Working Group 1 WG1 Geometry and Interactions

Technological Aspects and Developments of New Detector structures

WG1: Technological Aspects and Developments of New Detector Structures

ObjectiveObjective: Detector design optimization, development of new multiplier geometries : Detector design optimization, development of new multiplier geometries and techniques.and techniques.

Task 1: Task 1: Development of large-area Micro-Pattern Gas Detectors (large-area modules, material budget Development of large-area Micro-Pattern Gas Detectors (large-area modules, material budget reduction).reduction).

Task 2: Task 2: Detector design optimization including fabrication methods and new geometries (Bulk Micromegas, Detector design optimization including fabrication methods and new geometries (Bulk Micromegas, Microbulk Micromegas, single-mask GEM, THGEM, RETGEM, MHSP, charge-dispersive readout, Ingrid).Microbulk Micromegas, single-mask GEM, THGEM, RETGEM, MHSP, charge-dispersive readout, Ingrid).

Task 3: Task 3: Development of radiation-hard and radio-purity detectors.Development of radiation-hard and radio-purity detectors.

Task 4: Task 4: Design of portable sealed detectors.Design of portable sealed detectors.

How will we work?

Obviously, the work has to start from the Applications.

There will be meetings on the various tasks to compare findings, exchange experience from the applications

Example : Thick-GEMS are developed for various applications: photon detection for Cherenkov, calorimetry, muon systems… RD51’s goal is to make these work together.

Another example : large bulk Micromegas are developed for sLHC muon chambers, neutrino long baseline experiments, calorimetry. Here also cross-fertilization between applications would be productive.

The first step was to ask, end of May 2008:

- What is your preferred technology?(GEM, Micromegas, THGEM, RETGEM, MHSP, Cobra, PIMS, Microgroove, microwell, microdots…)

- What are your main applications? (calorimetry, TPC, photon detection, medical, imaging,…

- What is your timescale (small prototyping, scale 1 prototyping, delivery of detector, …)

GEOMETRY OF WG1

Geometry of WG1

38 institutes out of 54 expressed interest in tasks of Working Group 1

28 on Large Area Detectors (task 1)

9 on Design optimization (task 2, strong overlap with WG2)

20 on Radiation hard and high radiopurity (task 3)

3 on sealed detectors (task 4, recently added)

Large area detectors in various technologies are studied for various applications :

SLHC muon chambers (tracking and triggering)

SLHC forward tracking

ILC-TPC

Cherenkov counters

neutrino long baseline experiments

Development of large-area Micro-Pattern Gas Detectors (as of September 22)

Bulk Micromegas Single mask GEM

Development of resistive anodes

Task/Milestone Reference

Participating Institutes

Description Deliverable Nature

Start/Delivery Date

WG1-1/Development of large-area Micro-Pattern Gas Detectors - Micromegas

CEA Saclay, Demokritos, Napoli, Bari, Athens Tech. U., Athens U., Lanzhou, Geneva, PNPI,Thessaloniki,Ottawa/Carleton

Development of large area Micromegas with segmented mesh and resistive anodes

First prototype (1x0.5m2)

m1/m12

      SLHC full size m13/m60

  CEA Saclay, Ottawa/Carleton Demokritos, Athens Tech. U., Athens U.

  ILC full size m13/m36

WG1-1/Development of large-area Micro-Pattern Gas Detectors - GEM

Bari, CERN, Pisa-Siena, Roma, Arlington, Melbourne, TERA, PNPI,MPI Munich, Argonne

GEM R&D Report, small size prototypes

m1/m18

  Bari, CERN, Pisa-Siena

  Full scale prototype

m6/m18

      Development completed

m19/m30

  Arlington   Medium-size prototype

m1/m6

      1 m2 prototype m13/m18

      1 m3 stack m19/m30

  Roma, Bari   JLab HallA full scale prototype

m18/m30

Task & Milestones:

Development of large-area Development of large-area Micro-Pattern Gas Micro-Pattern Gas Detectors (large-area Detectors (large-area modules, material budget modules, material budget reduction).reduction).

200 m

MESHESMESHES

ElectroformedChemically

etched Wowen

PILLARSPILLARS

Deposited by vaporization

Laser etching, Plasma etching…

Many different technologies have been developped for making meshes (Back-buymers, CERN, 3M-Purdue, Gantois, Twente…)

Exist in many metals: nickel, copper, stainless steel, Al,… also gold, titanium, nanocristalline copper are possible.

Can be on the mesh (chemical etching) or on the anode (PCB technique with a photoimageable coverlay). Diameter 40 to 400 microns.

Also fishing lines were used (Saclay, Lanzhou)

drilling + chemical rim etching without maskMask etching + drilling; rim = 0.1mm

Detector design optimization, fabrication methods and new geometries

6 keV X-ray

104

pitch = 1 mm; diameter = 0.5 mm; rim=40; 60; 80; 100; 120 mm

THGEM Example

RTGEM: resistive electrode THGEM

3÷10 G/ copper oxide layer

Gain of RETGEM in various gases:

resistive foilresistive foilgluegluepadspads

PCBPCB

meshmesh

Resistive anode:Charge dispersion readout

1 M/ plastic foil

Discharge studies and spark-protection developments for MPGDs

Applications : ILC-TPC, DM, SLHC vertex detector, polarimetry in Astrophysics…Techniques: GEM, Micromegas

Gas + Pixel detectors

55 m

55 m

14111 m

1612

0 m

1408

0 m

(pi

xel

arra

y)

11 22 33

44

55

55

μ m

55 μ m

Pre

am

p/

shap

er

TH L dis c.

Con

fig

ura

tion

la

tch

es

Interface

Counter

Syn

chro

niz

ati

on

Logic TimePix

65000 pixels per chip

Counting, time, time over threshold modes adressable pixel by pixel.

Interactions of WG1WG2

WG1

WG6Production

WG5 Electronics

WG7Test beams

Characterization, basic studies on performance, aging

WG4

Simulations

New materials, new geometries

Protecti

on

WG1: Technological Aspects and Developments of New Detector Structures

ObjectiveObjective: Detector design optimization, development of new multiplier geometries : Detector design optimization, development of new multiplier geometries and techniques.and techniques.

Task 1: Task 1: Development of large-area Micro-Pattern Gas Detectors (large-area modules, material budget Development of large-area Micro-Pattern Gas Detectors (large-area modules, material budget reduction).reduction).Interactions with Applications : calorimetry, tracking for LC and SLHC, muon tomography, large objects Interactions with Applications : calorimetry, tracking for LC and SLHC, muon tomography, large objects imaging,…imaging,…Interactions with Electronics: low-cost highly integrated systemsInteractions with Electronics: low-cost highly integrated systemsInteractions with Production: large machines needed. Interactions with Production: large machines needed.

Task 2: Task 2: Detector design optimization including fabrication methods and new geometries (Bulk Micromegas, Detector design optimization including fabrication methods and new geometries (Bulk Micromegas, Microbulk Micromegas, single-mask GEM, THGEM, RETGEM, MHSP, charge-dispersive readout, Ingrid).Microbulk Micromegas, single-mask GEM, THGEM, RETGEM, MHSP, charge-dispersive readout, Ingrid).Interactions with operation and performancesInteractions with operation and performances

Task 3: Task 3: Development of radiation-hard and radio-purity detectors.Development of radiation-hard and radio-purity detectors.Interactions with Applications : Low-noise detectors for rare eventsInteractions with Applications : Low-noise detectors for rare events

Task 4: Task 4: Design of portable sealed detectors.Design of portable sealed detectors.Interactions with Electronics: portable systemsInteractions with Electronics: portable systemsInteractions with Production: sealed low-outgasing detectors.Interactions with Production: sealed low-outgasing detectors.