wu - surface topography investigation for niobium cavities and its implication for thin film

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October 4, 2010 1 Surface topography investigation for niobium cavities and its implication for thin film SRF Genfa Wu Fermilab developed highly successful processing techniques for 1-cell cavities . Field emission in 1-cell cavity was completely under control. Magnetic field quench became dominant niobium cavity performance limitation. Optical inspection and surface replication of cavity equators revealed large number of surface defects in both 1-cell and 9-cell ILC cavities. The analysis indicated the surface topography and roughness played secondary role in cavity performance limitations in modern niobium cavity processing. Fermilab effort to perfect the niobium RF surface is progressing well.

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http://www.surfacetreatments.it/thinfilms Surface topography investigation for thin film SRF (Genfa Wu - 20') Speaker: Genfa Wu - Fermilab | Duration: 20 min. Abstract The general surface topography will be discussed for various niobium cavities. The field enhancement factor for both niobium or thin film cavities will have different effects. Their implications for thin film based cavities will require investment in extensive surface preparations for cavity substrate cavities. The surface preparation effort at Fermilab will be discussed for future new material effort.

TRANSCRIPT

Page 1: Wu - Surface topography investigation for niobium cavities and its implication for thin film

1October 4, 2010

Surface topography investigation for niobium cavities and its implication for

thin film SRFGenfa Wu

Fermilab developed highly successful processing techniques for 1-cell cavities . Field emission in 1-cell cavity was completely under control. Magnetic field quench became dominant niobium cavity performance limitation. Optical inspection and surface replication of cavity equators revealed large number of surface defects in both 1-cell and 9-cell ILC cavities. The analysis indicated the surface topography and roughness played secondary role in cavity performance limitations in modern niobium cavity processing. Fermilab effort to perfect the niobium RF surface is progressing well.

Page 2: Wu - Surface topography investigation for niobium cavities and its implication for thin film

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Outlines

9-cell cavity yieldANL/FNAL facility and diagnostic capability

Quench localization, optical inspection and surface replicaCavity processing/testing summary

Cavity performances and surface featuresCavity performances and surface roughnessImpact of surface topology for thin film/new material and Fermilab’s effort in cavity RF surface preparationSummary

October 4, 2010

Page 3: Wu - Surface topography investigation for niobium cavities and its implication for thin film

9-cell Cavity Performance & Stats

For cavities from established vendors, using optimized EP processing and handling procedures:1st-pass cavity yield >35 MV/m is (29 +- 8) %2nd-pass cavity yield >35 MV/m is (56 +- 1) %, where 2nd pass refers to any surface preparationAll cavities passing gradient requirement also pass Q0 requirement Data from C. Ginsburg

Even after 2nd pass, less than 56% cavities yield at 35MV/m.Surface defects affects SRF cavity superconductivity dramatically.

October 4, 2010

Page 4: Wu - Surface topography investigation for niobium cavities and its implication for thin film

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Argonne/Fermilab Cavity Processing Facility

Electro-PolishingUltrasonic Degreasing

High-Pressure Rinsing Assembly & Vacuum Leak TestingCourtesy of M. Champion

October 4, 2010

Page 5: Wu - Surface topography investigation for niobium cavities and its implication for thin film

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Fermilab Cavity diagnostics – optical inspection

Camera inspection system by Kyoto University/KEK

Questar QM-1, originated at Cornell USAF-1951 seen by Questar

Kyoto/KEK: standard ILC cavities. Questar: All style cavities

Resolution (µm)

Questar ~10

Kyoto/KEK ~25

Image of TE1ACC006

Image of 3C9FER001

October 4, 2010

Page 6: Wu - Surface topography investigation for niobium cavities and its implication for thin film

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Fermilab Cavity diagnostics – T-map/OST

Cernox based fast thermometry (FNAL T&I Dept. ) and diode based T-map

(A. Mukherjee et al.)

Oscillating Superleak Transducer (“second-sound” detectors from Cornell University – Z. Conway

October 4, 2010

Page 7: Wu - Surface topography investigation for niobium cavities and its implication for thin film

Capable to reveal the 3-D profile of geometric defects and to evaluate the mechanism leading to quench at the defects based on local magnetic field enhancement.Useful to assess surface preparation effectiveness by extracting surface roughnessAchieved resolution at the micron detail (to resolve features ~<10µm in diameter; ~1µm in depth).

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Fermilab Cavity diagnostics – Surface replica

M Ge, G Wu, D Burk, J Ozelis, E Harms, D Sergatskov, D Hicks, and L D Cooley, Routine characterization of 3-D profiles of SRF cavity defects using replica techniques,Manuscript submitted to Journal of Superconducting Science and Technology.

October 4, 2010

Berry S, Antoine C, Aspart A, Charrier J P, Desmons M, and Margueritte L, Topologic analysis of samples and cavities: A new tool for morphologic inspection of quench site, Proc. 11th Workshop on RF Superconductivity, 2003

Page 8: Wu - Surface topography investigation for niobium cavities and its implication for thin film

A man-made pit 125µm deep, 300µm in diameter Pit replicaµm

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Length = 0.8 mm Pt = 128 µm Scale = 200 µm

profile of a pit on the Nb coupon profile of pit’s replica

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Surface replica - resolution

Overall, 1 µm detail can be replicatedOctober 4, 2010

Page 9: Wu - Surface topography investigation for niobium cavities and its implication for thin film

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A discussion about surface detail

J. Knobloch, et al., “High Field Q Slope in Superconducting Cavities Due to Magnetic Field Enhancement at Grain Boundaries,” in Proc. of 9th Workshop on RF Superconductivity, Santa Fe, New Mexico,1999, pp. 77-91

Does 1 micron resolution sufficiently characterize the RF surface?

As magnetic field at the edge of the defect approaches the thermal critical magnetic field, the magnetic flux then penetrates the corner area deeper, depending on the field enhancement factor (corner radius).

At this time, the defect can be divided into one lossy corner and a remaining flux-free body.

The effective corner curvature is in micron scale as in the case of normal conducting niobium.

Surface replica resolution of 1 µm sufficient to characterize the RF surfaces

High resolution profilometer (KLA Tencor Model P-16)

Probe tip with 0.8 µm diameter Horizontal resolution < 1 µm Vertical resolution ~1 Å

October 4, 2010

Page 10: Wu - Surface topography investigation for niobium cavities and its implication for thin film

Epoxy after casting on silicone

Ribbon

SiliconeFeature on silicone

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Feature’s 3D shape after profilometer scanning

Silicone pouring into an open half cell with a string embedded

Visually indentify the features

Surface replica – extraction and surface scan

October 4, 2010

Page 11: Wu - Surface topography investigation for niobium cavities and its implication for thin film

Ethanol rinsing and HPR after molding

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Surface replica - cavity RF performance verification

0 10 20 30 401.000E+08

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TE1AES004 - Q vs EComparison before and after applying molding material

2/9/20094/10/2009

Eacc [MV/m]

Q0

No performance degradation

M Ge, G Wu, D Burk, J Ozelis, E Harms, D Sergatskov, D Hicks, and L D Cooley, Routine characterization of 3-D profiles of SRF cavity defects using replica techniques,Manuscript submitted to Journal of Superconducting Science and Technology.

October 4, 2010

Page 12: Wu - Surface topography investigation for niobium cavities and its implication for thin film

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Cavity processing/testing summary

1-cell cavity processing highly optimized to be free of field emission.It allows “clean” studies of 1-cell cavity performance.

October 4, 2010

Page 13: Wu - Surface topography investigation for niobium cavities and its implication for thin film

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Cavity performances and surface features

Cavities represent six categoriesFine grain BCPLarge grain BCPSingle crystal BCPFine grain light EPFine grain heavy EPFine grain Tumble polishing plus light EP

Cavities have apparent geometric defectsBumpsPitsScratches or grain boundaries

Cavities have no visible defects Surface roughness in

Weld seamHeat Affected Zone (HAZ)Normal area

October 4, 2010

Page 14: Wu - Surface topography investigation for niobium cavities and its implication for thin film

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Length = 0.623 mm Pt = 148 µm Scale = 160 µm

1.3GHz 9-cell cavity TB9ACC017

EB-Welding seam

Y-Y’

X-X’

X-X’

Y-Y’TB9ACC017 quenched at 12.3MV/m, Pit was found at Cell #4 equator 180 deg region (quench location), the pit is 150 µm deep and 200 µm wide on the top.

Surface defect limits cavity performance at low field

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Length = 0.645 mm Pt = 143 µm Scale = 160 µm

October 4, 2010

Page 15: Wu - Surface topography investigation for niobium cavities and its implication for thin film

Spot (a)

Spot (b)

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Length = 0.756 mm Pt = 159 µm Scale = 170 µm

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Length = 1 mm Pt = 155 µm Scale = 160 µm

AES001 quenched at 15.6~21MV/m, Twin peaks were found at Cell #3 equator 169 deg region

Spot A height 160µm, diameter 700µm on bottom

Spot B height 155µm, diameter 1000µm on bottom

Surface defect limits cavity performance at low field

15October 4, 2010

Page 16: Wu - Surface topography investigation for niobium cavities and its implication for thin film

Diameter: 400µm,Depth: 60µm

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Length = 1.49 mm Pt = 81.9 µm Scale = 100 µm

Diameter: 1300µm, Depth: 70µm A 15µm high tiny bump in the center.

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40.2 MV/m quenched at pit region

39MV/m quenched NOT at pit region

TE1ACC003

TE1AES004

Equator welding seam

Equator

welding seam

HAZ

Surface defect limits cavity performance at high field

16October 4, 2010

Page 17: Wu - Surface topography investigation for niobium cavities and its implication for thin film

Field enhancement factor with r/R model

r/R h simulation h meas.

TB9ACC017 ≈0.14 ≈2.2 ≈3.4

TE1ACC003 ≈0.23 ≈1.8 ≈1.17

TE1AES004 ≈0.96 ≈1.2 ≈1.08

Hrf,critical = 180mT, Hp/Eacc=4.26 mT/(MV/m)

V. Shemelin, H. Padamsee, “Magnetic field enhancement at pits and bumps on the surface of superconducting cavities”, TTC-Report 2008-07, (2008).

17October 4, 2010

Page 18: Wu - Surface topography investigation for niobium cavities and its implication for thin film

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1-cell cavity: PKU-LG1

P. Kneisel, “Progress on Large Grain and Single Grain Niobium – Ingots and Sheet and Review of Progress on Large Grain and Single Grain Niobium,” in Proc. of 13th Workshop on RF Superconductivity, Beijing, China, 2007.

43 MV/m. 189 mT

NingXia large grain RRR niobium

Post purified BCP processed Low temperature baking

Features found at multiple locations: BCP stains BCP etching pits Weld Pits Steep grain boundaries

October 4, 2010

Page 19: Wu - Surface topography investigation for niobium cavities and its implication for thin film

A-A’

Joint of grain boundary

Eacc reached 43MV/m

The height of step on A-A’: 60µmThe height of step on B-B’: 25µm

Joint of grain boundary

Welding seam

B-B’

The measurement of grain boundary step

A-A’

B-B’

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Profile on A-A’

Profile on B-B’

Optical image of PKU-LG1

October 4, 2010

Page 20: Wu - Surface topography investigation for niobium cavities and its implication for thin film

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Field enhancement factor with step model

Severe grain boundary do not cause material imperfection in this cavity.

Phonon peak in thermal conductivity helps to reduce the effect of the normal conducting region?

October 4, 2010

Cavity Computed field enhancement

factor

Measured maximum H field

[mT]

PKU-LG1 1.6 185

J. Knobloch, et al., “High Field Q Slope in Superconducting Cavities Due to Magnetic Field Enhancement at Grain Boundaries,” in Proc. of 9th Workshop on RF Superconductivity, Santa Fe, New Mexico,1999, pp. 77-91

Page 21: Wu - Surface topography investigation for niobium cavities and its implication for thin film

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Field enhancement factor

Many cavity quenches are found that cannot be explained by magnetic field enhancement.

Surface topology plays as secondary role in cavity performance limitation.

Intrinsic material imperfections remain as primary cause for poor performance in SRF cavities.

Severe grain boundary is not a concern for large grain cavities.

October 4, 2010

Cavity Feature Computed field enhancement factor

Measured maximum H field [mT]

Max. H field from field enhancement

factor [mT]TB9ACC017 Pit 2.2 54.1 119

AES001 Bump 1.5 96.8 145.2TE1ACC003 Pit 1.8 154 277 ?TE1AES004 non-quench pit 1.2 168.0 201.6

PKU-LG1 Grain boundary 1.6 185 296 ?

Page 22: Wu - Surface topography investigation for niobium cavities and its implication for thin film

Cavity surface roughnessWelding seam HAZ Normal area

BCP'd 70µmNR-6(3 similar)

EP'd 40µmTE1ACC005

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22October 4, 2010

Page 23: Wu - Surface topography investigation for niobium cavities and its implication for thin film

Cavity surface roughnessWelding seam HAZ Normal area

EP'd 120µmTE1ACC003(8 similar)

EP'd 150µmTB9ACC017

Tumbling 100-120µmTE1ACC004(4 similar)

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Page 24: Wu - Surface topography investigation for niobium cavities and its implication for thin film

0.000

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PKU Large grain BCP'd cavity

PKU Single crys-tal BCP'd cavity

Surface roughness vs. Gradient

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TESLA shape ,quenched but no obvious defects

Cavity performance becomes less dependent on the surface roughness as the maximum magnetic field reached a plateau

October 4, 2010

Page 25: Wu - Surface topography investigation for niobium cavities and its implication for thin film

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Investigation of intrinsic quench limits

36.83 MV/m

Geometric Defect

Courtesy of G. Ciovati

Cavity was cut open, samples are being analyzed – A. Romanenko

Quench location

A work in progress !

October 4, 2010

Page 26: Wu - Surface topography investigation for niobium cavities and its implication for thin film

Influence of Cavity Topography on Thin-Film SRF Performance

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For thin film RF surface, the top layer is vulnerable to magnetic field enhancement. The performance of such cavity will depend on the surface topography. Increasing the film thickness can help, but brings other unforeseen problems.

The substrate cavity preparation is very important.

October 4, 2010

Page 27: Wu - Surface topography investigation for niobium cavities and its implication for thin film

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Fermilab’s effort in cavity processing

Tumble polishingLight EPChemical mechanical polishing

BCP 150 µm

Tumble 120 µm

EP 40 µm

October 4, 2010C. Cooper, Tumble polishing, TTC 2010, Fermilab

Page 28: Wu - Surface topography investigation for niobium cavities and its implication for thin film

Chemical mechanical polishing (before)

Courtesy of CMPC Surface FinishesFermilab collaborator

Page 29: Wu - Surface topography investigation for niobium cavities and its implication for thin film

Courtesy of CMPC Surface Finishes

Chemical mechanical polishing (after)

Page 30: Wu - Surface topography investigation for niobium cavities and its implication for thin film

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Conclusions

Cavity replica can be a great technique to identify the quench site

The defects can be classified as geometric imperfections or intrinsic to the material.

Geometric imperfections may only play a secondary role in limiting cavity performance. Not all defects are necessarily harmful to cavity performance, other than bearing the risk of trapping acidic water during processing.

Existing processing techniques can easily reduce the magnetic field enhancement (by reducing surface roughness) and enable cavities to reach high gradients in the absence of intrinsic material imperfections.

Material study (cavity cut out) is a must to understand quench behavior further.

Perfect substrate preparation remains a challenge for thin film SRF.

G. Wu, M. Ge, P. Kneisel, K. Zhao, L. Cooley, J. Ozelis, D. Sergatskov and C. Cooper, “Investigations of Surface Quality and SRF Cavity Performance”, manuscript submitted to IEEE transactions on Applied Superconductivity.

October 4, 2010

Page 31: Wu - Surface topography investigation for niobium cavities and its implication for thin film

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Acknowledgements

M. Ge, C. Ginsburg, A. Romanenko, L. Cooley, P. Kneisel, G. Ciovati, M. Morrone.R. Schuessler, D. Hicks, C. Thompson, D. Burke at Fermilab/MDTLTom Reid, R. Murphy, D. Bice, C. Baker at ANLJ. Ozelis, M. Carter, D. Marks, G. Kirschbaum, R. Ward at Fermilab/IB1. We also thank Mark Champion for his useful discussion and support.

October 4, 2010