WELCOME TO M&P TC MEETING

Materials & Processes Technical Committee Meeting May 27, 2015, Wednesday

7:00 - 8:00 AM

Room 511, Sheraton San Diego Hotel & Marinna

Agenda• Introduction All• CPMT M&P TC Chair/vice-chair M J Yim• TC Activities 2015-2016 & Monthly newsletters M J Yim• ECTC M&P Subcommittee Diptarka Majumdar/Bing Dang• IEEE CPMT Advanced Packaging Materials (APM) Symp. 2016• Other Conferences and activities• Open for anything else

Attendees (in random order): Eric Perfecto, Diptarka Majumdar, Bing Dang, Kwang-Lung Lin, C.R. Kao, Tanja Braun, Yoichi Taira, M. J. Yim (chair), Jim Morris, Bill Chen, Chin C. Lee (past Chair), Rama & Kimberly (visit from Brewer Science).

http://cpmt.ieee.org/technology/105-tc-materials-a-processes-.html

2015-16 CPMT TC Chair/Vice ChairChair MJ Yim (Intel)Vice-chair Dongwook Kim (Qualcomm)

TC – M&P chair/vice-chair webpage updated by Marsha

Past Chair CC Lee (UC Irvine)Past Vice-chair Daniel Lu (Henkel China)

2015-16 CPMT M&P Committee• CPMT M&P TC Member list (as of 2015)

Member E-mail Expertise RegionTim Chen tim_chen88@hotmail.com Adhesives, underfill ChinaDaniel Lu Daniel.Lu@cn.henkel.com Adhesives, electronic and display materials, processing ChinaSheng Liu victor_liu63@126.com Tthermomechanical and reliability China

Tanja Braun Tanja.Braun@izm.fraunhofer.de assembly processes, polymers Germany

Masazumi Amagai amai@ti.com Wafer Fab, Package Mechnical Modeling JapanAkitsu Shigetou shigetou.akitsu@nims.go.jp Hybrid materials & interconnect Japan

Yoichi Taira taira@jp.ibm.com JapanKyung-Wook Paik kwpaik@kaist.ac.kr Adhesives, 3-D Korea

K. S. Chiang Askschian@ntu.edu.sg SingaporeC. Robert Kao crkao@ntu.edu.tw Solders, 3-D Taiwan

Kwang-Lung Lin matkllin@mail.ncku.edu.tw Solders, interconnect, advanced packaging, EM TaiwanYu-Hua Chen YH_Chen@unimicron.com Taiwan

Rajen Chanchani rajen505@aol.com 3-D, substrates USAWilliam Chen william.chen@aseus.com Electronic packaging & manufacturing USA

Bing Dang dangbing@us.ibm.com 3D, interconnect and packaging, laser processing USAPhil Garrou  p.garrou@ieee.org USA

Dong Wook Kim dwkim@qti.qualcomm.com Solders, 3-D, interconnect USAChin C. Lee, past-Chair cclee@uci.edu Bonding and solders USA

Ning-Cheng Lee nclee@indium.com Solders and soldering processes USAYi Li yi.li@intel.com Substrates, adhesives, materials USA

HongTao Ma hongtaoma@hotmail.com Semiconductor and LED packaging and relaiblity USADiptarka Majumdar diptarka@yahoo.com USA

Mikel R. Miller mrmiller@draper.com materials, mechanics, reliability USAJames E. Morris j.e.morris@ieee.org ECAs; nanotechnologies USA

Govindarajan Muralidharan muralidhargn@ornl.gov USAEric Perfecto perfecto@us.ibm.com Solders, 3-D, interconnect USA

Mark D. Poliks mpoliks@binghamton.edu materials, processing, flexible electronics USA

Dwayne Shirley dshirley@qti.qualcomm.comAdvanced Packaging, EMC, Substrates,

Solder, ReliabilityUSA

Ivan Shubin ivan.shubin@oracle.com 3D, Materials, interconnects USAEphraim Suhir suhire@aol.com Materials physics, modeling USA

Quinn Tong quinn.tong@us.henkel.com USALejun Wang lejunw@qti.qualcomm.com Assembly processing and materials USA

Paul Wesling p.wesling@ieee.org USAC. P. Wong cpwong@cuhk.edu.hk USA

Myung Jin Yim, chair myungjin.yim@intel.comAdhesives, flip chip, 3D TSV and optical

interconnectUSA

Tieyu Zheng tizheng@microsoft.com Mechanics, reliability, thermal USAHongxia Lu hongxia.lu@intel.com USA

USA: 25Taiwan: 3China: 3Japan: 3Germany:1Korea: 1Singapore: 1Total: 37

By 2015: >45By 2016: >50

Increase committee member

Increase more Asia/Europe member

Communications:•A newsletter that covers all the news related to Materials. •The Chair, Vice Chair, and Executive Committee members routinely communicate through e-mail and telephone. •General membership receives announcements for conferences, workshops and symposia. •The highlights of the Materials Conference are summarized in the CPMT newsletter.

Meetings:•TC-5  Committee meets every year during the ECTC Annual Meeting. •TC-5  Committee will try to meet once a year outside of US. •The committee chair communicates with the Board of Governor. •The TC chair attends special meetings called by the TC Vice President to determine the future roadmap of the society. •A teleconference call or material webinar will be conducted when warranted.

Web Assets:•http://sites.ieee.org/cpmt-tc5/ The site is primarily used for general announcements, committee newsletters and conference details.

Conferences:•Materials-related sessions during ECTC (TC-5 sponsors) •International Materials Conference (IEEE-CPMT (TC-5) co-sponsors) held every alternate year •International conferences on specific Materials (from time to time) (TC-5 sponsors) •International Conference on Electronic Materials and Packaging – every year in Asia (rotates between Singapore, South Korea, Japan)

Publications:•The Proceedings of Electronic Components and Technology Conference •The Proceedings of  Materials Conference (TC-5 co-sponsors) •The Transactions of CPMT – TC-5 contributes the technical papers, reviews potential papers for publication and acts as associate editors •The proceedings of Electronic Materials and Packaging (TC-5 co-sponsors)

Collaborative Efforts:•Actively collaborating with IMAPS, American Ceramic Society, American Society of Metals, Society of Plastic Engineers and Materials Research Society •There is a new push to start new collaborative international events.

Volunteers:•TC-5 has approximately 50 volunteers each year (37 as of 2015 list), consisting of the Executive Committee, the conference officers, the session chairs, paper reviewers and associate editors. TC-5 will try to reach out to international members by holding the technical committee meeting once outside of US.

2015-16 M&P TC Committee Activities

Current activities/formats written in TC-5 webpage

CPMT-M&P News Letter Status

MJ Yim

CPMT-M&P TC Web Administrator

2015--- (To be uploaded from Ning Cheng Lee @Indium)

2014•October 2014 News LetterMicrostructure variation – electric current (Kwang-Lung Lin @ National Cheng Kung Univ.)•Sept 2014 News LetterCPMT MP TC Newsletter Sept 2014-Micro pillar compression 2014 (C. R. Kao @ National Taiwan Univ.)•May 2014 News LetterCPMT MP TC Newsletter May 2014 DW KIM – Final (DW Kim @ Qualcomm)

2013•December 2013 News LetterSilver flip-chip technology poster (CC Lee @UC Irvine)•November 2013 News Letter2013_Saint-Venant_CPMT_Materials_TC_120613 (E. Suhr @Portland State Univ.)•October 2013 News LetterIEEE CPMT-TC5 Materials and Process-MJ Yim-Oct-Newsletter-2013 (MJ Yim @Intel)•August 2013 News LetterCMPT MP TC Newsletter Aug 2013 (Paik) (KW Paik@KAIST)

• Need more contribution from M&P members on monthly newsletter to facilitate networking and sharing. => Bimonthly or Quarterly newsletter

• Need volunteer for web administrator from members.

Uploaded Newsletter and Contributors

2015 ECTC: M&P Subcommittee

• Chair Diptarka Majumdar/Bing Dang Number of abstract submissions received Primary 89

Secondary 82Number of abstracts accepted for presentation Oral 35

Poster 15

Sessions Chair DateTime

Adhesives, Underfills, TIMs Lejun Wang May 27 8:00 AM

Tieyu ZhengNovel Materials & Processes Ivan Shubin May 29 1:30

PMMikel Miller

3D Materials & Processing Myung Jin Yim May 28 1:30 PM

Bing DangSolders & Bonding Kwang-Lung Lin May 29 8:00

AMDwayne Shirley

Substrates Dong Wook Kim May 27 1:30 PM

Frank Wei

IEEE CPMT Advanced Packaging Materials (APM) Symp. 2016

• Conflict in 2015 with major packaging events in China• Decided to push out to 2016.• Time/date is TBD, but Shenzhen or Suzhou is recommended for hosting place.• Tim Chen will be general chair.

17th Int’l Conference on Electronic Materials and Packaging (EMAP) 2015

• Sept 1, Sept. 4, 2015• Portland State Univ., Portland, OR,

USA.• Prof. Sung Yi is general chair.