welcome to your digital edition of aerospace & defense...

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Welcome to your Digital Edition ofAerospace & Defense Technology and

Aerospace Manufacturing and Fabrication

Included in This December 2017 Edition: Aerospace & Defense Technology Aerospace Manufacturing & Fabrication

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www.aerodefensetech.com December 2017

From the Publishers of

Inside the Army's WIAMan Test Program

Using Thermoplastics forAerospace Applications

Improving the Surface Finish of Additive Manufactured Parts

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2 Aerospace & Defense Technology, December 2017

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Aerospace & Defense Technology

ContentsFEATURES ________________________________________

4 Power Electronics4 High-Reliability Capacitors8 Test and Measurement8 WIAMan

14 Additive Manufacturing14 Improving the Surface Finish of Additive Manufactured Parts21 Materials: Lightweighting21 Using Thermoplastic Composites for Aerospace Applications

24 RF & Microwave Technology24 Identifying and Isolating Signals Using Radio Frequency

Photonics

TECH BRIEFS _____________________________________

28 Bioinspired Surface Treatments for ImprovedDecontamination: Commercial Products

29 Mechanical Characterization and Finite ElementImplementation of the Soft Materials Used in a NovelAnthropometric Test Device for Simulating Underbody BlastLoading

31 Processing and Characterization of Lightweight SyntacticMaterials

32 High Temperature Graphene-Peek Adhesive 33 Stress Corrosion-Cracking and Corrosion Fatigue Impact of IZ-

C17+ Zinc-Nickel on 4340 Steel

DEPARTMENTS ___________________________________

36 Application Briefs38 New Products40 Advertisers Index

SPECIAL SUPPLEMENT ___________________________

Aerospace Manufacturing and Fabrication(Selected editions only)

ON THE COVER ___________________________________

The Army's new WIAMan (Warrior Injury AssessmentManikin) is the first test dummy designed specificallyfor vertical loading in underbody blast scenariossimilar to those soldiers may experience in combatfrom IEDs. To learn more, read the feature article onpage 8.

(Photo courtesy of Diversified Technical Systems)

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4 www.aerodefensetech.com Aerospace & Defense Technology, December 2017

High-Reliability CapacitorsWhen the Mission Just Can’t Fail

Maintaining technological superi-ority remains critical for na-tional defense forces. Many face

informal adversaries that are adept atharnessing today’s sophisticated civil-ian technologies, like mobiles, M2Mcommunication and social media, tolaunch attacks unexpectedly. Defenseoperations are intelligence-led; re-sponses must be surgical and precision-guided to avoid harming civilians; andevery measure must be taken to avoidinjury to soldiers or loss of equipment.At the same time, government fundingof defense forces, particularly in theWest, is under pressure.

As a result, defense today, more thanever, is about prevention and deterrence,based on intelligence, surveillance infor-mation, and seamless coordination be-tween planners and the teams in the field.At the same time, lives are at stake, andequipment reliability is of paramount im-portance. Every component must betrusted to perform faultlessly over its life-time, from powerful, high-value ICs likegraphics processors and DSPs to discretedevices like capacitors that have numer-ous vital roles ranging from stabilizingpower supplies to blocking noise and con-ditioning analog signals. Procurement au-thorities impose exacting requirementson capacitors in terms of quality assur-ances and screening.

Making the GradeAs the reliability grades of compo-

nents progresses, more screening andtesting is done to ensure that only themost robust parts make it into end users’hands. Figure 1 illustrates the notion.Table 1 illustrates the manufacturing andscreening capabilities that are applied tocomponents from commercial gradeparts, where basic part level and processtesting is done to ensure a high standardof starting quality, all the way through tospace-grade and custom parts.

Ceramic Capacitors Multilayer ceramic capacitors

(MLCCs) are found in many high relia-bility and space applications. Figure 2 il-lustrates some of the most important ap-proval documents for this class of device.

When it comes to the options avail-able to items based on DLA drawings,

Table 1. Capacitor-screening requirements are defined for applications ranging from commercial to space-grade and custom.

Grade Screen and Test options available*

Commercial Basic level testing; KEMET defined qualifications; no PCN

Automotive AEC-Q200 defined qualifications; testing for cap; DF, DWV, IR; PCNs

COTS testing for cap, DF, DWV, IR; PCNs; Voltage Conditioning; DWV and8% max PDA; Certificates of Compliance; Custom Tests, Screens, &Data; Visual Inspection

MIL-PRF testing for cap, DF, DWV, IR; Visual Inspection; Constructed andScreened per MIL specs; Certificate of Compliance; Group Dataavailable; Established Reliability; SBDS; F-Tech; Weibull Grading; DCLeakage; Surge Voltage/Current

Space testing for cap, DF, DWV, IR; Visual Inspection; MIL-PRF-123 & GR-900;MIL-PRF-49470; Compliant to NASA and ESA S-311; Group Data andTesting Summary; Certificate of Compliance; SBDS; F-Tech; WeibullGrading; DC Leakage; Surge Voltage/Current; X-ray; DPA;

Custom Custom In-Process Screening; Custom Group Testing; ApplicationSpecific SCD’s; Group Data and Testing Summary; Material Analyticsand Test Reports; SBDS; F-Tech; Weibull Grading; DC Leakage; SurgeVoltage/Current

*the combination of what tests are done depends on part family type

(DF: Dissipation Factor, DWV: Dielectric Withstanding Voltage, IR: Insulation Resistance, PDA:Percent Defect Allowance, PCN: Process Change Notice, SBDS: Simulated Breakdown andScreening, F-Tech: KEMET’s advanced process methodologies, DPA: Destructive Physical Analysis).

Figure 1. The requirements placed on capacitors become increasingly stringent as end-user applicationsbecome increasingly mission-and safety-critical.

Commercial Automotive COTS MIL-PRFSpaceGrade

Custom TestingBeyond MIL-PRFand Space Grade

Increasing Reliability

Figure 2. Key military test specifications for ceramic capacitors.

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various MIL specifications are applica-ble. Some examples include M55681 forsurface-mount parts, M39014 for leadedcomponents, and M49470 for stackedcapacitors. Various sub-groups of devicetypes may also be defined within thesecategories. From a qualification and lot

release standpoint, extended acceleratedlife testing and LVH testing is applied.Additional screening such as thermalshock tests, shear tests and biased hu-midity may also be required, and thesupplier must be able to comply. Single-lot date code (SLDC) and BR/BX/BP di-

electric options are also available. In ad-dition, KEMET is able to perform in-process inspection and A/B grouping perM123 as well as SLDC and BR/BX/BP op-tions in a variety of termination optionsincluding 70/30 lead/tin, gold, and100% tin.

When a device needs additionalamounts of energy storage capabilities,stacked capacitors provide a proven andeffective solution for those cases wheremuch higher CVs are needed. Stackeddevices are often placed in the inputand output filters of power supplies andin capacitor banks. The number of ca-pacitors in a stack can be customizedand fit to a number of leaded configura-tions, as Figure 3 illustrates, includingsurface mount and through-hole.

Space-grade MLCCs must perform ex-tremely highly in terms of their volu-metric efficiency and lightness, as wellas reliability. Efficient and robust BaseMetal Electrode (BME) technology,combined with X7R and C0G dielectricsallow high capacitance values in ex-tremely small 0402 and 0603 case sizes.

Polymer and TantalumPolymer and tantalum capacitors are

also extremely important in the de-fense/high-reliability market. Their highvolumetric efficiency makes them idealfor applications where a large amount ofcapacitance is needed in a small pack-age. Device manufacturers must followthe strictest reliability standards such asthose outlined in MIL-PRF-55365 forboth MnO2 and polymer-cathode tanta-lum devices targeted for defense andhigh-reliability applications. This sup-

6 Aerospace & Defense Technology, December 2017

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Evans Capacitor Company designs, develops and manufactures the most power dense capacitors in the market today. EVANSCAPS are hybrid wet tantalum capacitors that provide high capacitance, low ESR and high current handling capability in a Hi-Rel, ruggedized package. EVANSCAPS are suitable for Transmit Pulse in Phased Array Radars, Seeker Radar, Jammers, Diode Pumped Lasers and High Power RF Microwave, as well as the more common power hold-up applications.Evans Capacitor Companysupporting virtually all Tier 1 Aerospace and Defense Companies.

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Power Electronics

Figure 3. Stacked capacitors in a variety of config-urations can be qualified for military and high-reli-ability applications.

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ports a robust assurance of the highestlevels of reliability for applicationswhere failure is simply not an option.

In addition to following the militarystandards set out to produce highly reli-able parts, extra methods have been de-veloped to assess the reliability forCOTS polymer electrolytic devices. Asan example, KEMET’s T540 and T541 se-ries have undergone enhanced reliabil-ity assessment. The process is one thatensures reliability levels correspondingto 0.1 percent per 1,000 Hours, 0.01percent per 1,000 hours and 0.001 per-cent per 1,000 hours. The T540 andT541 Series are the first polymer elec-trolytic capacitors available with failurerate options defined by the KO-CAP®

assessment method.The basic principle is to test a signifi-

cant representative sample of each manu-facturing lot ordered with this featureunder accelerated voltage and/or temper-ature conditions to obtain the necessary

unit hours with an Accept/Reject (A/R)Number of 1/2 to demonstrate theclaimed reliability level. As an example,to achieve a reliability level of 0.001 per-cent per 1,000 hours, one failure is al-lowed in 108 accumulated part hours. Forthe lower reliability levels, fewer parthours are required. The acceleration fac-tors are predetermined for each designbased on testing that is conducted undermultiple conditions of temperature and

voltage. The assessed reliability is equiv-alent to steady-state operation at +85°Cand full rated voltage, as are the MIL-PRF-55365 Weibull Failure Rate Estimates.

ConclusionThe rules surrounding high-reliability

electronic equipment cover every aspectof component selection, to ensure thebest possible reliability and long-termsafety. Understanding the diverse re-quirements placed on capacitors de-mands familiarity with a wide range oftest specification that are applicable tovarious device technologies, construc-tion types and functional roles in end-user equipment. Knowing the right doc-uments to reference can be challengingwithout guidance.

This article was written by Wilmer Com-panioni, Technical Marketing Manager,KEMET Corporation (Simpsonville, SC).For more information, visit http://info.hotims.com/65858-500.

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Power Electronics

Figure 4. The latest MLCCs can be deployed indefense, aerospace and space environments.

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The newest crash test dummyin development is actually ablast test dummy. WIAMan(Warrior Injury Assessment

Manikin) is a ground-breaking anthro-pomorphic test device (ATD) being de-veloped by the U.S. Army. It’s the firsttest dummy designed specifically forvertical loading in under-body blast(UBB) scenarios, like the ones soldiersmay experience in combat from IEDs. Akey goal of the program is to develop ascientifically-valid injury criteria forblast testing of military ground vehicles.This test data will be the most advancedof its kind and will be used to developnew, safer vehicles and associatedequipment to help reduce injury risk for

warfighters. Another first coming out ofthis program is the high-tech data ac-quisition system that is entirely con-tained within the dummy, making itthe first completely autonomous deviceof its kind.

WIAMan is a strategically orches-trated collaboration of government, ac-ademia and industry. The prime con-tractor to build both the manikin andthe data acquisition system, and inte-grate them, is California-based Diversi-fied Technical Systems. Known for itsexpertise in biomechanics and automo-tive crash safety testing, DTS manufac-tures miniature data recorders and sen-sors for test labs around the world. Sincethe project started in February 2015,

two generations of prototypes calledTechnical Demonstrators have endureda grueling series of lab tests and blastevent ‘ride-alongs’ in the field.

“Ultimately, WIAMan testing seeks toanswer two life or death questionswhen a military vehicle is attacked in anIED blast,” says Tamer Abubakr, Re-search Engineer at DTS. “First, did thesoldiers survive the blast? Second, caneveryone still fight and get themselvesout of there to safety? So, the better thevehicle is designed to withstand blasts,the better the chance of the soldier’ssurvival.”

Once the final production units aredelivered next year, the Army will beusing WIAMan in live fire tests as much


WIAManHigh-Tech Test Lab Focuses on Saving Soldiers’ Lives

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Aerospace & Defense Technology, December 2017 www.aerodefensetech.com 9

Test & Measurement

as 2-3 times per week. But first WIAManhas to pass an extensive battery of tests.During the past year, WIAMan under-went 90 full body drop tests along witha battery of laboratory tests to measureits response to blast force, accelerationand rotational velocity. Throughoutthat time, virtually every componentfrom the fasteners to the flesh were con-tinually monitored for biofidelity, per-formance and any improvements thatmay help with manufacturability. Get-ting just the right material composition,including the same center of gravity(CG) is critical. Even the foot is a veryspecific ratio of molded pieces of differ-ent densities with an underlying metalstructure to provide the same compres-sion rates of a human foot. Unlike tradi-tional crash test dummies, the WIAMandevelopment path has pioneered theuse of new materials and innovativemanufacturing techniques such as 3Dprinting of production parts. The inge-nuity of the team has paid off not onlyin terms of accelerating an already ag-gressive build schedule, but in perform-ance as well.

While WIAMan is a ground-up newdesign, it is loosely based on the HybridIII 50th percentile male frontal automo-tive crash test dummy that’s been mod-ernized to represent today’s soldier. IfWIAMan could stand upright, he wouldbe 5’10” tall and 185 pounds (84 kg),which is an inch taller and 13 morepounds of muscle than the Hybrid III.

“After these 90 full body drops, thedummy looks like it did the day it rolledoff the showroom floor,” says Abubakr.“It hasn’t been damaged at all. That’s ahuge improvement for the Army that’sconstantly replacing parts on the old Hy-brid III dummy that was designed nearly40 years ago. WIAMan doesn’t havethose issues because it was designed tohandle that type of vertical load.”

The WIAMan Test Lab In spring of 2017, a new 3,000+ sq. ft.

lab located inside DTS headquarters inSeal Beach, California, was built exclu-sively to support the multi-year project.The climate-controlled WIAMan Lab isfurnished with state-of-the-art testequipment that includes a drop tower, alinear impactor and high-speed cameras.

Key to the test lab is a Lansmont122 Shock Test System, which is an11-foot drop tower used to replicatethe vertical impact in a vehicle blast.The drop tower consists of a cast alu-minum plate that replicates highshock pulses like those soldiers mayencounter in combat. There’s also anelectric hoist lift and positioning sys-tem that enables precision repeatabil-ity, an element that is key to any vali-dation testing. One of the major

features designed in WIAMan is thecapability to support up to 146 chan-nels of embedded data acquisition de-signed to measure potential skeletalinjuries. The ultra-small data acquisi-tion systems are distributed through-out the test manikin and connected toa variety of sensors. With all thewiring and cables inside, not only isthe system better protected, it alsoeliminates 146 cables exiting thedummy, which can cause issues sim-

Technical Demonstrators are currently undergoing test and evaluation by the U.S. Army.The high-tech manikin supports up to 146 channels of data acquisition inside thedummy to measure force, acceleration and rotational velocity that a soldier may expe-rience in a vehicle blast.

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Test & Measurement

ply trying to position a dummy in avehicle and can alter test dynamics ifa cable gets tangled or damaged.

The same 5-point harness that’s in aMRAP (Mine-Resistant Ambush Pro-tected U.S. military vehicle) securesWIAMan in the drop tower seat while a200g pulse simulates both the ampli-tude and frequency characteristics ofblast shock. Underneath the drop towerthere are four landing pads withbumpers made of various materials thatcan be adjusted to vary the pulse waves.Load cells in the drop test seat measuremultiple load paths through the pelvisand femur to quantify potential spineand lower extremity injuries. The datacollected includes force, moments, ac-celeration and angular velocity fromsensors located in the pelvis, spine,tibia, foot and heel.

“When running a drop test, we focuson velocity and the ‘time to peak’,” saysAbubakr. “If the dummy is brought to acertain height and dropped free fall, it’s

going to reach a specific velocity at thetime of impact. That’s how the velocityis tuned. The time to peak is howquickly it de-accelerates from that peakvelocity. The bumpers are adjusted andchanged out during different tests totune the ‘time to peak’ and make sureit’s similar enough to a live blast that wecan compare it.”

Linear Impactor TestingLong ago Aristotle understood that "the

whole is greater than the sum of its parts."Using a Cadex Linear Impact Testing Ma-chine SB202, the team has been able to ef-fectively perform iterative testing on a sin-gle component like the pelvis to see how itmay perform or affect the entire dummyafter even small modifications are made.

WIAMan, the first test dummy built specifically forunder-body blast testing, is prepped on the droptower for a validation test that will impart a 200 gpulse for 7 milliseconds, simulating an under vehi-cle blast.

Testing a variation of the WIAMan leg on the linear impact tester helps evaluate how design and engineer-ing changes may affect the overall performance.

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Test & Measurement

“The purpose of the linear impactor isto be able to mount up just the leg orjust the pelvis and obtain similar inputto the whole body test,” says Abubakr.“By testing individual segments we canmake design changes and quickly test it.For example, if a material was changedon the foot, how does that affect the re-sponse? If we’re happy with the results,we can move it to the whole body testand get that same response.”

Each part is instrumented with sen-sors to monitor linear and angular ac-celerations, axis forces and bending mo-ments. The linear impactor accelerates a20kg impact mass to a velocity of 20

meters/sec using a pressurized air tankthat’s connected to a pneumatic actua-tor. An air-brake stops the impact, whilea dual-beam light gate measures thefinal velocity.

High-Speed CamerasIn addition to all the injury data

being collected inside the dummy, mul-tiple high-speed cameras capture all theaction outside. Analyzing gross motormovement in slow motion helps engi-neers better understand the forces sol-diers experience in the field. To do this,the lab is equipped with multiple high-speed cameras to capture the action at

over 100,000 frames/second. ThePhotron FASTCAM Mini AX200 has aGigabit Ethernet Interface for high-speed data transfer and the ability to re-motely switch off cooling fans to elimi-nate any vibration when recording athigh magnifications.

“If we see anything strange in the testdata we can go back to the high-speedcamera and help determine what it is,”says Abubakr. “We also put markers atdifferent joints and on the rest of thedummy body, then we can track thosepoints as they move in space and com-pare it to the human response we’re try-ing to replicate.”

That ‘human response’ is based onextensive biomechanics and cadavericresearch done in partnership with topuniversities throughout the country.Each university focused on key injuryareas primarily in the lower extremi-ties like the spine, pelvis and feet tocreate predictable under-body blastUBB patterns. The data has also al-lowed the team to develop a Finite El-ement Model, an extensive software-based injury library and validatedanalysis techniques.

In June 2017 DTS will be deliveringfour Gen One WIAMans so the Armycan do final testing and approve every-thing before WIAMan goes into produc-tion next year. “An automotive vehiclecrash takes place in 30-40 milliseconds,whereas a military vehicle blast is overin just 5 milliseconds,” says Abubakr.So far, at every stage, WIAMan has suc-cessfully proven its ability to performand consistently deliver data that hasonly the smallest window and literallyone chance to get it right.

The test data WIAMan is responsiblefor has far reaching, life-saving implica-tions not only in the development ofsafer military vehicles, but to familiesaround the world. “Saving lives is thebig motivation for this project and re-ally all of DTS. We’re out there helpingpeople and saving lives and making ve-hicles safer, whether it’s military or au-tomotive,” sums up Abubakr.

This article was written by Randy Boss,Program Manager, Diversified TechnicalSystems (DTS) (Seal Beach, CA). For moreinformation, visit http://info.hotims.com/65858-501.

Multiple high speed cameras in the lab capture test images at 100,000 fps which allows the engineeringteam to track and map data with the movements on camera.

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Improving the Surface Finish of Additive Manufactured Parts

A new chemical immersion treatment could revolutionise the aerospace industry

South West Metal Finishing hasbeen working on an additivemanufacturing surface treat-ment process for the last three

years and believes it could be the futurechoice of aircraft manufacturers around

the world, such as the likes of Safran,UTC Aerospace and Airbus.

Almbrite™ is a chemical immersionprocess designed to modify and en-hance the surface of additive manufac-tured (AM) parts by removing foreign

object debris whilst smoothing andbrightening the surface of a part, as il-lustrated in Figure 1.

Aerospace and defense manufactur-ers have been searching for a surfacetreatment solution since additivemanufacturing started to be used. Oneof the challenges regularly encoun-tered is the poor finish of AM compo-nents. They are often rough orporous, with semi-melted powder par-ticles. That can obviously affect theperformance of the component,which is detrimental when you’remaking an aircraft.

AM uses various techniques to con-struct a three-dimensional object includ-ing direct energy deposition and powderbed fusion processes. AM is a process inwhich a component is built up in dis-creet layers by using a high-energy heatsource to fuse powders. The processesare driven by data from computer aideddesigns (CAD) which are then slicedinto individual layers. In some cases,fine metal powders are deposited on topof a build platform and the energy beamis used to melt the shape of the design.The build then proceeds with a newlayer of metal powder which is thenmelted, such that the component isbuilt up in a layer by layer fashion.

This layer manufacturing approachmeans that more complex parts canbe produced compared with tradi-tional processes. One of the benefitsof AM for manufacturers is that in-creased complexity generally doesn’thave a detrimental impact on the costof the process. Parts treated with thenew technology are more cost-effec-tive than machined parts as they canincrease in geometric complexitywithout increasing the cost of build(Figure 2).

Figure 1. Left top: AM part resolution at 500 microns. Left bottom: Treated part resolution at 500 microns.Middle: AM part without treatment. Right: AM part treated with new immersion process.

Figure 2. Improved performance.

Co

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Complexity

machined almbrite

Cost against complexity

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Additive Manufacturing

AM allows component designers tohave greater design freedom, knowingthat the end result will be more repre-sentative of the final design than is pos-sible with traditional processes.

The use of AM is on the rise in everysector, including medical and automo-tive, because of the versatility of creatingbespoke designs, one-off prototypes, orcomplex components that cannot be ma-chined. But without the correct finish,these components may fail at the earlyassessment stage in an industry that testsand re-tests to the breaking point.

The aerospace and defense industryhas adopted AM, though it needed timeto collate data and carry out stringenttests before it was confident the compo-nents could withstand the operatingconditions they would be subjected to.Everything had to be tried and testedand then tested again. Now theprocesses are considered safe enough,they must make sure the finish of thesecomponents fulfills the necessary re-quirements.

The highly skilled team developingthis technology knows the testing, timeand effort it takes to achieve approvalcertificates in aerospace and are fully ac-credited with NADCAP, ISO 9100,ISO9001 and ISO14001, holding ap-provals for all the major UK tier onesuppliers. AM surface treatment is beingtaken to the next level and many of theissues currently facing those using addi-tive manufacturing in the aerospace in-dustry are being addressed.This innova-tive surface treatment process greatlyimproves the finish of componentsmade using additive manufacturing, bychemically removing material fromeach surface to achieve the final condi-tion required.

Research and development began onthe AM treatment project in 2014. Ithas taken a long time to fully develop,but there was significant demand forthis type of post processing. Large aero-space manufacturers using additivemanufacturing presented the need for amore refined and enhanced surface fin-ish on their AM parts. Both commercialand technical challenges were over-come before launching Almbrite™ as aproduction capable finishing solution.This is a fantastic opportunity for the

aerospace industry to really push thequality and finish of AM parts beingused to build aircraft in the markettoday and going forward.

So, how exactly does it work? Thesurface treatment process essentiallyrefines the surface of the componentby chemically removing material fromeach surface to achieve a surfaceroughness of below 3.2 microns,whilst enhancing edge and featuredefinition.

For reference, metal AM parts tend tohave an average roughness between 10to 30 microns depending upon the AMprocess used. This means that the tech-nology can reduce the roughness of anAM part by up to 88%. It could also beargued that the innovative surface treat-ment could almost increase the qualityof AM aerospace components ten-fold.

Almbrite™ can enhance surface qual-ity regardless of the complexity of acomponent's geometry (Figure 3). This

Figure 3. No geometric constraints. Sheffield University’s Formula 1 team optimised rocker arms for theirvehicle’s suspension system, treated with the new technology for optimum performance.

Figure 4. Support structure removal

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complements AM designed compo-nents, which use either traditional ortopology optimized approaches, whereconventional treatments are unable ortoo costly to be used.

An AM part’s topology describes theway in which its geometrical properties

and measurements are interrelated andarranged. As AM is increasingly adoptedby big players in the aerospace and de-fense industry, the complimentary andinnovative treatment similarly has thepotential to generate substantial inter-est among top manufacturers.

Almbrite™ is a chemical immersionprocess; the immersion bath used duringthe treatment is changed, or refreshed,depending on throughput. If many AMparts need their surfaces treated in a cer-tain period to a high level of material re-moval, the bath will need to be replen-ished regularly. The level of materialremoval during the ALM surface treat-ment process is controlled using a com-bination of process parameters. The im-mersion times required during thetreatment process are the same regard-less of component size; however they dovary depending upon materials.

This technology is currently being usedto finish components made of titaniumalloys whilst applications on polyetherether keytone (PEEK), a thermoplasticpolymer used widely in engineering, aswell as aluminium alloys are in develop-ment. The surface treatment process isalso being looked at for application onnickel-based alloys in the future.

18 Aerospace & Defense Technology, December 2017Free Info at http://info.hotims.com/65858-854

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Figure 5. Max stress tested against cycles to failure comparing machined parts and treated parts’ performance.

Max

Str

ess

Max Stress against Cycles to failure [Ti6AI4V]

Cycles

Machined1.6Ra [almbrite]3.2Ra [almbrite]Support [almbrite]As built

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arcam.com Part of the Arcam Grouparcam.com A GE Additive

Company

Welcome to

Manufacturing

UNBOUNDArcam brings together best-in-class additive manufacturing systems, the highest quality materials, and real-world production expertise, changing the way manufacturers conceive and produce metal components. As the leading provider for titanium additive manufacturing solutions, we use our collective knowledge to inspire and disrupt conventional thinking for production. Welcome to manufacturing unbound. Welcome to Arcam.

arcam.com Part of the Arcam Grouparcam.com A GE Additive

Company

Welcome to

Manufacturing

UNBOUNDArcam brings together best-in-class additive manufacturing systems, the highest quality materials, and real-world production expertise, changing the way manufacturers conceive and produce metal components. As the leading provider for titanium additive manufacturing solutions, we use our collective knowledge to inspire and disrupt conventional thinking for production. Welcome to manufacturing unbound. Welcome to Arcam.


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Titanium and aluminium alloys are the primary metallicsused for manufacturing in the aerospace and defense industrycurrently. Aircrafts are also made up of a huge range of poly-mers; high performance polymer PEEK is highly valued inaerospace manufacturing. Nickel-based alloys are primarilyused in the engines and mechanical systems of aircraft, andthis is where the technology is branching out to in the future.

The material on which Almbrite™ is being used does im-pact the treatment’s chemical compositions, however, theprocess requires a chemical reaction to occur when treating ei-ther Titanium or PEEK thermoplastic polymers, which re-moves the unwanted material from the component surface.

In metal additive manufacturing, support structures areused to help transfer heat away from the part as new fusedpowder layers are added whilst helping to hold the part’sshape as it forms. Until now, metal AM has lacked an efficientway to remove supports after the build is complete. In fact,supports have often been removed with hand tools – e.g.hammer and chisel – which is a bit primitive considering theadvanced technology involved in the aerospace industry.

However, the new surface treatment process dissolves sup-ports used in the AM process, removing the need to machineaway or manually remove support structures, as illustrated inFigure 4. This is hugely beneficial as manually removing sup-ports constrains the geometric freedom of the part, restrictingthe design possibilities of aerospace components.

Further advantages include improving surface related ma-terial properties such as fatigue strength (Figure 5) and frac-ture toughness, whilst offering a controlled, cost efficientand repeatable treatment. The process can be used for anytype of part, but a significant advantage is that it is alsosuitable for internal surfaces where a high-quality finish canbe achieved. The surface treatment technology is currentlybeing used on hydraulic aerospace components such aspumps, gears, pipes and filters whilst development of appli-cation on more complex mechanical parts is underway. Ad-ditionally, the shiny, bright, aesthetically pleasing finishthat is produced means that it is being used on interiorssuch as gear sticks and dashboards. There is a broad scope ofdiverse applications in the future of AM surface treatment.

The application possibilities of this innovative surface treat-ment technology are endless. With high-level skill and preci-sion engineering experience, AM is now being used to producea vast range of components. These are usually small scale, me-chanical parts due to the stage at which AM is at in its techno-logical development. Aerospace manufacturers are looking atbuilding larger structural aircraft parts with AM such asstringers or wing sections as the capabilities expand. It’s keythat AM can replace manufacturing processes for componentsthat are already in use, to speed up production time and opti-mize performance without having to redesign the parts. WhilstAM took its time to be adopted by the aerospace industry dueto the strenuous testing involved, Almbrite™ is already beingrapidly accepted by aerospace and defense manufacturers.

This article was written by James Bradbury, Lead Researcher,South West Metal Finishing (Exeter, UK). For more information,visit http://info.hotims.com/65858-503

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Using Thermoplastic Composites for Aerospace Applications

Recent advancements in com-posite production and process-ing are making thermoplasticsa viable option in a wider array

of aerospace applications. Traditionally, aerospace manufacturers

have turned to composites for their sig-nificant weight reductions and cost sav-ings compared with conventional aero-space materials, such as aluminum.Thermoset composites have been thecomposite of choice in recent years fortheir perceived high quality, commercial-ized pricing, more mature manufacturingprocess and well-established supplychain. They found application in diverseareas, including primary structural appli-cations. Thermoplastics, in contrast, havebeen considered a costlier option andwere mainly used in small semi-structuralapplications, such as clips and brackets.

These perceptions are now changing,and thermoplastics are increasinglybeing considered for new applicationsin primary structural components, suchas stringers or stiffeners, wing boxes andfuselage panels.

Thermoplastics vs. Thermosets Thermoplastic and thermoset resins

have similar performance characteris-tics, and both can be combined with car-bon, glass or other fibers to form prepregsystems. The prepregs are then fash-

ioned into finished components. Themain physical difference between thetwo materials involves their resin sys-tems. An example of an aerospace-gradethermoset resin is an epoxy resin, whilea comparable thermoplastic polymercan be a polyether ketone family resin.

There are many types of thermoplas-tic materials with different thermal,chemical and mechanical properties,but the most promising for aerospaceapplications are PEEK (polyetherether-ketone), PEKK (polyetherketoneketone)and PPS (polyphenylene sulfide). Allthree are semicrystalline thermoplasticswith superior chemical and heat resist-ance and the ability to withstand highmechanical load. PEEK and PEKK in par-ticular are well suited for the creation oflarge structural components.

The two materials differ dramaticallyin processing temperature, handlingand storage requirements. Thermosetsare processed at much lower tempera-tures, ranging from room temperatureto ~300°F. They are typically “set” andcured in an autoclave. The curing cyclecan take as long as 12 hours. However,prior to curing, thermosets must be re-frigerated to prevent resin advancementand maintain their mechanical proper-ties. Typically, they have a limited shelflife of about 12 months from prepregproduction to part completion. In addi-

tion, once cured, they cannot beremelted, remolded or recycled.

Producing thermoplastic prepregsand completed thermoplastic parts isgenerally considered more difficult.They require high processing tempera-tures of ~600°F or more. However, noautoclave curing is normally needed.The main advantage over thermosets isthat prior to curing, they have an un-limited shelf life at room temperatureand do not require refrigeration. Also,recycling is possible with thermoplas-tics. They can be remelted and reformedpost cured, offering flexibility and sus-tainability advantages.

A close-up of a thermoset slit tape spool showing the slit tape mated to the liner and transverse wound across a core. The edges of this spool are tapered to matchthe specifications of specific AFP equipment; different winding patterns and edge profiles are possible to custom-tailor spool density and weight to end-use needs.

Wide parent rolls of prepreg material are precisionslit into slit tapes in widths ranging from 1/8 to 1+inch. The tapes are then spooled for use by AFPand ATL fabrication processes.

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Materials: Lightweighting

Facilities that produce aerospace-grade thermoplastics and thermosetsmust strictly adhere to the AS9100 stan-dards for quality and safety required byaerospace manufacturers and suppliers.These facilities typically feature Con-trolled Contamination Areas and cleanrooms designed to protect materialsfrom foreign object debris (FOD). Con-tamination by FOD can result in pro-duction issues, material consolidationproblems and eventual part rejection.

Processing ImprovementsThe latest manufacturing and pro-

cessing advances have improved ther-moplastic quality and made the mate-rial more cost-competitive withthermosets, especially when the totalcost of production is considered. Theadvances affect every stage of thermo-plastic manufacturing, includingprepreg production, converting and for-matting, and component production.For example, prepreg makers are usingnew innovative resin systems to im-prove both consistency in quality andscalability. Companies that format ther-moplastic prepreg have made dramaticstrides in process innovations. These in-clude improvements for both the preci-sion and the variety of output formatsthat support new processes. In addition,component producers have further im-proved the quality and efficiency oftheir processing methods.

The processes used to turn thermo-plastic prepreg materials into finishedcomponents have undergone major

modifications and improvements. Thefollowing four processes show the great-est potential for continuing innovation: • Automated fiber placement/auto-

mated tape laying (AFP/ATL) • Continuous compression molding • Compression molding • Automated press/thermoforming.

Each process typically makes a differ-ent type of aerospace part and requires

different prepreg materials, which mustbe specially formatted to fit the process.The AFP/ATL process, for example, isused to produce large parts and typicallycalls for precision slit tape on woundspools or pads. The tape is cut to narrowwidths ranging from 1/8 to 1+ inch. Thisallows highly accurate placement whenmaking finished parts. The compressionmolding process calls for prepreg in the

TSC vs TPC Infographic

Because thermoplastic prepreg material is nottacky at room temperatures, thermoplastic slittape spools can require different configurationsthan thermoset slit tape spools.

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AIntro

form of precision chopped flakes, whilecontinuous compression molding(CCM) requires precision biasply mate-rial on wound spools or pads. The bi-asply material is also used in the auto-mated press/thermoforming process.

Further innovations are taking placeat the final aircraft assembly stage. Newtechniques are being developed to re-duce labor and the need for fasteners.Thermoplastic parts can potentially beassembled using thermal welding withstandalone tooling or by consolidation,which welds components togetherwithout changing dimensional toler-ances. These assembly methods can re-place the use of adhesives or metallicfasteners in some applications, reducingoverall weight.

More Flexible ManufacturingThe advances in thermoplastic manu-

facturing and processing allow aircraftmanufacturers and suppliers to take ad-

vantage of thermoplastic materials’unique properties. One benefit is greatermanufacturing flexibility and efficiency.The fact that thermoplastics can be storedat room temperature and have unlimitedshelf life reduces waste and allows formore flexible production activities.

The ability to recycle thermoplasticssupports environmental and sustain-ability efforts. The materials can beremelted and molded into new forms,allowing mistakes to be corrected andrepairs to be made at the factory. In thelong term, it will be possible to repairdamaged thermoplastic parts while air-planes are still in the field, reducingmaintenance costs. At the end of a ther-moplastic part’s useful life, the part canpotentially be melted down and repur-posed for a less demanding application.

PartneringAerospace manufacturers who de-

cide on thermoplastic solutions

should seek assurance of a consistent,high-quality source of supply. Thiscalls for due diligence when selectingthermoplastic prepreg suppliers andconverters. Ideally, they will have ex-tensive experience in producing aero-space-grade materials and be well-versed in achieving high-precisiontolerances down to thousandths of aninch. Moreover, the company thatformats your thermoplastic materialsshould have broad-based capabilitiesand experience in creative formattingsolutions for diverse, innovative pro-cessing methods, including, but notlimited to, the four mentioned ear-lier: AFP/ATL, CCM, compressionmolding and automated press/ther-moforming.

This article was written by Grand Hou,Director of Research and Technology Ad-vanced Composite, Web Industries, Inc.(Marlborough, MA). For more information,visit http://info.hotims.com/65858-502.


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Asingle antenna can be usedfor both transmission andreception. To accomplishthis, the transmission must

be isolated from the reception. In Fig-ure 1, a radio frequency (RF) circulatoris connected right after the antenna.The three-port device separates thetransmit path from the receive path.After the circulator, a system can beused to identify the frequency of differ-ent signals. Once the frequency hasbeen found, a filter with the right pass-band frequency can be used to isolatesignals from each other.

RF photonics can be used for RF cir-culator, frequency identification, andfilters. The photonic filters are tun-able and narrow. A photonic-basedcirculator isolates the transmit pathfrom the receive paths. Multiple pho-tonic methods can be used to identifythe frequency of the signal. This arti-cle discusses these methods for identi-fying and isolating signals using RFphotonics.

The Need for Signal Identificationand Isolation

New signals continue to fill the avail-able spectrum. Amateur radio and tele-vision signals fill the high-frequency(HF), very-high-frequency (VHF), andultra-high-frequency (UHF) bands. AirTraffic Control (118-136 MHz) andemergency radio communications(138-144 MHz) also use VHF. In theUHF band, 400-MHz frequency is usedfor time and frequency standard trans-mission to satellites, while wirelessphones use the 900-MHZ frequencyband. Above 1 GHz, phones and Wi-Fialso use the 2.5- and 5-GHz bands.Commercial GPS uses the 1.2- and 1.5to 1.6-GHz frequencies. The 2.7 to 2.9-GHz band is used for Airport Surveil-lance Radars. As these signals increaseusage, isolation is required. Filters canseparate out these various signals. Be-fore separation, the frequency of thesignal has to be determined in order toset the filter appropriately.

Multiple methods exist for determin-ing the frequency of signals. One com-monly used method is the electricalspectrum analyzer. A block diagram ofan electronic spectrum analyzer isshown in Figure 2. The signal is low passfiltered (LPF) and then mixed with alocal oscillator (LO) from a voltage-con-trolled oscillator (VCO). The resultingintermediate frequency (IF) is amplified(IF Amp), passed through a band-passfilter (BPF), and detected (DET). Finally,the signal is displayed. The ramp gener-ator sweeps the LO and syncs the out-put to the display.

RF Photonics for Signal IdentificationRF photonics can play a role in fre-

quency identification. Multiple meth-

ods exist for accomplishing this task. A photonics-based spectrum analyzer

replaces the electronic componentswith photonic components. An opticalmodulator takes the place of the mixer,and a Fabry-Perot (FP) filter now scans,rather than the local oscillator. The re-sulting output is then sent to a pho-todetector where a display of power as afunction of RF frequency can be ob-tained. The block diagram is shown inFigure 3.

Another type of photonic spectrumanalyzer has been developed based onrare earth doped crystals. The absorp-tion of the crystal can be modified by alaser. Figure 4 shows two laser beams atdifferent angles to the surface of thecrystal. They create an absorption grat-

Outgoing RF

Signal

Identify

Signal

Separate

Incoming RF

Tx

RF

Circ

Figure 1: Example of an RF photonic circulator with a signal identifier and separator.

RF In

LPF

VCO

LO

Ramp Gen.

BPF

Det

Display

Mixer IF Amp

Figure 2: Block diagram of a spectrum analyzer.

Identifying and Isolating SignalsUsing Radio Frequency Photonics

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AIntro

ing on the crystal. A third laser is inputto the crystal from the opposite side ofthe other lasers. The absorption gratingset up in the crystal then deflects thebeam with the RF information onto a

photodiode array. The deflection of thebeam with the RF signals will be pre-cisely mapped to the photodiode array.

One method for finding the signalfrequency involves optical filters. The

fixed optical filter has a sinusoidal re-sponse. Combined with two lasers ofdifferent wavelengths, the signal fre-quency can be determined. The firstlaser’s wavelength is set at the null ofthe response while the second laser isset at the peak. Generated sidebands ap-pear on complementary slopes of the re-sponse. The optical power of each wave-length is demuxed and detected. Theratio of powers from the two photodi-odes is called the amplitude comparisonfunction (ACF). It can be used to deter-mine the frequency of the signal.

Another approach uses two. Similarto the two-laser case, the setup pro-vides measurement of the signal fre-quency; however, it does not requiretwo lasers, which can reduce thepower consumption.

Another method uses RF fading dueto dispersion as a filter. The dispersion-based filter provides an ACF similar tothe one in the previous section. A two-


RF & Microwave Technology

Det

Display

Amp

Ramp Gen.

TFPF

MZMLaser

RF In

Figure 3: RF photonic version of a spectrum analyzer.

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RF & Microwave Technology

laser method makes the ACF – the ratioof the two different frequency responsesgenerates the ACF.

Yet another version of the dispersion-based system was demonstrated. A sin-gle laser is followed by a dispersive ele-ment and a photodetector. Due to thedispersion, a frequency-to-time map-ping of the dual optical sidebands oc-curs. The time delay through dispersionmust have a linear response as a func-tion of wavelength. Under this condi-tion, the optical sidebands arrive at dif-ferent times to the photodetector. Thedifference in time between the first side-band and its twin is proportional totwice the RF frequency.

A combination of the above methodshas also been demonstrated. A tunablelaser can be used as one of the two lasersin a two-laser dispersion system. Ameasurement of the power maps thesignal frequency using an electronicprocessor. This is a combination of theswept spectrum analyzer and the disper-sion method.

RF Photonics for Signal SeparationRF photonics can also provide signal

separation. Once the signal frequency isdetermined, a filter can be centered onthe signal. The filter can be realized in dif-ferent ways. One is simply a bandpass fil-ter. Others can use finite impulse response(FIR) to create different filter shapes.

A photonic filter is often used to fil-ter RF signals. The most common met-ric for filter is the quality factor. Opti-cal filters have been realized in manydifferent ways. The Fiber Bragg grating(FBG) filter is one used frequently. Thefilter is designed to act as either abandpass (in reflection) or a notch fil-ter (in transmission).

Another method for generating an RFfilter is the use of either a FIR or an infi-nite impulse response (IIR) filter. The FIRfilter is simply the discrete convolutionsum of the sampled impulse response of agiven filter shape with multiple time-de-layed versions of the signal. The IIR filteris the same as the FIR filter, but instead ofa finite set of delays, the delays are mod-eled to continue forever.

Different ways exist to realize an FIR fil-ter. Figure 5 shows an optical source withdifferent optical carriers connected to a

modulator. The RF signal appears on eachwavelength. A demux separates the differ-ent wavelengths into parallel paths. Eachpath is attenuated and passed through amultiple of one time period delay. The sig-nals are combined with a mux connectedto a photodiode. The photodiode sums upthe delayed RF signals.

In another method, a multiple wave-length source and modulator are used.The output is connected to a fiber withmultiple Bragg gratings. The gratingsare spaced by a delay of T/2, providingan integer multiple of delays for eachwavelength. The reflected wavelengthsappear on a photodiode. An IIR filtercan be realized simply by using a feed-back loop of a fixed delay. In this case,the signal will ideally be a summationof an infinite number of delay roundtrips. While this is hard to realize in theelectronic domain, the low loss of fibercan provide multiple round trips with-out a large amount of loss.

Another method to measure the sig-nal frequency uses finite and infiniteimpulse response filters. A combinationof FIR and IIR filters can be used to iden-tify the center frequency of an RF sig-

nal. The FIR filter is generated by split-ting the light with a delay in one arm.The IIR filter is implemented by theelectronic feedback from the photodi-ode back to the modulator. The detectedpower increases versus frequency, andthe response is similar to methodsshown above.

ConclusionVarious advanced techniques have

been demonstrated to improve the per-formance of the photonic links. Nonlin-earities can be overcome by using differ-ent modulation formats. Optical fiberlimits can also be overcome by using dif-ferent fiber types and isolators. The noiseof the erbium-doped fiber amplifier(EDFA) can be characterized and con-trolled by proper design to reduce theadded noise. Finally, the Mach Zehndermodulator (MZM) can be used at differentbiases to improve the RF performance.

This article was written by Preetpaul S.Devgan, RF/EO Subsystems Branch, Aero-space Components & Subsystems Division,Air Force Research Laboratory, Wright-Pat-terson Air Force Base, OH. For more infor-mation, visit http://www.afmc.af.mil/.

Multimode

LaserDemux Mux PD

Figure 5: Example of an FIR filter using different fiber lengths.

RF In

SHB CrystalDetector

Array

MZMf2

f1

f3

Laser 3

Laser 1

Laser 2

Figure 4: RF photonic spectrum analyzer using an optical crystal.

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Tech Briefs

Bioinspired Surface Treatments for ImprovedDecontamination: Commercial ProductsInvestigation seeks to determine which coatings shed fluids most effectively.

Naval Research Laboratory, Washington DC

In January 2015, the Center forBio/Molecular Science and Engineer-

ing at the Naval Research Laboratory(NRL) began an effort to evaluate anddevelop top-coat type treatments suit-able for application to painted surfacesthat would reduce retention of chemicalthreat agents following standard decon-tamination approaches. Four commer-cially available surface treatments wereevaluated: NANOskin Hydro Express,Rust-Oleum® NeverWet®, Eagle One Su-perior NanoWax™, and Rust-Oleum®

Wipe New. Aluminum coupons were painted

with a polyurethane-based system fol-lowing the directions for those prod-ucts. Deposition of the surface treat-ments onto painted surfaces wascompleted as advised by manufacturerdirections. NANOskin Hydro Expresswas shaken and sprayed onto a clean,cool surface. The product was spreadevenly on the surface and allowed todry. Eagle One Superior NanoWax™ wassimilarly applied by spraying and wip-ing. Rust-Oleum® NeverWet® was ap-plied by simply spraying onto the sur-face and allowing to dry. Rust-Oleum®

Wipe New was applied by wiping itonto the surface with the preloaded mi-crofiber towel provided.

Sessile contact angles for samplesevaluated under this effort used three 3μL droplets per surface with eachdroplet measured independently threetimes for each of three targets: water,

ethylene glycol, and n-heptane. Geo-metric surface energy was calculatedbased on the water and ethylene glycolinteractions using software designed forthe DROPimage goniometer package.

Sliding angles were determined using5 μL droplets. The droplet was appliedat 0° after which the supporting plat-form angle was gradually increased upto 60°. Sliding angles for each of the liq-uids were identified as the angle forwhich movement of the droplet wasidentified.

Shedding angles for each liquid weredetermined using 12 μL droplets initi-ated 2.5 cm above the coupon surface.Changes in base angle of 10° were uti-lized to identify the range of dropletshedding angle based on a completelack of droplet retention by the surface(not sliding). The angle was then re-duced in steps of 1° to identify the min-imum required angle.

Droplets of 5 mL diameter were ap-plied to the surfaces and images werecollected at 30s intervals for 5 minutesfollowed by images at 5 min. intervalsfor a total of 30 min. DFP samples werekept covered for the duration of the ex-periment to minimize evaporation.

Simulant exposure and evaluationmethods were based on the tests devel-oped by Edgewood Chemical BiologicalCenter referred to as Chemical Agent Re-sistance Method (CARM). Standard targetexposures utilized a challenge level of 10g/m2. Here, the coupons were 0.00258

m2; a 5 g/m2 target challenge was appliedto the surfaces as two equally sized neatdroplets. Following application of the tar-get, coupons were aged 1 hour prior. De-contamination used a gentle stream of airto expel target from the surface prior torinsing with soapy water (0.59 g/L Al-conox in deionized water). The couponswere then soaked in isopropanol for 30minutes to extract remaining target; thisisopropanol extract was analyzed by theappropriate chromatography method todetermine target retention on the surface.

For paraoxon analysis, a ShimadzuHigh Performance Liquid Chromatog-raphy (HPLC) system with dual-plunger parallel flow solvent deliverymodules (LC-20AD) and an auto-sam-pler (SIL-20AC; 40 μL injection vol-ume) coupled to a photodiode array detec-tor (SPD-M20A; 277 nm) was used. Thestationary phase was a C18 stainlesssteel analytical column (Luna, 150mm x 4.6 mm, 3 μm diameter) with anisocratic 45:55 acetonitrile: 1% aque-ous acetic acid mobile phase (1.2mL/min).

For analysis of methyl salicylate(MES), diisopropyl fluorophosphate(DFP), and dimethyl methylphospho-nate (DMMP), gas chromatography-mass spectrometry (GC-MS) was accomplished using a Shimadzu GCMS-QP2010 with AOC-20 auto-injectorequipped with a Restex Rtx-5 (30 m x0.25 mm ID x 0.25 μm df) cross bond5% diphenyl 95% dimethyl polysilox-

Images of a painted coupon (A), a Nanoskin treated coupon (B), a Wipe New treated coupon (C), a NeverWet treated coupon (D), and a NanoWax treated coupon (E).

A B C D E

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Tech Briefs

ane column. A GC injection tempera-ture of 200°C was used with a 1:1 splitratio at a flow rate of 3.6 mL/min at69.4 kPa. The oven gradient rampedfrom 50°C (1 min. hold time) to 180°C

at 15°C/min. and then to 300°C at20°C/min. where it was held for 5 min.

This work was done by Brandy J. White,Anthony P. Malanoski, and Martin H.Moore for the Naval Research Laboratory.

For more information, download theTechnical Support Package (free whitepaper) at www.aerodefensetech.com/tsp under the Materials category. NRL-0072

Mechanical Characterization and Finite ElementImplementation of the Soft Materials Used in a NovelAnthropometric Test Device for Simulating UnderbodyBlast LoadingUnderstanding the mechanical behavior of components made from eight soft polymer materials isnecessary to ensure the predictive capability of WIAMan FE models.

Army Research Laboratory, Adelphi, Maryland

Anthropomorphic test devices(ATDs) have been used in automo-

tive safety research since the 1970s topredict injuries. ATDs must repeatedly

perform under a dynamic range of load-ing rates and reliably distinguish be-tween injuries ranging from minor tosevere.

Biofidelity is an assessment of a devices’ability to replicate the kinetics and kine-matics of a human subjected to identicalloads. Automotive ATDs are suitable for

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AIntro

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impacts where the principle direction offorce comes from the front, side or rear.However, during the recent militaryconflicts in Iraq and Afghanistan, impro-vised explosive devices (IEDs) accountedfor the most death and injury to Coalitiontroops. Military vehicles were commontargets of an IED attack because of theirsusceptibility to underbody-blasts and thepotential to inflict multiple casualties.Current whole-body ATDs have beenshown to exhibit poor biofidelity due tooverly-stiff behavior when subjected tohighly accelerative vertical loads.

To address the growing threat IEDspose to vehicle occupants, the WarriorInjury Assessment Manikin (WIAMan)project was commissioned by the USDepartment of Defense. The WIAManATD must demonstrate biofidelity withrespect to a human soldier subjected tovarying severities of in-vehicle under-body blast exposure.

ATD biofidelity is strongly dependenton the viscoelastic properties of its soft

components representing the flesh andbony structures. Polymeric componentsare often included in an ATD to simu-late complex properties of human softtissues. Polymer components were usedextensively in the development of anadvanced automotive trauma assess-ment device, the Test Device for HumanOccupant Restraint (THOR), to achievedesired levels of biofidelity and durabil-ity. Updates to the six-year-old Hybrid-III pelvis involved softening of the sur-rounding vinyl flesh material toimprove the ATD’s ability to assess childrestraint systems. The military lowerextremity (MIL-LX) (Humanetics, Ply-mouth, MI) surrogate has a compres-sion absorber in the tibia shaft to im-prove biofidelity during verticalimpacts. The current WIAMan designalso includes numerous polymeric partsto meet biofidelic requirements. The loading rates associated with under-vehicle explosions are not well estab-lished in the literature. In addition,

models of polymeric materials used incurrent ATDs are not published, mostlydue to proprietary information. A rangeof reported values (1–80.5 m/s) for vehi-cle floor deformation velocity show theuncertainty associated with blast testsof this nature. Initial simulations of full-body WIAMan ATD experiments withinits intended loading environment indi-cate maximum strain rates in the poly-meric components are in the range of100–200 s−1. These rates were estimatedin simulations where hyper-elastic ma-terial models were assigned to polymercomponents based on preliminary char-acterization tests. However, these find-ings have not been validated experi-mentally. It is therefore necessary tocharacterize the polymeric materialsunder a large range of strain-rates,which should include both static andhigh dynamic loading rates.

A finite element (FE) model of theWIAMan is being developed to be usedin low cost simulation of underbodyimpact scenarios. To predict responsesof the physical dummy, the FE modelmust be able to replicate the viscoelasticbehavior of its polymer components. Athorough understanding of the me-chanical behavior of these polymers isrequired to develop accurate computa-tional models of the ATD.

In this study, eight polymer materialsare characterized by uniaxial compres-sion and tension tests at strain ratesfrom 0.01 s−1 to approximately 1000 s−1

and implemented into an FE model ofthe WIAMan ATD. It is believed thatnone of the eight materials have beencharacterized within the dynamic rangenecessary to model blast mechanics.The validated model can be used as avaluable tool for common FE tasks suchas design of experiments and failuretests, which would be extremely costlyto perform on a physical dummy.

This work was done by Wade A. Bakerand Costin D. Untaroiu of Virginia Tech,Department of Biomedical Engineering andMechanics; and Dawn M. Crawford andMostafiz R.Chowdhury for the Army Re-search Laboratory. For more information,download the Technical Support Pack-age (free white paper) at www.aerodefensetech.com/tsp under the Ma-terials category. ARL-0208


Tech Briefs

Diagram of modified VALTS rig for isolated lower extremity tests. The WIAMan-LX is pictured and the fivepolymer components are labeled

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Tech Briefs

Processing and Characterization of Lightweight SyntacticMaterialsHollow spheres encapsulated in a metal matrix, syntactic metal foam offer significant potential aslightweight energy-absorbing materials.

Army Research Laboratory, Aberdeen Proving Ground, Maryland

Conventional composite materials, inwhich a matrix material is rein-

forced by particulates, whiskers, and/orcontinuous fibers, have long been of in-terest as potential materials solutions toengineering needs. Typically, the bene-fits of these reinforcements are observedfor cases of tensile loading, with onlyminimal improvement for cases of com-pressive loading. As a result, recent at-tention has grown in the use of hollowspheres as a potential reinforcement inmetallic systems.

Commonly known as syntactic foams,the hollow spheres display a prolongedregion under compressive loading in

which the spheres deform by crushing,thereby absorbing a large amount of de-formation energy. Furthermore, as anadded benefit, the inclusion of hollowspheres also serves to lower the weight ofthe final component, thereby offeringthe possibility of improved performancewith a simultaneous reduction in systemweight. Thus, these materials are prima-rily being considered for applicationsthat require a high capacity for absorb-ing energy (bumpers, struts, etc.).

When subjected to a compressive load,the hollow spheres (as well as compositesbased on these materials) typically dis-play a characteristic stress-strain relation-

ship with 4 main areas, as seen in the ac-companying Figure. After an initial re-gion characterized by a linear- elas-tic response (i), the cellularmaterials experience buckling, plas-tic deformation and collapse of in-tercellular walls as they enter the tran-sition zone (ii). Under further loading,the mechanism of buckling and collapsebecomes even more pronounced, whichis manifested in large strains at almostconstant stress (iii). The stress level σplindicates the beginning of this plateauregion in which the gradient of stressplateau is denoted as plateau modulus P.Cellular structure densification is ob-

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Tech Briefs

served after reaching some critical strainσd, and the stress level increases expo-nentially thereafter (iv). The cellular ma-terial is able to absorb a significantamount of impact energy through itselastic and plastic deformation duringthe loading process, as represented bythe area under the strain-stress curve.

Most of the early research in metalsyntactic foams has focused on the use offly ash spheres that were produced as aby-product of fuel combustion. Al-though composites reinforced with suchmaterials showed improved energy ab-sorption capabilities, the manner inwhich these spheres are produced re-

sulted in a large (and mostly random)distribution of size, geometry, and com-position. This inherent variability in ash-based spheres made it practically impos-sible to produce repeatable foams over along processing time frame. As such, de-finitive conclusions regarding the influ-ence of sphere parameters on perform-ance could not be reached.

More recently, a process has beendeveloped that can produce hollowmetal and/or ceramic spheres withconsistent and repeatable properties.In this process, a suspension of metaland/or ceramic powder is sprayed ontoa polymer support (e.g., spheres) to

form a green body that is then sinteredto produce the final sphere material.As can be envisioned, the ability to tai-lor the process (suspension composi-tion, coating time, etc.) directly trans-lates into the ability to producespheres with customized—and repeat-able—compositions and/or ge ome -tries. This, in turn, allows one to cre-ate composite materials specificallydesigned for a given application.

In a project designed to evaluate thepotential of such materials for use inArmy-relevant applications, the US ArmyResearch Laboratory entered into a col-laborative effort with Deep Springs Tech-nology (DST) (Toledo, Ohio). The focus ofthis joint effort was to identify and de-velop processing method(s) for incorpo-rating the hollow spheres into a lightmetal (aluminum [Al], magnesium [Mg])alloy matrix. Several mechanical andphysical tests were then used to deter-mine the performance of the resultinghollow metal sphere composites.

This work was done by Oliver Strbik IIIand Vincent H Hammond for the Army Re-search Laboratory. For more informa-tion, download the Technical SupportPackage (free white paper) at www.aerodefensetech.com/tsp under the Ma-terials category. ARL-0206Schematic drawing of the stress-strain behavior of porous materials under impact loading

High Temperature Graphene-Peek AdhesiveCompounding graphene into polymers has the potential to improve various material properties, evenat very low concentrations.

Armament Research, Development and Engineering Center, Watervliet, New York

Joining of composites can be a chal-lenging issue. If adhesives are used, thejoints are permanent and cannot be un-done. If they need to be undone, insertsare often used and these inserts increasecost and weight. Additionally, fibers canbe cut in the process leading to a partwith weakened mechanical properties.

Even with these drawbacks, mostcomponents that need to be joined arethreaded together, allowing for removalof the parts at a later time. However,threaded connections are costly to de-sign and manufacture, and are often thelocation of fatigue failures due to their

inherent stress concentrations. From anenvironmental and cost standpoint,there is a large waste associated with theremoval of material to form the threads,even more so in sectored threads, whereup to half of the machined thread isthen cut away. Additionally, threadedjoints often require grease to seal outenvironmental contamination and en-sure that they can later be disassembled.This effort is aimed at replacing seldom-used threaded connections with areusable thermoplastic adhesive.

The use of a thermoplastic makes thejoining reversible, allowing any connec-

tion to be treated almost like a threadedjoint, only one that uses heat instead oftorque for activation. Recently, using ther-moplastics as reusable adhesives has beenresearched by DoE for application in au-tomobiles. However, that work is focusedon thermoplastics for room temperatureapplications, with no work being con-ducted on high temperature thermoplas-tics such as PEEK and Polyimide. The useof localized microwave radiation to heatthe thermoplastic will eliminate the needfor large furnaces which consume largeamounts of time and energy, and ulti-mately heat other parts of the system that

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AIntro

Aerospace & Defense Technology, December 2017 www.aerodefensetech.com Free Info at http://info.hotims.com/65858-862

Tech Briefs

do not need to be heated. Therefore, aninvestigation was begun into activatinghigh temperature thermoplastics usingmicrowave radiation.

The accompanying figure shows thebasic concept. Two adherends arebrought together with a graphene-doped thermoplastic between them.The assembly is then subjected to mi-crowaves which excite the graphenenanoplatelets in the adhesive generat-ing heat and causing the adhesive tomelt. When the microwave source is re-moved, the adhesive solidifies joiningthe two materials. Since the adhesive isa thermoplastic, subsequent applica-tions of microwaves can be used to re-melt the adhesive and disassemble theassembly. For adherends that block mi-crowaves, a wave guide would beneeded to direct them to the bondline.

While various carbon species can ab-sorb microwaves, nanospecies such as

carbon nanotubes and graphene havebeen investigated most recently becauseof their highly effective absorption atlow weight loadings and ability to im-prove mechanical properties as well.Microwaves, when incident on an ab-sorptive material, create heating by theinteraction of the electromagnetic fieldswith the molecular and electronic struc-tures of the molecules in the materialexposed to the microwaves. Theamount, and rate, of heating can be afunction of microwave power, fre-quency, absorption, etc.

This work was done by Andrew Little-field, Joshua A. Maurer, and Stephen F.Bartolucci for the Armament Research,De-velopment and Engineering Center. Formore information, download the Tech-nical Support Package (free whitepaper) at www.aerodefensetech.com/tsp under the Materials category.ARL-0207

Stress Corrosion-Cracking andCorrosion Fatigue Impact of IZ-C17+Zinc-Nickel on 4340 SteelNew protective material could replace cadmium and aluminumcoatings on critical components.

Naval Air Warfare Center, Patuxent River, Maryland

The protection of cathodic metallicmaterials used for aircraft compo-

nents, like 4340, Aermet 100, and PH13-8 corrosion-resistant steel, is criticalto keeping the steel from pitting andcracking due to exposure to the operat-ing environment. Two importantproperties are resistance to stress-cor-

rosion cracking (SCC) and corrosionfatigue. These are insidious failuremechanisms that can lead to part fail-ure in service.

Cadmium and aluminum coatings arecurrently used to protect high-strengthsteels from corrosion, pitting, and crack-ing. These coatings are applied on new

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Tech Briefs

components and also at Navy FleetReadiness Centers (FRC) during compo-nent repair and overhaul. Both are ef-fective but each has shortcomings.

Cadmium is electroplated or sometimesapplied in a vacuum chamber. The elec-troplating process allows for coating of allcomponent surfaces using a low-cost

method. However,cadmium is toxicand carcinogenicand alternatives aredesired to elimi-nate these risks.

Aluminum iselectroplated orapplied by theion-vapor deposi-tion (IVD) process.At Navy FRCs, theIVD process isused. This requiresa vacuum and islimited by line-of-sight, so not allsurfaces of compo-nents can becoated depending

on their geometry. IVD is a relativelyhigh-cost practice and requires moremaintenance than a cadmium electro-plating line.

Alternatives to cadmium have beeninvestigated for at least 50 years, withIVD aluminum being an early commer-cialized alternative. More recently, zinc-nickel alloys have been optimized tohave coating properties that are veryclose to cadmium. The depositionprocess for these new alloys is electro-plating.

A company called Dipsol provides acommercial zinc-nickel plating solu-tion, IZ-C17+, that has been optimizedfor use on high-strength steels to per-form similarly to cadmium and alu-minum. One shortcoming of the dataavailable is the ability of the coating tominimize SCC and corrosion fatigue ofthe substrate material and how it com-pares to cadmium and aluminum.These are two critical requirements forsacrificial coatings used on Navy andMarine Corps aircraft components.

Prior work documents the method toassess SCC and corrosion fatigue andthe performance of electroplated cad-mium on 4340 steel by itself, with aMIL-PRF-23377 Class C primer, andwith both the primer and a MIL-PRF-85285 gloss white topcoat. This protec-tive coating system is typical for high-strength steel components.

The purpose of this research was toassess the ability of electroplated IZ-C17+ zinc-nickel to suppress SCC andcorrosion fatigue of 4340 steel usingmethods previously developed by theMaterials Engineering Division. Thezinc-nickel coating was assessed by it-self, primer only, and with the primerand standard gloss white topcoat usedon fleet aircraft components. Theprimer used was a standard MIL-PRF-23377, TY I chromate-based primer cur-rently used on high-strength steel partsthat are coated with cadmium or alu-minum.

This work was done by Craig Matzdorf,Charles Lei, and Matt Stanley for the NavalAir Warfare Center. For more informa-tion, download the Technical SupportPackage (free white paper) atwww.aerodefensetech.com/tsp underthe Materials category. NAWC-0003

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Application Briefs

Optics 1, Inc. (Safran)Bedford, NH603-296-0469www.optics1.com

Optics 1, Inc. (Safran) recently announced that its Inte-grated Compact Ultralight Gun-mounted Rangefinder (I-

CUGR) has been selected by the United States Marine Corps(USMC). The I-CUGR is a small, lightweight, and ruggedweapon-mounted laser rangefinder with integrated illumina-tion and aiming lasers that will give USMC the ability toquickly range targets without taking hands off their rifles –providing more accurate first round hits.

The Optics 1 I-CUGR mounts to a weapon system using thestandard MIL-STD-1913 Picatinny Rail System giving the op-erator the ability to range man-sized targets out to 1500 me-ters (± 1 meter) (depending on conditions) without taking hishands off the weapon system. Without additional effort ormoving off position, the digital display provides users withdistance information in meters or yards.

When used in conjunction with night vision optics, the I-CUGR increases a unit’s lethality by adding several capabilitiessuch as a Night Vision Mode; a Vis Laser used for aiming andboresight; an IR laser used for night engagements or to marktargets for other team members; and an IR flood light that

provides discrete illumi-nation of the targetarea. While tethered tothe Kestrel® with Ap-plied Ballistics, the I-CUGR provides and dis-plays accurate holds forclimate conditions (i.e.wind, altitude, humid-ity temperature andbarometric pressure)used in long range shooting.

Developed as a modular system, the I-CUGR can be usedon all types of military Sniper, CQB, or crew-served weaponsystems (adaptor required) and can be used with all types ofbullet designs and calibers. The simple two-button opera-tion allows for ease of use on the device or with a remote sothe shooter’s hands never leave the weapon. The I-CUGRconsumes very little power, allowing for extended use, andis ruggedized for military operations to include being water-proof to 1 meter. A single CR123 battery provides power for3000+ LRF ranging events. Total weight of the unit is 12 ozincluding remote and battery.

The I-CUGR has been designed by Optics 1 leveraging provenrangefinder technology from Safran Electronics & Defense. Pro-duction will take place in Bedford, New Hampshire at Optics 1.

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Stratasys Direct ManufacturingValencia, CA1-888-311-1017www.stratasysdirect.com

Stratasys Direct Manufacturing, asubsidiary of Stratasys Ltd., was re-

cently chosen by Airbus to produce 3Dprinted polymer parts for use on A350XWB aircraft. The company will printnon-structural parts such as brackets,and other parts used for system installa-tion, on Stratasys FDM production 3DPrinters using ULTEM™ 9085 material.The project will help Airbus achievegreater supply chain flexibility and im-prove cost competitiveness, while lever-aging on reduced material consumption and waste.

FDM, which is short for Fused Deposition Modeling, usesproduction thermoplastic materials such as ULTEM 9085 andULTEM 1010—which are certified to UL-94V0, FAR 25.853,and FAR 29.853 standards. The process works by heating andextruding the thermoplastic filament and using it to build theparts up layer-by-layer. ULTEM 9085 is often favored for aero-space applications because it is flame, smoke, and toxicity-cer-

tified to UL-94V0 and FAA 25.853 standards. It also offers out-standing thermal and chemical resistance, and excellentstrength-to-weight ratios.

Stratasys Direct Manufacturing’s 3D printing capacity andinfrastructure allow printing and shipping parts on demandto Airbus, bringing the expected reactivity, tighter turnaroundtimes and lower inventory costs.

The Airbus A350 XWB is a family oflong-range, twin-engine wide-body jetairliners developed by European aircraftmanufacturer Airbus. It is the first fam-ily of aircraft to feature a fuselage andwing structures made primarily fromcarbon fiber-reinforced polymer. Pow-ered by twin Rolls-Royce Trent XWB tur-bofan engines that produce 97,000 lbfof thrust, it seats anywhere from 280 to366 passengers, depending on configu-ration.

Stratasys, the parent company of Stratasys Direct Manufac-turing, and Airbus share a history of collaboration, havingworked together since 2013 on the implementation of 3Dprinting FDM technology for Airbus tools and flying parts ap-plications. This collaboration led to the qualification in 2014of ULTEM 9085 material for the production of flying parts onvarious Airbus aircrafts.


3D Printed Aircraft Parts

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What’s On

Featured Sponsor Video:Channel Modeling for 5GThis demonstration shows how WirelessInSite meets 3GPP and METIS channelmodeling requirements for 5G.

techbriefs.com/tv/5G

A First: Astronomers See theLight from Cosmic Collision For the first time, astronomers havedetected a cosmic collision in bothgravitational waves — ripples in space-time itself — and electromagnetic waves,or light. Other forms of electromagneticradiation — including X-ray, ultraviolet,optical, infrared, and radio waves — were also detected.

techbriefs.com/tv/cosmic-collision

Underwater Robots CouldSoon Speak a New LanguageSatellites and mobile phones, built oninternational standards, help keep theworld connected. But the communicationstechnology used on land does not workwell underwater. Researchers from NATOare now developing the first-ever standardfor underwater wireless communications,called JANUS.

techbriefs.com/tv/JANUS

Battery-Free RFIDs Help ‘RFly’Drones Find Missing ObjectsLarge warehouses across the country lose billions of dollars every year fromlost inventory. ‘RFly’ is a new drone-based,wireless technology from MIT, featuringrelay technology that can integrate with adeployed RFID infrastructure — and atthe same time identify the location ofevery item to within less than a foot.

techbriefs.com/tv/RFly-drones

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Aerospace & Defense Technology, December 2017

Application Briefs

Fujifilm Medical Systems U.S.A., Inc.Stamford, CT1-800-872-3854www.fujifilmhealthcare.com

Fujifilm Medical Systems U.S.A., Inc., was recently awardeda new 10-year contract with a maximum value of $768

million as part of the Digital Imaging Network-PACS (DIN-PACS) IV project from the U.S. Department of Defense (DoD)and the U.S. Department of Veterans Affairs. Specifically, U.S.government healthcare providers can now purchase and in-stall various technologies from Fujifilm’s Synapse enterpriseimaging portfolio including Synapse 5 PACS, Synapse Mobil-ity Enterprise Web Viewer, Synapse 3D, Synapse CV (Cardio-vascular) and Synapse VNA (Vendor Neutral Archive).

Fujifilm’s technology will play a significant role in theMHS Genesis transition—a project that will replace the cur-rent electronic health system (EHR) used by the DoD and Vet-erans Affairs. Specifically, MHS GENESIS integrates inpatientand outpatient best-of-suite solutions that connect medical

and dental informa-tion across the con-tinuum of care,from point of injuryto the militarytreatment facility.MHS GENESIS willsupport the avail-ability of electronichealth records formore than 9.4 mil-

lion DoD beneficiaries and approximately 205,000 MilitaryHealth System personnel globally. It enables the applicationof standardized workflows, integrated healthcare delivery,and data standards for the improved and secure electronic ex-change of medical and patient data.

Enterprise Imaging is rapidly evolving as a necessary organi-zational priority for health systems across the globe. The col-laborative HIMSS-SIIM Enterprise Imaging Workgroup, whichconsists of representatives from the Healthcare Informationand Management Systems Society and the Society for ImagingInformatics in Medicine, defines Enterprise Imaging as “a setof strategies, initiatives and workflows implemented across ahealthcare enterprise to consistently and optimally capture,index, manage, store, distribute, view, exchange, and analyzeall clinical imaging and multimedia content to enhance theelectronic health record.” Fujifilm’s Synapse solutions underthe DIN-PACS IV contract will provide core technology toallow U.S. government healthcare organizations to deploy anEnterprise Imaging strategy that addresses modern IT architec-ture needs, security, cost savings, operational efficiencies,physician needs, improved outcomes and diagnostic imaging.

To date, 29 facilities have already installed FujifilmSynapse systems globally.


Enterprise Imaging System

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http://techbriefs.com/tv/5G

http://techbriefs.com/tv/cosmic-collision

http://techbriefs.com/tv/JANUS

http://techbriefs.com/tv/RFly-drones

http://www.techbriefs.tv


Joint Effects Targeting System



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Application Briefs

U.S. Army Operational Test CommandFort Hood, TX254-287-9993www.otc.army.mil

Forward observers, experts in directing artillery and mortarfire onto enemy targets, have been testing a new piece of

targeting equipment recently. “Black Falcon” soldiers of Head-quarters and Headquarters Battery, 2nd Battalion, 319th FieldArtillery Regiment, put their hands on the Joint Effects Target-ing System (JETS) — a modular, man-portable, hand-held,day/night, all-weather, target observation, location, and des-ignation system. Com-ponents of the JETS in-clude a Handheld TargetLocation Module (HTLM);a Laser Marker Module(LMM); and a PrecisionAzimuth Vertical AngleModule, all mountedatop a tripod.

Sgt. 1st Class RyanOrouke, a test non-commissioned officerwith the U.S. ArmyOperational Test Com -mand’s Airborne andSpecial OperationsTest Directorate (ABN-SOTD), said JETS test-ing collects data to determine its suitability, reliability andsurvivability when conducting static line airborne opera-tions in a door bundle configuration for airdrops.

HHB Troopers spent four days in New Equipment Training(NET) from the Program Manager Soldier Precision TargetingDevices office out of Fort Belvoir, VA. Sgt. 1st Class Juan Cruz,ABNSOTD assistant JETS test NCO, said that NET places thesoldiers in practical exercises that validate their being able touse the equipment in their missions.

After NET validation, the “Black Falcons” put JETS throughits paces by performing seven combat equipment jumps andseveral door bundle drops, making sure that when JETS hitsthe ground after the jump, it still functions. After each air-borne operation, the “Black Falcon” forward observers assem-bled the equipment, then began identifying and designatingenemy personnel and vehicle targets in day and night condi-tions. Targets were arrayed over rolling terrain from 800 me-ters to over 2,500 meters away, then test data was gathered toprepare a test report so senior Army leaders can make procure-ment decisions on JETS.

Upon completion of testing, JETS could potentially beissued to Army Light and Airborne Artillery forces world-wide, signaling the first steps in upgrading the target ac-quisition of artillerymen.


During operational testing at Fort Bragg, N.C.,“Black Falcon” soldiers of Headquarters andHeadquarters Battery, 2nd Battalion, 319thField Artillery Regiment, perform a combatequipment jump with the new Joint EffectsTargeting System (JETS). Once on the ground,they will test to make sure the JETS still func-tions. (U.S. Army file photo)

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Boundary-Scan Test Hardware InterfaceJTAG Technologies (Eindhoven, the Netherlands) announced

the immediate release of a new JTAG/boundary-scan test hard-ware interface product compatible with the MAC Panel massinterconnect system. The JT2147/eDAK is a multi-function sig-nal conditioning module that allows ‘ideal world’ connectionsfrom JTAG Technologies PXI and PXIe DataBlasters to the MACpanel ‘Scout’ connection system.

Based on the popular QuadPod™architecture from JTAG Technolo-gies, the JT2147/eDAK is an en-hancement of JTAG ‘s current DAKinterface and has been specifically de-signed for robust high-integrity ATE sys-tems. In using the JT 2147/eDAK, test sys-tem builders will greatly simplify their

wiring task and, at the same time, retain the signal integrity as-sured by the QuadPod’s active interface.

In addition to four independent JTAG Test Access Ports(TAPs), the JT2147/eDAK features 64 digital I/O scan channelsplus 16 ‘static’ DIOs. Each TAP can be programmed to operatethrough a range of voltage levels and two can also operate asother test and programming interfaces such as BDM or SWD.


3U VPX Processor BoardConcurrent Technologies

(Woburn, MA) is now ship-ping deployment quantitiesof the rugged conduction-cooled TR E5x/msd-RCx proces-sor board, having passed all the pre-requisite qualification tests. Theseinclude storage and operation over ex-treme temperature ranges, as well as reliable operation when subjected to three-axis shock and random vibrationtests according to the VITA 47 standard. As such, TR E5x/msd-RCx is available for use in the type of harsh environments en-countered in some military, defense, transportation and in-dustrial applications.

TR E5x/msd-RCx is a 3U VPX board based on a quad-coredevice from the Intel® Xeon® processor E3-1500 v5 familyand has 16GB of DDR4 ECC DRAM. This allows for highperformance command, control, communicate and com-pute, intelligence, surveillance and reconnaissance applica-tions. In addition to a wide assortment of on-board I/O in-terfaces, an XMC expansion site enables customers to addapplication specific storage and I/O with up to 24 single-ended and 20 differential pairs traced through to the backplane.


Airborne Data Acquisition SystemsCurtiss-Wright’s Defense Solutions division (Ashburn, VA)

announced that its Teletronics Technology Corporation (TTC)business has expanded its family of rugged multipurpose ac-quisition and recording solutions for Airborne and Ground-based Instrumentation Networks. ADSR-4003 recorders inte-grate three (3) independent solid-state recorders into a singlesize, weight and power (SWaP) -optimized compact unit. TheADSR-4003Z models are designed for mounting in a DZUS railfor easy, rapid installation. The ADSR-4003F, models are de-

signed to have a flangedbase plate for secure di-rect mounting.

The base ADSR-4003F-1 model provides two (2)1000BASE-T Ethernetports and can accept upto three (3) removablesolid-state memory car-

tridges with capacity up to 256 Gigabytes each. The ADSR-4003F-1 also includes four (4) unpopulated I/O card slots. TheADSR-4003F-2 and -3 variants add high definition videorecording and streaming capabilities. The ADSR-4003F-5 vari-ant supports up to four (4) Gigabit Ethernet (GbE) interfaces.

Designed to address a wide range of demanding airborne ap-plications in Flight Test and Operational environments, theunits, in addition to providing recording functions, can also beutilized as a Data Server for Digital Moving Map applications.


38 aerodefensetech.com Aerospace & Defense Technology, December 2017

New Products

STATEMENT OF OWNERSHIP

U.S. Postal Service Statement of Ownership (Required by 39 U.S.C. 3685) 1. PublicationTitle: Aerospace & Defense Technology 2. Publication Number: 181-20 3. Filing Date:10/16/2017 4. Issue Frequency: Feb, Apr, May, Jun, Aug, Sep, Oct, Dec 5. No. of IssuesPublished Annually: 8 6. Annual Subscription Price: $75.00 7. Complete Mailing Addressof Known Office of Publication (Street, City, County, State, and Zip+4) (Not printer):Tech Briefs Media Group, 261 Fifth Avenue, Suite 1901, New York, NY 10016 8. CompleteMailing Address of Headquarters or General Business Office of Publisher (Not printer):SAE International, 400 Commonwealth Drive, Warrendale, PA 15096-0001 9. Full Namesand Complete Mailing Addresses of Publisher, Editor, and Managing Editor. Publisher(Name and Complete Mailing Address): Joseph T. Pramberger, 261 Fifth Avenue, Suite1901, New York, NY 10016; Editor (Name and Complete Mailing Address): Bruce A.Bennett, 261 Fifth Avenue, Suite 1901, New York, NY 10016; Managing Editor: None 10.Owner (If the publication is owned by a corporation, give the name and address of thecorporation immediately followed by the names and addresses of all stockholders owningor holding 1 percent or more of the total amount of stock. If not owned by a corporation,give the names and addresses of the individual owners. If owned by a partnership or otherunincorporated firm, give its name and address as well as those of each individual owner.If the publication is published by a nonprofit organization, give its name and address).Full Name and Complete Mailing Address: SAE International, 400 Commonwealth Drive,Warrendale, PA 15096-0001 11. Known Bondholders, Mortgagees, and Other SecurityHolders Owning or Holding 1 Percent or More of Total Amount of Bonds, Mortgages, orOther Securities. Full Name and Complete Mailing Address: None 12. For Completionof Nonprofit Organizations Authorized to Mail at Nonprofit Rates. The purpose, func-tion, and nonprofit status of this organization and the exempt status for federal incometax purposes: Not applicable 13. Publication Name: Aerospace & Defense Technology 14.Issue Date for Circulation Data Below: December 2017 15. Extent and Nature ofCirculation (Average No. Copies Each Issue During Preceding 12 Months/Actual No.Copies of Single Issue Published Nearest to Filing Date): a. Total No. Copies (Net PressRun): 37,405/37,937 b. Paid and/or Requested Circulation: (1) Outside CountyPaid/Requested Mail Subscriptions (Include Advertisers’ Proof Copies/ExchangeCopies): 33,484/33,404 (2) In-County Paid/Requested Mail Subscriptions stated on PSForm 3541. 0/0 (3) Sales Through Dealers and Carriers, Street Vendors, and CounterSales (Not Mailed): 0/0 (4) Requested Copies Distributed by Other Mail ClassesThrough the USPS: 0/0 c. Total Paid and/or Requested Circulation (Sum of 15b(1),15b(2), and 15b(3): 33,484/33,404 d. Non-requested distribution (By Mail and outsidethe mail) (1) Outside County Non-requested Copies Stated on PS Form 3541:2,143/2,225 (2) In-County Nonrequested Copies Stated on PS Form 3541: 0/0 (3) Non-requested Copies Distributed Through the USPS by Other Classes of Mail: 0/0 (4) Non-requested Copies Distributed Outside the Mail: 850/1,031 e. Total Non-requestedDistribution (Sum of 15d (1), (2), and (3)): 2,993/3,256 f. Total Distribution (Sum of 15cand 15e): 36,476/36,660 g. Copies Not Distributed: 929/1,277 h. TOTAL (Sum of 15fand 15g): 37,405/37,937 i. Percent Paid and/or Requested Circulation (15c ÷ f times100): 91.8%/91.1% 16. This Statement of Ownership will be printed in the December2017 issue of this publication. 17. I certify that all information furnished on this form istrue and complete. I understand that anyone who furnishes false or misleading informa-tion on this form or who omits material or information requested on the form may besubject to criminal sanctions (including fines and imprisonment) and/or civil sanctions(including civil penalties): Joseph T. Pramberger, Publisher.

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Free Info at http://info.hotims.com/65858-867 Free Info at http://info.hotims.com/65858-868


Free Info at http://info.hotims.com/65858-873Free Info at http://info.hotims.com/65858-872



POWER LINEFILTERS FROMAPITECHNOLOGIESEMI Power Line Filtersfrom API Technologies

provide excellent attenuation for high voltageimpulse. Available with fast-on, bolt-in terminals orwire leads, single stage and dual stage. High perform-ance in both metal and plastic cases and ideally suitedfor products that must conform to FCC part 15 regu-lations. http://eis.apitech.com/power-line-filters.aspx

API Technologies Corp

LEMOS/ SENATUFFTALK INDUSTRIAL BLUE-TOOTH HEADSETThe Lemos / Sena Tufftalk,is anearmuff Bluetooth® communi-cation and intercom headset,

designed specifically to meet the communicationand connectivity needs of industrial applicationswhile protecting your employees hearing and supply-ing clearer communications. Tufftalk sports a 1.4 kmworking Bluetooth range – the furthest of any prod-uct on the market today. www.lemosint.com

LEMOS/SENA TUFFTALK

NANOSILICAFILLED, DUALCURE SYSTEMMaster Bond UV22DC80-1 is formulated to cure

readily upon exposure to UV light and it willcrosslink in shadowed out areas with the addition ofheat. This abrasion resistant system features superiordimensional stability and has very low shrinkageupon cure. Optically clear UV22DC80-1 passesNASA low outgassing tests and has a Tg exceeding125°C. www.masterbond.com/tds/uv22dc80-1

Master Bond

ANALYZING WIFI AND LTEPERFORMANCEWireless InSite’s Com mun -ication Systems Analyzer

includes important WiFi and LTE metrics for in situassessment of devices such as smart home appli-ances and intelligent personal assistant devices,routers, LTE base stations, and more. The softwarecalculates bit error rate (BER) and throughput bypost-processing Wireless InSite’s high fidelity signalcoverage predictions, giving users the tools theyneed to visualize and optimize device performance.www.aerodefensetech.com/remcom201712

Remcom

Product Spotlight

1000 WATT ACTO DC SWITCHERThe compact, lightweight,low profile CM1000 po w -er supply will provide anoutput of 28Vdc at 35.7Amps with an 89% effi-ciency at full load and86.9% efficiency at half-

load. Unit is 6" W x 9.9" L (includes connectors) and2" H, max weight of 6 lbs, fully sealed to meet IP67and humidity up to 100%. Perfect for the mostdemanding conditions! http://abbott-tech.com/1000-watt-ac-dc-switchers-cm1000/

Abbott Technologies

MULTIPHYSICS MODELING, SIMULATION, APP DESIGN ANDDEPLOYMENT SOFTWARE

COMSOL Multiphysics® is an integrated software envi-ronment for creating physics-based models and simula-tion apps. Add-on products allow the simulation of elec-trical, mechanical, acoustic, fluid flow, thermal, andchemical applications. Interfacing tools enable its inte-gration with all major technical computing and CADtools. Simulation experts rely on COMSOL Serverproduct to deploy apps to their colleagues and cus-tomers worldwide. https://www.comsol.com/products

COMSOL, Inc.

A WORLD OF FIBER OPTIC SOLUTIONS

• T1/E1 & T3/E3 Modems, WAN• RS-232/422/485 Modems and Multiplexers• Profibus-DP, Modbus• Ethernet LANs• Video/Audio/Hubs/Repeaters• USB Modem and Hub• Highly shielded Ethernet, USB (Tempest Case)• ISO-9001http://www.sitech-bitdriver.com

S.I. Tech

INTRINSICALLYSAFE FIBEROPTICSWITCHES

Liteway, Inc. offers a line of full bi-directional fiberoptic switches in the following styles: 1¥N, 2¥N, 1¥3,1¥4, Latching or Non-Latching, Signal Sensing,Manual or Remote controlled. Since there is no lightto/from electrical data conversion, there is no data tointercept. Switches can be used Stand-alone, DIN railor Rack mounted, are available with all standard opti-cal connectors and are ready for immediate use. Allswitches are manufactured in the USA. Visit www.fos-witch.com or call Liteway, Inc. at 1-516-931-2800

Liteway, Inc

New Products

Aerospace & Defense Technology, December 2017 aerodefensetech.com 39

UC-2524, Flame Resistant, UrethanePotting

EpoxySet (Lincoln, RI) formulates awide variety of urethane compounds in-cluding the UC-2524. The UC-2524 is aflame-resistant potting/casting materialthat is used for environmental protec-tion of electronics. This potting materialyields very low cure stress as well as highimpact resistance over a temperaturerange of -55 to 130°C. The electricalproperties make itsuitable for highvoltage powersupplies andignition coils.It is thermallyconductive andmeets the requirementsof UL-94-VO.

The UC-2524 is a low viscosity system thatcan be cured at room temperature or withheat. With a 100°C cure, UC-2524 can be de-molded in 20 minutes. It has a minimumwork time of 60 minutes with an easy 1:5 byvolume mix ratio ideal for use in dispensingequipment.

For Free Info Visithttp://info.hotims.com/65858-512

Direct Drive Torque MotorsAllied Motion Technologies (Amherst,

NY) announced the addition of smallerframe sizes to its line of MegafluxTM

Frameless Direct Drive Torque Motors.Motors are now available in sizes rang-ing from 60 to 792 mm in outside diam-eter, with multiple stack lengths foreach diameter.

Brushless torque motors are designedto produce high torque values com-pared to standard brushless motors.They have higher pole-counts, muchthinner axial dimensions, larger diame-ters than typical motors, and are de-signed to run at low-to-moderate speed.Being frameless, Megaflux kit motors(consisting of a matched rotor and sta-tor pair) are ideally suited for OEM de-signs where they can be integrated di-rectly into the driven axis. A largeopen-center aperture provides free pas-sage to route cables, light beams orother machine mechanics.

For Free Info Visithttp://info.hotims.com/65858-530

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Ad IndexAdvertiser Page Web Link

Abbott Technologies, Inc. ........................................39 ............................................................www.abbott-tech.com

Accurate Screw Machine ..........................................7....................................................................AccurateScrew.com

API Technologies Corp...............................................39 ..............http://eis.apitech.com/power-line-filters.aspx

Arcam CAD to Metal, Inc. ..........................................19 ..................................................................................arcam.com

Arnold Magnetic Technologies ..............................23 ............................................................ArnoldMagnetics.com

Aurora Bearing Co.......................................................20 ......................................................www.aurorabearing.com

COMSOL, Inc...................................................................39, COV IV ......................................................www.comsol.com

Cornell Dubilier ............................................................11 ..........................................................cde.com/MLSHSlimpack

CST of America, Inc.....................................................COV III ......................................................................www.cst.com

Evans Capacitor ..........................................................6....................................................................www.evanscap.com

G.R.A.S Sound & Vibration ........................................31 ................................................................................www.gras.us

Gage Bilt Inc. ................................................................20 ..............................................................................gagebilt.com

Gemstar Manufacturing............................................15 ..............................................www.gemstarcases.com/LLRC

GT Advanced Technologies ......................................37......................................................................................GTAT.com

Imagineering, Inc. ......................................................1, 27 ..................................................................www.PCBnet.com

Intlvac Thin Film Corporation ................................33 ......................................................................www.intlvac.com

Kaman Precision Products ......................................34 ................................................................kamanmemory.com

Lemos International Co., Inc. ..................................39 ..................................................................www.lemosint.com

Liteway Inc.....................................................................39 ..................................................................www.foswitch.com

Marotta Controls ........................................................2 ......................................................................www.marotta.com

Master Bond Inc...........................................................37, 39......................................................www.masterbond.com

Mini-Systems, Inc.........................................................25 ..............................................................mini-systemsinc.com

Photon Engineering....................................................29 ............................................................www.photonengr.com

Positronic Industries, Inc. ........................................17 ........................................www.connectpositronic.com/adt

Proto Labs, Inc. ............................................................5 ........................................................go.protolabs.com/DB7MC

Remcom..........................................................................39....................................................................www.remcom.com

Renishaw Inc.................................................................18 ..................................................................www.renishaw.com

S.I. Tech ..........................................................................39 ........................................................................www.sitech.com

Tech Briefs TV ..............................................................36 ....................................................................www.techbriefs.tv

VPT, Inc. ..........................................................................3 ....................................................................www.vptpower.com

W.L. Gore & Associates ..............................................COV II..........................................www.gore.com/GORE-FLIGHT

Zeus, Inc. ........................................................................13 ......................................................................www.zeusinc.com

Aerospace Manufacturing & Fabrication

Ascent Aerospace ....................................................5a ..........................................................ascentaerospace.com

C.R. Onsrud, Inc. ........................................................11a................................................................www.cronsrud.com

En'Urga Inc. ................................................................12a ..................................................................www.enurga.com

International Polymer Engineering ..................12a......................................................www.ipeaerospace.com

Ingersoll Rand Power Tools ..................................4a ........................................................................irtools.com/qx

Specialty Coating Systems, Inc. ..........................7a..........................................www.scscoatings.com/military

Superior Tube Co. ....................................................COVIIa ................................................www.superiortube.com

Technologic Systems ..............................................13a ..................................................www.embeddedARM.com

Weldaloy Products Company................................3a ..........................................................................weldaloy.com

Publisher . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Joseph T. Pramberger

Editorial Director – TBMG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Linda L. Bell

Editorial Director – SAE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .William Visnic

Editor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Bruce A. Bennett

Digital Editorial Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Billy Hurley

Associate Editor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Edward Brown

Managing Editor, Tech Briefs TV . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Kendra Smith

Associate Editor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Ryan Gehm

Production Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Adam Santiago

Assistant Production Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Kevin Coltrinari

Creative Director . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Lois Erlacher

Senior Designer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Ayinde Frederick

Marketing Director . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Debora Rothwell

Marketing Communications Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Monica Bond

Digital Marketing Coordinator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Kaitlyn Sommer

Digital Marketing Assistant . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Bronagh Mageean

Audience Development Coordinator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Stacey Nelson

Subscription Changes/Cancellations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . [email protected]

TECH BRIEFS MEDIA GROUP, AN SAE INTERNATIONAL COMPANY261 Fifth Avenue, Suite 1901, New York, NY 10016(212) 490-3999 FAX (646) 829-0800

Chief Executive Officer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Domenic A. Mucchetti

Executive Vice-President . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Luke Schnirring

Technology Director . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Oliver Rockwell

Systems Administrator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Vlad Gladoun

Digital Media Assistant Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Anel Guerrero

Digital Media Assistants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Peter Weiland, Howard Ng, Md Jaliluzzaman

Digital Media Audience Coordinator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Jamil Barrett

Credit/Collection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Felecia Lahey

Accounts Receivable Assistant . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Nicholas Rivera

Accounting/Human Resources Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Sylvia Bonilla

Office Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Alfredo Vasquez

ADVERTISING ACCOUNT EXECUTIVES

MA, NH, ME, VT, RI, Eastern Canada . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Ed Marecki

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(401) 351-0274

CT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Stan Greenfield

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(203) 938-2418

NJ, PA, DE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .John Murray

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (973) 409-4685

Southeast, TX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Ray Tompkins

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(281) 313-1004

NY, OH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Ryan Beckman

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(973) 409-4687

MI, IN, WI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Chris Kennedy

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(847) 498-4520 ext. 3008

MN, ND, SD, IL, KY, MO, KS, IA, NE, Central Canada . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Bob Casey

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(847) 223-5225

Northwest, N. Calif., Western Canada . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Craig Pitcher

(408) 778-0300

CO, UT, MT, WY, ID, NM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tim Powers

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(973) 409-4762

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POSTMASTER: Send address changes and cancellations to NASA Tech Briefs, P.O. Box47857, Plymouth, MN 55447.

December 2017, Volume 2, Number 12

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December 2017

Supplement to Aerospace & Defense TechnologySupplement to Aerospace & Defense Technology

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Aerospace Manufacturing & Fabrication, December 2017 www.aerodefensetech.com 1a

Additive Manufacturing (AM) isgrowing in importance as a fabri-cation process for the space

industry, enabling weight and cost sav-ings through optimized designs forcomponents. The use of AM gives aero-space engineers an alternative to moretraditional manufacturing processes,but also retains the challenge of produc-ing parts without defects. These prob-lems can be approached using non-destructive methods such as X-rayComputed Tomography (CT) andFinite Element Modelling (FEM) toinspect geometries and quantify theimpact of defects on the mechanicalproperties of a part, taking into accountfactors such as internal stress frommetal cooling during fabrication.

Researchers at ELEMCA and CNEShave found success with this method byfocusing on the quality control of an alu-minium AM part for space applications.This study is part of a larger project,ALMIA (Additive Layer Manufacturingfor Industrial Application)[1], led bySOGECLAIR Aerospace with CNES,FUSIA, RATIER-FIGEAC and ICA; theproject aims to define and validate a newAM process for space applications. Inthis particular study, a single part intend-ed for the TARANIS satellite, and madefrom the aluminium alloy, AS7G06,reduces weight by 16% and integrateseleven functional parts into one.

X-ray CT was used to identify the loca-tion of porosities in the material, and togenerate Finite Element (FE) models inSimpleware software (Synopsys,Mountain View, CA) for simulation ofactual part response, including designoptimization and fabrication validation.A random vibration model was consid-ered, and comparison made betweenthe results from a theoretical geom-etry and the manufactured compo-nent. The goal was to confirm thequality of the AM process, and totest a new method of validating CTscanned parts. Simulations usingthese models represent the actual part

behaviour in real conditions, enablinganalysis of the effect of each defect, andcomparison to the theoretical simula-tions carried out using an idealisedComputer-aided Design (CAD) model.

MethodologySOGECLAIR carried out simulations

from a CAD (Figure 1) model to vali-date the design evolution of the part, inparticular the result from topologicaloptimization. The model considers ran-dom vibrations in the X, Y and Z direc-tions (Table 1), with the critical axischosen for the real test, and vibrationtests performed in this direction on thereal part to adjust the model. In thiscase, the FE model is based on the CAD

design, rather than the X-ray CTdataset. In the simulations, the part isconsidered to be fixed to the base, andtwo point masses represent the SASequipment and connectors (Table 2);the complete model includes titaniumscrews and permaglass rings, contain-ing about 800,000 elements. Simulationresults showed that the dimensioningaxis is X, and the higher stresses werefound when applying a vibration acrossthe X axis. The value of maximumstress obtained by the modelling onCAD data was compared to the resultsfrom modelling the actual dataobtained from CT scanning.

CT Reconstruction & SimulationX-ray tomography was conducted on a

V Tome X system, developed by GeneralElectric (Phoenix), with a copper filterplaced just after the X-ray source toreduce the reconstruction artefacts andincrease the power of the scan[3]. Thevolume and internal features were visu-alised for inspection, and did not showany voids, cracks, inclusions, or othermaterial health defects larger than theresolution of the voxels; this proved thatthe manufacturing process for the partis well-controlled.

Simpleware software was used toprocess the image data and to generate acomputer model for simulation. Image-based meshing algorithms in the soft-

Quality Control for AdditiveManufacturing Parts Using Non-Destructive Testing

Figure 1. SOGECLAIR CAD Model

Axis Frequency (Hz) PSD acceleration (g2/Hz) Level (g, RMS) Time (min)

X, Y

20100150

299.75002000

0.04020.20.20.040.04

0.0025

7.50 3

Z

201503002000

0.01760.50.5

0.0114

15.20 3

Table 1. Random vibration input [©SOGECLAIR]

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2a www.aerodefensetech.com Aerospace Manufacturing & Fabrication, December 2017

ware generate Finite Element (FE) mesh-es for topologies of arbitrary complexity,offering advantages over traditional CADmodels by representing ‘as-manufac-tured geometries’ that capture slightdeviations from AM designs. With thesetechniques, the accuracy of the meshes isonly limited by the quality of the imageacquisition and segmentation, wherebyautomatic and semi-automatic tools areused to capture regions of interest withinthe image data. The mesh generationalgorithms ensure that multi-part models

have perfectly conforming interfaceswithout gaps or overlaps[2].

To obtain the FE models, SimplewareScanIP was used to segment the mainbody of the component from the imagespace. Threshold-based segmentation wasused to create a mask of the structure,before the mask geometry was refined bydisconnecting all regions of the maskfrom the main body. Manual segmenta-tion techniques such as painting andthreshold-assisted painting were used toensure accurate segmentation of impor-

tant details such as the screw holes, and toreduce the influence of metal artefacts.Light Recursive Gaussian-based smooth-ing was applied to the segmented geome-try to increase the surface smoothnessprior to meshing (Figure 2).

The Simpleware FE Module was usedto automatically produce a coarse meshwhile maintaining the detail of featuresof interest. A mesh refinement region wasapplied to the top part of the structure(in relation to the orientation shown inFigure 2), and node sets added to thescrew hole regions to fix the componentfor later simulations. The mesh, whichcontained approximately 450,000 ele-ments, was exported in a native ANSYS(Canonburg, PA) format for simulationin ANSYS Workbench 17.1 (Figure 3).

For convenience, the titanium screwsand permaglass rings were not included,as the loads were applied directly on themesh rather than a CAD model, with thegoal of limiting the work of the simula-tion software. Instead, node sets weregenerated within Simpleware ScanIP, towhich appropriate boundary conditionswere assigned in ANSYS Workbench.These included a fixed support at thebase (yellow nodes), point mass for SAS(blue nodes), and point mass for connec-tors (cyan nodes), as shown in Figure 3.Von Mises stress was computed across thethree directions, and then compared tothe theoretical values (Table 3).

DiscussionThis study primarily aimed to validate

the additive manufacturing process. Theresults from the X-ray CT scan showedthat the part was free of defects, with goodmaterial health and uniform part density:this demonstrated a good level of controlin the new manufacturing process. Thepart itself, which is a flight model, has suc-ceeded in every quality test. The secondgoal of the study was to proceed to simu-lation from CT data, and was achieved bygenerating a high-quality mesh suitablefor representing the real component.

There were some differences betweenthe CAD and CT models, as there willalways be some deviation between designand realization; this is why the characteriza-tion was important for better understand-ing of how this deviation affects the realbehaviour of the part. However, there areother factors that can affect simulationresults, including CT artefacts; the exclu-sion of the screws and rings within theimage-based models was also affected bythis decision, and might need further work.

Non-Destructive Testing

Gravity center (mm)

Mass (t) x y z

SAS (M1) 107 E-6 -0.050 0.341 145.588

Connectors(M2)

87 E-6 -4.031 53.092 71.409

Table 2. Point Masses [©SOGECLAIR]

Figure 2. Image-based Segmentation

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A broader aim for this study was to contribute to a globalproject to validate AM parts for the space industry. It is possibleto run simulations from CT data and find good agreement withCAD model simulations. One goal of future work will be toevaluate the impact of the X-ray tomography artefacts, and torefine the CT model to even more closely represent the as-manufactured part.

This article was written by Julien Uzanu, R&D Engineer, andJérémie Dhennin, CEO, ELEMCA (Labège, France); Matthew Nixon,Application Engineer, and David Harman, Simpleware TechnicalSales Manager, SYNOPSYS (Exeter, UK); and Jean-Michel Desmarres,Material Expert, CNES (Toulouse, France). For more information,visit http://info.hotims.com/65858-505.

References[1] Dr. Oliver Brunke, Introduction to X-ray Computed Tomography,PHOENIX|X-RAY, p18, 2007.[2] Young, et al. An efficient approach to converting 3D image datainto highly accurate computational models, PhilosophicalTransactions of the Royal Society A, 366, 3155-3173, 2008.[3] ASTM E1441-11, Standard Guide for Computed Tomography(CT) Imaging, ASTM international, 2011.

Figure 3. Mesh Imported into ANSYS Workbench

Figure 4. Von Mises stress – random solicitation

VM max (MPa)

Random solicitationaxis

CAD [©SOGECLAIR] CT model

X 17.66 12.2

Y 13.66 7.11

Z 4.53 1.98

Table 3. Comparison of Von Mises stress between CAD and CT model

Non-Destructive Testing

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Conformal coatings protect elec-tronic circuits from harsh envi-ronments via a chemical film that

“conforms” to a circuit board’s topogra-phy. These coatings protect againstmoisture, chemicals, contamination,vibration, corrosion, and thermal stresswhile improving product reliability byreducing failures. The benefits confor-mal coating can provide often vary inimportance by industry. In aerospaceelectronics there is an emphasis on ben-efits of protection from corrosive gasses,outgassing, tin whiskers, and radiation.For the purpose of this article, we willfocus on liquid coating materials.

Coating SpecificationsA good first stop for new conformal

coating users is two widely used coatingspecifications. MIL-I-46058 is the militaryspecification on conformalcoating. This document isstill widely referenced today,although it has been inactivefor new board designs devel-oped within the last 20 years.This doesn’t necessarily stopend users from trying to con-form to this standard howev-er, even today.

The more recent specification is IPC-CC-830, which also has a valuable sisterhandbook (IPC-CC-830-HDBK) docu-menting best practices. Most manufac-turers use one of these specifications asa baseline to guide coating selection andcompliance of their application process.

Coating SelectionThere are various coating types and

application methods. Both the IPC andMIL specifications note coating types thatinclude silicones (SR), acrylics (AR), ure-thanes (UR), and epoxy (ER). The selec-tion of the proper coating for a specificapplication is a very personal decisionbased on the pros and cons of each coat-ing type, and the corresponding protec-tion provided by each chemistry. As anend user you must know your market, theuse environment for the end product,

anticipated life of the product, and subse-quently what protection best positionsyou to pass testing parameters you, oryour customer, have established. Of par-ticular note, MIL-STD-883, MIL-STD-810,and DO-160 all provide testing guidelinesrelevant to the aerospace industry.

Defining a ProcessPrior to determining the preferred

application method for your confor-mal coating process, it is often criticalto evaluate the coverage requirementsfor your circuit boards. Some compo-nents such as connectors, test points,RF shielding, and switches are oftennot coated. Understanding therequired coverage area, keep-outareas, and having an understandingwith your customer on how toapproach “optional” areas are all

important aspects of estab-lishing your coatingprocess.

Optional areas are oftennon-metal components orbare board regions where it isacceptable to apply confor-mal coating, though it maynot be required. Sometimes adesigner or quality depart-

Type of Coating Thickness

Acrylic 25-75 μm [0.98-2.95 mil]

Urethane 25-75 μm [0.98-2.95 mil]

Epoxy 25-75 μm [0.98-2.95 mil]

Silicone 50-200 μm [1.97-7.87 mil]

Figure 1. Coating thickness by chemistry as recommended by IPC-CC-830

Developing a Conformal CoatingProcess for Aerospace Applications

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ment may want to see coating applied onall non-keep-out areas. In many casesthere is a trade-off between the desiredcoated area and aesthetics, with a num-ber of customers seeking a visuallyappealing process.

Coating ThicknessConformal coating thickness is tested

on bare, flat board surfaces or testcoupons. Preferred, cured, conformalcoating thickness does vary by chemistry.The IPC (Association ConnectingElectronics Industries) standard deemscured films to be between 25-75 μm(0.98-2.95 mil) for acrylic, urethane, andepoxy resins. Silicones are appliedroughly twice as thick. Coating thicknessper chemistry as recommended by IPC-CC-830 is noted in Figure 1.

Thickness is often also addressed inestablishing baseline performance crite-ria on a formulator’s technical datasheet. These performance characteris-tics often reflect values determined with-in the thickness range noted in Figure 1.Lastly, thickness may also be addressedin the most pertinent place of all, the cir-cuit assembly’s engineering drawing.

Increasing the coating thickness inyour application does not correlate to anincrease in protection of your assembly.Nevertheless, it is not unusual for endusers to push the limits on coating thick-ness. End users can favor thicker films ofcoating for various reasons. The assem-bly could be installed in a harsh environ-ment or you could simply be providingthe process engineer additional peace ofmind. That being said, requiring a thick-er than recommended film should notbe pursued blindly. A formulator maynot guarantee product performanceoutside of their recommended thicknessrange. Further, the product itself mayhave characteristics that are counter tothe protection process at high film thick-ness. Hard coatings, such as acrylics andurethanes, can often crack as cured filmbuilds increase.

In short, there are published standardsfor appropriate film thickness for yourprocess. Outside of this independentresearch, end-users often set their ownstandards that may fall outside of the rec-ommended target range. These instancesshould always be qualified prior to pro-duction and in conference with the for-

Aerospace Manufacturing & Fabrication, December 2017 7aFree Info at http://info.hotims.com/65858-880

Figure 2. The Delta 6 is a flexible robotic confor-mal coating/dispensing system that is ideal forselective coating, potting, bead, and meter-mixdispensing applications.

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mulator. You must also be mindful ofwhat these coverage requirements doto your resulting application method.Sufficient coverage on packages, par-ticularly on corners, sides, or underleads (if required) can be challengingin thin film applications, whereas thickfilm processes can increase the flowcharacteristics of a coating applicationand be more difficult to managearound keep-out areas. The coatingtype, thickness, and applicationmethod require a delicate balance inbuilding a defect-free process.

Application MethodsManufacturers have a myriad of

application methods to choose fromin building their coating process.Factors such as budget, board vol-ume, and product mix are typicallyobvious factors in making this deci-sion. However, quality and taking intoaccount the established coverage arearequired as dictated by the engineeringrequirements must be a major factor inthis decision-making process.

DippingA good low-cost method for low volume

coating operations starts with a dippingprocess. Here the assembly is immersedin a bath of coating so exposure to thechemistry is complete. Dipping does offerbenefits in covering complex topographysince the entire board is immersed.Thickness is controlled by the withdrawalrate of the assembly from the bath.Dipping is a process conducted verticallyso coating can be uneven as the materialflows to the bottom of the board duringthe withdrawal process.

Since the chemistry sits in an open vat,any chemistry that is reactive to the ambi-ent environment must be closely moni-tored as the viscosity of the coating canchange with exposure to elevated tem-peratures or humidity. Also, since theentire board is immersed, any keep-outareas must be meticulously masked toprevent impingement into these zones.

Manual SprayA more common application approach

is manual spray via an aerosol can orhandheld nozzle. This process is also veryeasy to implement with minimal equip-ment costs. There is certainly a level ofvariability in this process as thickness isdifficult to control and operator depend-ent. As the operator moves the nozzleover the board surface, shadowing can

occur as coating is applied in each direc-tion. It is suggested that after each cyclethat the board is rotated 90 degrees toassure an even film build and counteractshadowing in any one direction.

Manual spray is a fast process, thoughthe nature of mass coverage doesrequire masking of keep out areas whichcan be a laborious process. You will alsosee a significant loss of coating in theprocess as the vast majority of the chem-istry is wasted. This puts a strongemphasis on operator safety and ventila-tion of vapors or solvents lost in thespray process.

Selective CoatingSelective coating provides an automat-

ed approach to eliminate process variabil-ity, increase throughput in high volumeapplications, and greatly reduce or elimi-nate masking due to its inherent roboticcontrol. These programmable units great-ly reduce material waste in the applicationwith transfer efficiencies of 99% (vs. 25%-40% for dipping or manual spray) so coat-ing cost per board is much less.

The selective process can entailnumerous application methods depend-ing on the desired application and con-formal coating type. Solvent-based coat-ings contain a low percentage of resinand subsequently are very low in viscosi-ty (sub 100 cps). As the solvent evapora-tion for these coatings can be as high as80%-90%, the coating is put on theassembly much thicker wet, to obtainyour target dry film thickness. Forinstance, it would not be unusual to haveto apply a 200 μm wet film to achieve a

25 μm dry film after solvent evapora-tion. As a result, solvent-based coat-ings are often applied via an airlessfilm coating process at robot speedsup to 500 mm/sec. Film coating pro-vides superb edge definition overlarger coated areas.

Thinner films of coating can beachieved with the introduction of airto create an atomized process. Lowvolume (0.5 psi – 5 psi), pattern shap-ing air can be used to break down acoating into small particles ordroplets to result in a much thinnerwet film. This process can be usedfor solvent-based, low viscosity fluidswhen a user is looking for a very lowdry film thickness.

Atomization is also the preferredmethod for higher viscosity coatings(often silicones) or UV chemistries.There are very few limits on what you

can atomize. Very thick materials can besprayed by altering the atomizing air pres-sure, though selectivity can be compro-mised in high pressure applications.Conformal coating films are often createdwith pressures below 5 psi. A series ofspray caps can result in pattern shapesvarying from conical to fans in patternwidths down to 3 mm. For added control,most selective coating applications inte-grate a detailing tool to jet, or needle dis-pense in and around small keep-out areas.

Selective coating has a higher initialcost than dipping or manual sprayoperations, but can often be justifiedby the higher throughput, materialsavings, and reduction in maskinglabor. All of these factors must betaken into consideration when evaluat-ing the best process for your produc-tion environment.

ConclusionImplementing a conformal coating

process is a delicate balance of materialselection, understanding the engineer-ing requirements for coverage, keep-outarea, and thickness, and choosing anappropriate application method. Everyvariable in the process has its own prosand cons that you must weigh againstyour internal resources and productionvolume. Changing one variable may alsoimpact other decisions you make in theprocess so it is always important to quali-fy your process prior to implementation.

This article was written by Frank Hart,Global Sales and Marketing Manager, PVA(Cohoes, NY). For more information, visithttp://info.hotims.com/65858-507.

Figure 3. Non-Atomized Film Coat valve utilizing the patent pendingcontinuous film calibration process.

Conformal Coating Process

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Aerospace Manufacturing & Fabrication, December 2017 www.aerodefensetech.com 9a

The interconnected backbone of aMIL-STD-1553B vehicle dependson the electrical and mechanical

reliability of the components, thedesign, and the installation. With thevast array of MIL-STD-1553B specifiedsub-assemblies, there are factors that cango overlooked for passive componentssuch as couplers, cables, and connec-tors. Often built with kilometers ofwiring, aircraft in particular can be diffi-cult to troubleshoot and must beinspected frequently for potential fail-ures such as intermittent connections,shorts, and corrosion. Still, these passivecomponents that make up the networkcan be individually assessed to operatewith a high level of integrity.

Bus Couplers ConsiderationsMIL-STD-1553B specifies that data

bus couplers must be placed betweenthe main data bus and the vehicle subsys-tems, computer system, or terminal inorder to protect the integrity of theentire network. The data bus coupler isoften called a ‘stub coupler’ where a‘stub’ is simply a pair of wires connect-ing avionics components to the mainbus. MIL-STD-1553B and STANAG 3838further specifies that each stub couplercome equipped with fault isolation resis-tors and a step-up transformer (1:1.41)

to avoid shorts, improve common moderejection, and provide lightning immu-nity for the terminals connected to thebus.

While bus couplers are necessary toprotect the internal wiring and circuitry,they inevitably add a degree of mis-match. The main bus (often 78twinax) has a consistent impedancealong the transmission line until a stubwhere the discontinuity causes an abruptchange in impedance resulting in reflec-tions and loss. MIL-STD-1553B specifiesthat the longest stub length is 20 feet fortransformer coupled stubs in order tominimize the impedance load on themain bus. Still, this number can beexceeded as there is a delicate balancein introducing loads on the bus in orderto achieve the specified signal-to-noiseratio and systems error rate perform-ance as specified in MIL-HDBK-155A.

The effect the stub has on the buswaveform depends on the rise/fall timeas compared to the time it takes for awave to propagate from the bus to theend of the stub and back. The reflectioncan occur before the waveform haschanged, causing waveform distortions.In essence, a high impedance of the cou-pling stub can minimize signal distor-tion but since this impedance is reflect-ed back to the main bus, the impedancehas to be kept below a certain thresholdin order to deliver an adequate amountof power at the receiving end. The totalload and total characteristic impedancecan potentially have an adverse effect onthe performance of an installation.

Oftentimes, it is desirable to havereserve couplers in order to access extraremote devices whenever deemed neces-sary. Still, the hazard that the extra loadcan cause makes it so that reserve cou-plers are not used in a bus line systemunless absolutely required[1].

In-Line Stub CouplerIn-line couplers are spliced directly

into the main bus cable, allowing forsmall form factors and weight savingswhen compared to the box style stubcoupler. These couplers can be conve-niently rolled up in wiring bundles with-out the need to preplan the arrange-ment of couplers. Highly integratedwiring systems in small aircraft mayrequire in-line couplers due to their lim-ited weight requirements to maintainthe desired power-to-weight ratio. Thiscomes with the cost of modularity as thein-line stubs are often difficult torepair/replace in the case of a failuredue to a lack of transformer integritywhere the windings could be open orshorted. During installation, a completecable harness cannot be dismantled andreorganized due to unexpected circum-stances (damage during fitting) by theoperators in charge of fitting the equip-ment – potentially costing more in timeand pushing back deadlines for aircraftconstruction. This can inhibit produc-tivity on the industrial scale as the exactarrangement of the aircraft componentsand interconnections must be thorough-ly gauged in order for the whole processto run smoothly.

In-line couplers have the benefit of high reliabili-ty and space savings with the tradeoff of flexibil-ity during installations and overhauls.

Couplers housed in boxes allow for a highly modular configuration in aircraft but the increase in con-nections can decrease their level of reliability as compared to in-line stubs.

Designing With MIL-STD-1553B Components

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Box Stub CouplerBoxed couplers can be an asset in

that they are relatively simple to installand replace, thereby mitigating anyhassle that can occur upon installation.Still, designers must plan for mountingpoints for couplers and their respectivewiring as the bulky housing occupiesmuch more space and weight. Thesplicing necessary to install a boxedcoupler is more unreliable, as there arefar more connections between the bulk-head connectors on the box and theclamp/solder or crimp joints of thewiring. These connections can quicklyfatigue under the duress of an aircraft’shigh vibration environment, increasingthe mean times between failures(MTBF). MTBF is a direct measure of asystem’s reliability based on known fail-ure rates of subassemblies in a 1553Bnetwork. This indicator is also directlyproportional to the number of compo-nents and joints between each compo-nent. In the occurrence of a fault, tech-nicians connect bus analyzers to thetwisted shielded pair bus and then twistand wring the wires in order to locatethe source of the short. This can fur-ther damage the bus wires, posinganother potential risk for failure to anetwork installation[2].

Multi-Port CouplersSince there is no specification for the

minimum distance between stubs on abus, multiple stub output couplers areemployed to connect to a tight groupingof avionics to potentially save space,weight, and improve MTBF as this solu-tion limits the amount of individualstubs necessary. While these also comein in-line form factors for intricatelydesigned aircraft wiring, the box stylecouplers have the benefit of saving onspace while maintaining modularity andease of installation and repair.

Harness ConsiderationsCable Length

Typically, most of the cable runs in a1553B installation consists of the mainbus, or a twisted shielded pair with animpedance between 70 and 85 (typ-ically 78 ). The maximum attenuationspecified for the cabling is 1.5 dB/100feet at 1 MHz; for longer cable runs alower attenuation is necessary. In otherwords, the maximum length of the bus isdirectly correlated to the gauge of theinner conductors and time delay of thetransmitted signal.

According to MIL-HDBK-1553ASection 40.6.1, when a signal’s propaga-tion delay is more than 50% of the riseor fall time, it becomes necessary to con-sider transmission line effects such asattenuation. The average rise time of a1553B signal is 1.6 nanoseconds/foot soa 100 foot bus would have a 160 nanosec-ond propagation delay.

Twinaxial Cable Electrical ConsiderationsTwinaxial cables are normally leveraged

for the main data bus in a 1553B networkdue to their effectiveness for short-range,high-speed, differential signaling applica-tions up to 15 MHz. A minimum of 90%coverage is specified in MIL-STD-1553Bfor enhanced RF/electromagnetic inter-ference (RFI/EMI) protection.

While the two balanced signals run-ning through the twisted pair cancels anyrandomly induced noise picked upthrough the copper braid, optimizingthe braid and dielectric of the twinax canstill greatly improve some of its electricalcharacteristics. Braiding can be made ofa variety of metal alloys but copper stillhas the best conductivity and, therefore,provides higher coverage. The coveragecan be further improved to up to 93% byweaving the braid tighter. This level ofcraftsmanship in the manufacturingprocess can enhance performance with-out leveraging any extra materials.

Another option to improve perform-ance is to add an additional dielectricfiller to separate the braid from the twist-ed pair and lower leakage capacitance toground. This is especially useful in longruns where the longer conductors have ahigher capacitance.

Triaxial Cable Electrical ConsiderationsTypically used for sensitive and wide-

band systems where noise voltages aris-ing from stray power sources is of con-cern, such as video and high frequencydata circuits, triaxial cables are moresimilar to a coaxial cable with an extralayer of dielectric and shielding. Thegrounded outer braid adds the ability topass both ground loop and capacitivefield noise currents from the internalcoax. At high frequencies, the cablereduces the shield surface transferimpedance due to the isolation anddecoupling between the two braids[3].While this additional layer providesgreater bandwidth and interferencerejection, it is more expensive than thetwinax and coax so it is typically used inspecialized systems such as low-imped-ance laser lamps and exploding bridge(EBW) ordinance systems[4].

Multiple Signal HarnessingConsiderations

The interconnections between avionicsequipment often require the use of cableharnesses for multiple discrete signals.These cables require extra care so thatthe signals transmitted are not interrupt-ed or obscured by external noise.Oftentimes, twisted shielded pairs areleveraged for the benefits of differentialmode transmission where common-modesignals can be readily distinguished andcanceled, as well as added shielding toprovide EMI protection. The shielding isthen stripped back and the twisted pairunfurled in order to crimp or solder con-nector pins and ground the shielding (orgenerate another pin).

Twinaxial cables have balanced conductors that leverage differential signaling where any external com-mon-mode noise can easily get canceled. Additionally 1553B twinaxial cables require a minimum of90% coverage, further increasing noise immunity.

Discrete triaxial cabling is leveraged for specialized high frequency applications where the second layerof shielding is chassis ground while the inner braid functions as the return path for the signal. This pro-vides protection from common-mode interference.

MIL-STD-1553B Components

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For the isolation of signals when anumber of signals pass through a singleconnector, wires that carry similar sig-nals are often laced separately in theharness. In some cases multiple floatingshields have the potential to causeground loops and can be avoided bybeing properly terminated with conduc-tive RFI/EMI backshell adapters andlarge compression rings.

Cable Jacketing and InsulationWhile the electrical performance of

the harnessing is critical, the mechanicalreliability of the cabling can be just asrelevant in the performance of a databus. Cable jacketing is the first line ofdefense in harsh environments and tem-perature extremes. Military cables areoften designed to withstand tempera-tures between -55°C to 125°C, particular-ly in high altitude applications. Polymerssuch as Teflon (PTFE) are often lever-aged for its strength and elasticity in awide range of temperatures. Materialssuch as perfluoroalkoxy (PFA) for cablejacketing and fluorinated ethylenepropylene (FEP) for insulation havebeen introduced for their ability to func-tion at extremely high and low tempera-tures (from -55°C to 200°C).

Jacketing materials that cannot with-stand extreme temperature cycling willeventually swell, crack, or deform, creat-ing intermittent signals or even completesignal loss. Low smoke zero halogen(LSZH) jacketing can also be necessary invehicles with low ventilation, as somejacketing materials become highly reac-tive when burned, producing toxic fumesthat pose a danger to any inhabitants inthe closed space.

Connector ConsiderationsMIL-STD-1553B does not directly spec-

ify the type of connector that must beused to connect cabling with the excep-tion of the polarity of a concentric con-

nector. There are essentially two types ofconnectors: multi-pin connectors(shapes including circular, rectangular,and rack and panel), and discrete con-centric triaxial design (threaded and bay-onet). As specified in MIL-HDBK-1553A,the ideal method for carrying a busthrough a multipin connector is throughthe use of a triaxial contact since theseterminate the twisted pair coaxially andterminate the braid through 360 degreeswith nearly 100% coverage.

Discrete Concentric ThreadedThreaded connectors have the bene-

fit of a straightforward design that canbe used in many applications, althoughconnectors from different vendors maynot be compatible. Threaded connec-tors present a disadvantage in tightspaces where there is not enough lever-age to torque a connector properly andblind mating may be necessary. A majorconcern for interconnects on an aircraftare connections coming loose due to


Threaded connector heads can often be fittedwith safety wire to prevent demating under highshock and vibrational strain, particularly in heli-copters.

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12a Aerospace Manufacturing & Fabrication, December 2017Free Info at http://info.hotims.com/65858-883


vibrational strain. Oftentimes, technicians will leverage safetywire to prevent this occurrence. Still, the wire itself simplymaintains tension by being twisted around itself to preventdemating, the actual connector must maintain the torque inorder to stay fastened to prevent an intermittent connection.Cross-threading is another concern for unintentionally forcedmates between two unmateable connector heads, ultimatelydamaging the threads.

Discrete Concentric Bayonet Bayonet type connectors have the advantage of simple,

repeatable installation without the need for safety wiring asvendors can employ multiple lugs where the center contactand a second intermediate cylindrical contact can maintainengagement. This type of connector head is most often usedfor the twinax main bus as it does not need the same torsionalstrain as a threaded connector for reliable contact. This is par-ticularly beneficial in tight spaces. It is also important to notethat along with the diversity of vendors offering bayonet con-nectors comes the diversity in mating surfaces that are notintermateable and may not be able to support the keyingrequirements for some systems.

ConclusionPractical concerns such as the simplicity of fitting connections

versus the reliability of the connection can be addressed duringdesign of the wiring arrangement in a 1553B network prior toinstallation. While using box style couplers and bayonet adaptersmay increase simplicity and modularity, the reliability of theinterconnect can go down as the MTBF increases, as well as therisks posed when obtaining bayonet connectors from variousmanufacturers. Aside from what is directly specified in MIL-STD-1553B, the type of coupler and cable assembly leveraged is high-ly dependent on the type of signal and layout of the vehicle.

This article was written by Mark Hearn, Product Manager,MilesTek (Lewisville, TX). For more information, visithttp://info.hotims.com/65858-504.

Reference1. http://www.google.ch/patents/US59493002. https://www.google.com/patents/US76600923. https://books.google.com/books?id=1WfPWbSN7pUC&pg=SA7-

PA51&dq=triaxial+cable&hl=en&sa=X&ved=0ahUKEwjRncbw9tHVAhVIKCYKHQLvBeIQ6AEILTAB#v=onepage&q=triaxial%20cable&f=false

4. http://www.milestek.com/blog/index.php/2011/05/twinax-vs-triax-cables-benefits-and-differences/

Multi-pin cable harnesses that route discrete signals between avionicsequipment often use twisted shielded pairs with triaxial connector pininserts as the concentricity ensures the polarity of cables from two differentvendors are not reversed.

MIL-STD-1553B Components

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Metric-Sized Metal Shapes

Parker Steel Company (Maumee,

OH) offers metric-sized metals suit-

able for applications where pre-

sized metric parts are needed.

Parker Steel’s cold-finished car-

bon steel, alloyed and high-

strength stainless steel, aluminum, copper, brass and tool steel

bars/shafting, tubing, sheets and plates, angles, channels and

tees; and other specialty shapes can be shipped out the same

day as ordered with very few exceptions.

Among the most frequently specified metric metals for aerospace

applications are the 360 brass and 17-4 PH stainless steel products. The

360 brass (European CuZn36Pb3; CW603N) round and hex bars are

produced from a combination of copper and zinc. Exhibiting high

strength and superior corrosion-resistance, the 360 brass shapes are

100 percent machinable, although welding and cold forming are not

recommended. The material is suitable for bushings, circuit board

relays, switches, nuts, bolts, pump shafts, and fixtures.

The 17-PH round bar stainless steel offers high strength, exception-

al corrosion resistance, and good mechanical properties. Supplied in

condition A (annealed) directly from the mill, these shapes are easily

machined and welded for a variety of parts found on aircraft.


Corrosion Protection

A leading coil coater and manufacturer of proprietary coating

chemistries has recently introduced InterCoat®ChemGuard, a new type of cor-

rosion protection for galvanized steel. InterCoat®ChemGuard uses a new

type of coating technology that utilizes covalent bonds and enhances

the effectiveness of zinc and substantially improves corrosion protec-

tion on galvanized steel.

Standard practice to

protect metal from corro-

sion for approximately the

last 70 years has been to

coat it with zinc. Heavier

zinc coatings have normal-

ly been applied to provide longer protection. InterCoat®ChemGuard,

instead, reacts with the zinc to form a permanent, covalent bond on

the surface of the metal. The product is applied over a light layer of

zinc, which reacts with the zinc to dramatically improve its corrosion

protection properties. The bond which is formed at the molecular

level cannot be washed or worn off. This is different and more effective

than the typical barrier coating. This revolutionary process allows

bending, stamping, post-painting and even shearing, while providing

self-healing characteristics that help protect newly exposed zinc that

naturally occurs during secondary processing.



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Solder for Carbon Materials

Goodfellow (Coraopolis, PA) has announced the

availability of C-Solder, the trade name for a group of

new tin-based, flux-free soldering alloy that enables

the joining of carbon materials. The resulting bond is

both mechanically strong and electrically conductive.

With C-Solder you can join carbon materials includ-

ing carbon fibers or carbon nanotube fibers in car-

bon-carbon arrangements; carbon to metals (e.g.,

copper aluminum, titanium, stainless steel), ceramics and glass materi-

als; and aluminum to aluminum, all without using flux.

Key features of C-Solder include: a melting point of 232˚C (solidus

temperature); density of approximately 7.4 g/cm3; excellent flow;

good wetting of surfaces to be joined; electrically and thermally con-

ductive; it's not affected by cleaning solvents; does not leave a residue;

it's not flammable; and it's flux-free and lead-free.


Electrically & Thermally Conductive Grease

epoxySet (Lincoln, RI) presents CTG-

81, electrically and thermally conductive

non-silicone grease. This grease offers

excellent heat dissipation with a thermal

conductivity of 7.2 W/m°K and an electri-

cal resistance of <.01 ohm-cm. It is ideal

for high end applications where maximization of heat transfer is essen-

tial. This non-curing hydrocarbon can withstand 200°C continuously

and will not dry out or melt producing optimum stability over a lifetime

of use. CTG-81 can be used in applications requiring electrical contact

where no stress to the electrical pads can be tolerated. It is a free-flow-

ing paste that can easily be dispensed from syringes or cartridges. It can

be supplied in any size syringe or cartridge as well as jars or cans.


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Automated Design Analysis Software

DfR Solutions (Beltsville, MD)

announced the next release of

Sherlock Automated Design Analysis™

software - Version 5.3. Advanced fea-

tures include Thermal-Mechanical

Analysis. This advanced new capability

provides the ability to capture system-level effects on solder joint relia-

bility during temperature cycling.

Sherlock Automated Design Analysis™ Software uses a Physics of

Failure approach to indicate when thermal temperatures are too hot

for integrated circuits and solder joints. The new Thermal-Mechanical

Capability now available in Sherlock version 5.3 enables users to quick-

ly and easily run thermal-mechanical analyses directly in Sherlock. The

Thermal-Mechanical Analysis in Sherlock enables design improvement

by changing component type, material parameters, and or layout to

minimize loads during thermal expansion. Understanding the interac-

tion of mounting points and components during thermal expansion

assures a more reliable PCB layout under thermal-mechanical stresses.


Handheld Analyzer

SciAps (Woburn, MA) has introduced Z-200C+, a handheld analyzer

for carbon and other elements. The analyzer is the world's only hand-

held analyzer capable of measuring carbon content down to 0.015%,

suitable to distinguish L-grade stainless from straight and H-grades, and

to analyze most carbon steels. The Z also measures other alloy elements

including Mn, Si, Cr, V, Cu, Ni, Se, Nb, Mo, Pb, and others. Therefore

the Z-200C+ also offers a handheld solution for fast, accurate determina-

tion of Mn:C ratios. The Z eliminates the need

for laboratory results or cumbersome spark OES

technology. It provides a fast, reliable result for

C and Mn:C ratio within seconds, without having

to transport bulky analyzers, massive argon

tanks, or wait for laboratory analysis. The Z also

provides carbon equivalent (CE) values using a

variety of different formulas, depending on the

user's choice.

The Z-200C+utilizes LIBS (laser induced breakdown spectroscopy). It

replaces the bulky, power-hungry electric spark source in OES with a

miniature, military-grade, high energy pulsed laser. The laser's small

beam profile reduces argon consumption by a factor of 1,000. Now the

argon supply is a small user-replaceable canister in the handle of the ana-

lyzer, instead of a large external tank. For general alloy analysis the argon

yields about 600 tests. For L-grades, the number of tests drops to about

125 because several tests are averaged.


Micro Purge System

Aeroprobe Corporation (Christiansburg,

VA), a company that provides air data meas-

urement systems to aerospace, automotive,

turbo-machinery, wind turbine, and wind

tunnel testing industries around the world, is adding a Micro Purge

System (μPS) to its line of measurement solutions products. The μPS will

allow users to purge the pneumatic system of the μADS of debris and

moisture that can develop during normal operation. These elements

can influence data acquisition and create functional issues.

The μPS is controlled by a Micro Air Data Computer (μADC), anoth-

er component of the μADS. As a pump-based purge system, the μPS can

be operated without the need for an external compressed air source.

Aeroprobe’s μPS is the lightest solution for purge available and can be

paired with any of the company’s μADCs.


Test Methodology for Aircraft Wireless Systems

Leti (Grenoble, France), a technology research institute of CEA

Tech, announced that it has developed a methodology for testing high-

speed wireless communications on airplanes that allows different sys-

tem deployments in cabins, and assesses wireless devices before they are

installed. In a joint research project with Dassault Aviation, Leti demon-

strated a channel-measurement campaign over Wi-Fi frequency in sev-

eral airplanes, including Dassault’s Falcon business jet. Using a channel

sounder and a spatial scanner, Leti teams determined a statistic model

of the in-cabin radio channel, constructed from the antenna position

and the configuration of the aircraft.

A radio-frequency channel emulator

and the in-cabin channel model were used

to test Wi-Fi designed for passenger com-

munication and entertainment before

installation in the aircraft. In that test, two

different wireless access points and differ-

ent antenna configurations for Wi-Fi networks deployed in an aircraft

cabin were evaluated. Based on an extensive test campaign, mean val-

ues of performance parameters, together with the operating margin,

were provided according to the device configuration, kind of traffic

and channel conditions. In addition, the technology gives aircraft

designers key tools to define wireless communication systems that

enhance passenger experience, without aircraft immobilization.


Backlit Silicone Keypad

The Spanish company, Grabysur (Seville,

Spain), has just launched its first custom-

made backlit silicone keypad for both civil

and military applications, resistant to extreme

environmental conditions, and without mini-

mum order. Unlike other synthetic materials such as plastic, silicone

better resists exposure to sunlight, humidity, pressure, chemicals or

dust, keeping material properties unchanged for longer.

This illuminated silicone keypad is applicable in naval, terrestrial

and aerospace industries, and in any sector where there is exposure to

extreme environmental conditions. It is IP65 certified, which guaran-

tees resistance to water and dust. As with the rest of its HMI solutions,

Grabysur is in charge of the complete product cycle, from design to

manufacturing, from its facilities at the Aerospace Technology Park in

Andalusia, Aeropolis. The company custom manufactures the new tai-

lored keypads to the specific needs of each customer, both in terms of

design features and number of units.


Concentric Mechanical Encoders

Grayhill, Inc. (LaGrange, IL) has introduced the

Series 20 mechanical encoders with concentric shafts,

available in a range of design and output code options

to meet individual application needs. With panel or

shaft seal options, and designed to meet relevant mili-

tary standards, the Series 20 encoders are applicable to

military, transportation, avionics, medical equipment,

test and measurement equipment, and more.

The Series 20 encoders are available with four different

angles of throw options for both the inner and outer shafts, determining

the maximum number of positions for the encoder. They are available

with either a fixed stop or continuous rotation. The Series 20 encoders

combine the feel of rotary switches with a digital output, and offer an eco-

nomical way of obtaining binary, gray, or quadrature code output from a

rotary switch. The 20-series switch is the smallest form factor concentric

shaft mechanical encoder Grayhill produces.


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