply chain management and turnkey procurement
bull State-of-the-art production equipment
bull Automated production lines optimized for medical device assembly
bull Facilities in Silicon Valley and San Diego California
3075 Oakmead Village Drive Santa Clara CA 95051 | 4084960222 | wwwpromex-indcom
copy 2018 Promex Industries Inc
Figure 1 Overall Heterogeneous Assembly Process
Letrsquos conquer your device design packaging and assembly hurdles together Wersquoll work with you one-on-one starting from whatever you bring us even if itrsquos just concept drawings to solve challenges like these
bull Build an assembly operation to run the increased number and type of processes required by unique devices with a high quantityvariety of components
bull Accommodate unusual electrical requirements such as very high currents (hundreds of amps) low currents (picoamps) low voltages or extreme electronic and noise minimization
bull Reduce assembly temperature below 240degC ndash sometimes as low as 40degC
bull Place parts with high accuracy and precision
bull Seal interfaces to prevent liquids from leaking when the volume for analysis is small or the liquid is potentially harmful to the device user or environment
bull Modify equipment fixtures and processes to economically build a small number of units while planning for the ramp to production volumes
bull Provide systems to track monitor gather store and report information required for medical devices
Implantable RFID Chips
Heterogeneous assembly services as specialized as your devices To offer heterogeneous assembly services we mastered combining a wide variety of electronic and microelectronic assembly technologies like wafer backgrinding and sawing multiple die-attach processes mechanical component attach low temperature processes overmolding test etc We invested in advanced equipment for SMT chip-on-board flip chip sealing and more Developed the skills to achieve accurate placement minimal voiding adhesive flow control etc In the contract manufacturing sector for 35+ years wersquove become one of the few companies offering heterogeneous services to get your devices to market faster
Heterogeneous Assembly Process Overview
Specialized Parts
SMT Assembly From
SMT Process
Wafer Processing Through Die Attach amp Wire Bond Flow
Specialized Part Placement amp Attach
4084960222
Quality and compliance is evident in everything we do bull Class 100 and Class 1000 cleanrooms
bull Pre-production support control plans custom manufacturing processes
bull Medical market process verifications
bull Vendor audits and qualifications
bull IQ OQ and PQ for processes and equipment
bull pFMEA development
bull FDA Title 21 Part 820 FDA compliance
bull Certified operator training program
bull S-2020 ESD compliance
bull Full lot traceability and C-of-Cs
bull Tight quality and environmental controls for consigned and turnkey materials
ISO 90012015 Certified ISO 134852016 Certified IPC-A-610 Class 3
Standard or custom packages and devices bull Air cavity plastic QFNs overmolded plastic QFNs
and DFNs
bull Overmolded legacy packages (PDIP SOIC SSOP)
bull Chip-on-Board
bull Flexible circuits
bull Solder-sealed hermetic (side brazed flat packs ceramic pin grid arrays)
bull Glass-sealed (CERDIP CERQUAD CERPACK)
bull Ball grid array (tinlead lead free SAC305)
bull MCM RF modules CSP MEMS
bull SIPS 2D 25D 3D stacked die MCM
bull Image sensors
bull Optoelectronics and photonics
bull Class IIIII medical or implantables
bull Biomedical lab-on-a-chip and sensor microelectronics
bull Microfluidic devices
ndash
ndash
ndash
ndash
ndash
ndash
ndash
ndash
ndash
ndash
ndash
SERVICES
Processing packaging amp heterogeneous assembly bull Wafer thinning and dicing
Wafers up to 300mm (12 inches)
Backgrinding to as thin as 25 um
Pre-saw die-attach film application
Dual-spindle saws for complex dicing
Custom thinning and sawing for AlN glass and ceramic
ldquoPizzardquo wafers and shuttle-die processing
Controlled water resistivity
bull Si SiGe GaN InP wafer processing
bull Die plating
bull Die attach film (electrically or thermally conductive and non-conductive)
bull Automated die attach with better than 10 micron accuracy
bull Flip chip and micro BGA placement
bull Fine-pitch wirebonding (Au ball AI wedge Au wedge)
bull Precision encapsulation and dispense
bull Overmolding of die on lead frames or substrates
bull Laser marking
bull Lead trimming forming and finishing
bull Specialized cleaning processes (plasma ultrasonic aqueous with or without saponifiers)
bull Automated SMT lines
High-speed chip shooter
gt= 01005 component placement
Water-soluble and ldquono cleanrdquo solder flux options
RoHS-optimized reflow ovens
bull Class 100 1000 and 10000 humidity-controlled cleanrooms
Engineering bull Custom-engineered process flows
bull Fixture and tooling design
bull Package design
bull Material selection expertise
bull Microelectronics miniaturization
bull Seamless transition from prototype to production
Test amp measurement bull Statistical process control metrics
bull Laser vision solder paste measurement
bull X-ray
bull CSAM
bull XRF
bull Fine and gross leak test
bull Ball and die shear
bull Wire bond pull
bull Automated optical inspection
Production bull Supply chain management and turnkey procurement
bull State-of-the-art production equipment
bull Automated production lines optimized for medical device assembly
bull Facilities in Silicon Valley and San Diego California
3075 Oakmead Village Drive Santa Clara CA 95051 | 4084960222 | wwwpromex-indcom
copy 2018 Promex Industries Inc
4084960222
Quality and compliance is evident in everything we do bull Class 100 and Class 1000 cleanrooms
bull Pre-production support control plans custom manufacturing processes
bull Medical market process verifications
bull Vendor audits and qualifications
bull IQ OQ and PQ for processes and equipment
bull pFMEA development
bull FDA Title 21 Part 820 FDA compliance
bull Certified operator training program
bull S-2020 ESD compliance
bull Full lot traceability and C-of-Cs
bull Tight quality and environmental controls for consigned and turnkey materials
ISO 90012015 Certified ISO 134852016 Certified IPC-A-610 Class 3
Standard or custom packages and devices bull Air cavity plastic QFNs overmolded plastic QFNs
and DFNs
bull Overmolded legacy packages (PDIP SOIC SSOP)
bull Chip-on-Board
bull Flexible circuits
bull Solder-sealed hermetic (side brazed flat packs ceramic pin grid arrays)
bull Glass-sealed (CERDIP CERQUAD CERPACK)
bull Ball grid array (tinlead lead free SAC305)
bull MCM RF modules CSP MEMS
bull SIPS 2D 25D 3D stacked die MCM
bull Image sensors
bull Optoelectronics and photonics
bull Class IIIII medical or implantables
bull Biomedical lab-on-a-chip and sensor microelectronics
bull Microfluidic devices
ndash
ndash
ndash
ndash
ndash
ndash
ndash
ndash
ndash
ndash
ndash
SERVICES
Processing packaging amp heterogeneous assembly bull Wafer thinning and dicing
Wafers up to 300mm (12 inches)
Backgrinding to as thin as 25 um
Pre-saw die-attach film application
Dual-spindle saws for complex dicing
Custom thinning and sawing for AlN glass and ceramic
ldquoPizzardquo wafers and shuttle-die processing
Controlled water resistivity
bull Si SiGe GaN InP wafer processing
bull Die plating
bull Die attach film (electrically or thermally conductive and non-conductive)
bull Automated die attach with better than 10 micron accuracy
bull Flip chip and micro BGA placement
bull Fine-pitch wirebonding (Au ball AI wedge Au wedge)
bull Precision encapsulation and dispense
bull Overmolding of die on lead frames or substrates
bull Laser marking
bull Lead trimming forming and finishing
bull Specialized cleaning processes (plasma ultrasonic aqueous with or without saponifiers)
bull Automated SMT lines
High-speed chip shooter
gt= 01005 component placement
Water-soluble and ldquono cleanrdquo solder flux options
RoHS-optimized reflow ovens
bull Class 100 1000 and 10000 humidity-controlled cleanrooms
Engineering bull Custom-engineered process flows
bull Fixture and tooling design
bull Package design
bull Material selection expertise
bull Microelectronics miniaturization
bull Seamless transition from prototype to production
Test amp measurement bull Statistical process control metrics
bull Laser vision solder paste measurement
bull X-ray
bull CSAM
bull XRF
bull Fine and gross leak test
bull Ball and die shear
bull Wire bond pull
bull Automated optical inspection
Production bull Supply chain management and turnkey procurement
bull State-of-the-art production equipment
bull Automated production lines optimized for medical device assembly
bull Facilities in Silicon Valley and San Diego California
3075 Oakmead Village Drive Santa Clara CA 95051 | 4084960222 | wwwpromex-indcom
copy 2018 Promex Industries Inc
ndash
ndash
ndash
ndash
ndash
ndash
ndash
ndash
ndash
ndash
ndash
SERVICES
Processing packaging amp heterogeneous assembly bull Wafer thinning and dicing
Wafers up to 300mm (12 inches)
Backgrinding to as thin as 25 um
Pre-saw die-attach film application
Dual-spindle saws for complex dicing
Custom thinning and sawing for AlN glass and ceramic
ldquoPizzardquo wafers and shuttle-die processing
Controlled water resistivity
bull Si SiGe GaN InP wafer processing
bull Die plating
bull Die attach film (electrically or thermally conductive and non-conductive)
bull Automated die attach with better than 10 micron accuracy
bull Flip chip and micro BGA placement
bull Fine-pitch wirebonding (Au ball AI wedge Au wedge)
bull Precision encapsulation and dispense
bull Overmolding of die on lead frames or substrates
bull Laser marking
bull Lead trimming forming and finishing
bull Specialized cleaning processes (plasma ultrasonic aqueous with or without saponifiers)
bull Automated SMT lines
High-speed chip shooter
gt= 01005 component placement
Water-soluble and ldquono cleanrdquo solder flux options
RoHS-optimized reflow ovens
bull Class 100 1000 and 10000 humidity-controlled cleanrooms
Engineering bull Custom-engineered process flows
bull Fixture and tooling design
bull Package design
bull Material selection expertise
bull Microelectronics miniaturization
bull Seamless transition from prototype to production
Test amp measurement bull Statistical process control metrics
bull Laser vision solder paste measurement
bull X-ray
bull CSAM
bull XRF
bull Fine and gross leak test
bull Ball and die shear
bull Wire bond pull
bull Automated optical inspection
Production bull Supply chain management and turnkey procurement
bull State-of-the-art production equipment
bull Automated production lines optimized for medical device assembly
bull Facilities in Silicon Valley and San Diego California
3075 Oakmead Village Drive Santa Clara CA 95051 | 4084960222 | wwwpromex-indcom
copy 2018 Promex Industries Inc