x-ray summary of 1 module and 6 sc:
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X-ray summary of 1 module and 6 SC: Assy are identified by their sensor PDB number, electronics all coming from wafer SXB0LT. Assy always observed through the FEI (i.e. FEI on top of the assy) 20210120310702 (module, see drawing for FEI numbers) 20210110142304 + 0608B (9 columns) - PowerPoint PPT PresentationTRANSCRIPT
X-ray summary of 1 module and 6 SC:
Assy are identified by their sensor PDB number, electronics all coming from wafer SXB0LT. Assy always observed through the FEI (i.e. FEI on top of the assy)
20210120310702 (module, see drawing for FEI numbers)
20210110142304 + 0608B (9 columns) 20210110142305 + 0712B (9 columns) 20210110142306 + 0711B (9 columns) 20210110142307 + 0708B (9 columns) 20210110142308 + 0707B (9 columns) 20210110142309 + 0706B (9 columns)
Summary: bumping/flipping good and uniform, minor defects spotted. Chip cutting still quite bad.
P. Netchaeva, L.Rossi, F. Vernocchi 8/5/02
0606A 0506A 0106A
0707A 0706A 1104A
0105A
1003A
0712A
0902A
0711A
0612B8 columns
0911A 0708A
0411B8 columns
0702B8 columns
If not specified= 9 good columns
We look through the backside of the FEI
HV pad
5 missing Bumps (FEIChipped)
X-ray view
Some shorts possible
Maybe few shorts
Microscope view of FEI cutting edges, quite some chipping and unequal cutting sizes.
In on sensor?
20210110142304 + 0608B
20210110142305 + 0712B
20210110142306 + 0711B
20210110142307 + 0708B
20210110142308 + 0707B
20210110142309 + 0706B