work in progress – do not publish rf&a/ms 1-page update analog - carrier frequency bands lf...

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Work in progress – do not publish RF&A/MS 1-page update Analog - carrier Frequency bands LF Analog (0- 0.4GHz) RF (0.4-30GHz) mm-wave (30- 300GHz) THz (>300GHz) Example applications Automotive controls Cellular 60 GHz point-to- point No products yet On-chip regulators WLAN Imaging Coordinate with ERD Power management SerDes Automotive radar ADC,DAC Wireless backhaul Chapter scope illustrated above Subgroup updates: CMOS, Bipolar, III-V, HVMOS, Passive devices Common to all: Very few adjustments for 2012 7 productive X-TWG meetings: A&P, Interconnect, MEMS,ERD, PIDS, Test, Design Industry survey 1

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Page 1: Work in progress – do not publish RF&A/MS 1-page update Analog - carrier Frequency bands LF Analog (0-0.4GHz)RF (0.4-30GHz)mm-wave (30-300GHz)THz (>300GHz)

Work in progress – do not publish

RF&A/MS 1-page updateAnalog - carrier Frequency bands

LF Analog (0-0.4GHz) RF (0.4-30GHz) mm-wave (30-300GHz) THz (>300GHz)

Example applicationsAutomotive controls Cellular 60 GHz point-to-point No products yet

On-chip regulators WLAN Imaging Coordinate with ERD

Power management SerDes Automotive radar

ADC,DAC Wireless backhaul

• Chapter scope illustrated above• Subgroup updates:

• CMOS, Bipolar, III-V, HVMOS, Passive devices• Common to all: Very few adjustments for 2012

• 7 productive X-TWG meetings:• A&P, Interconnect, MEMS,ERD, PIDS, Test, Design

• Industry survey1

Page 2: Work in progress – do not publish RF&A/MS 1-page update Analog - carrier Frequency bands LF Analog (0-0.4GHz)RF (0.4-30GHz)mm-wave (30-300GHz)THz (>300GHz)

Work in progress – do not publish

CMOS• Adopt TCAD based models following PIDS

• More consistent values of analog device parameters

• Reflect impact of local wiring on device parameters• Use interconnect roadmap information

• Review FOMs to better reflect application requirements• Apply consistently across technologies: CMOS, bipolar, III-V

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Bipolar• Build the roadmap by simulation

• Consider performance plateaus of 3-4 years duration

• Improve the tie to application requirements in defining bipolar timing – Survey? iNEMI?

Page 3: Work in progress – do not publish RF&A/MS 1-page update Analog - carrier Frequency bands LF Analog (0-0.4GHz)RF (0.4-30GHz)mm-wave (30-300GHz)THz (>300GHz)

Work in progress – do not publish

III-V technologies• Review FOMs vs Technology, introduce enhancement mode

FETs

• Heterogeneous 3D integration

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Passive devices• Review FOMs vs application• Consider mm-wave applications• Consider new materials for voltage regulation applications

HVMOS• Add Coff, Leakage current, Ambient /Junction

Temperature

• Expand scope to include 60V for automotive, 100V for MEMS actuation,…

Page 4: Work in progress – do not publish RF&A/MS 1-page update Analog - carrier Frequency bands LF Analog (0-0.4GHz)RF (0.4-30GHz)mm-wave (30-300GHz)THz (>300GHz)

Work in progress – do not publish

X-TWG Discussions• Assy & Pkg

• Die-to-Die I/O, Substrate thickness & TSV, Redistribution layers, mm-wave antennae

• Interconnect• thin metal parasitics, Thick metals, TSV, Current densities & E-M

• MEMS • resonators, varactors, switches. –help develop RF FOMs.

• ERD• Create table of Emerging Device X Functional Elements & FOMs

• Perhaps a “micro”-workshop in Monterey

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Page 5: Work in progress – do not publish RF&A/MS 1-page update Analog - carrier Frequency bands LF Analog (0-0.4GHz)RF (0.4-30GHz)mm-wave (30-300GHz)THz (>300GHz)

Work in progress – do not publish

X-TWG Discussions(2)• PIDS

• Work to make nanoHub simulator be consistent with RFAMS needs

• Test• Create a table of product test and device characterization needs by

frequency band

• Design• Review RFAMS Drivers & FOMS,

• Include Automotive & Smart-grid drivers

• SIP vs SOC discussion

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Page 6: Work in progress – do not publish RF&A/MS 1-page update Analog - carrier Frequency bands LF Analog (0-0.4GHz)RF (0.4-30GHz)mm-wave (30-300GHz)THz (>300GHz)

Work in progress – do not publish

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