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RoHS Enforcement

http://www.rohs.gov.uk/Docs/Links/RoHS%20Enforcement%20Guidance%20Document%20-%20v.1%20May%202006.pdf

Compliance Assurance System (CAS)

• A definition of the purpose of the system, its essential requirements and specification. This specification should cover compliance both within the company and within the supply chain

Compliance Assurance System (CAS)

• A formally defined process which implements the requirements of the system and is integrated within the organization’s quality and management systems

Compliance Assurance System (CAS)

• A technical documentation system (paper and/or electronic) to support the process and measures to assure conformity with the requirements of the system together with necessary training, tools and infrastructure.

Evidence of Active Control of the CAS

• Results of internal and supplier audits to validate Compliance Assurance System and/or processes. i.e. the supplier’s ability to assure compliance.

Evidence of Active Control of the CAS

• Evidence that the system is being followed including results of product specific conformance assessments comprising items such as product assessments (including justification of RoHS categorization and use of exemptions), materials declarations, procurement, inventory and production controls and substance analysis where appropriate

Evidence of Active Control of the CAS

• Overview of any internal data system used for the management of RoHS compliance data

Evidence of Active Control of the CAS

• Producers’ or suppliers’ completed materials declaration for each part (including revision for revised parts) and justification of RoHS categorization and use of exemptions. These declarations would be limited to the list of RoHS substances, not full materials declarations

Evidence of Active Control of the CAS

• Analysis report for homogeneous materials in parts/components, (which could be the producers or suppliers own internal or external test results). The test results should refer to homogenous materials in parts/components.

Evidence of Active Control of the CAS

• Producers’ or suppliers’ warranties /certificates declaring that the use of the restricted substances is within the permitted levels

Evidence of Active Control of the CAS

• Provide evidence that procedures are being followed to show that materials declarations have been assessed to determine if they can be trusted. Enforcement authorities will also need to see documented compliance procedures

Three Steps to RoHS Compliance

• Documentation

• Procedures

• Marketing

Documentation

• Design for RoHS Compliance• Bill of Material Conversions

– Components, Hardware

• Build to Print Drawings– PCB’s - Cables– Metals - Plastics– Metal Finishes - Paints

• Material Declarations• Testing

(RoHS) Directive

IPC 1065 ANNEX B: Level B Materials and Substances

For Level B materials and substances, the default threshold level is 1000 ppm based upon the weight of the product or subpart being declared. Reporting below the threshold is allowed, but not required.

Where metals are listed in Annex B, they require reporting of the metal content in the metal alloys..

Note: Materials/substances are listed by group. Please refer to Annexes E and F for details.

Material/Substance Threshold level

Antimony/Antimony Compounds 1000 ppm

Arsenic/Arsenic Compounds 1000 ppm

Beryllium/Beryllium Compounds 1000 ppm

Bismuth/Bismuth Compounds 1000 ppm

Brominated Flame Retardants (other than PBBs or PBDEs) 1000 ppm

Nickel/Nickel Compounds (external applications only ¹) 1000 ppm

Certain Phthalates (see Annex F) 1000 ppm

Selenium/Selenium Compounds 1000 ppm

Polyvinyl Chloride (PVC)(Disclosure is limited to “is present”/”is not present” in amounts that exceed threshold)

1000 ppm

1) Nickel alloys are not reportable. Nickel and nickel compounds must be reported when used in applications where nickel compounds are likely to result in prolonged skin exposure (e.g., an outer enclosure for a portable electronic product designed to be carried). Use of nickel or nickel compounds in components and parts designed to be located inside the outer enclosure of a product need not be reported.

Homogeneous material

-Semiconductor package contains six different homogeneous materials.

The term “homogeneous” is understood as “of uniform composition throughout”. Examples of “homogeneous materials” are individual types of: plastics, ceramics, glass, metals, alloys, paper, board, resins, and coatings. The Commission further states that a

“homogeneous material” cannot be mechanically disjointed into different materials.

The term “mechanically disjointed” means that the materials can be, in principle, separated by mechanical actions. This means that an insulated wire is considered as

two homogeneous materials: the metal wire and the plastic insulating material.

Texas Instruments, Inc.Search Results for "74ALVC16244ADGGRE4"

Current Production Information

TI Part Number 74ALVC16244ADGGRE4 Assembly Site TI MALAYSIA A/T 

Lead/Ball Finish CU NIPDAU  Package Type / Pins DGG | 48 

Planned Lead/Ball Finish   Package Body Size (WxLxH) mm 6.1x12.5x1.15 

MSL / Reflow Ratings Level-1-250C-UNLIM  Total Device Mass (mg) 201.729963 

Pb-Free (RoHS) & Green Details

RoHS & High-Temp Compatible Y  Green Compatible N 

Pb-Free (RoHS) Conversion Date 01-Aug-2003 (DC 0331)  Green Conversion Date Aug-2005 

Pb-Free (RoHS) Available Supply Date 15-Apr-2005  Green Available Supply Date Jun-2006 

               

Component Substance CAS Number Amount (mg)

Homogeneous Material Level Component Level

Percentage % ppm Percentage % ppm

Bond Wire

Metallurgy Gold 7440-57-5  0.504594 98.9468 989467 0.2501 2501

Trace Metal Calcium 7440-70-2  0.00001 0.002 19 0 0

Trace Metal Copper 7440-50-8  0.000003 0.0006 5 0 0

Trace Metal Palladium 7440-05-3  0.005355 1.0501 10500 0.0027 26

Trace Metal Silver 7440-22-4  0.000003 0.0006 5 0 0

Sub-Total     0.509965 100 1000000 0.2528 2527

Die Attach Adhesive

Conductive Material Silver 7440-22-4  0.203 70 700000 0.1006 1006

Polymer Epoxy   0.0377 13 129999 0.0187 186

Polymer Proprietary Resin   0.01595 5.5 54999 0.0079 79

Reactive DiluentProprietary

Material   0.03335 11.5 114999 0.0165 165

Sub-Total     0.29 100 1000000 0.1438 1436

Lead Frame

Base Metal Copper 7440-50-8  61.680318 97.425 974249 30.5757 305756

Base Metal Iron 7439-89-6  1.519454 2.4 24000 0.7532 7532

Base Metal Lead 7439-92-1  0.018993 0.03 299 0.0094 94

Base Metal Phosphorus 7723-14-0  0.009497 0.015 150 0.0047 47

Base Metal Tin 7440-31-5  0.018993 0.03 299 0.0094 94

Base Metal Zinc 7440-66-6  0.063311 0.1 1000 0.0314 313

Sub-Total     63.310566 100 1000000 31.3838 313836

Component Substance CAS NumberAmount

(mg)

Homogeneous Material Level Component Level

Percentage % ppm Percentage % ppm

Lead Frame Plating

Plating Gold 7440-57-5  0.025736 2.5 25000 0.0128 127

Plating Nickel 7440-02-0  0.926496 90 900000 0.4593 4592

Plating Palladium 7440-05-3  0.077208 7.5 75000 0.0383 382

Sub-Total     1.02944 100 1000000 0.5103 5101

Mold Compound

Coloring Carbon Black 1333-86-4  0.26586 0.2 2000 0.1318 1317

Filler Fused Silica 60676-86-0  111.262402 83.7 836999 55.1541 551541

Flame Retardant Additive Antimony Oxide 1309-64-4  1.3293 1 10000 0.659 6589

Flame Retardant Polymer Brominated Epoxy   0.53172 0.4 4000 0.2636 2635

Hardener Phenolic Novolac   5.3172 4 40000 2.6358 26358

Hardener Proprietary Hardener   0.66465 0.5 5000 0.3295 3294

Other additives

Catalyst Mold Release Adhesion Agent   0.93051 0.7 7000 0.4613 4612

Polymer Biphenyl Epoxy   1.3293 1 10000 0.659 6589

Polymer Cresol Novolac Epoxy   10.6344 8 80000 5.2716 52716

Stress Relief Agent Silicone   0.66465 0.5 5000 0.3295 3294

Sub-Total     132.929992 100 1000000 65.895 658945

Semiconductor Device

Silicon Chip Doped Silicon 7440-21-3  3.66 100 1000000 1.8143 18143

Sub-Total     3.66 100 1000000 1.8143 18143

 

Total     201.729963     100 1000000

Solder Finish CategoriesThe following categories are meant to describe the Pb-free 2nd level interconnect

e1 – SnAgCue2 – Other Sn alloys (ie. SnCu, SnAg, SnAgCuX, etc.) (No Bi or Zn)e3 – Sne4 – Precious metals (ie. Ag, Au, NiPd, NiPdAu, but no Sn)e5 – SnZn, SnZnX (no Bi)e6 – Contains Bie7 – Low temperature solder (<150°C) containing indium but no bismuthe8, e9 symbols are unassigned categories at this time.

JEDEC 97 / IPC 1066

Compliance Data

• Format

• Where do you put it?

• Design / ECN Loop

Form Structure

1752 Form

Companies Supporting IPC 1752•3M Technologies S Pte Ltd •5-Trees LLC •Ageus Solutions •Agile Software •Array Solutions •Austin Insulators Inc. •Beckman Coulter •C&D Technologies •Celestica, Inc. •Circuit Connect, Inc. •Coherent •Conexant •Datakey Electronics, Inc. •DiSS Technology (HK) Co., Ltd. •E2open •Electronic Hardware Corp. •Energy Transformation Systems •ExcelStor Technology •Foresite Systems •Foxconn Electronics Inc. •Freescale Semiconductor •Future Electronics •GE Security •Harris Corp. •Harvard Custom Manufacturing •Indian Springs Mfg. Co., Inc. •Information Handling Services •Jabil Circuit •Kemet Electronics Corp. •LG Chemical •Lucent Technologies •MHTB •Maxtor Corp. •MicroRam Electronics, Inc.

•Molex •National Semiconductor •Nexgen Mediatech Inc •Omnitrix, Inc. •Optichron Inc. •PCNalert •Panasonic Electronic Devices Co., Ltd. •Pantronix Corporation •Paxar Americas, Inc. •Precience, Inc. •PTC •Qualcomm, Inc. •Ramtron International Corp. •Sagem Tunis •Sanmina-SCI •Schaffner •Shenzhen Newstar Microelectronics Co., Ltd. •Solectron Corporation •Speedline Technologies •Sun Microsystems •Sunpower Technology Co. •Symbol Technologies, Inc. •Synapsis Technology •Temex •Teradyne •Texas Instruments •The GoodBye Chain Group •Trompeter Semflex, Inc. •Tyan Computer Corp. •Tyco Electronics •UPE Electronics •Uawithya •Vitesse

Documentation

• Design for RoHS Compliance• Bill of Material Conversions

– Components, Hardware

• Build to Print Drawings– PCB’s - Cables– Metals - Plastics– Metal Finishes - Paints

• Material Declarations• Testing

PCB’s

Surface FinishesSURFACE FINISH

THICKNESS ADVANTAGES DISADVANTAGES

HASL 50-1500 pm "Nothing solders like solder."Easily applied.Lots of industry experience.Easily reworked.Good bond strengthWithstands multiple thermal cycles.

Huge coplanarity differences resulting in off-contact printing and assembly defects.Contains lead.Not suited for high aspect ratios.Not suited for <0.020" pitch.PCB dimensional stability issues.Bridging problems on fine pitch assemblies.Inconsistent coating thickness (on varying pad sizes).

OSPBenzimidazoles)

0.2-0.6 pm Flat, coplanar pads.Reworkable (by fabricator).Doesn't affect final hole size.Short, easy process.CU-SN IMC formed has been reported to be stronger and more robust than Bu-Sn from HASL and Ni-Sn from Ni-Au.

Assembly line changes may be required; not a drop-in.Question remains over reliability of exposed Cu after assembly.Limited thermal cycles.Cannot be reworked by assembler.Sensitive to some solvents and used for misprint cleaning.Limited shelf life.Test pins cut coating, leaving exposed copper.

ENIG 125-250 pin Ni2-8 pin Au

Planar surface.Consistent thicknesses.Withstands multiple thermal cycles.Long shelf life.Solders easily.Good for fine-pitch product.

Not wire bondable.Expensive.Should not be used on < 1.0 mm pitch;black pad issuesWaste treatment of Ni.Cannot be reworked by fabricator.Ni is suspected carcinogen.Not optimal for higher speed signals.

Surface Finishes

SURFACE FINISH

THICKNESS ADVANTAGES DISADVANTAGES

Immersion Ag

> 5 pin Good for fine-pitch product.Planar surface.No black pad concerns.Short, easy process cycle.Eliminates nickel.Doesn't affect final hole size.Long shelf life.Can be reworked/reapplied by the fabricator.OK for multiple insertions.Inexpensive.Drop-in process for the assembler.Good for ultra-high speed signals.

High friction coefficient; not be suited for compliant pin insertion (Ni-Au pins).Some systems cannot throw into blind vias with aspect ratios >1:1.Tarnishing must be controlled.

Immersion Sn

25-60 pin Good for fine-pitch product.Planar surface.Eliminates nickel.Can substitute for reflowed solder in selective strip.Inexpensive.

Handling concerns.Panels need to be routed and electrically tested before coating.Contains thiourea.Limited rework cycles at assembler.Horizontal process needs nitrogen blanket.

Laminates

Restricted Substances in Alloys

• Lead as an alloying element in steel greater than 0.35% lead by weight.

• Lead as an alloying element in aluminum greater than 0.4 % lead by weight.

• Lead as an alloying element in copper greater than 4% by weight.

Aluminum 2011A Composition Spec

Component Wt. %

Al 91.4 - 95.1

Bi 0.2 - 0.6

Cu 4.5 - 6

Component Wt. %

Fe Max 0.5

Other, each Max 0.05

Other, total Max 0.15

Component Wt. %

Pb 0.2 - 0.6

Si Max 0.4

Zn Max 0.3

Metal Plating

Cable and Harness Assemblies

• Most restricted substances in the RoHS Directive can be found in the insulation, tinning, solder, connectors, and terminations commonly used in cable and harness assemblies. Therefore, component and wire specification and selection are critical to meeting the concentration limits for these substances

Cable and Harness Assemblies

Cable Assemblies

Plastic Enclosures: PBB’s & PBDE’s

Plastics

IEC Standard draft-Levels of RoHS compliance testing

• Non-destructive Screening– XRF handheld or laboratory analyzer– No parts disassembly required– for uniform and homogeneous samples

• Destructive Screening– XRF handheld or laboratory analyzer– Different materials are analyzed separately– mechanical sample preparation is needed

• Verification methods– GC/MS-FTIR, verification of polymers+ electronics– HPLC-UV, verification of polymers + electronics– ICP-MS

IEC Standard draft - Preferred RoHS analysis techniques by

elements• Pb, Cd

– ICP-MS, ICP-AES (destructive) ,verification

– AAS (destructive)

– XRF (non-destructive)

• Cr (VI), hexavalent Chrome

– Spot test ISO3613, Alkaline digestion & colorimetric test EPA3060A diphenyl-carbazide color test, verification of metals

– XRF (for Cr total presence)

• PBB’s and PBDE’s (Br compounds)

– GC/MS-FTIR, verification of polymers+ electronics

– HPLC-UV, verification of polymers + electronics

– XRF (for Br total presence only)

• Hg

– ICP-MS, ICP-AES,

– CV-AAS,AFS verification method

– XRF

PlaterPlater

OEMOEM CustomerCustomer

Plates the part

• Manufactures the raw part• Plates the part• Assembles & Tests sub-assembly• Del ivers completed assembly

Plated Sub-Component

Unplated Sub-Component

Completed Component/Sub-Assembly

Completed Final Product

Final Product Assembly

Out-goinginspection

Incominginspection

RoHS screeningof finished product

: Test Point

PCB ShopPCB Shop

Sub Contractor

Sub Contractor

• Manufactures PCB

• Plates the part

Out-goinginspection

Incominginspection

Plasticssupplier

PlasticssupplierConnectors/

components

Connectors/components

Tracking materials declaration-suggested test points

Testing

Three Steps to RoHS Compliance

• Documentation

• Procedures

• Marketing

Procedures

Continual Improvement of the Quality Management System

Management Responsibility

Resource Management

Measurement Analysis & Improvement

Product Realization

RoHS Compliant

Bill of

Material

INPUT OUTPUT

PRODUCT

RoHS CompliantFinished Product

Management Responsibility and Resources

• Have you composed a hazardous substance list? RoHS vs. Green?

• Have you identified equipment that will be needed for manufacturing compliant product? Soldering irons, solder pots, XRF, dedicated work areas, rework stations.

• Have you provided proper training? IPC 610D, IPC 620, JSTD 001D.

Design and Development

• Compliant bill of material. What level of documentation will you provide? MSL, peak temperature, metal finishes, material declarations.

• Have you developed specifications for cables, metals, metal finishes, paints, plastics, hardware?

• What documentation do you require your customer provide?

• Will you offer RoHS compliant documentation services to you customer? i.e. BOM conversions.

Purchasing

• What RoHS compliance requirements will you provide to your suppliers?

• What RoHS verification at incoming do you perform?

• What documentation do you require from your suppliers?

• Do you audit suppliers for RoHS compliance to assess high risk?

• Do you have a unique part numbering for compliant vs. noncompliant parts?

• Do you label parts at incoming to distinguish compliant vs. noncompliant?

Production Process

• What documentation do you require from your customer for production processes? (MSL, peak temperature, lead finish)

• Will you segregate floor space for compliant assembly? (Dedicated cells, machines, equipment)

• Will you mark equipment for use with leaded processes, non-leaded processes, or both?

• Have you chosen you solder alloys and fluxes?• Do you have a process for material handling of

compliant vs. non-compliant product?• Has all personnel been trained to new standards, IPC

610D, IPC 620, JSTD 001D new equipment and new processes.

Measurement Analysis and Improvement

• Will you perform XRF testing?• Is there a process for non-conforming product?• Do you have a process for non-compliant

traceability and containment?• Do you keep records of non-compliant

substances found on the manufacturing floor?• Do you include RoHS compliance in your

internal audit program?• Is RoHS compliance part of your Management

Review?

Three Steps to RoHS Compliance

• Documentation

• Procedures

• Marketing

Marketing

• Documentation / C of C to Customer

• Product Marking / Advertising

• Third Party Certification of RoHS Compliance– (ISO 9000 / QC 080000)

QC 080000 Advantages

• Clear competitive advantage.

• Demonstrate superior processes and documentation for RoHS compliance.

• Lock-in and grow existing customers.

• Now even more of a “Value Added Supplier”

Advantages For Your Customer

• Your certification goes a long way towards your customer providing “Due Diligence” for RoHS compliance.

• Reduces his audit requirements of your RoHS compliance.

Summary

• Your Product will be tested.

• Penalties inversely proportional to effort.

• Material Declarations versus C of C’s

• Revised “Build to Print” Drawings and Specifications.

• Compliance Assurance System

• Third Party Certification (QC 080000) to demonstrate compliance.