What We Do

• Package Modeling– BGA, Flip-Chip, PGA, QFP, TSOP, PoP

• Connector/Cable modeling– SMA, SCSI, USB, Thru-hole, Board-to-board

• PCB Measurement– Impedance, Skew, Delay, switching noise

• Socket, Contactor Modeling– Probe Card, Socket, Calibration Standard

• Design Consulting– Design reviews, load board design, prototype development, design

recommendations• Validation

– DDR device, DIMM module• Partner Support

– Conference, Design Seminar

High Speed Design Center