xcument resume ce 060 048 title technician training for

XCUMENT RESUME

ED 340 893 CE 060 048

TITLE Technician Training for the SemiconductorMicrodevices Industry. Final Report.

INSTITUTION Center for Occupational Research and Development,Inc., Waco, Tex.

SPONS AGENCY Office of Vocational and Adult Education (ED),Washington, DC.

PUB DATE Jan 92CONTRACT V199A00030NOTE 309p.

PUB TYPE Reports - Research/Technical (143)

EDRS PRICE MF01/PC13 Plus Postage.DESCRIPTORS Cost Effectiveness; *Curriculum Development;

*Electronics Industry; *Electronic Technicians;Industrial Training; Information Dissemination;Manufacturing; Microelectronics; PostsecondaryEducation; School Business Relationship;*Semiconductor Devices; Technical Institutes;Technological Advancement; Two Year Colleges

IDENTIFIERS Texas State Technical College Waco

ABSTRACTThe Center for Occupational Research and Development

(CORD) carried out four activities to foster semiconductormanufacturing technician (SMT) training: (1) collaboration withindustry experts and educators while developing a curriculum to trainSMTs; (2) implementation and testing of the curriculum at a technicalcollege; (3) dissemination of information to postsecondary schools,community, and technical colleges; and (4) creation of a model forthe development of technician training programs for new and emergingtechnologies. Four recommendations emerged from the project: (1) costsavings in SMT program implementation can be achieved by usingexisting labs and using solar cells rather than semiconductors; (2)

participants should be given release time from the job whileattending classes; (3) participants should have more time to attendclasses; and (4) student materials should be developed. (The bulk ofthe document consists of the following appendices: SMT project timeline; technical advisory committee membership list and letter;preliminary task list; curriculum advisory committee and validationlist; industry survey/responses statement; Boise State University(BSU) Transformations course description; BSU Transformationsdemographics and schedule; Texas State Technical College (TSTC) atWaco SMT outlines for nine specialty course; TSTC curriculum andcourse descriptions; CORD model curricula and course descriptions;press notices; promotion/dissemination of semiconductor manufacturingtechnology materials; and evaluation report by Glen Bounds.) (NLA)

***********A***********************************************************

Reproductions supplied by EDRS are the best that can be madefrom the original document.

*XA********************************************************************

Technic !an Training for theSemiconductor Microdevices Industry

(V199A00030)

Final Report

to

Office of Vocational and Adult EducationUnited States Department of Education

January 1992

U.S. DEPARTMENT OF EDUCATIONOfhce of Eclucahonal RIrmarch and Improvement

ED ONAL RESOURCES INFORMATIONCENTER (ERIC,

15 Tins documint has been reproduced asrpCsiviel from the person or organizationoriginating it

0 Minor changes have been made to imProvereproduction Quality

Points of view or opinions stated in this docuwilint cio not neCillsianly remittent WhomOE RI position or policy

bc---.

C),R) Center for Occupational Research and Development._9 601 C Lake Air Drive Waco, Texas 76710

C)817/772-8972

C.3)2 BEST COPY AVAILABLE

Contents

I. Introduction 1

II. Project Objectives and Methodology 2III. Project Participants and Roles 3IV. Pilot Sites 4V. Project Activities 5VI. Dissemination 14

VII. Evaluation 16VIII. Conclusions 17

APPENDICES

A. Semiconductor ManufacturingTechnology Project Time Line 21

B. Technical Advisory CommitteeMembership List and Letter 25

C. Preliminary Task List 31

D. Curriculum Advisory Committeeand Validation Task List 75

E. industry Survey/Responses Summary 121

F. Boise State University TransformationsCourse Descriptions 131

G. Boise State University TransformationsDemographics and Schedule 137

H. Texas State Technical College at WacoSemiconductor ManufacturingTechnology Outlines (9) SpecipIty Course 141

I. Texas State Technical College at WacoCurriculum and Course Descriptions 177

J. Center for Occupational Researchand Development Model Curriculaand Course Descriptions 185

K. Press Notices 195

L. Promotion/Disseminatio.) ofSemiconductor ManufacturingTechnology Materials 209

M. Evaluation Report (Glen Bounds) 215

lii 3

Technician Training for theSemiconductor Microdevices Industry

Final Report

I. INTRODUCTION AND BACKGROUNDUntil the last several years the United States has dominated the semiconductor

manufacturing industry, one it invented and developed. Foreign competition,however, has capitalized on the manufacturing techniques for this advancedtechnology field, and now America finds itself striving to recapture its leading edgein the industry. As with any significant commercialization of a new technology, akey factor is the availability of an appropriately trained technical workforce.

According to the Semiconductor Industries Association (SIA) the total worldwidesemiconductor market is expected to top $55 billion by year-end (1991), and willgrow to $77.2 billion by 1994.1 The United States market is projected to rise to 50percent over 1990 values by 1994 as shown in the chart below:

Projected Growth of U. S. Semiconductor Manufacturing'

Year Shipments Percent Change

1990 $14.4 billion (Base Year)

1991 $15.6 billion +7.8%

1992 $18.0 billion +15.3%

1993 $20.1 billion +11.9%

1994 $21.7 billion +8.1%

The technicians who will support the projected growth must possess a soundfoundation of knowledge and interdisciplinary skills that enable them to adapt as atechnology changes; yet, while they are multiskilled, they must also possessexpertise specific to semiconductor manufacturing. In this industry technicians mustbe able to operate, maintain, and calibrate modern technical production equipmentinvolved in creating high-vacuums, chemical vapor deposition equipment,photolithography, and ion implantation and be able to take statistical samples andcompute factors that describe a system's ability to produce reliably.

Educational institutions are beginning to respond to the need for these highlyqualified workers. However, many schools do not have the expertise to conduct aneeds analysis and curriculum design for training semiconductor manufacturing

technicians (SMT).In June of 1989, the Center for Occupational Research and Development

(CORD) responded to the Department of Education's Request for Application for

1 Channel Magazine, November 1991, Vol. 4, No. 8.

1

Cooperative Demonstrations Programs in High Technology (CFDA No. 84.199A),called Technician Training for the Semiconductor Microdevices Industry. Inresponse to this proposal a partnership composed of CORD, SEmiconductorMAnufacturing TECHnology (SEMATECH), and the Texas State Technical College(TSTC) at Waco agreed to design, develop, and implement an SMT trainingprogram for technicians in the semiconductor industry. The curriculum model couldthen be disseminated to two-year postsecondary schools through the NationalCoalition of Advanced Technology Centers (NCATC). The request was for$429,477 in federal funds with the project partners providing $107,362 non-federalmatching funds or in-kind contributions (a project total value of $536,809).

A grant from the Office of Vocational and Adult Education, U.S. Department ofEducation, was awarded to CORD as the prime contractor for the period fromJanuary 1, 1990, through July 31, 1991. A no-cost extension continuing the grantthrough October 31, 1991, was given to allow completion of the worker retraining.

II. PROJECT OBJECTIVES AND METHODOLOGYThe contract awarded to CORD was to accomplish the following four goals to

foster SMT training:

to work with industry experts and educators while designing and developing acurriculum to train semiconductor technicians;to implement and test the curriculum at a technical college;to disseminate information about the curriculum to two-year postsecondaryschools and to encourage its implementation at other community andtechnical colleges;to create a model for the development of technician training programs for newand emerging technologies.

To accomplish the above goals, twelve objectives were defined and aredelineated below.

1. Organize a Project Advisory Committee (PAC).2. Prepare preliminary (technician) task list and a curriculum design.3. Validate the (technician) task list.4. Forecast future needs.5. Design curriculum and courses.6. Implement retraining classes.7. Implement an Associate Degree program in Semiconductor

(microelectronic) Manufacturing Technology.8. Provide for semiconductor training program replication.9. Evaluate the project.

10. Disseminate information.11. Design a model for technician training development.12. Report project progress.

52

Activities associated with each of the above goals and objectives are describedin later sections of this report.

III. PROJECT ';'ARTICIPANTS AND ROLES

To accomplish the project goals and objectives, CORD, serving as primecontractor, worked closely with four other organizations. SEMATECH, an industryconsortium, provided subject matter expertise; TSTI (now TSTC) provided thedemonstration site for implementation of the Associate Degree program; NCATCserved as the principal means of disseminating project information to two-yearinstitutions; and Boise State jniversity (BSU) served as pilot site for the retraining ofcurrent workers. A project organization chart is shown below, followed bydescriptions of each organization and its role.

U.S. Departmentof Education

$ Grant

Training Consortium

National Coalition ofAdvanced Technology Centers

(NCATC)

ATC

vbwitreavilvidoosi

Motorola

r., " HIM .1Ib

Job Requirem'entsibleeds Advisory CommItteejMend limbs Csardiaatioa

Pilot Test1Vainingflietraining

SEMATECH

Industrial Consordum

Figura 1

SMT Training Projact Modal Organization Chart

CORD is a nonprofit organization with a 19-year track record in designing,developing, and disseminating technical curricula in new and emergingtechnologies. CORD conducts educational research, designs curricula, developsinstructional materials and assists various institutions, industries, organizations andstate agencies in implementation of complete education/training programs inadvanced technological areas.

As prime contractor on the project, CORD coordinated the efforts of the otherpartners (SEMATECH and TSTC), scheduled meetings, assimilated data, and

3

provided necessary input as to curriculum content and course design. CORDsought and secured agreement from BSU to serve as the pilot-test site for theretraining component of the project. CORD has been active in disseminatinginformation about the project to other two-year schools through the NCATC.

SEMATECH is a manufacturing research and development consortiumconsisting of 14 major United States semiconductor manufacturers, comprising over80 percent of the total United States microdevice production. The group pools itswide technology base to develop advanced process equipment and materials toensure the United States a world-leading manufacturing capability with exclusivelydomestic content by 1993. SEMATECH integrates new equipment from UnitedStates suppliers into a total factory system, such as the state-of-the-art facility inAustin, Texas, evaluating and qualifying the equipment for the equipmentmanufacturers and the member companies.

SEMATECH supported the project by identifying and assigning experts inspecific aspects of semiconductor manufacturing to work on the project. Theseexperts staffed the Advisory Committee, provided input to the task list, and critiquedthe curriculum.

TSTC is a statewide technical college system with four campuses locatedthroughout Texas. The Waco campus, which was the pilot site for the two-yeartechnician training, houses an Applied Manufacturing and Engineering TechnologiesCenter. Courses in Robotics, Laser/Electro-Optics and other industry centeredadvanced technologies are included in the curricula. TSTC is an original member ofthe NCATC.

NCATC is a coalition of more than 60 technical and community collegeswith specific commitment to customized technical education and training. TheNCATC promotes infusion of proven advanced technology into United Statesindustries by providing training necessary so that industry will have a readilyavailable workforce, trained in the knowledge and skills needed by localcompanies.

BSU, College of Technology, School of Applied Technology, Boise, Idaho,prepares certificate, associate, baccalaureate and graduate students for productivecareers in technological and engineering related disciplines. BSU's School ofApplied Technology was chosen for the worker retraining pilot site, in part due to itsproximity to Micron Technology, Inc.a semiconductor manufacturer thatrecognized the potential for worker retraining. The BSU College of Technology isan NCATC member.

IV. PILOT SITESTwo curricula were developed as oart of this project, one to augment the current

workforce and achieve a level of tecl .1ical literacy, and the other to provide a two-year Associate Degree in Semiconductor Manufacturing Technology. Eachcurriculum was pilot-tested at a different school.

4

Associate Degree DemonstrationThe TSTC Waco campus offers over 40 instructional programs of which twelve

are in applied manufacturing and engineering technologies. With facilities in placeto offer training in Nuclear Energy, LaseriElectro-Optics, Robotics and ComputerIntegrated Manufacturing (CIM), TSTC has many featuressuch as heavyemphasis in class design on hands-on learning and a willingness to commit to thisprojectthat made it an ideal site to install the pilot two-year curriculum. Inaddition, TSTC has an excellent working relationship with SEMATECH, and islocated only 100 miles from SEMATECH's facility in Austin, Texas.

Retraining Current Worker DemonstrationSeveral sites, including TSTC at Waco and Austin Community College, Austin,

Texas, were considered for the worker retraining portion of the project. When adownturn in the semiconductor industry made it evident that SEMATECH and localSEMATECH members would not be able to support the retraining program, othersites around the United States were pursued to determine their interest and ability tobecome part of this project.

Representatives of Micron Technology, Inc., Boise, Idaho, who had attended aSEMATECH sponsored workshop in Austin, were very interested in the project.Upon returning to Boise they contacted BSU and encouraged their participation.BSU offers 27 technical education degree programs in a nine building campuscomplex and several off-campus locations with an enrollment of 1550 in 1N1. Theofferings range from Construction Management and Health Services to ComputerIntegrated Manufacturing. To supplement its formal program offerings, the collegeprovides upgrade training for employed adults, apprenticeships, basic academicskills, adult basic education and continuing education.

V. PROJECT ACTIVITIESThe twelve project objectives listed in the proposal (see Section II, Objectives

and Methodology) formed the basis for organizing and managing the project.Descriptions of activities supporting each task follow. A project time line is found inAppendix A.

I. Organize a Project Advisory Committee (PAC)Following the award of the grant, meetings were held with three major

manufacturers of microdevices (Motorola, Advanced Micro Devices, and TexasInstruments) and SEMATECH in Austin, Texas. The purpose of the visits wasto enlist support from each company's management for employees to serve onthe Project Advisory Committee. It was a necessity to have representativesfrom industry who were knowledgeable about the jobs that technicians do intheir companies; this knowledge was required to accurately guide thecurriculum design so that graduates would have the necessary knowledge andskills for entry-level work in manufacturing semiconductors.

5

After the meetings SEMATECH agreed to assign Tom Liberty, a technicalexecutive in SEMATECH Manufacturing Operations, to work on the project full-time for up to four months. Mr. Liberty solicited support from SEMATECH andits member companies in the form of providing members for the AdvisoryCommittee. One representative from each member company was assigned tosupport Advisory Committee activities. The first meeting was scheduled forApril 2-4, 1990, at SEMATECH to explain the project's purpose and goals, todiscuss procedures to be used throughout the project, and to elicit the supportfrom all participants. An Advisory Committee membership list is included inAppendix B. The committee met three other times--October 9, 1990,February 4, 1991, and May 9-10, 1991to assist in refining the list ofcompetencies and the curriculum; as the project proceeded, committeemembers also offered comments as to the appropriateness of certainequipment being used in the training.

2. Prepare a preliminary Task List and a Curriculum DesignIn February 1990, Tom Liberty put together a list of the various technicians

employed by major semiconductor companies by title and job description. Thislist was distributed by SEMATECH in an information release letter to theTechnical Advisory Board members. The letter informed potential committeemembers of this project, requested their participation at a Project AdvisoryCommittee meeting April 2-4, 1990, (Appendix B), and asked for commentsrelated to their companies' use of technicians.

Mr. Liberty and members of the SEMATECH staff developed a preliminarylist of tasks that an entry-level SMT student would be expected to performbased upon their expertise and upon input from their coworkers . A copy ofthe preliminary task list is included in Appendix C.

Independently, curricula and training needs were received from Motorola;Intel; Texas Instruments; Hewlett-Packard; Harris Semiconductor; IBM;Semiconductor Research Corporation (SRC); Micron Technology, Inc.;Portland, Oregon Development Commission; and SEMATECH. Texas A&MUniversity, Bryan/College Station, Texas; Durham Technical CommunityCollege, Durham, North Carolina; and St. Michael's College, Winooski,Vermont, also provided information about training related to semiconductormanufacturing. A sample of the material was synthesized into a list of taskswhich was shown at the Advisory Committee meeting on April 3-4, 1990.

The committee offered comments as to the procedures for validating all thecompetencies. CORD developed competencies for all work areas and preparedand distributed them to the Advisory Committee members for validation.Subsequent to the meeting a complete list of competencies was developed,reviewed by SEMATECH personnel, and distributed to Advisory Committeemembers for validation.

In the same time period, early April 1990, representatives from tencommunity/two-year technical colleges and two four-year colleges were invited

6

to a meeting at SEMATECH on April 20, 1990. The purpose was to providetechnical assistance to CORD and TSTC in assembling the list of competenciesand to offer suggestions for the designing and developing of curriculum andimplementation of training/retraining programs. A description of the AdvisoryCommittee responsibilities and its membership is found in Appendix D.

3. Validate the Task ListValidation of the task list was accomplished by SEMATECH personnel.

Due to a concern for corporate security, CORD was not allowed direct access tothe company representatives who could comment on the task list. Rather,SEMATECH handled the technical review and validation of the task list. OnMay 7, 1990, experts from SEMATECH and industry were sent the preliminaryTechnician Task List for examination and validation. On June 5, 1990, the finalTechnician Task Analysis and a proposed curriculum was sent to all AdvisoryCommittee members as well as the educational institution contact persons (atotal of more than 50 individuals) for comment.

4. Forecast future needsAt a training workshop sponsored by SEMATECH in Austin, Texas, on

October 9-10, 1990, semiconductor industry representatives responded toseven survey questions regarding the evolving industry needs. A copy of thesurvey and CORD's summary of results is included as Appendix E. In brief,responders said operators will be replaced by technicians who require a broaderskill base in math, chemistry, physics and communication. Other areas in whichtechnicians are expected to have expertise are quality, maintenance,engineering, safety and logistics.

The need for a technically trained workforce almost goes without saying forthe semiconductor industry. Dr. Gordon Moore, Chairman of IBM, stated onOctober 16, 1991, at the Microcontamination conference in San Jose, California"We spend $50 million a year on training or about 7-8 percent of the cost toproduce wafers." Motorola is studying a possible apprenticeship program tobegin at either the high school or community college level. TSTC reports thatthe SEMATECH member companies who have recently laid off unskilledsemiconductor process operators are hiring graduates from their Laser/Electro-Optics, Electronics, Instrumentation curricula because of the skills students gainfrom these programs.

To broaden its view of the semiconductor industry, CORD developed aworking relationship with Semiconductor Research Corporation (SRC). A jointMassachusetts Microelectronics Center (MMC) and SRC study of trainingneeds for technicians for the semiconductor industry, was reported at the SRCCompetitiveness Foundation Workshop on Microelectronic ManufacturingEngineering Education, May 30-31, 1991. This survey supports the results ofthe CORD/SEMATECH survey in defining a technician as changing from routineand prescribed actions toward a proactive role in problem solving. The

7

experienced technician of the future will spend as much as 80 percent of anassignment on problem solving and will need a broad base of math, science,and applied semiconductor technology.

5. Design curriculum/develop coursesUsing the validated competencies as an guide to what graduates of a SMT

program should know and be able to do, course outlines were formulated.Competencies were grouped according to similar tasks or similar equipmentneeded to establish basic course design. Course outlines included coursedescriptions, outlines of classroom activities, lab activities, competencies to begained, an equipment list, and a list of references. Suggested times forclassroom and laboratory activities were assigned to each course.

Once course descriptions had been prepared, the curriculum wasconstructed incorporating factors such as prerequisites and the need forbalanced class loads quarter-to-quarter. A series of meetings amongSEMATECH, TSTC, and CORD was used to refine and critique the curriculumand courses. The final result is shown in Figure 2.

PHASE I PHASE 2 TECH SPECIALTY

PERSONALCOMPUTERS

2 *loft15 Days

33 Mir

GRAPHICS FORTECHNICIANS

2 al,15 Days

30 NI

MECHANICALDEVICSK AND

SYSTEMS2 "Pion

10 Days20 Mr

ELECTRIZITWELECTRONICS

2 '1'1sirr

30 Days 110 Mc

SPECIALTY

20 Days 130 Hr

APPLIED COMMUNICATION1 I*/ 40 Days 40 Hrosv

VACUUM AND LASER SYSTEMS1 */ 30 Days 30 Hr

owl

BREAK

1 Hr

Break1 Hr

Brak1 Hr

SPECIALTY(costswes)

2 Pv/err 20 Days 40 NrSELF STUDY

1 He

SELF STUDY

1 Hr

APPLIEDMATHEMATICS

20 Days 00 lir

PRINCIPLES OFTECHNOLOGY I

3 14110 20 08Ys 00 Sr

PRINCIPLESTECHNOLOGY

3 1410.,,

OfH

20 Days 60 Hr

APPLIED

CHEMISTRY

AND SAFETY

3141119, 10 DinS 30 14t

PRINCIPLES OF OULAITY

CONTROL

2 Homy 20 Oeys 40Hr

8 SWINIM -------0..4----4Wesksweskit

12 %%NM

----p,

Figure 2

SPAT Proposed "Transformations" for SMT Retraining Model Curriculum

8

1 1

6. Implement retraining classesRetraining for Technology, or Transformations, is a curriculum designed to

provide technical literacy training to people who desire to work in a technicaljob. As designed, the retraining curriculum goals are the following:

1) To build a strong math, science, and communication base using appliedacademic courses (approximately 240 contact hours)

2) To provide training in chemistry, computers, electronics, quality contiol,and mechanical devices (approximately 180 contact hours)

3) To provide an introduction to the specializations required insemiconductor manufacturing (approximately 120 contact hours).

The pilot site for the retraining portion ot the project was at BSU inconjunction with Micron Technology, Inc. CORD worked on-site at BSUbeginning in January 1991, to help the BSU staff organize and develop outlinesand select materials. As originally designed, Transformations is a 14-week, six-hour per day, 420-hour curriculum; however, adaptations made to fit theBSU/Micron needs resulted in redesigning it to 22 weeks at three and one-halfholirs per day, for a total of 308 hours. Courses taught inciude AppliedMathematics, Principles of Technology (applied physics), Graphics forTechnicians, Mechanical Dovices and Systems, Fluid Power, AppliedChemistry, Applied Communication, and Computer Fundamentals. These weretaught by contract instructors under BSU supervision. Micron Technology, Inc.chose to provide in-house training in electronics, quality control (normally taughtin a Transformations setting), and semiconductor processes. The approvedcurriculum structure and the sequence of courses tautpt are shown in Figure 3.

BOISE STATE UNIVERSITY/SCHOOL OF TECHNOLOGY MICRON TECHNOLOGIESIN HOUSE OR LATERBSU TRAINING

PERSONAL

COMPUTERS

2 'lop16 Days30 Hr

GRAPHICS FOR

TECHNICIANS

3 .,/a "Vow,

9 Days31. /2 HI

MECHANICAL

DEVICES AND

SYSTEMS

3.111 Nu"6 Gays21 141.

APPLIED

cosipAutimpow

COMPOSITION

i -VI "Now13 Days19 'h lir

FLUID

POWER

3.1h *ion

II Days21 14t

ELECTRICITY/

ELECTRONICS

APPLIEDMATHEMATICS

UNITS: A, D. C. 1-10. 13

3 -'/IPT/06, 12 Days 42 Hr

PRINCIPLES OF

TECHNOLOGY I

UNITS: 1-6

3. VT *km 14 Days 49 He

PRINCIPLES OF

TECHNOLOGY II

(ROTS: S. 7. 9-11

3 .'h 70,,, 14 Days 49 14,

APPUEDCHEMISTRYAND SAFETY

3. th who,

II Days

31.1h Hr

PRINCIPLES OF QUALITY

CONTROL

22 %%mks *

Figure 3

SMT Approved BSU/Micron Retraining Model Curriculum

9

The Micron trainees normally worked shifts of twelve hours per shift, threedays per week. Micron allowed employees one and one-half hours time off perday to attend classes; employees spent two hours of personal time to make upthe needed time. Nineteen of the twenty trainees completed the course; onedropped due to illness. Micron provided the training in electronics and qualitycontrol. Nearly all Micron workers completed the retraining program; sixteenhave elected to continue technical training by participating in in-house programsoffered by Micron or by enrolling in an accredited program at BSU or anotherschool. As a result of their experience with the pilot program, Micron is planningto send more workers through the additional sessions of retraining, and isdiscussing possible implementation of the TSTC Associate Degree programwith BSU.

To make up some of the difference, Micron taught the electricity/electronics,quality control, and semiconductor process training in-plant with materials theywere already using. CORD supplied training materials for Applied Mathematics(units A,B,C, 1-10, and 13), Principles of Technology (units 1-7 and 9-11),Graphics for Technicians and Mechanical Devices and Systems.

A portion of the BSU course in fluid power using Vickers fluid power trainersand workbooks was structured. BSU also prepared the Personal Computers,Communications/English Composition, and Applied Chemistry modules. Blockdiagrams of the proposed and implemented curricula are shown in Figures 1and 2. Greater detail on these modules is found in Appendix F.

Micron selected 20 workers from among its employees for the program andthe following student parameters were tracked:

AttendancePre- and post test scores in writing, reading, algebra, numerics, generalmath, Principles of Technology (applied physics) and fluid powerPost test scores in graphics and mechanical devices.

Since the students worked three days a week, and classes were conductedfour days a week, some students had difficulty attending all the classes,attributing to attendances ranging from nearly perfect to about 60 percent. Thefact that some workers were required to work overtime probably had a negativeeffect on attendance and scoring. Post-test gains over pre-test scores werenoted in numerics, algebra, Principles of Technology and math. (Test scoresare compared in Appendix G). In spite of the heavy time demands for thestudents to perform their jobs, attend classroom training, and completehomework assignments, student comments were generally favorable. Micronplans to continue training the workers and send more of its workers through the

same training. Instructors' evaluations indicated that this was a dedicatedgroup of students with varying levels of ability. The Applied Mathematics andPrinciples of Technology instructors considered the courses to be too short. It

should be noted that because of time restrictions Applied Mathematics wastaught in 42 contact hours where normally CORD recommends 60 hours, andPrinciples of Technology was reduced to 84 hours where 120 hours isrecommended. No course was considered too long.

10 A. 3

7. Implement an Associate Degree program in MicroelectronicsTechnology

TSTC faculty used the model Associate Degree curriculum as a guide;differences were caused primarily by state requirements for specific coursesand by the substitution of existing courses for recommended courses. OnMay 15, 1990, TSTC in Waco, submitted the proposed Associate Degreecurriculum to the Texas Higher Education Coordinating Board; approval wasgranted by the Board on August 15, 1990, which opened the way for TSTC tooffer a pilot-test curriculum that fall.

A major challenge has been installation of a working semiconductorfabrication laboratory in a cleanroom environment. Because modern integratedcircuits require ultraclean environments which are very expensive to produceand maintain, such facilities were ruled not feasible for the pilot program. TheTSTC instructor recommended the manufacturing of silicon solar cells(photovoltaics) as a student project. Working solar cells can be fabricated withline spacings of about a millimeter (1 mm or 0.001 meter = 1000 microns), some100 to 1000 times larger than a computer chip, thus much more practical forinstructional purposes. Solar cells use the same patterning, layering, dopingand metallizing processes as are used in making computer chips but can befabricated in a less-clean cleanroom, in the class 100,000 to 50,000 range.Such a room still requires more efficient filtering than a typical office, but ismuch more manageable in a teaching environment and less restrictive andexpensive.

TSTC received approval to purchase complete and functional solar cellprocessing equipment for $64,000. The solar cell manufacturer also donated adiffusion furnace. Additional equipment was received as contributions in-kindfrom Texas Instruments, SEMATECH, and other manufacturers. In ali, morethan 40 pieces of equipment and other accessories have been received, mostas contributions. The contributions have a new value of nearly $8 million.

TSTC placed selected pieces of this equipment in a modified chemistrylaboratory of about 1,000 square feet, using existing acid-handling drains, sinksand safety showers. Such a facility is sufficient to do the basic chemicalprocesses in support of solar cells and other less sensitive projects. To houseall the equipment will require more than double this area, and plans are beingmade for future expansion. Laboratory space is shared with other departmentsfor vacuum systems, computer, and electronics training.

From the model curriculum, TSTC developed nine specialty core coursesfor semiconductor manufacturing covering all process areas identified in thetask analysis, and modified technical core courses (e.g., Vacuums 1 andLasers) to meet the needs of the program. Outlines of the courses are includedin Appendix H. Basic core courses such as English and economics remain asstandard courses without change.

n I 4

TSTC developed an attractive two-color, one-sheet brochure (printed ontwo sides) and a promotional video for the SMT program which has appearedon local television. Even so, students select courses in lasers, instrumentationand control, electronics, and computers over SMT. Prospective studentsinherently understand the need for lasers and computer maintenance but do notknow what an integrated circuit or chip is. Semiconductor manufacturing beingsuch a new technology and this being a new program, it is expected thatenrollment will increase with time.

Ten students enrolled in the first year as full-time SMT majors and sixcompleted the third quarter. Another dropped during the summer fourth quarter.The fall quarter brought the enrollment up to nine SMT majors. Seventeenstudents majoring in other areas such as Laser/Electro-Optics and Electronicshave selected courses in semiconductor technology as technical electives.

8. Provide for Semiconductor Training Program replicationThe detailed curriculum material found in Appendix I oi this report will allow

replication of the SMT program at other schools. It is unlikely that any schoolwill take a snapshot of the TSTC curriculum and produce an identical program.Needs of local industry and the ability to obtain and provide cleanroomlaboratory space for that equipment will determine the local structure. Localand state educational board requirements may impact basic and technical corecontent requiring adjustments in schedule and technical specialty coursecontent.

CORD will produce a Curriculum Guide for implementation that will containall the material in this report plus additional information on curriculum models,bridge programs and data of interest to the educator. This handbook isscheduled to be available in early spring of 1992.

9. Evaluate the projectThe project evaluation is covered in .94.1ction VII below.

10. Disseminate informationThe dissemination is covered in Section VI below.

11. Design a model for technical training developmentThe SMT curriculum was designed based upon experience gained by

CORD in several other advanced-technology fields. This experience has shownthat there is a group of courses (a core) that is necessary in several disciplines.The courses provide the fundamentals of science and mathematics, humanities,economics, and courses that deal with the function of discrete systemcomponent parts. It is the core that provides the broad-based interdisciplinaryskills necessary for technicians in today's woric environment.

To provide the specialty training necessary in a specific field, such assemiconductor manufacturing, courses are designed to address the attributes of

12

that field. Nine courses were designed for the SMT project; their outlines areincluded is Appendix J of this report. The advanced technology modelcurriculum structure, showing course titles is shown in Figure 4a; the SMTmodel curriculum, indicating the specialty course titles is shown in Figure 4b.

For retraining of current workers, the curriculum was based upon successfulprojects CORD has conducted at other locations. The structure was shown inFigure 2, in Section V, part 7. It is based upon the need for certain workers in aplant to have an increased knowledge of modern technologies and how theyaffect today's workplace. It is not the intent of this curriculum to educatetechnicians, rather to provide a technology foundation.

SPECIALTY

AREA

TECHNICALCOREAREA

BASIC

SKILLS

AREA

COURSES SELECTED

FOR SPECIALMATION IN

APPROPRIATE TECHNICAL AREA

ii

ElectricityElectronicsMechanicsElectromechanicsMaterials

MathematicsScienceCommunications

FluidsGraphicsControlsComputers

Computer LiteracySocioeconomics

Figure 4a

Postsecondary ProgramsAdvanced-Technology Model Curriculum Structure

General Philosophy

13

SPECIALTY

Overview of Semiconductor ManufacturingSMT-I Wafer Prep, Contamination Control, Oxidation, DiffusionSMT-II Photolithography, Wet and Dry EtchSMT-III CVD, Thin Films, Metallzation, Ion ImplantProjects in Semiconductor Manufacturing Technology

TECHNICAL CORE

Applied industrial ChemistryDC and AC Circuits

Vacuums and LasersVacuums 11

Semiconductor Electronics I Electronic Test and InstrumentationSemiconductor Electronics II Automated Production SystemsDigital Electronics Applied Statistical Quality ControlMechanical Devices and Systems Microprocessor ControlsDiagnostic Troubleshootingof Automated Systems

/ 'APPLIED MATH /AND SCIENCE

COMMUNICATIONS SOCIC;ECONOMIC'/

Algebra Technical CommunicationTrigonometry Personal Computer SkillsPhysics for Technicians 1 Group CommunicatloiPhysics for Technicians 11

Economics In TechnologyElements of Supervision

Figure 4Ib

SMT Curriculum Model for Two-year Postucondary Technology Program

12. Report project progressQuarterly progress reports were submitted to the Department of Education.

This final progress report serves as the third quarter report for 1991. Programupdates concerning significant events in the SMT program were sent to thaDepartment of Education Program Officer in a timely manner.

VI. DISSEMINATIONThe Technician Training Program has been promoted and information

disseminated in eleven educational and industry conferences by CORD andSEMATECH personnel and in a Semiconductor Equipment and MaterialsInternational (SEMI) Industry-Education conference by TSTC Chancellor, Dr. CecilGroves. A major article on the Transformations worker retraining program appearedin Economic Development Commentary, and the BSU News Senfices placed anarticle on the Micron worker training program in the Idaho Business Review. Thebook Tech Prep Associate Degree: A Win/Win Experience, by Dan Hull and DaleParnell, describes the Transformations curriculum at BSU. Articles trackingprogress on the TSTC demonstration course have appeared in six issues of theNCATC Newsletter. Several newspaper articles have also appeared.

14 1 7

Due to the very complex nature of SMT, individuals trained and employed inindustry will often need and desire to expand their knowledge and capabilitiesthrough various advanced training. With this thought, meetings were initiated withTexas A&M University and the University of Texas to develop articulationagreements which would provide continuing education opportunities for personscompleting the Associate Degree curriculum.

To establish a broad base of interest and participation in the curriculumdevelopment, a coordination and communication meeting was held April 20, 1990,with a number of schools from across the country. These schools expressed aninterest in the SMT project. During this one-day meeting, institutions shared theirknowledge of semiconductor training, job needs, and retraining needs as theyperceived them in their respective regions. The project director explained the workthat had been done to date in regard to the project and shared the task analysis.

Educational institutions interested in the project were invited to attend AdvisoryCommittee meetings and workshops on October 9-10, 1990, andFebruary 3-4, 1991, (see section V, part 1). Many of those who were unable toattend requested and were mailed copies of the Technician Training Project StatusReport issued at each of the meetings. This interest group grew from 35 to over 60by May 1991, when the Educational Information Dissemination conference washeld.

An Educational Information Dissemination conference was heldMay 9-10, 1991, at TSTC in Waco with 20 persons from nine institutions inattendance. Participants discussed curriculum implementation at TSTC and touredthe Laser Electronics Technology and Semiconductor Manufacturing Technology!aboratories. A 235-page Semiconductor Manufacturing Technology DisseminationConference notebook was issued to all participants. Topics included an overview ofsemiconductor manufacturing and the program, revised curricula and courseoutlines, a TSTC process sequence and TSTC implemented curriculum, TSTCproposed curriculum revisions for 1991-1992, implementation guidelines,bibliography, publishers and textbook review.

In addition to the communication with a number of schools and businesses,project visibility was enhanced through a press conference and project briefing forSenator Phil Gramm on Saturday, March 17, 1990. Press notices are found inAppendix K. On May 2, 1990, Mr. Tom Liberty of SEMATECH and the projectdirector appeared on a national teleconference relating to Electronic TechnologyPrograms for the '90s. On March 9, 1990, Mr. Liberty addressed the NationalAssociation of Industry Specific Training Directors and described the SMT project.More than a dozen states were represented, and the participants expressed greatinterest in the project.

Promotion of the SMT program continued throughout and beyond the contractperiod. Dr. Walter Ed ling, CORD Vice President for Programs, presented the SMTcurricula, partnering efforts, and other sub-projects at the Semiconductor ResearchCorporation Competitiveness Foundation Workshop, May 30-31, 1991, in Troy, NewYork; at the NCATC Fall conference, November 7-9, 1991, Waco, Texas, and theNCATC Summer comerence, June 21-23, 1990, Camden, New Jersey; and at other

15

conferences. An Education Council meeting at the Applied Materials TrainingDepartment in Austin, Texas, on November 18, 1991, was the site of a two and one-half-hour presentation and discussion of the SMT cuniculum given by CORDResearch Associate, Mr. Bob Thompson.

The BSU/Micron Transformations worker retraining program was presented byDr. Ed ling to many groups including the National Conference for OccupationalEducation for the National Council on Community Services and ContinuingEducation October 21, 1991, in Corpus Christi, Texas, by CORD ResearchAssociate Alan Sosbe who aided BSU in the Micron program. A complete listing ofpresentations and articles in national publications is found in Appendix L.

VII. EVALUATIONAs specified in the project prnposal, CORD employed an outside evaluator to

assist CORD and SEMATECH in determining program effectiveness and evaluatehow well the four main project goals have been achieved. Each of the pilot trainingsites was visited by the evaluator to examine enrollment, student learning gains,and continued participation rates in both pilot courses. Dissemination efforts werealso examined and suggestions for improved effectiveness and future directions willbe put forth. The evaluation report by Dr. Glen I. Bounds, Provost, Bill PriestInstitute for Economic Development, Dallas Country Community College District,Dallas, Texas, is found in Appendix M.

Overall, the program has been very successful. The SW' students at TSTChave completed four of seven quarters, but the first TSTC graduates will not bereceived into the job market until June 1992. Semiconductor manufacturers havesent representatives to TSTC to interview and evaluate the mid-course SMTstudents and the reports are favorable. SEMATECH has been hiring Laser/Electro-Optics graduates from TSTC at Waco and Instrumentation Technicians from TSTCat Harlingen, and each year they and other semiconductor manufacturers come tothe campuses to interview and hire.

Student recruitment is a priority. TSTC is committed to the success of theprogram, but no school can continue a high technology program without anadequate number of students. A program of this magnitude and caliber wouldexpect to have from 40 to 60 students in various phases of the program. Additionalbrochures explaining what semiconductor manufacturing is and its importance as acareer could be developed to mail to high school counselors. Portions of theprospective-student package could be couched in less technical language, TSTCcounselors could travel to Texas high schools to speak on and hold discussionsabout new programs, and videos such as Silicon Magic from SEMI and the TSTC-developed video could be shown.

The program at TSTC has been sharing the vacuum laboratory with theLaser/Electro-Optics groups which perform everything from pump teardown tometallization experiments. Scheduling problems arose when the SMT students who

were ready for an experiment found that the metallization system either neededrepairs or was scheduled for demonstration by the laser groups. The second

16

1 9

problem with this arrangement is that the vacuum lab does not have a cleanroom airfiltration system because of the dirty-type experiments performed in the vacuum lab.Carrying clean wafers into the dirty vacuum lab for metallization will certainly causecontamination, low yields, and possible experiment failure. This is not solely bad,as low yields and yield improvement are problems that students need to learn tostruggle with. To avoid scheduling problems with shared equipment, the SW" groupshould eventually obtain its own metallization system.

The worker retraining was successful enough for Micron Technology, Inc. tocontinue training of the 19 graduates and consider training of additional personnel.The grueling schedule experienced by the workers suggests that some furtherarrangements need to be made for release time from the job while attending&asses. The fact that 420 hours of instruction was compressed into 308 hours withonly one dropout (due to illness) shows that there is some flexibility in the program,but the absenteeism fcr some of the shift workers approached 40 percent. One canassume that had the class hours been reduced, attendance would have been higherand, hopefully, learning would have increased. Now that the program has beendemonstrated successfully, employers should be urged to be more supportive ofemployee technical literacy training by allowing flexible time schedules to attendclasses.

VIII. CONCLUSIONS

Overall, the Semiconductor Microdevices Training project has been verysuccessful. The SMT students at TSTC have completed four of seven quarters.Semiconductor manufacturers have sent representatives to TSTC to interview _Indevaluate the students enrolled in SMT, and they report a high interest in thestudents; the representatives have also made many complimentary remarksregarding the curriculum. The worker retraining program at BSU has beencompleted, and a majority of the retrained Micron workers have elected to continuetheir training, either with in-plant classes or with on-campus studies. All primaryobjectives of the project have been met or exceeded.

A. Achievement of Four Primary Objectives1. To work with industry experts and educators to design and develop curricula

to train semiconductor technicians.Industry experts were assembled from SEMATECH and its member

companies into a Technical Advisory Committee to create and validate a detailedTechnician Task Analysis. Representatives from community colleges (NCATCmembers) along with two more from four-year colleges formed the CurriculumAdvisory Committee to provide guidance to design and develop a curriculum basedon the survey of industry needs and the Technician Task Analysis.

2. To implement and test the cunicula at a technical college that has a trackrecord of working with the semiconductor industry.

17

SEMATECH has consistently hired graduates of the Laser/Electro-Opticsprogram from TSTC at Waco and the Instrumentation Technician program at TSTCHarlingen and Waco campuses. The first four of seven quarters of curriculummaterials have been tested and revised. TSTC has fully implemented the SMTprogram, making considerable investmenm in facility renovation and equipmentprocurement and is committed to continuing the curriculum.

3. To disseminate information on the curriculum and encourage its replication atcommunity and technical colleges throughout the country.

The curriculum has been presented at several NCATC and SMT TechnicalAdvisory conferences and at an Educational Dissemination conference.Conference reports and notebooks have been distributed to many schools andmanufacturers that have requested curriculum information. Articles on workerretraining in the semiconductor industry and progress of the SMT Associate Degreeprogram have been published in the Idaho Business Review, EconomicDevelopment Commentary, Tech Prep Associate Degree: A Win/Win Experience,and the NCATC Newsletter. Professional-quality brochures describing the TSTCSMT program are available and have been sent to many interested communitycolleges.

4. To create a model for the development of technician training programs fornew and emerging technologies.

The process and cooperative efforts between industry, community colleges, auniversity and an independent consultant that were used to develop the SMTAssociate Degree program and the worker retraining program are described in thisreport. An extensive curriculum guide is being developed and will be available inearly 1992.

B. RecommendationsCost of implementation is always a major factor when any school considers

whether or not to offer a new curriculum. This is especially true in thesemiconductor field because of the very high cost of the equipment and thecleanliness requirements. TSTC achieved significant cost reduction in their use ofsolar cell manufacture rather than semiconductors; the identical techniques wereused without the need for extreme cleanliness. TSTC also achieved cost savingsby utilizing labs designed for other curricula to support SMT. Both of these are veryimportant, and any school should consider these opportunities while contemplatingthe possibility of offering an SMT program.

The worker retraining at BSU was successful enough for Micron Technology,Inc. to continue training of 16 graduates and to consider offering retraining toadditional personnel. The grueling schedule experienced by the workers suggeststhat some further arrangements need to be made for release time from the job while

attending classes.The fact that 420 hours of instruction were compressed into 308 hours shows

that there is some flexibility in the program. Only one student dropped from the

class and absenteeism for some of the shift work workers approached 40 percent.One can assume that had either the work or class hours been reduced, attendancein class would have been far greater. Now that the program has beendemonstrated successfully with the employed semiconductor worker, employersusing this program in the future should be urged to allow more time to attendclasses by reducing the working hours.

This project provided for curriculum and course design, not development ofstudent materials. While the outlines are very useful for instructors, there is a nearvoid of student material for this highly sophisticated subject. There needs to be aproject funded for the development of the necessary student materials.

C. ImpactWhile the cost of the laboratory equipment and facilities may prevent a number

of schools from implementing the total curriculum immediately, it is expected thatseveral schools will begin with partial implementations as directed by the needs oftheir local semiconductor manufacturers.

The Harlingen campus of TSTC expects to implement some portion of theWaco TSTC tested curriculum. Schools in Austin, Texas; Portland, Oregon; BoiseIdaho; Albuquerque, New Mexico, and other states with semiconductormanufacturing plants have also indicated an interest. Applied Materials, Inc., thethird largest manufacturer of process equipment for microdevice fabrication, hasrequested that Austin Community College put in place semiconductor-specifictechnical core courses and some implementation of the specialty courses to supportthe new Applied Materials, Austin, Texas, facility by 1993.

19

APPENDIX A

Semiconductor ManufacturingTechnology Project Time Line

Semiconductor Manufacturing Technician Project Milestones

January 1, 1990

February 1, 1990

March 1, 1990

April 2-4, 1990

April 15, 1990

April 20, 1990

May 1990

May 2, 1990

May 7, 1990

May 15, 1990

June 3, 1990

August 15, 1990

August 27, 1990

September 4, 1990

October 5, 1990

October 9-10, 1990

December 3, 1990

January 7, 1991

February 1, 1991

February 4, 1991

Project begins.

Employment of project director.

Complete preliminary planning with SEMATECH.

Technical Advisory Committee meeting.

Technical Advisory Committee provides detail task list.

Educational Coordinating Committee meets.

Technical Advisory sub-Committee meetings atSEMATECH: Task validation and examination.

Initial curriculum design by the CORD and TSTC. Initialtask list edited, printed and ready for dissemination.

Task list validated by SEMATECH and industry experts.

TSTC submits preliminary curriculum to state.

Task analysis and proposed curriculum sent to AdvisoryCommittee members and school representatives forreview and suggestions.

Texas Higher Education Coordinating Board gives TSTCapproval to begin course in semiconductor technology.

Request to SEMATECH CEO for greater SEMATECHinvolvemeIt by CORD.

Instructor Employed at TSTC. Pilot program begins.

Task analysis ready to publish.

Technician Training Project Status Report toSemiconductor Technician Training workshop in Austin,Texas.

Curriculum writer employed at the CORD.

Micron Technology, Inc, agrees to pilot retrainingprogram in conjunction with BrJ.

Third-party evaluator hired to review demonstrationcourses and materials at TSTC and BSU sites.

Second Technician Training Project Status Reportincludes summary of survey responses.

23

March 4, 1991

April 1991

April 19-20

April 29, 1991

May 9-10, 1991

June 30, 1991

June 29, 1991

August 5, 1991

October 31, 1991

Worker training courses begin at BSU with MicronTechnology's workers.

Chemistry writer develops Woricplace Chemistry outlineas recommended by advisory committee.

Educational Coordinating Committee meeting held atSEMATECH in Austin, Texas. Proposed project structuredeveioped.

Request no-cost modifications and for four-month no-costcontract extension to design/develop specific coursesand implement worker retraining.

Educational Dissemination Conference and AdvisoryCommittee meets at TSTC.

Scheduled end of contract.

No-cost contract extension granted throughOctober 31, 1991.

Worker training courses end at BSU with MicronTechnology's workers.

Demonstration course outlines received from TSTC.Project complete. Semiconductor ManufacturingTechnician course continues into second year at TexasState Technical College.

24

APPENDIX B

Technical Advisory CommitteeMembership List and Letter

25

ORD CENTER FOR OCCUPATIONAL RESEARCH AND DEVELOPMENT

601 C Lake Air Drive Waco, Texas 76710 Telephane (817) 7724756

March 23, 1990

Technical Advisory Committee

Dear FILE:

Thank you very much for agreeing to serve on the Technical Advisory Committeefor the Semiconductor Manufacturing Technology Curriculum developmentproject We have every reason to believe that the results of this project willprovide major benefits to the effort to increase the competitive posture of the U.S.semiconductor industry, and your experience and advice are critical to thatsuccess.

The Advisory Committee meeting is scheduled for Tuesday and Wednesday,April 3 and 4 at the SEMATECH headquarters in Austin. As you can see fromthe enclosed agenda, the meeting will begin at 8:30 A.M. on April 3. Thereforeyou will need to arrive the evening of April 2, if you are coming from out of town.Special SEMATECH rates of $60 are available at the Wyndham hotel, which isconvenient to the SEMATECH facilities. A map and additional information areenclosed.

We are particularly interested in looking forward to the decade of the '90s anddesigning training programs which will match the emergin_g needs of the chipindustry as the technology continues its rapid evolution. This effort at projectionis far more difficult than simply observing current and past practice, and it is thearea where your experience and judgment will be especially critical.

While we will present some information about the project and some "strawman"exhibits to stimulate discussion, the major purpose of this meeting is to hear yourideas and perspectives in regard to what technicians need to know and do insemiconductor manufacturing and the type of training and retraining needed toprepare and develop a world-class, competitive workforce in the industry.Therefore, we encourage you to come prepared to share any ideas andinformation which may contribute to the discussion.

Enclosed are an agenda for the meeting, a brief description of the project and apreliminary list of the participants. Also enclosed is a Proposed ManufacturingTechnician Task Listing prepared by Tom Liberty and his associates atSEMATECH. This is intended to be a stimulus for thinking and discussion andyou should feel free to add or modify as you see fit.

27

2

Please call Walter Ed ling or Barbara Grayer at (800) 231-3015 or (817) 772-8756(ir Texas) to confirm your attendance. Thank you again for agreeing toparticipate, and we look forward to a productive meeting.

Sincerely,

Tom Liberty Walter H. Ed ling, Ph. D., P. E.Director, Technical Educational Programs Director of ProgramsSEMATECH CORD

WHE:shEnclosuresbcc: Robert Millar, DOE

William Cox, TSTIBert Marcom, ACCDon Goodwin, TSTICecil Groves, TSTI

SEMICONDUCTOR MANUFACTURING TECHNOLOGYTECHNICAL ADVISORY COMMITTEE

Jerome BeckmanHewlett Packard815 14th StreetLoveland, Colorado 80537

Andre BlancDirector of Manufacturing TechnologyHarris Semicont'uctorMS 58-74Building 58, Palm Bay RoadMelbourne, Florida 32905

Dick BlanchardIXYS2355 Zanker RoadSan Jose, California 95131-1109

Bill BrennanAMD2706 Montopohs DriveAustin, Texas, 78741

Joe CarrollIBM1000 River RoadEssex Junction, Vermont 05452

Wayne CroninMotorola10803 Greymere CourtAustin, Texas 78739

Bernard FaySemi/SEMATECH2706 Montopolis DriveAustin, Texas 78741

Norman F. FosterSRCSuite 300, Building 440179 Alexander DriveP.O. Box 12053Research Triangle Park, North Carolina 27709

John GeorgickTexas InstrumentsMS 38513353 Floyd RoadDallas, Texas 75265

Jan HarrisNSCMS 40003333 West 90th SouthWest Jordan, Utah 84088

L.C. "Bud" Harris IllDirector, Business DevelopmentBusiness and Technology CenterAustin Community College5930 Middle Fiskville RoadAustin, Texas 78752

Jim LaiblHuman Resource ManagerHarris SemiconductorMS 62-003P.O. Box 883Melbourne, Florida 32901

Tom LibertyIBM/SEMATECH2706 Montopolis DriveAustin, Texas 78741

Richard MooreAssociate Dean of InstructionTexas State Technical Institute3801 Campus DriveWaco, Texas 76705

Jerry MuffNSCMS 2C43111 39th Avenue SoutheastP.O. Box 5000Puyallup, Washington 98374

Vijay PersuadHarris Semiconductor2706 Montopohs DriveAustin, Texas 78741

John WaiteNSCMS 27-100P.O. Box 58090Santa Clara, California 95052-8090

Skip WeedSEMATECH/Motorola2706 Montopolis DriveAustin, Texas 78741

Keith R. WhitesideTraining and Education Semiconductor GroupTexas InstrumentsMS 39097800 Banner DriveP.O. Box 650311Dallas, Texas 75251

Ron WilliamsNCR2001 Danfield CourtFort Collins, Colorado 80525

Cliff WilsonIBM1000 River RoadEssex Junction, Vermont 05452

CORD StaffDaniel M. Hull, President and CEOWalter H. Ed ling, Director of ProgramsBarbara Grayer, SecretaryKay Liston, Executive Assistant

Center for Occupational Research andDevelopment

601 C Lake Air DriveWaco, Texas 76710

30

APPENDIX C

?reliminary Task List

:i I31

of 41

Basic FunctionsI. Operations

A. Checks status of parts (materials)inventory

B. Determines day's priorities

Technician Task List

PROCESS: PHOTOLITHOGRAPHY

Detailed Job Tasks

Reviews product type and countsReviews material inventory and requirements

Reviews manufacturing specifications

Reviews manufacturing schedules

Establishes work priorities and scheduling

CORD/SMTEd ling/Lovettbg/October 5, 1990, 1:48 PM

Knowledge Required

Wafer characteristicsWafer identification parameters, codingWafer flatsCrystal orientation (1,1,)(1,0,0)Semiconductor equipment and materialsInstitute (SEMI) codeUse of colimated light and x-raydiffraction inspectionMetallurgy of crystalsCrystal structureCrystal growthCrystalline planesSolid solutionsImpurities and dopingNeeds to know how to use inventory controlsystem to look ahead and group lots of similartype to minimize number of set-ups

Details of photolithography process

Reading and interpretation of productionspecificationsChecks equipment status for any repairs oradjustments on previous shiftReading and interpretation of productionschedulesCommunicates with previous shift for passdownof informationBasics of manufacturing schedulingBasics of MRP

of 41

Basic Functions

C. Checks/adjusts equipment setting fordesired operation


PROCESS: PHOTCLITHOGRAPHY(continued)

Detailed Job Tasks

Reviews manufacturing specificationsAdjusts, verifies all operating parameters


Knowledge Required

Fundamentals of photochemistryFundamentals of inorganic and organiccompounds

Effect of timeEffect of light wavelengthEffect of temperature--PolymerizationPhysics of light

Frequency wavelength, energyDiffraction effectsCoating and film technology-Suriace preparation and adhesionSolvents usedFilm thickness

measurement techniquesPorosityProperties of liquidsViscosity units and measurementsDensitySpecific gravityPressureFlow measurementFlash pointProperties of gasesDensityPressureTemperatureGas lawsParticle pressuresFlow measurement

of 41


PROCESS: PHOTOLITHOGRAPHY(continued)


Basic Functions Detailed Job Tasks Knowledge Required

D. Prepares substrates as required by Washes wafers using scrubbers, highspecifications pressure water Cleans used to promote adhesion or remove

Spin driesDesiccates

particulates collected in storage boxes,How to look for wafer spots left from incomplete

Dehydration bakes dry.Low temperature bakeHigh temperature bake

Why wafers must be raised above 100° C toremove monolayers of water

Vacuum bake Physics of rotationAngular speed, accelerationCentrdugal forcesBalancePhysics of heatiemperature and its measurementInsulation, Thermal conductingRau ?bon, conversion, conductionHydruphilic/hydrophobic conditionsConstruction of bakery ovens

Inspect for hydrophilic/hydrophobic condition Binocs, 1r Microscope angle measurement techusing drop waterMeaning of hydrophobic and hydrophilic

of 41

Basic Functions

E. Vapor-primes substrates



Detailed Job Tasks

Loads, adjusts spin-coaters for primingVerifies liquid primer supply and specsVerifies vapor primer supply and specsVacuum bakes primer


Knowledge Reouirqd

Properties of primer liquids and gases--Basic chemistryPhysical properties

Safety requirementsSources and handlingOperational details of primer applicationMethodsAdjustments

Quality checksReason for primerHazards from materialOxygen contamination of vapor primeNeed to exceed 100"C, conductive vs radiantheatChange of wafer surface state to hydrophobic

of 41

Basic Functions

F. Coat wafers with photoresist

G Soft bakes wafers

I



Detailed Job Tasks

Loads, adjusts spin-coater for resistapplicationVerifies resist type and supplyMonitors specified process variables

Loads, adjusts bake processConvection ovens

Vacuum ovensIR ovens

Microwave ovensConduction bell ovens

CORD/SMTEdling/Lovettbg/October 5, 1990, 1:48 PM

Knowledge Required

Types of resist application (static vs dynamic)Different viscosities of resistHazards of chemicalsImportance of correct temp & humidity in roomHow exhaust flow into cup can change resistthickness profileReason for Edge Bead RemovalOptical EBR(Top & Bottom EBR techniques)Properties of photo resist materialsBasic chemistryPhysical propertiesSensitizers

SolventsNegative positive

OxygenationAdditivesSafety requirementsSources and handling

Reason for softbakeWhat happens if temp is either too high or lowTypes of softbake ovensOperational details of application devices andbaking processes

MethodsAdjustmentsQuality checks

CoverageThicknessPinholes

.? ;'71

4 .)

Page 6 of 41

Basic Functions

H. Exposes wafers



Detailed Job Tasks

Loads, adjusts stepperVerifies, loads proper masks and pelliclesOperates and monitors stepperMonitors, adjusts exposure parametersIntensityTimeUse of integrator


Knowledge Required

How a big a stepper field printsDifferent versions of reticlesParticle size and pellicle stand off distanceCheck stepper performance against "Mother"machine gridHow positive and negative resist react to lightReasons for CP and Overlay varianceGlobal vs field by field alignmentHow a stepper "MAPs" a waferConstruction and operation of stepper

AdjustmentsRoutine maintenancePreventative maintenanceOperating stepsMasking processesSingle

DoubleMultiple layersPlanarizingPhysics of exposure sources

UltravioletElectronic beam

DiffractionResolutionYellow light, spectral responseDispense mechanismsStatic

DynamicMoving

Drawback

i

Page 7 of 41



CORD/SMTEdling/tovettbg/October 5, 1990, 1:48 PM


H1. Post exposure bake Loads adjust bake process Reduces standing wavesStabilizes

0 Increases adhesion

I. Develops photoresist Loads, adjusts developer process asrequired

0 Immersion used for small geornetrics and longdevelop times

ImmersionSpray

Spray for quick turn around of wafers andautomation

Plasma Plasma develop for exotic multilayer resistprocessesDeveloper properties and chemistry

t.) Developer processes14:1 Immersion

SprayPlasmaPuddleInspection and quality control parametersUnder/over develop

J. Hard bakes wafers Loads, adjusts bake processes Physics and construction of baking processesVacuum (See above)ConvectionInfrared Radiation

Reason for hardbake & oventypes, proximitybaking on hotplates

MicrowaveHot plate

0

Page 8 of 41

Basic Functions




Detailed Job Tasks Knowledge Required

K. Measures and inspects wafer per specs Counts defects

K1. Wafer inspection Measure critical dimensions

L Transmit wafer to etch

Types of measurement tools (KLA, SEM)Familiarity with measurement devices and useVisual

MicroscopicCritical dimensions

Edge distension,bridging,edge quality

Resist liftingScratchesContamination

Pinholes

Optical Tools and intensity/reflectivity profilesEngineering spec vs production capabilitySpore vs line profileEntire CMOS, NMOSBipolar flow of wafers being processed toconnect defect seen with correct process stepIs the defect at the current level or previous?

Measure overlay Engineering spec vs production capabilityFamiliarity with TPC Methods

4 -7at

01 41

Basic Furrtions

II. MaintenanceA. Calibrate and/or adjust photolithography

equipment

4



Detailed Job Tasks

Adjust exhaustAdjust spin speedAdjust dispensing quantityAdjust bake temperature and timeAdjust light intensity and distribution.Adjust alignment/spacing of stepperPerform other stepper adjustments


Knowledge Required

Use of strobeVolume & weight measurementDifferent wavelengths ot light id equipmentWhat is a stepper "Baseline"Global vs field by field parametersMagnificationTrapezoidFocus within a field can varyHow one stepper can be matched to a groupLens vs stage parameters for overlayadjustmentMechanical knowledgeConstruction of photolithographyequipment

Required calibrationsRequired adjustments

Maintenance proceduresRoutinePreventative

- MajorKnowledge of physics

(Covered above)Knowledge of chemistry

(Covered above)Knowledge of crystalline metallurgy

(Covered above)Knowledge of electricity/electronics

Circuit analysis to board levelSystematic trouble-shooting proceduresAbility to read, interpret electrical

specifications, circuit diagrams, and

4

of 41

Basic Functions

B. Perform preventive (scheduled)maintenance

C. Troubleshoot and repair equipment



Detailed Job Tasks

Change lampClean chuckLube transporterLevel stageAdjust automatic wafer handler

Change, wipe down/flush wetbench idlerChange microcontrollerChange cameraChange/bake out SEM gun tipRestore vacuum to spin chuckCorrect misalignment in dispense armRepair stepper


Knowledae Required

functional diagramsAbility to use state-of-the-an analysisequipment

- VTVMOsilloscope digital

Knowledge of vacuum systemsTo level of tiouble shooting components

Knowledge of pneumatic systemsTo level of trouble shooting components

Knowledge of hydraulic systemsTo level of trouble shooting components

How a lamp's file is reduced when it's shutoffRemoval of finger prints from lampLamp centering adjustments & uniformityKnowledge of micro controllers

To major component levelDiode adjustments for AWA sensing

Camera gain for various substitutesAdjustments to SEM for locus adjustmentsReasons for "COMETS" at coat

of 41

Basic Functions

Ill. Train others to do tasks in 1 and 2



Detailed Job Tas.l.%

Lays out training materials and steps forothersExplains functions to othersChecks performance of others during training

CORD/SMTEdling/Lovettbg/October 5, 1990, 1 :48 PM

Knowledge Required

Able to organize and write out technicalinformationTerminology

SapseilclingB grammar, punctuationPerceptive writingOutliningCitations (references)Oral presentation skillsAble to communicate technical informationverballyPrepare presentationsPrepare support documents (diagrams,sketches, etc.)Able to understand the basic teaching/learningprocess, and empathize with learnersPatience, toleranceUnderstands need for repetition, closesupervision during learning

of 41

Basic Functions

IV Multitasking and workload management

V Improve cycle time and yield



Detailed Job Tasks

Seeks ways to combine and coordinate tasksOffers suggestions for operationalimprovementProvides written and verbal reportsPresents reports and technical summariesverbally

Performs trials (experiments) of differentprocess steps and adjustmentsRecords and analyzes results in terms ofyield and cycle time improvementTracks, records and analyzes basic defectpatterns

CORD/SMTEdling/LovettbglOctober 5, 1990, 1:48 PM

Knowledge Required

Looks ahead for similar lotsMinimizes tool set-upsCoordinates with co-workersMonitors SPC & tool operation and looks fortrendsShift to shill passdownsOrganization of lot & equipment statusReport writing, making charts & tablesExperienced in working in teams or groupsWilling to share informationWilling to ask for help or ask questionsWilling to accept adviceWilling to compromise viewsAware of creative thinking techniques

Knowledge of experimental methodsAble to record and organize data (Chai is,graphs, etc.)Able to interpret data and relate to hypothesesRuns design of exp to find optimal equip.parametersLooks for tool to tool differencesDesigns own job to be more efficientHandles wafers as little as possible (minimaltransfers)

_ Page 13 0141


A. Verify status of producl inventory


PROCESS: CHEMICAL VAPOR DEPOSITION - CVD



Log lot on COMETSVerify Number of Wafers, Process STEP,look for FCMsLook for Kan Ban TAG

B. Tool stalus Verify up for ProcessAll systems in SPEC

C. Loading monitors

D. Loading software recipe and verifyingrecipes

E. Push run

F. Respond to alarms

G. Unload wafers

Pre measure Wafers for stressLoan monitors into cassette according toSPECFlat orient Wafers on FLAT

Load recipe required in finder microspecCheck sequence and recipeEnter lot number and match sequencePlace Wafers on machine

Verify problemUnload Wafers if req'd

of 41


PROCESS: CHEMICAL VAPOR DEPOSITION - CVD(continued)

Basic Functions

CORD/SMTEdling/Lovellbg/October 5, 1990, 1:48 PM


H. Measure stress, thickness Measure thickness on prometrixMeasure stress on FSMMeasure Refractive INDEXLook for particles in bright light

I. Visual inspection Look for deformities in filmMicroscope inspection

Log into RSIJ. SPC. Input data to RSI Run SPC program

Input dataCheck for points out of control

K. Input data to COMETS Log lot out log lot out on comets:

of 41

Basic Functions

II. MaintenanceA. Routine checks

1. Particles

Leaks

3. Flow c.ontroller calibrations

4. Facilities

5. Pump operation

Film Quality


PROCESS: CHEMICAL VAPOR DEPOSITION - CVD(continued)

Detailed Job Tasks

Scan Wafers on tencorRun Wafers on machineScan Wafers on tencorVerify particle counts are in SPEC

Run lear rate routineVerify in SPECTroubleshoot leak w/leak checkerVerify baratron reading

Run AFC calibration routine

Read water flow, temperature, exhaust HowgaugesAdjust valves so gauges read in SPECCheck oil levelCheck pumping speed: Time To Pumpchamber down shut off ballast valve

Run metal evaporatorRun electric?l test, place WAFER on probestation, run program


Knowledae Required

of 41


PROCESS: CHEMICAL VAPOR DEPOSITION - CVD(condnued)

Basic Functions

B. Repair1. Chamber cleans

2. Loadlock wipedowns

3. "0"ring inspection/replace

4 Robot calibrations5. Pressure calibration6. Flow controller zero7. Clean pump screens & forelines

III. EngineeringA. SPCB. Identify equipment operation/baselining

equipmentC. Find causes for out of control processesD. TrainingE. Prepare/present repor1

IV OtherA. Stripping monitors

:ye C B. Ordering spare parts

Detailed Job Tasks

Vent chamber using routineWear safety equipmentWipe chamberVisual inspection of progress kitPumpdown chamberManually flow gauges & set pressure

Remove Orings

Follow routinesFollow routinesFollow routinesUse DVM's, o'scopes & schematics totroubleshoot systemShut off pumps & clean screens, & foreline

Prepare chemicals & monitors for stripping


Knowledne Required

of 41

Basic Functions

I. Observe safety precautionsA. High voltageB. RFC. High vacuum


PROCESS: METALIZ ATION(continued)

Detailed Job Tasks

Awareness

Volume, Pressure

II OperationsA. Check gauges, controllers Read, adjust record values from meters,

instrumentsB Check gas flows, power, temperature Read, adjust record values from software or

mechanical13 C. Verity status of product inventory Review inventory, strategize process

elliciencies/workload; check suppliesinventory

D. Load monitors Review, select, edit, recycle-handlecassettes, transfer wafers, insert cassette

E Monitor process and respond to alarms Check instrument values, read & recordF. Record process variables Record KWH, cv time, argon N2, flows,

temperatures, pressures, powerG. Unload wafers Remove cassette, remove waters, load into

carrierH. Measure film quality Evaluate resistivity, performance, thickness,

XRF & profilometry, alloy emlest movile, orcontamination, particles, stress

I Perform visual checks Evaluate grand size, defects, specularity,color

J. Determine if process is within tolerance Plot value on control chart, review VS spec,(spec) evaluate control chart

K. Record date on product Record measurement results in database,start/end times


Knowledge Required

ol 41


PROCESS: METALIZATION(continued)



L. Make process corrections Adjust by time, recipe parameters, minoradjust repair; convert new files

M. Follow flow chart Notify customer of incoming inventory,communicate process discrepancies

III MaintenanceA. Power-up electronics Turn breakers on check visual over is on to

controllers, reset reboot computer installfloppy disks, initialize SKM; verify vacuumconditions

u, B. Reset controllers Check temperature, status of pump, basec, pressure, value configuration/status, turnon

C. Regenerate pump-down curve (vacuum)Check temperature, clean poppeti valve startcompressors, check temperature, openvalves/configurationRecord pressure over time internalSelect program, initialize values, verilyvalues, calculate partial pressures, makedecisionChange cooling water verify inventory cleanshans, tools, record status and values

of 41

Basic Functions

D. Evaluate RGA values or spectraE. Remove, clean, align, rebuild mechanical

walor holdersF. Vent vacuum chamberG Remove shields and targetsH Clean chambers and shields

I Install clean shields and targetJ Remove, clean, inspect, replace, reinstall

"0" rings



Detailed Job Tasks

Adjust valves turn on N2remove/screws/shields/targetVacuum and clean, inspect cleanlinessMix chemicals, install program, positionshields, implement clean program, evaluateresistivity of wafers, dry shields, inspectshields inventory sharpInstall shields/screws: Solvents. Cylinders,Flow Dynamics, DVM, MSe of gauges,instrumentsInspect qualityPlace probes on target, take measurement,reportRemove shields, report K, re-install shields,report K


Knowledge Required

of 41

Basic Functions

K.Check target short-to-groundL. Troubleshoot shortM. Calibrate RF generation and 20 KW

power supplyN. Check wafer handling, alignment,

cleanliness0 Rebuild, replace, reinstall valvesP. Troubleshoot electronic controlling boards0. Trace electronic, plumbing, vacuum

schematics, pneumaticsA Perform leak checkS Calibrate MFC (mass flow control)T. Keep maintenance logU Calibrate heater controllers

Perform chemical cleans on depositedparts

W. Charge and qualify gas bottles, linesX. Perform computer and system diagnosticsY. Check microswitches, relays, sensors,

IV'sZ Coordinate supplier support, spare partsa Rebuild cathodes, recheckb Align chamberc. Check groundd. Check water resistivitye. Calibrate pressure transducersf Operate wacuum manually

IV. Process technician functionsA System requalificationB Monitor CV plots



Detailed Job Tasks


Knowledge Required

of 41

Basic Functions

C. Monitor SPC controls and adjustD. Measure resistivityE. Analyze film composition, step coverage

groove size, reflectivityF Waste process operation specsG. Adjust cathode magnets, and electric

I ieldsH. Measure and evaluate electro-migrationI. Maintain relations with up- and down-

stream process steps. Determinecmtomer needs. (Understandrequirements)

J Characterize, define process tolerancesK. Design perform, analyze, conclude, report

experimentsL. Prepare, analyze equipment performance

reportsM Implement SPCN. Generate troubleshooting guide0. Reduce defect densities, increase yield

V Other FunctionsA Train othersB Prepare, present reportsC. Participate in team activities, problem

solvingD. Observe cleanroom practicesE. Monitor utility usage and spare part useF. Participate in personal development

activitiest-



Detailed Job Tasks


Knowledge Reuuired

of 41

Basic FunctionsObServe safety precautions

A. High voltageB. RFC. High vacuum

II. OperationsA.Checks status of parts (materials)B. Determines priorities

C Verifies etch system functionality

D. Etches send ahead wafers

E. Observe and control system operation


PROCESS: PLASMA ETCHING

Detailed Job Tasks

Reviews product type and countReviews material inventory and requirementsReviews prior shill pass downsEnsures clean wafer boatsReviews manufacturing specificationsReviews manufacturing schedulesEstablishes work priorities and schedulingVerifies chamber base pressurePerforms slow calibrationsPeriorms partial pressure lestPeriorms particle testPerforms etch rate testEnter passive data from system testprocedures into data base and determines ifsystem performance specification has beenmetTakes appropriate action based on thesystem test resultsTrouble shoots and corrects problemsNotifies engineering, ect...as indicatedOptically inspectTake appropriate actionVerifies process recipeMonitor time to etch endpointMonitor shape of etch endpoint & curveRespond to systems alarms


Knowledge Required

Basic plasma physicsBasic chemistryBasic math

of 41

Basic Functions

F. Inspect wafers at post etch

(3. Perform lot tracking

H. Moves lot (physically)

Ill. Maintenance

A Clean work stationB. Clean process chamber

C. Conditions etch chamber

D. Responds to system failures

E. Check cooling unit water level


PROCESS: PLASMA ETCHING(continued)

CORD/SMTEdling/Lovet1bg/October 5, 1990, 1:48 PM


Inspect wafers opticallyTake appropriate actionMove lot on cometsEnter appropriate data and commentsMoves lot to next operation and locationWipedownVent etch chamberRemove chamber partsClean chamber partsInstall clean chamber partsClean chamberObserve safety regsLoads wafers and runs conditioning andseasoning recipesManipulate system using 'manual'commandsTrouble shoots

of 41


A. Optical film thickness measurements

B. Thin film resistivity MeasurementsC Optical Critical Dimension MeasurementsD Scanning Electron

Microscope CriticalDimension Measurements

II Management of Activities, Priorities

Ill MaintenanceA Perform scheduled maintenanceB. Trouble shoot & determine problem

sourcesC. Repair problems


PROCESS: METROLOGY

Detailed Job Tasks

Execute programsRecord dataLoad/unload wafersEnter data info VaxAlignment of patternsAS ABOVEAS ABOVEExecute programsRecord dataLoad/unload wafersEnter data into VaxAlignment of patternsOperation of S.E.M.Review manufacturing schedules, inventoryMake decisions on minute-tominute, & hour.by hour activities


Knowledge Required

Computer knvIedge (General)Accurate transcription of resultsN/AComputer knowledge (General)Microscope operationAS ABOVEAS ABOVEGeneral computer knowledge

General computer knowledgeSEM Theory & operation

General computer knowledgeBasic industrial engineering knowledge

of 41

Basic FunctionsI. Observe safety precautions

A. High voltageB. Hazardous chemicalsC. High pressure toxic gasesD.Vacuum systemsE. Elevated temperaturesF. Facility evacuation procedures

II. OperationsA. Check status of furnace

1. Process gas supply

2. Temperature zones

3. Robot and elevator

4. Upstream computer

B. Checkstatus of metrology tools1. Laser/light source2. Focus/alignment

3. Control computer

C. Check lot inventory1. Kan-ban,JIT WIP

2 Status in Process Control Computer(COMETS)


PROCESS: OXIDATION/DIFFUSION/LPCVD

Detailed Job Tasks

Monitor status of gas cabinet, upstreamvalves, pressure gauges, mass flowcontrollers, exhausts, burn-boxMonitor power delivered to zones andcorresponding temperature offsetsCheck autuprofile statusVerify status and coordinates

Monitor system statusVerify communications channelsReboot computer system

Verify laser/light source operationCheck system focus/alignment

Reboot computer systemChange hard disk cartridges

Determine line status and status of inventoryqueuesReview lot status/historyReview factory communication messages


Knowledge RequiredElectricityChemical safetyGas handling and safetyVacuum technologyBasic physics: heatIndustrial safety

Basic physics: Flow, pressure, temperature,combustion, heat, kinetic energy

Basic pl ysics: Temperature, heat conduction,convection, radiation, Joule Healing, Ohm'sLaw, thermoelectric effectBasic computer operationAnalylic geometry, Cartesian coordinatesBasic computer operationAbility to understand complex systems

Basic physics: Optics

Basic physics: OpticsGeometryBasic computer operation

Elements of indusi!ial engineeringElements of production managementBasic economicsBasic computer operationUnderstanding of Electronic Mail and WordProcessing

of 41

Basic Functions

D. Check test wafer inventoryE. Check status of preclean toolsF. Review process control charts

G Determine day's prioritiesH. Adjust and/or test toolsI. Log in operation in Process Control

Computer (COMETS)

L.


PROCESS: OXIDATION/DIFFUSION/LPCVD(continued)

Detailed Job Tasks

Refer to wet cleans tasks

Access SPC chartsIdentify out-of-control conditions

Periocm preclean operationLoad material handlerDownload process recipe from upstreamcomputer (APEX)

M Begin process runN Monitor run0 Unload material handlerP. Perform Metrology operation0. Enter data and log out operation in

COMETSR Move lots to proper position in fab facility

III Process troubleshooting/processimprovement

A Design and perform experiments toisolate process problems

Operate machinePerform subset of Basic PM'sOperate VAX terminal

Refer to wet clean tasksOperate machineOperate Apollo workstationInitiate data communication between APEXand furnacesOperate machineOperate machine

Operate machineOperate VAX terminal

Observe deviations from normal machinebehavior

Design and run experiments

Document process problem remedies

CORD/SMTEdling/Lovettbg/Oclober 5, 1990, 1:48 PM

Knowledge Required

Statistical process controlBasic probability and statisticsBasic economicsMachine operationSee under "Maintenance"Basic computer operationUnderstanding of process shop floor computersystem

Machine operationBasic computer operation

Machine operationMachine operation


Process physics and chemistryElectromechanical instrum,ntation

Experimental design

of 41

Basic Functions

B. Design and perform experiments toimprove process capability and/oroperations efficiency

IV Equipment maintenanceA Preventive maintenance

1 Ouar1zware change2 Ouar1zware clean/inspect3 Vac system disassembly and

assembly4 Pump oil and filter change5 Helium leak check

6 Pyro torch assembly

7 Thermocouple adjustment

8 Generate test recipes

9. Change PBr3, TMB, and TEOSAmpules

10 Service burn box



Detailed Job Tasks

Observe deficiencies in process orequipmentObserve deficiencies in operationalproceduresDesign and run experimentsDocument improvements

System rebuild

Operate chemical quar1z cleanersSystem rebuild

Operate helium leak detector

Rebuild pyro torch assembly

Adjust position, connectors, reference circuits

Apollo workstation operation

Rvi,,uild, refill, and test liquid source deliverysystems

Clean and rebuild hydrogen burn box

CORD/SMTEdling/lovettbg/October 5, 1990, 1:48 PM

Knowledge Required

Process physics aid chemistryExperimentlIdesign

Vacuum technologyUse of hand toolsBasic chemistryVacuum technologyUse of hand toolsVacuum technologyVacuum technologyBasic electronicsGas handlingBasic electricityBasic chemistry combustion, StoichiornetryElectricity, physics. Thermoelectric effectProper1ies of materials, metals and alloysComputer operationDetailed understanding ot process chemistryand physicsVacuum technologyElectricityGas handlingGas handlingElectricityBasic chemistry combustion, Stoichiometry

of 41



Basic Functions

B. System repair1. Vac system troubleshooting

2. Gas jungle troubleshooting

3 Microconlroller troubleshooting4. Upstream computer troubleshooting

5. Furnace power electronicstroubleshooting

6. Main system power distribution andUPS troubleshooting

7. I/0 module, alarm processor, gasmodule, and torch controltroubleshooting

8. Temperature module and temp controlcircuitry troubleshooting

9. Liquid source delivery systemtroubleshooting

10.Spare parts coordination11.Documentation of repair activities

V. Engineering supportA. Organize, run, and evaluate experiments13 Update and document process recipesC. Update process and maintenance specs

Detailed Job Tasks


Knowledge Required

Vacuum technologyElectronics (Power and Analog)Mechanical systemsVacuum technologyElectronicsFluid dynamicsElectronics (Microprocessors)Computer operationElectronics (Digital)Heat transferElectronics (Power)Electricity (Facility)Electronics (Power)Electronics (Analog and Digital)

Heal transferElectronics (Power am, ..nalog)Fluid dynamicsGas handlingVacuum technologyElectronicsElectronic Mail and Word Processing

All of abode

All of aboveAll of above

tL)

of 41

Basic Functions

D. Monitor and report on technical aspectsof operation

VI. Training (Sell and Others)A. Identity educational needs and take

courses/ask questionsB Learn by doing: ExperimentC. Teach what you know to your fellow

workersVII. Meetings, reponing, and other group

activities


PROCESS: OXIDATION/DIFFUSIONILPCVD(continued)

Detailed Job Tasks


Knowledcie Required

All of above

of 41

Basic FunctionsI Operations

A. Check status of parts (materials)inventory

B. Determines day's priority

C Performs daily process checks onequipment for normal operation

D. Chemical safety and handling


PROCESS: WAFER CLEANING

Detailed Job Tasks

Reviews product typeReviews materials inventory andrequirementsReviews specificationReviews manufacturing schedulesEstablishes work priority and scheduling

Reviews manuf acturing specsPerforms daily panicle and etch rate tests onappropriate process tanksPerforms bath bring-up operations asspecified on process instructionsManually/automatically filling chemical tanksand cannislers

CORD/SMTEdling/Lovellbg/October 5, 1990, 1:48 PM

Knowledge Required

Needs to know how to use inventory control tolook ahead and group lots of similar type.

Needs to know critical delay limes betweenprocesses in order to prioritize processingcheck equipment status for any repairs oradjustments communicates with previous shiftfor passdown of informationIs cenitted to run operations

Able to use metrology equipments (particlescounters, film thickness measurementequipments)Must possess full knowledge of chemicalhandling and safety

Safety gear must be worn at all times duringchemical handlingFull knowledge of SEMATECH safely numberand shower positioning

of 41

Basic Functions


PROCESS: WAFER CLEANING(continued)



E. Operate pre-diffusion cleaning equipment Load/run cleaning equipmentUnderstand chemistry/recipe of operation

Understand "delay-time" betweenfurnace/pre-clean operationsUnderstand chemical fill system toequipment

Able to troubleshoot (simple) any equip nen!problemFull understanding of process flow(COMETS) system

F Operate automatic pholoresiststripping/wet etch equipment

Load/run equipmentUnderstand chemistry/recipe of operationUnderstand manual sink/automated sinkoperationPerform daily process checks (particles/etchrates)Understanding of process flow systemFull awareness of chemical handling/safetySolve simple operaiion/process problemsassociated with equipment components/robot

Be certified on equipment operationUnderstand chemical safely and handlinginvolved with equipmentAble to identify/correct

Process problems related to the chemistryinvolved

of 41

Basic Functions

II. MaintenanceA. Calibrate and/or adjust wafer cleaning

equipment

B Perform preventive maintenance

C. Troubleshoot and repair equipment

D Training



Detailed Job Tasks

Calibrate/adjust temperature controllerCalibrate flow controllersCalibrate motor speed controllerAdjust door seals/lidsCalibrate transducersPerform other wet bench/spray processoradjustments

Adjust robot armFilter changesChange/replace plumbing componentsCheck tor leaksCheck tor mechanical wearCheck Ireon content of refrigeration unitChange process controllersCalibrate/adjust flow controllersCheck operation of plumbing componentsRepair electrical components of equipmentRepair pneumatic/electrical pumpsLayout training materials and steps torothersExplain functions to others

CORD/SMTEdling/Lovetibg/October 5, 1990, 1:48 PM

Knowledge Required

Chemical safetyKnowledge of flow process controlCertification on piece of equipment

Use of strobe, volume and weightmeasurements

of 41


A. Wafer cross section1. How a FET operates2. Process flow3. What the process does4. Masking layers (oxidies, nitrates)5. Masking with photo resist6. Implant damage7. Channeling and twist angles and

charging8. Anneal and activationat

B. Safety1 Acids and solvents2. Gasses3. High voltage4 Radiation5. Alarm system and evacuation routes6 Maintaining Teflon oat integrity


PROCESS: IMPLANT

Detailed Job TasksM.S. has completed introri%ictory safety class(given in orientation)M.S has completed radiation awarenessclassM.S. understands acid and solvent relatedsafety issues (M.S. is able to recognize acidlines, safety cabinet, ldmus paper, safetyshower and shower rinse time, reactions ofacids and solvents, and applications ofimplant specific acids and solvents.)M.S. understands implant specific gasrelated safety issues (M.S. is able torecognize implant specific hazardous gasesand the dangers of each gas, and knows thelocation of the gas boxes on each machine.)M.S. understands high voltage related safetyissues (M.S. is able to point out high voltageareas of each piece of equipment andpresent related safety precautions)M.S. understands radiation related safetyissues (M.S. is able to point out "hot spots"on the equipment and can demonstrateradiation awareness)M.S. understands evacuation procedures(M.S. is able to follow evacuation routes fromboth of the implant service aisles as well asthe implant bay. M S. must also know how toread the Fab layout and follow evacuationroutes for other bays)


Knowledge Required

of 41

Basic Functions

C. Wafer handling1. Automatic flat firtder2 MGI wafer transfer3. Vacuum pick-up techniques4 Clean dirty boat or box5. Clean work station


PROCESS: IMPLANT(continued)

Detailed Job Tasks

M.S. knows how to clean a dirty box or dirtyboatM.S. understands and practices the correctprocedure for cleaning a work stationM.S. understands the importance of, andpractices the following wafer handlingtechniques:1 Uses the wafer lift, MGI Automatic

Transfer, and MGI Automatic FlatFinder when handling boats of wafers.

2. Uses correct vacuum pick-up techniques3. Does not leaf, over wafers4. Does not cross over wafers with body

parts5. Uses correct boat handling techniques6. Can correctly place wafers in a boat7. Can correctly place a wafer in a single

wafer carrier

CORD/SMTEd ling/Lovettbg/OCtober 5, 1990, 1:48 PM

Knowledge Required

1

Page 35 of 41

Basic Functions

6. Metrology equipmentA. Thermawave Thermaprobe 300

a. Technical overviewb. Operationsc. Process flow

B. Prometrix Omnimap R550/ea. Technical overviewb. Operationsc. Process flow

C. Tencor surfscan 5000a. Technical overviewb. Operationsc. Process flow



Detailed Job Tasks

M.S. can successfully load a desiredprogram onto the Surf scan 5000M.S. can operate Surfscan 5000 in manual orcapture collection modesM.S. knows the correct nomenclature fortaking measurements on the RS 50/e and theThermaprobe 3000M S. can select and use correct files andprograms for the RS 50/e fand Thermaprobe300M.S. knows control limits and frequency ofmeasurement of the calibration wafers on theRS 50/e and Thermaprobe 300M.S. can recail any data point in any RS 501eor Thermaprobe 300 programM.S. can recognize and delete false data .

points on the Thermaprobe 300 and RS 50/eM.S. can bring up Thermaprobe 300 from apower off conditionM.S. can change Thermaprcbe 300 light bulbM.S. can recover a wafer from theThermaprobe 300M.S. can back-up Thermaprobe system anddata tapes


Knowledge Required

1.

1

Page 36 of 41

"VI

Basic Functions

D. Implement specific COMETS logging1. Up/down protocol

E. R.T.A.'s1. Peak

a. Technical overviewb. Operationsc. Process flow

2. A G.a. Technical overviewb. Operationsc. Process flow



Detailed Job Tasks

COMETS Logging

M.S. can view the status of any entity in theimplant bayM.S. can view any given spec on COMETSM.S. can correctly and accurately log anygiven event for an entity in the implant bayM.S. can view inventory of production anddetermine processing for each lotM.S. can perform continuous process loggingM.S. knows the relationship betweenCOMETS logging and E10-89M.S. can verify and edit the correct implantrecipeM.S. can verily and edit the RTA manualsettingsM.S. knows the correct wafer flat orientationin the boatM.S. can correctly load and unload wafersM.S. knows what type of boat is to be usedon the RTAM.S. knows why the dummy wafer is loadedin each cassetteM.S. knows the correct annealingtemperature for the implant anneal recipe

CORD/SMTEdling/Lovet1bg/October 5, 1990, 1:48 PM

Knowledge Required

1

of 41

Basic Functions

F. Laser scribe1. Technical overview2. Operations3. Process flow

G. Implant monitor flow1. Particle monitors2. Implant monitors3. Corrective action response

A



Detailed Job Tasks

VI. Laser ScribeM.S. can pedorm long- and short-termshutdowns on the laser scribeM.S. can start the laser scribe from long- andshort-term shutdown conditionsM.S. can explain and perform scribingprocedures on implant monitor wafersM.S. can correctly load and unload wafersfrom the RS 50/e, Surfscan 5000 andThermaprobe 300M.S. can verify RS 50/e probe I.D.,successfully change probe head, andperform probe conditioningM S. has completed S P.C. classM S. can generate S.P.C. charts for thePrometrix Rs 50/e and the Thermaprobe 300

Charge monitor

CORD/SMTEdling/Lovettbg/Oclober 5,1390, 1:48 PM

Knowledge Required

of 41

Basic Functions

H. Implant process flow1. Phase 1 implants

a. Stepsb. Speciesc. Dosesd. Resist strips



Detailed Job Tasks

M.S. knows implant process flow, includingsteps, species, resist strips and approximatepolesM.S. knows usable particle monitor reiectlimitsM.S. snows what to do with particle monitorsexceeding usable particle monitor limitsM.S. knows what type ot wafers are to beused as particle monitorsM.S. knows what to do with monitors forreclaimM.S. knows what type of monitor is used foreach implant testM.S. knows the frequency and specificationsfor monitoring implant utility wafersM.S. knows response protocol for out ofcontrol monitors


Knowledge Required

Safety

IC manufacturingSPC,Data entry

1

of 41

Basic Functions

I. OperationsA. Implanter technical overview

1. Vacuum technologya. Roughing pumpsb. Cryo pumpsc. Ddfusion pumpsd. Turbo pumpse.H.C.I.G.s, T.C. gauges, and other

vacuum measurement devices2. Introduction to the source chambers

a. Ionization and how radiation iscreated

b. ARC chamber functionsc. Source magnetd. Extraction electrodee. Beam steering and focusingf. Electron suppression

3. Introduction to the beamline/flight tubea. AMU and analyzer magnetb. Post accelerator electrodesc. Bet"..n focusingd. Beam blow-up

4. Introduction to the process chambera. Faradays and suppressionb. Electron showersc. Dose processorsd. Scanninge. Beam profiling



Detailed Job Tasks

GeneralM.S. can explain the following ion implantfunctions (refer to figures 1A, 1B, 2A and28):

A. Arc currentB. Arc voltageC. Filament current/resistanceD. Source magnet(s)E. Amu and analyzer magnetF. Faraday cups and magnetic electron

suppressionG. Scanning

M.S. can describe possible causes of thefollowing beam set-up failures. (Refer tofigures 1A, 1B, 2A and 2B):

A. Maximum filament current with no arccurrent

B. No filament currentC. No arc currentD. The beam current on the NV20A's

disk Faraday is considerably greaterthan the beam current on the flagFaraday

E. The beam current on the PI9200shutter (with no adjustments to thebeam) is approximately equal to thebeam stop beam current reading


Knowledge Required

of 41

Basic Functions

B. Working on line with spec and trainingdocuments1. Equipment set-up and operations

a. Explain the workings of theimplanters while selling up

2. Skills practicea. Have trainee pci;orm different set

-ups on each machineb. Have trainee trouble shoot common

implant setup problems

1 : f



Detailed Job Tasks

NV20AM.S. knows the correct start-up sequenceand procedures (refer to sections 5.0, 6.0and 9.0 of spec IMPP0004).M.S. knows the correct vacuum pressures(refer to section 6.0 of spec IMPP0004)MS. knows the correct sel-up sequence andprocedures (refer to sections 5.0, 6.0 and 9.0of spec 'MPP0004)M.S. knows how to correctly setup and tuneeach implant (refer to sections 5.0, 6.0 and9 0)M.S. can correctly submit, load, unload andretrieve wafers from the implanterM.S. can retrieve data from any givenprevious implantM.S. can verify, load and write a recipeM.S. knows correct procedures for shuttingdown the implanter (long and short term)M.S. can explain the following NV20Afunctions (refer to figures 2A and 28):

A. NV20A sourceB. Extraction electrons and axes steeringC. Ouadrapole lensD. Resolving SLITE P.A electrode assemblyF Flag FaradayG Electron shower


Knowledge Required

1

of 41

Basic Functions




Delailed Job Tasks Knowledae Required

M.S. can explain the following PI9200functions (refer to iigures 1A and 1B):

A. Freeman sourceB. Extraction electrode and extraction

electrode alignmentC. VanesD. ShutterE. Mass resolving systemF. P.A. electrode assemblyG. Flood gun

CA) H. Charge monitorI. Beam profiling

3 Viewing operation and equipmentstatus

4. Continuous process logging5. Viewing S.O.C. data

,1

APPENDIX D

Curriculum Advisory Committee andValidation Task List

75

SEMICONDUCTOR MANUFACTURING TECHNICIAN

CURRICULUM ADVISORY COMMITTEE

Description:

Purpose:

Meetings:

Responsibilities:

Representatives of the companies requiring retraining ofexisting technicians and/or likely to hire new technicianswho are graduates of the program; other experts qualifiedto contribute specialized knowledge; and representativesof the institutions likely to provide future training andretraining

Provide technical assistance to CORD in curriculumdesign and development and assist CORD and TSTI inimplementation of training/retraining program(s)

Three between February 1990 and June 1991; in addition,substantial work will be done by mail

Provide information relating to the technical aspects oftechnician jobs

Assist in the design and data interpretation of needsassessment for training/retraining in membercompanies

Review and comment on job descriptions and taskanalysis

Validate technician job competencies

Review curriculum/course models for trainingiretraining

Evaluate laboratory requirements for training andretraining environment

77

SEMICONDUCTOR MANUFACTURING TECHNOLOGYEDUCATIONAL COORDINATING COMMITTEE

Dan Angel, President

District Administrative OfficesAustin Community College

P. 0. Box 140526Austin, TX 78714

Don Beck, Instructor

Electronics

Texas State Technical Institute-HarlingenP. 0. Box 2628Harlingen, TX 78561-2628

Glen I. Bounds, ProvostBill J. Priest Institute

for Economic Development1402 Corinth

Dallas, D( 75215

Ron Brey, Director

Non-Traditional Instruction

District Administrative OfficesAustin Community CollegeP. 0. Box 140526Austin, TX 78714

Jim BurnettDirector of High Technology

Special Programs

Olney Central College

Olney, IL 62450

Ronald L. Carter, Ph.D., Director

NSD/CAEDS

University of Texas at Arlington

P. 0. Box 19016

Arlington, TX 76019

Norman Colbath, Division Chair

Technology and Graphics

District Administrative Offices

Austin Community CollegeAustin, TX 78714

William H. Cox, Ph.D.

Dean of Instruction

Texas State Technical Institute-Waco3801 Campus Drive

Waco, TX 76705

F. Pat Foy, Ph.D.

Manager, Technical Services

Business and Technology Center

Austin Community College

5930 Middle Fiskville Road

Austin, TX 78752

Don E. Goodwin, President

Texas State Technical Institute-Waco

3801 Campus Drive

Waco, TX 76'05

Cecil L. Groves, Ph.D., Chancellor


3801 Campus Drive

Waco, TX 76706

Kent Hansen, Chairman

Electronics Engineering

Linn-Benton Community College

6500 SW Pacific Boulevard

Albany, OR 97321

L. C. Harris, Ill, DirectorBusiness Development

Business and Technology CenterAustin Community College5930 Middle Fiskville RoadAustin, TX 78752

Jim Jackson, DirectorContinuing Education

St. Michael's CollegeWinooski Park

Colchester, VT 05439

Don Johnson

Associate Vice President

Vocational Technical Education

Portland Community CollegeP. 0. Box 19000

Portland, OR 97219

Rand Johnson, Director

Center for Business and

Economic Development

Salt Lake Community CollegeP. 0. Box 30808Salt Lake City, UT 84130

Vijay Joshi, Program Director

Microelectronics Technology

Durham Technical Community College1637 Lawson Street

Durham, NC 27703

Bert Marcom, Assistant Vice Presidentof Academic Affairs

Austin Community CollegeP. 0. Box 140526Austin, TX 78714

George H. Mc Shan, Dean of Instruction

Texas State Technical Institute-Harlingen

P. 0. Box 2628Harlingen, TX 78561-2628

Richard Moore, Associate Dean ofInstruction


3801 Campus Drive

Waco, TX 76705

Wayne Perm ley, Assistant Training

Specialist

Electronics Training Division

TEEX

The Texas A & M University System

College Station, TX 77843-8000

J. D. Pierson, Ph.D.

Associate Dean

Industrial Training & Economic

Development


3801 Campus Drive

Waco, TX 76705

Lee Pubs, Department Chairman

High Technology Department

Indian Hills Community College

Airport Campus, Building 58

Ottumwa, IA 52501

John Schlosser, Division Director

Electronics & Manufacturing

Texas State Technical Institute-HarlingenP. 0. Box 2628

Harlingen, TX 78551-2628

Peter C. Scott, DirectorScience Technology DivisionLinn-Benton Community College

6500 SW Pacific BoulevardAlbany, OR 97321

Tsay-jiu Shieh, Assistant Professor

Electrical Engineering

University of Texas at ArlingtonP. 0. Box 19016

Arlington, TX 76019

George Van De Water, DirectorSchool of Continuing Education

Salt Lake Community CollegeP.O.Box 20808

46000 South Redwood RoadSalt Lake City, UT 84130

Samuel S. Villareal

Associate Training SpecialistElectronic EngineeringTEEX



James P. Wallace, Division Head

Electronics Training DivisionTEEX



Barbara Gutheil, DirectorContinuing Education

Vermont Technical CollegeRandolph Center, VT 05061

Roger Perry, Provost

Champlain College

163 South Willard StreetP. 0. Box 670Burlington, VT 05402-0670

Jerome BeckmannHmlett Packard815 14th Street

Loveland, CO 80537

CORD Staff

Daniel M. Hull, President and CEO

Walter Ed ling, Director of Programs

601 C Lake Air Drive

Waco, Texas 76710

Elements ofKnorgrilLd

DEVICE OR PROCESS -

Requiredni_gyiSk_Atne Reciulred Knowledge

.4 4.of4:047-0,0:4401

0 = Not Applicable= Useful

2 = Important3 = Essential

1

Basic Functions

I. OperationsA. Checks status ol pans (materials)

inventory

co

B. Determines day's prkirdies

page 1 ol 40

Technician Task Ust


2daggijskjigi

Reviews prockid type and counts

Reviews malarial inventory and requiremenls

Reviews manufacturing specdicalions

Reviews manulactudng schedules

Establishes work priorities and stheduling

Knowledge Required

Wafer characteristicsWafer identAicatbn pararnelers, coding

Wafer II(?)Crystal orientation (1.13(1.0,0)Semiconcluctor equipnent and malenalsInstkule (SEMI) codeUse of cokmaled lighl and x-raydiffraction inspection

Melalkirgy of crystalsCrystal structureCrystal growthCrystalline planesSolid solutions!nil:willies and doping

Details of photolithography process

Reading and interpretation of productionspecificationsReading and interpretation of productionschedulesBasics of manufaauring schedulingBasics of MRP

CORD/SPATHull/EdlingbgiMay 2, 1990. 10 34 AM

/

0 No. ApplicableI MANI ii

Basic Functions


PROCESS: DiOTOLITHOGRAPHt(continued)


C Checksiadjusts equipment setteig lot Reviews manufackning specifications Fundamentals ol photochemistrydesired operation Adjusts, verifies al operating parameters Fundamentals of inorganic and organc

compoundsElect of limeElect of light wavelengthElect ol temperaturecoPolymerizationPhysics of lightFrequency wavelength, enemyDiffraction elects

Coaling and film technology&Mace preparation and adhesionSolvents usedFilm thicknessMOILSUMMOM techniquesPorosity

Propeilies of SquidsViscosity units and measurementsDensitySpecific gravityPresageFlow measurementFlash point

Properties of gasesDensityPreaeureTenperatureGas lawsParticle pressuresFlow measurement

rage 2 of 40

BEST COPY AVAILABLE

CORD/SPA THuNiEdlingbg/May 2. 1990. 10 34 AM

/

0 AppacabbI licnt..0

Basic Functions

Technician Tusk List

PROCESS: ElDTAMINfile Uri(axillnued)

Detailed Job Tasks Knowledge Reauired

D. Prepares substrates as required by Washes wafers using scrubberS, high Physics of rotation

spealications pressure WAIN' Angrier speed, acceleration

Spin dies Centrifugal forces

Desiccates Balance

Dehydration bakes Physics of heal

Low temperature bake Temperalure and its measuremer4

High temperature bake Insulation, Thermal (=ducting

Vacuum bake Radiation, conversion, conduction

Inspect tor hydrophic/hydrophobic condition Hydrophilic/hydrophobic coalitionsConstr(?????) of bakery ovens

E. Vaporpnmes substrates Loads, adjusts spin-coaters for priming Properties of primer liquids and gases

Verifies liqukt primer supply and specs Basic chernistry

Verities vapor primer sup,* and specs Physical propenies

Vacuum bakes primer Safety requiremergsSources and handing

Operational details of primer applicationdethodsAdjustmentsDually checks

F Coat waters with pholckesist

1 rt0.. 11

Page 3 of 40

Loads, adiusts spin-coater 104' resistapplicationVerifies resist type and supplyMonitors specified process variables

CORDISMT

ba/May 2, 1990, 10.34 AM

/

0 Not Appi,x )bieI WNW

1 f'

Basic Functions

G Soh bakes wafers

1 2 7

Page 4 of 40

Technician Task Liali

PROCESS: EfigigkingraWILY(continued)

DetaIId Job Tasks

Loads, actOtsts bake processConvection ovensVacuum ovensIR ovensMicrowav ovensConduction bell ovens

Knowledge Required

Properties of photo resist materialsBask cherrigryPhysical propertiesSensitizersSolventsNegative positiveOxygenationAddilvesSafety requirementsSources and handling

Operational details of application devices andbaking processes

MethodsAdjustmentsOutlay chedtsCoverageThickness

- Pinholes

CORD/SPATHull/EdlingbolMay 2, 1990, 10:34 AM

1

0 z- Not Applicable1

Basic Functions

H. Exposes waters

I Devek ips photorems1

Page 5 of 40

Technician Task Us*

PROCESS: EMIMArligranAl_ni(continued)

Detailed Job Tasks

Loads. adusts stepperVerdies. loads paper masks and pelklesOperates and monitors stepperMonitors. edit/51s exposure parameters

IntensityTimeUse of integrator

Loads. adiusts developer process asrequired

immersionSprayPlasma

Knowledoe Reouire4

Construction and operation of stepperAdustmentsRoutine maintenancePreventative maintenanceOperating steps

Masking processesSingleDoubleMultiple Layers

PlananzingPhysics of ) sources

UltravioletElectronic beamDtfradionResokitionYellow light spectral response

Dispense mechanismsStaticDynamicMovingOravitadt

Developer properties and thernstryDeveloper processes

ImmersionSP(ayPlasmaPuddle

Inspcction and cp.iakty control parametersUnderlovet deveiop

CORD/SMTHultrEdlingbgrMay 2, 1990, 10 34 AM

0 7. Nol Applicable

1 3


PROCESS: PHOTOLITHOGRAPHY(conlinued)

Basic Functions Detailed Job Tasks Knowledge Reauired

J Hard bakes waters Loads, adlusts bake processes Physics and construction ol baking processesVacuum (See above)ConvecionIntrwed RadiationMicrowaveHot plate

K. Measures and onspecis water per specs

L Transnul water to etch

131

page 6 of 40

Familiarity with measurement devices and useVisualMiCrOSO3p1C

Creical dimensionsEdge dislensionAndging,( ).edge qualityRe???? NitingScralctiesContaminationPinholes

Familiarly with TPC Methods

CORIYSM THue/Ey:MingbgeMay 2, 1990. 10 34 Am

Basic Functions

H. MaintenanceA. Calibrate and/or adjug ptigokthography

equipm

page 7 of 40

Technician Task Ust

PROCESS: PHOTOLITHOGRAPHY(continurf)

Detailed Job Tasks

AdOist exhaustAdjust spin speedAdjust dispensing quantityAdjust bake ternperature and timeAdjust light intensity and distrbutiori.Adjust alignment/spacing of stepperPerform other stepper adjustments

Knowledge Required

Mechanical knowledgeConstruction of photolithographyequipment

required calibrationsRequired adjustmentsMaintenance procedures

Routine- PreventativeIdajor

Knowledge of physics(Covered above)

Knowledge of chemistry(Covered above)

Knowledge of crystalline metaikugy(Covered above)

Knowledge of elisclriady/elactronireCircuit anatomis so boardlcosiSysterlfic trouble-shooting proceduresAbility to read, interpret electficalspecifications, circua diagrams, andfunctbnal diagramsAbily So use staled-the-an analysis

equipmentVTVM

Osdloscope - digitalKnowledge of vacuum systems

To level of troubie shooting componentsKnowledge al pneumatic sygems

To level of trouble stooling corrponerds

CORDISMTHuIVEdlingbWMay 2. 1990, 10 34 AM

0 z Not Applicable1 t Useful

3 4

Basle Functions

8 Perform preventive (scheduled)maintenance

C Troubleshoot and repair equOment

Ill Train others to do tasks in 1 and 2

:1;4,5

eageeol 40

Technician Task Ust

PROCESS: ElDIQUIltgalli(continued)

Detailed Joh Tasks

Change lampClean chuckLube transporterLevel stageMOO automatic water handier

Change. wipe dowrVIlush wetbench tilerChange microconIrollerChange cameraChange/bake oul sem gun tipRestore vacuum to sport chuckCOMICI misalignment in CliSpenliel armRepair stepper

Lays out training materials and steps torothersExplains lunctions to othersChecks performance ot others during training

Knowledge Required

Knowledge of hydraulic systemsTo level of trouble shooting components

Knowledge ot micro controllersTo MajOf component Wel

Able to organize arxlwree out technicalinformation

TerminologySperlingBasic grammar. punctuationPerceptive writingOutliningCitations (references)

Able to oommunscate technical illormationverbally

Prepare presentationsPrepare support documents (diagram.skeiChes. etc.)

Able to understand the basic leaching/teamingprocess, and empathize with learners, Patience.toierance Understands need for repetition. closesupervision (luring teaming

CORD/SMT

bg/May 2. 1990. 10:34 AM

/14

0 Not Applicableliet.

13

Basic Functions

IV Multitasking and workload management

V Improve cycle lime and yield

I OperationsA Checks status ol parts (materials)

inventory13 Determines day's priorities

C. Checks/adjusts equipment selling tordesired operation

page 9 ol 40


PROCESS: PHOTOLITHOGRAPHY(conliflultd)

Detailed Job Tasks

Seeks ways to combine and coordinate tasksOffers suggestions tor operationalimprovementProvides written and velbal reportsPresents reports and technical summariesverbaNy

Performs trials (experiments) of difterentprocess steps and adjustmentsRecords and analyzes results in terms ofyield and cycle Nene erprovementTracks, records and anatyZes basic detectpatterneReviews product type and countsReviews material inventory and recluirements

Reviews maniAacturing specdicationsReviews manulaclining scheclulesEstablishes work priorities and scheduling

Reviews manutactunng specificationsAdjusts, verifies all operating parameters

Knowledge Reauired

Experienced in working in teams or gioupsWiNing to share informationMina to ask tor help or ask questionsWilling to accept adviceWilling to compromise viewsAware of creative thinking technewes

Knowledge of experimental methodsAble to record and organize data (Chans,graphs, etc.)Able to interpret data and relate to hypotheses

Needs to know how to us inventory controlsystem lo look ahead and group lots of similartype to minimize number of sel-upsChecks II quipment status for any repairs oradiustments on previous shiftCommunicates with previous shift for passdownof information

Is certified and runs daily test on all °campmate

CORD/SmTHult/EdinglogiMay 2, 1990, 10-34 AM

/

2 1 3 3

3 1 3 3

Not Applkabbo

38

Basic Functions

D. Prepares substrates as required byspecificalions

E Vapor primes substrates

F Coat waters vaPi photoresist

G. Soft bakes waters

page 10 0140


PROCESS: PHOTOLIMOGRAPHY(corelfamd)

Botalloti 4ob Tasks

Washes wafers using scrubbers, highpreSSUreSpin driesDesiccatesDehydration bakes

Low temperature bakeHigh temperature bakeVacuum bake

Inspect tor hydrophilic/hydrophobic nonillion

Loads, adjust spin-coaters for pnrmngVerifies 1411d Omer suppty and specsVetilies vapor primer supply and specsVacuum bakes primerLoads, adjusts spin-coater for resistapplication

Loads, adjusts bake processComection ovensVacuum ovensIR ovensMicrowave ovensConduction bell ovens

Knowledge Required

Cleans used to promote adhesion or removeparticulates weeded in storage boxes, how tolook for wafer spots lett from incomplet8 dry.Why walers must be raised absve 100 C toreMOve monolayers of waif

Binocular Microscope angie measurement techusing drop water, meaning of hydrophobic andhydroPhIlicReason for Omer, hazards Korn material,oxygen conlominallon ot vapor prima, need toexceed 10e C, conductive vs radiant heat.change of wafer solace state to hydrophobic1, nes of resist appication (static vs dynamic)ddlefenl viscosities of resist, dyed resist !leeringresist, hazards of chemical, importance ofcorrect leap & humiday In mom; Wm exhaustlbw into cup can change resist thickness profile.Reason tor Edge Bead removal, optical ERR.(Top & Bottom ERR techniques)Reason for softbake. what happens N tem iseither too high of bw. Types of sottbake ovens

CORD/SPATHuIVEdlingbg/May 2, 1990, 10 34 AM

1 1 3 3

1 1 3 3

2 2 3 3

3 3 3 3

2 2 3 3

Not ApplicableUseful

Basic Functions

H. Exposes wafers

H I Post exposure bake

I. Develops pholoresist

J. Hard bakes wagers

sags 11 of 40


PROCESS: pHOTOLIDIOGRAPHY(continued)

Detailed Job Tasks

Loads, aditisis stepperVerifies, bads proper masks and pelliclesOperateS and monitors stepperMonitors. adiusts exposure parameters

intensityTimeUse of integrator

Loads adiust bake process

Loads, Awls devebper process asrequired

ImmersionSW,/Plasma

Loads, adpists bake processesVacuumConvecibriInfrared RadiationMicrowaveHot plate

Kqowledge Requked

How big a stepper fiekt prints, different versionsol reticles exist panicle size and pellicle standoh distance. Check stepper perlormance againstWeiner machine grid. How positive andnegative resist react to light Reasons for CPand Ovailay variance. Goobal vs field by fieldalignment. How a stepper WAP's a waferReduces standing wavesStabilizes CO'satrzeaseS adhesion

Immersbn used for small goometrics and bngdowel:9*nel. Spray be quidi turnaround ofwafers and automation. Plasma develop forexotic muailayer rest* processes

Reason for harcbake IL oven types, proximitybaking on footplates,

CORD/SMTHuSiEdlingbig/May 2. 1990. 10 34 AM

0 r. Not Applicable

3

2

1 1

Basic Functions

K. Measures and kispects water per specsK 1 Water inspectionL. Transmit wafer to etch


PROCESS: ENDIQUILIMAEM(centinu.d)

Count detectsMeasure critical dimensionsMeasure oveday

II Maintenance Adjust exhaustA Calibrate and/or adjust photokthography Adjuit spin

equipment Adjust dispensing quantityit4jus1 bake temperature and timeAdjust light intensity and distrtoutionAdjust alignment/spacing of stepperRedorm other stepper adjUstments

B Periorrp preve0ive (scheduled)maintenance

C Troubleshoot and repair equiprnere

Train others to do tasks m 1 and 2

page 12 of 40

143

ChangelampClean chuckLube transporterLevel stageAdjust auloMatiC water handlerChange, wipe down/flush wetbench MeiChange MICMCOrtrOlkXChange cameraChangeobake out sem gun tipRestore vacuum to spin chudiCorrect misalignment in dispense armRepair stepperLays out training materials and steps torothersExplains furictions to othersChecks periormance of others during training

Knowleclas Reauired

Types ot measurement tools (KLA. SEM, opticalloots and intensity/retiedivity prolitesSpore vs line profitsEngineering spec vs production capabilityEntir CMOS, HMOS, Bipolar flow ot watersbeing processed to connect detect seen *ehcorrect process stepIs the defect at the current level or previous?Use of strobeVolume weight measurementDeferent wavelengths of light in equipmentWhat Is a stepper Itasekne; global vs field byHeti parameters; magnification, trapezoid; focuswithin a held can varyHow one stepper can be matched to a groupLens vs stage parameters lot overlayaclustmentHow a lamps We is reduced when its shut ohRemoval ol linger prints from tamLam centering adjustments S unitomiityDiode aOsstments tor AWA sensing

Camera gain for various substitutesAdjustments to SEM for focus adjustmentsReasons lot 'COMETS at coat

Otal presentatn slcs

CORD/SMTHult/Edfingbog/May 2, 1990. 10 34 AM

1

1 1 3 3

1 1 3 3

2 3 3 3

3 3 3 33 3 3 3

2 3 3 3

1 3 3 31 3 3 31 3 2 3

1 3 3 3

1 3 3 3

2 3 3 3

1 3 2 3

2 3 3

o Hot ApplicableUseful 144



IV.

Basic Function%

(continued)

Detailed Job Tasks Knowledge Reouired

2 I 3 3

Mu Ri-lasking and worktoad management Seeks ways to combine and coordinate tasks

Otters suggestans for operationalimprovement

looks ahead lot similar MsMinimizes tool set-upsCoordinates with co-workersMonitors SPC & tool operation and looks fortrends

Provides wraten aid verbal reports Shift to shift passdowns2 2 3 3Presents repoils and technical sunimanes Organization of lot & equipmerd status2 3 3 3verbally Repoli writing, making charts & tables2 3 3 3V Irrsarove cycle time and yiekl Performs trials (experiments) of different

process steps and adjustmentsRuns design of exp to lind optimal equipparameters 2 2 3 3

Locks for tool to tool differences2 2 3 3Records and analyzes results in terms of Designs own job to be MOO) efficient2 3 3yiekl and cycle time improvement Handles wafers as little as possible (minimal

transfers)2 1 3 3

Tracks, records and analyzes basic defectpatterns

SPC, Western Electric rulesWhat is *out of control

2 2 3 3

What are the common defects found inphotolithographyWhat piece ol equipment does a defect comehom

1 4 ;5

page 13 of 40 CORD/SMT

bg/May 2, 1990, 10 34 AM

o Not ApplicabteI z I le iJ

1 4


PROCESS: CHEMICAL VAPOR DEPOSITION - CVD

Basic FuactionsI Operalione

A Verdy status of product inventoryB Tool slaty%C Loading rriooftersO Loading software recipe and verdying

MapesE Push runF Respond lo alarmsG Unbad wafersH Measure stress, thicknessI Visual inspectionJ SPC Input data to RSIK. Input data to COMETS Log lot out

1 4 7

Page 14 of 40

a

a.

a.b.b.

C.

Detailed Job TasksLog lot on COMETSVenly Kober of WFRS, Process STEP,look tor FCMsLook for KanBan TVerily up for ProcessAl systems in SPECPre measure WAFERS for stressLoan monitors into cassette according toSPECFlat orient WFRS on FLATLoad recipe required in finder microspecCheck sequence and recipeEnter lot number and match sequencePlace WFRS on machineVerdy problemUnload WFRS d reqdUeasuri thickness on promelnkMeasure stress on FSMMeasure Refractive INDEX ???????Look for pandes in bright ktilLook tor delormMes in filmMicroscope inspectionLog into RSIRun SPC programInput dataCheck for poirds oul of cordrollog lot out on comets:

Knowledge Required

CORD/SMTHuO/Edlingbg/May 2. 1990. 10 34 AM

ha

0 =. Not Applicabia

Technician Task Ust

PROCESS: CHEMICAL VAPOR_DEPOSITION CVD(corminueo)

Basic Functions

II MaintenanceA. Routine checks

1 Panides2 Leaks3 Flow conUotler caltrations4 Faalities5 Pump operation6 Fikn Quality

B Repair1 Chanter cleans2 Loadlock wipedowns3 Oring inspechonireplace4 Robot calittalkins5 Pressure calibration6 Flow controller zero7 Clean purnp screens & foreknes8 THIS LINE DID NOT COPY

Maintenance

1 .1 9

rage 15 ol 4.

Detailed Jab Tasks

al . Scai WFRS on tencoral. Run WFRS on machineal . Scan WFRS on tencoral . Verdy panicle counts are in SPECa2.Run tear rate routinea2. Verily tt SPECa2. Troubleshoot leak wneak checkera2. Verily baratron readinga3. Run AFC calibration routinea4. Read water flow, temperature, exhaust How

°alinesal.Adiust valves so gauges read in SPECa5. Check od levelaS. Check puneoing speed. Tome To Pump

chanter down - shut on ballast vaNean. Run metal evaporatora6.Run electrical test place WFR on probe

station, lun programbl . Vent chanter using routinebi . Wear salety equipmentbl . Wipe chanter with (77777?)bl . Visual inspection of progress kittot . Punipdown chanterbl .Manually flow gauges & set pressureb2. Same as blto3.Remove Oringsbe. Use DV1A's, o'scopes & schematics to

troubleshoot systemb4,b5,b6, follow routinesIA Shut on pumps & clean saeens, & forekne

Knowledg Required

CORDISMTHuluEdtingbgrklay 2, 1990, 10 34 AN 0 1- Not Applicable

Basic Functions

Tachnician Task List

PROCESS: CHEMICAL VAPOR DEPOSiTION - CVD(continued)

Detailed Job Tasks Knowledge_ Raquked

a. Prepare chemicals & monitors for strippingIII. EngineeringA SPCB Identify equipment operaliontaselining

eqinpmerlC Find causes for out of control processesD TrainingE Prepare /present report

IV OtherA Stripping monitorsB Ordering spare parts

151Page 16 ol 48 CORD/SM T

HultiEdlingpgiMay 2. 1990, 10 34 AM

/ ,..4 "-

o = Nof AppikaimUseful

Basic Functions

I Observe safety precautionsA High voltage

RFC High vacuum

II OperationsA Check gauges, controllers13 Check gas flows, power, temperatureC Verily status of product mventoryD Load monitorsE Monitor process and respond kr alarmsF Record process variablesG Unload watersH Measure WTI qualityI Pertorm esual checksJ Determine d process is within tolerance

(sPec)K Record date on productL Make process correctionslA Follow flow chan

rage 17 of 40

Technician Task Ust

PROCESS: METALIZAT1ON

Detailed Job TasksAwarenessVolume, Pressure

Read, adiusl record values from meters,instrumentsRead, adiust record vatues from software ormechanicalReview inventory, strategize processetticienessAvoddoad; check suppliesinventoryReview, select, edit, recycle.handecassettes, transfer wafers, insert cassetteCheck instrument valves, read & recoidRecord KWH, cep time, argon N2, lbws,terrperatures, pressures, powerRemove CISSetle, (IMMO wafers, bad intocarrierEvaluate resistivity, performance, thickness,XRF & profilornetry, alloy ernlest mobile, orcontamination, particles, stressEvaluate grand size, defects, speculasity,COlOr

Not value on control chart, review VS spec,evaluate control chartRecord measummerd results in database,start/end timesAdjust by time, recipe parameters, minoradlusl Weir; convert new filesNody customer of incoming inventory,cornmuncale process discrepancies

Knowledge Reauired

CORDSMTHultrEdlingbgiMay 2. 1990, 10 34 AM

0 Nor Applicablefir if

Basic Functions

Ill MaintenanceA Power-up eledronicsB Reset controllersC. Regenerate pump-down curve (vacuum)

Evakate RGA values Of spectraE. Remove, clean, al, rebuild mechanical

wafer holdersF Vert vacuum chamberG Remove shields and targetsH. Clean chambers and shields

I Inst aN clean shiekls and target

J Remove, clean, inspect replace, reinstall'0*-rings

155page 18 of 40

Technician Task Ust

PROCESS: METAUZATION(continued)

Detailed Job Tasks

Turn breakers on check visual over is on tocontrollers, reset reboot computer irtslallfloppy disks, initialize SKM; verily vacuumconditionsCheck ternperature, status of pump, basepressure, yak* conliguratioNstalus, lumonCheck temperature. clean poppet' valve startcompressors, check temperature, openvalveSicontigurationRecord pressure over time internalSelect program, inilialize ???, verily valves,calculate partial pressures, make decisionChange coohng water ??? Overton/ @leansham, tools, record MMus and valves

Adjust vatves turn on N2removetscrews/shieWsitargetVacuum and dean, inspect cleanlinessMix chemicals. hula Prorlain. Positionshiekls, ??? clean program evahmteresistivey of wafers, dry shkeds, Inspedshields inveMory sharpInstal shieldsiscrews: Solvents, Cylinders.Flow Dynamics, OVM, MS* ol gauges,instruments

Inspect qualityPlace probes on target ???, lakemeasurement, ???ireporti???Remove shields, report K, re-insIall shields,report K

Knowledge Required

CORD/SMT

bgiMay 2, 1990, 10 34 AM

a/4

0 7. No4 Applicable

Basic Functions

K Check target short.lo-groundL Troubleshoot shootM. Calibrate RF generation and 20 KW

pOWer supplyN Check water handling, alignment.

cleanlinessO Rebuild, replace, reinstall valvesP Troubleshoot electronic corvirolling boardsO Trace electronic. pkimbing, vacuum

schematics, pneumaticsR Pertorm leak chockS Calibrate MFC (mass lbw control)T Keep maintenance bgU Calibrate heater controliersV. Perform chemical cleans on deposited

pansW Charge and qualify gas bottles, linesX Perform com)uter and system diagnosticsY. Check microswilches, relays, sensors,

IVs2 Coordinate supplier suppod, spare partsa Rebuild cathodes, recheckb Align chamberc. Check groundd. Check wafer resistivity

Calibrate pressure transducersI Operate vacuum manualy

IV I/MGM technician functionsA System rewalificationB Monitor CV plotsC. Monitor SPC controlsand adjust0. Measure resistivity

page 19 of 40


PROCESS: M§TAUZATION(continued)

Detailed Job TasksKnowledge Reoireg

CORDSM THull/Et:110gborMay 2. 1990, 10 34 AM

/

0 = Noi Applicable

I 5

Basic Functions

E. Analyze film composition, step coveragegroove(?) size, reflectivity

F Waste proceSs (Watson sPec:sG Adjust cathode magnets, and electnc

fieldsH Measure and evakiale electro. migrationI Mairgain relations with up and down-

stream process steps. Delermmecustomer needs. (Understandrequirements)

J Characterize, deline process tolerancesK Design perform, analyze. conclude, report

expenmentsI. Prepare, anatyze equipment ()gado/mance

reportsM Implement SPCN Generale troubleshooting guide0. Reduce defect densities, increase yield

V Other FunctionsA Train others

Prepare, present repoilsC Participate in Warn activities, mblem

solvingD Observe deanroom practicesE Monitor utility usage and spare part useF Participate in personal development

activities

page 20 of 40


PROCESS: METAUZA11ON(C01101ned)

Detailed Job Task, Knowledge Rooked

CORD/SM THuNiEdlingbcyMay 2, 1990. 10.34 AM 0 Not Applicable

1 GO

Basic FunctionsI. Observe safety precadions

A. High voftageB. RF

High vacuum

II OperafionsA. Checks status of pans(matenals)B. Determines poorthes

Verities etch systemfunctionality

Etches send ahead wafers

E Observe and control system operation

F Inspect waters at post etch

sage 21 of 40

Technician Task Ust

PROCESS: PLASMA ETCHING

Detailed Job TasksReviews product type and countReviews material inventory and requnementsReviews prior shift pass downsERSUres clean water boats

Reviews manufacturing specificationsReviews manufacturing schedulesEstablishes work priorities and schedulingVerifies chamber base pressurePerforms slow calibrationsPerforms peniaf pressure testPerforms particle testPedorms etch rate tesiEnter passive data from system lestprocedures into data base and determines Nsystem performance specdication has beenmetTakes *preprints action based on thesystem test results

Trouble shoots and corrects probeernsNotifies engineering Id...as indicated

Optically inspectTake appropriate actionVrlss proCeSS recipe1400110f lime So etch end)oint14nnitor shape of etch endpoint & curve' . ipond to systems alarms

Inspect wafers opticallyTake appropriate action

Knowledge Required

Basic plasma physicsBasic chemistryBasic math

CORD/SMTHuniEdlingbgfMay 2. 1990. 10:34 AA4 0 4" Nol APPOkable

Basic Functions

G Perform lot tracking

H Moves lot (physically)Ill Maintenance

A Clean work stationO Clean process chamber

C Condnions etch chamber

D Responds to system !allures

E Check cooling unit water level

E; 3

sage 22 ol 40

Technician Task Ust

PROCESS: PLASMA ETCHING(continued)

Detailed Job Tasks

Move WI on cometsEnter appropriate data and commentsMoves lot to next operation and locationWipedownVent etch chanterRemove chanter partsClean chamber pansInstal clean chanter partsClean chanterObserve safely regsloads waters and runs condaioning andseasoning recipesManipulate system using 'manual'commandsTrouble shoots

Knowledge Required

CORDSMTHuNiEdlingdigiMay 2, 1990. 10 34 AM

0 Not ApplicableI

Basic FunctiontI. Operations

A Optical I4m truckness measurements

B Thin lilm resistivity MeasuremenlsC Optical Critical Dimension MeasurementsO Scanning Electron

Microscope CriticalDimension Measurements

II Management ol Activities. Priorities

Ill MaintenanceA Periorm scheduled maintenanceB Trouble shoot & deternine problem

SOUrCeS

C. Repair problems

I 6 5

page 23 ol 40

Technician Task Ust

PROCESS: METROLOGY

Detailed Job TestiExecute program.Record dataLoad/unload watersEnter data info VaxAhgnment of patternsAS ABOVEAS ABOVEExecute programsRecord dataLoad/unload wafersEnter data into VaxAlignment of patternsOperation of S.E.M.Review manufacturing schedules, inventoryMake decisions on minutetominute, & hour-by-hour activities

Knowledge Required

Crimputer knowledge (General)Accurate transcription of resuNsN/AComputer knowledge (General)Microscope operatimAS ABOVEAS ABOVEGeneral computer knowledgeN/AGeneral computer knowledgeSEM Theory & operation

General computer knowledgeBasic industrial engineering knowledge

CORDISMTHuiliEdlong1,1.11/ l

3 2

3 2

3 2

3 2

0 Not ApplicableI Useful

. S .

Basic Functions

I. Observe safely precautionsA. High voltageB. Hazardous chemtalsC High pressure toxic gasesO. Vacuum systemsE Elevated leffperaturesF Facility evacuation proceckires

II OperatsonsA. Check status of turnace

Process gas supply2 Temperature zones

3 Robot and elevator

4 Upstream computer

B Checkstalus of metrology tools1 laser/light source2 Focusralignment

3 Control cornputer

C Check lot inventory1 Kan-ban.JIT WIP

2 Status on Process ControlConuter (COMETS)

O Check test wafer mei:doryE Check status of ()reclean tools

1(3Page 24 of 40

Technician Task Ust

PROCESS: OXIDAT1ON/DIFFUSION/IPCVD

Detailed Job Tasks

Monitor status ol gas cabinet, upstreamvalves, pressure gauges. mass flowcontrollers, exhausts, bumboxMonitor power dekvered to zones andcorresponding lenperature offsetsCheck autoprolde statusVerify stakes and coordinates

Monitor system statusVerily comrrunications channelsReboot compiler systemVerily laser/ligN source operation

Check system locus/alignment

Reboot computer systemChange hard disk cartridgesDetermine line status ard status ol inventoryqueues

Review lot status/historyReview factory communication messages

Refer to wei cleans tasks

BEST COPY AVAILABLE

Knowledge Required

ElectricityChemical safelyGas handling and safelyVaCtiuffl technologyBasic physics: healIndustrial safety

Basic physics: Flow, pressure. ternperature.combustion, heat, kinetic energy

Bast physics: Temperature, heat conduction,convection, radiation, Joule Heattn9. Ohm'sLaw, thermoelectric etteuBasic computer operationAnalytic geometry, Cartesian coordinatesBasic computer operationAbility lo understand complex systems

Basic physics: Optics

Basic physics. OptiosGeometryBasic computer operation

Elements of industrial engineenngElements of production managementBasic economicsBasic computer operationUnderstanding of Electronic Mail and WordProcessing

CORD/SMTHOYE dingbg/May 2. 1990. 10 34 AM Nof Applicable

I II, nI..11

Basic Functions

F. Review process conirol charts

G Delermine day's prionliesIi Adiust and/or lest toolsI Log in operation in Process Control

Computer (COMETS)


PROCESS: OXIDATION/DIFFUSION/LPCVD(=aimed)

Detailed Job Tasks

Access SPC chartsidentify oulbf-conlrol conditions

J Perform ()reclean operationK Load material handlerL Download process recce from upslream

computer (APEX)

k4 Begin process runN Mon4or runO Unload malarial handlerP Perform Metrology operationO Enler data and log out operation in

COMETSR Move lots lo proper position in lab lacifity

III Process troubleshooting/processimprovement

A Design arKI perform experimenls toisolate process problems

B Design arKI perform experimenls toimprove process capabikly anclioroperalions elliciency

page 25 ot 40

Operate machinePerform subsei of Basic PM'sOperate VAX terminal

Reler to wei ciean tasksOperate machineOperate Apollo workstationInitiate data communication between APEXand furnacesOperate machineOperate machine

Operate machineOperate VAX terminal

Observe deviations horn normal machinebehaviorDesign and run expenmenlsDocument process problem remedies

Observe deficiencies I n process OfequipmentObserve deficiencies in operationalproceduresDesign and run expenmertsDocument inprovements

3EST COPY AVAILABLE

)(powledge Required

Statistical process controlBasic probability and statisticsBasic economicsMachine operationSee under 'Maintenance-Basic computer operationUnderstanding of process shop 1100(01:M1:U1Wsystem


Machine operationMachine operation


PIOCOSS physics and chcaistryElectromechanical instnimentationExperimental design

Process physics and chemistryExperimental design

CORDISMTHuli/Edlingbp/May 2, 1990, 10 34 AM 0 r_ Not Applicable

Act Functions

IV Equipment maintenanceA Preventive maintenance

Marinate change2 Ouaitzware clearvinspect3 Vac system disassembly andassembly4 Pump oil and filter change5 Helium teak check

6 Pyro torch assembly

7 Termocouple adjustment

8 Generate lest recipes


PROCESS: OXIDATION/DIFFUSION/LPCVDCcominuecs

Detailed Job Tatks

System rebuild

9 Change PEIr3, TMB, and TEOSAnpules

10 Service burn box

B System repair1 Vac system troubleshooting

2 Gas jungle houbleshooting

3 MiCSOCOillfolef troubleshooting4 Upstream computertroubleshooting

page a of 46

Operate chemical quartz cleanersSystem rebuild

Operate helium teak detector

Rebuild pyro torch assembly

Adjust position, connectors, reference circuits

Apoffo workstahon operation

Rebuild, refill, and lest liquid source deliverysystems

Clean and rebuild hydrogen burn box

j(nowledgeiteguited

Vacuum technologyUse of hand tools

Basic chemistryVacuum technologyUse of hand toolsVacuum technologyVacuum technologyBasic electronicsGas handlingBasic electricityBasic chemistry: combustion, StoichtmetryElectricity, physics: Thermoelectric effectProperties of matenals. metals and alloysComptAer operationDetailed understanding ot process chemistryand physicsVacuum technologyElectricityGas haMingGas handlingElectricityBasic chemistry: combustion, StoichamehyVacuum technologyElectronics (Power and Analog)Mechanical systems

FEVIrlacuutdrinflumenitc:77gy

Elecuonics (MicroproGessors)Computer operationElectronics (Digeal)

CORD/SM THult/EdlingbgiMay 2. 1990, 10 34 AM

47citt hi

0 = No1 ApplicableUseful

Basic Functions

Technician Task Ust

PROCESS: OXIDATION/DIFFUSION/LPCVD(conueuxa

Detailed Job Tasks

S. Furnace power electronicstroubleshooting6 Main system power distributionand UPS troubleshootiria7 tiO module, alarm processor,gas module, and torch controltroubleshooting8 temperature module and tempcontrol circuitry troubleshooting9 Liqukl source delivery sys1emtroubleshooting

10 Spare pads coordination11. Documentation of repairactivities

V Engineering supportA Organize, run, and evaluate experimentsB. Update and document process recjoesC. Update process and makeenance specsO Monitor and report on technical aspects of

operationVI. Trainina (SO and Others)

A. Ideredy eckicahonal needs and lacecourseWask questions

B. Learn by doing: Experimer4C. Teach what you know lo your fellow

workersVII Meetings, reporting, and other group

activities

rage 27 of 40

Knowledge Required

Heal transferElectronics (Power)Electricity (Facility)Electronics (Power)Electronics (Analog and Digital)

Heal transferElectronics (Power and Analog)Fluid dynamicsGas handingVacuum technologyElectronicsElectronic Mail and Word Processing

AIolalove

Al of aboveAI 134 above

All of above

CORDiSMTHull/El:HungbgiMay 2, 1990, 10 34 AM 0 Not Applicable

Usefui

Besic Funsgmat

I OperationsA. Check status of pans (malenals)

inventoryB Deleimines day's priority

C Performs daily process checks onequipment tor normal operarion

0 Chemical safely and handling

E Operate pre-dittusion cleaning equipment

175rage 28 or 40


PROCESS: WAFER CLEANINg

Wailed Job TasksReviews product typeReviews materials inventory andrequiremeNsReviews specificationReviews manufacturing schedulesEstabkshes work primly and scheduling

Reviews manufacturing specsPeriO4MS daily particle and eich rale rests onappropriate process tanksPedorms bath bring-up operations asspecified on process insiructionsManually/automatically tilling chemical tanksand cannisters

Load/run cleaning equipmentUnderstand chemestry/recipe ol operationUnderstand 'delay-lime betweenfurnace/pre-clean operationsUnderstand chemk:al NI system lo equipmentAble to l'roubleshoot (snipes) any equipmentproblemFul understanding of process low(COMETS) system

Knowledae Required

Needs to know how to use inventory control tolook ahead and group lots of similar typeNeeds to know critical delay times betweenprocesses in order lo prioritize processingcheck ecaripment status for any repairs oradjustments communicass with previous shinlOf passdown of intormationIs certified lo run operationsAble to use meirology equipments (paniclescounters, lin thickness measurementequipmeres)

Must possess lull knowledge of chemicalhandling and saltilySafety gear must be worn al al limes ckmngchemical handlingFull knowledge of SEMATECH safety numberand shower positioningBe certified on equipment operationUnderstand chemical safety and handlinginvolved with equironentAble to klentily/correctProcess problems related to ihe ciemesiryinvolved

CORD/SPATfiull/Edlingbg/May 2. 1990. 10 34 AM

aff hif?k

0 r Nog ApplkableI I PCP11.1

Basic Functions

II MaintenanceA. Calibrate and/or adiust water cleaning

equipment

Perform preventrve maintenance

C Troubleshoot and repair equipment

D Training

F Operate automatic photoresiststricpingtwat etch equipment

177Page 29 of 40



Detailed Job Tasks Knowledgellsgaigg

Calibrate/WWI temperature controller Use of strobe. volume and weight

Calibrate Dow C0fIlf011913 measurementsCaMxate motor speed COnfrollerAdiusl door seals/lidsCalibrate transducersPedorm other wet bench/spray processoradiustmentsAdjust robot armFiner changesChange/replace plumbing componentsCheck tor leaksCheck tor mechanical wearCheck freon content of refrigeration 'IndChange process controllersCalibrate/adjust lbw corerollersCheck operation of pkinibing componentsRepair electrical components ol equipmentRepair pneumatic/electrical pumpsLayout training materials and steps for othersExplain functions lo othersLoadirun equipmentUnderstand chernistrynecipe of operationUnderstand manual sink/automated sinkoperationPedorm daily process checks (particles/etchrates)Understanding of process flow systemFut awareness ot chemical handlinWsafelySolve simple operation/process roblemsassociated with enuipment corrponent:lobot

Chemical safelyKnowledge of flow process controlCertification on piece of equivnent

CORD/SMTHuovE dlIngbcyMay 2, 1990, 10 34 AM

= No1 APPIkable

Basic Functions

I OperationsA. Water cross section

How a FE T operates2 Process lbw3 What the process does4 Masking !aims (oxidies,nitrates)-- 5 Masking with photo resist6 Implant damage7 Channeling and twist anglesand charging8 Anneal and activation

8 SafelyAcds and solvents

2 Gasses3 High voltage4 Radiation5 Alarm system and evacuationroutes

Maintaining Tenon boat integrityC Water handing

Automatic flat finder2 MGI water transfer3 Vacuum pick-up techniwes4. Clean dkty boat or box5 Clean wodi mationkm 'ant specific COMETS bgging

Updown protocol

v3ge 30 ol 40

Technician Task Ust

PROCESS: IMPLANT

Detailed Job TasksI. Safety

M.S. has completed introductory safety class(given In orientation)M.S has compteled radiation awarenessclassM.S. understands acid and solvent relatedsafety issues (M.S. is able to recognize acidlines, salety cabinet, litmus paper, salelyshower and shower rinse lime, reactions ofacids and solvents, and applications of

rmecific acids and solvents.)M S u Jar stand inplant specific gas relatedsalety issues (M.S. is able to recognizeimplant specific hazardous gases and thedarxiers of each gas, and knows the locationof the gas boxes on each machine.)M.S. understands high voltage related safelyissues (M.S. is able to point oul high win%areas of each piece of equipment andwawa related safety precautions)kl 1. understands radiation related safelyissues (M.S. is abie to point out "hot spots'on the equipment and can demonstrateradiation awareness)U.S t;nderstands evacuation procedures(IA S. is able to lollow evacuation rovies fromboth of the implant saiviCe aisles as well asthe implant bay. U.S. mist also know how toread the Fab layout arid follow evacuationroutes tor other bays)

It General Fab ProcedureM S knows how to clean a dirty bok or dutyboat

Krxre.w421_91 gyintst

CORD/SM THull/EalingbgiMay 2, 1990. 10 34 AM

la14

o

o Nol Applicableiiraona


PROCESS: MAE(canon/Ns

Basic Functions Datalled_Job Tasks Knowledge Require4

PA.S. understands and practices the =redprocedure lot cleaning a work stationM S. understands the importance of, andpractices the following wale; ;landingtechniques:

1. Uses the wafer NIL MGI Automatic-Transfer, and MGI Automatic Flat Finderr.4

when handling boats ol wafers.2 Uses correct vacuum pock-up

techniques3. Does not lean over waters4 Does not cross over wafers with body

pans5 Uses correct boat handling techniques6. Can correctly place wafers in a boat7 Can correctly place a wafer in a single

wafer carrierIII Metrobgy Equipmere

M.S. can successtutty load a desiredprogram onto the Suctscan 5000M.S. can operate Surlscan 5000 in manual orcapture collectk)n modesM S knows the correct nomenclature tortaking measurements on the RS 50:e ane theThermaprobe 3000M S can select and USe correct tiles andprograms for Me RS 50/e and Thermaixobe300M S knows control limits and frequency ofmeasurement ol the calibration wafers on the

1 1 RS 50/e and Thermaprobe 3u0S can recaN any data point m any RS 50/e

Page 3i of 40

BEST COPY AVAILABLECOR D/SM THuIVEdlingbniMay 2, 1990, 10 34 AM

0 ttor ApplkableIA .st.

Basic Functions

Technician Task Ust


Detailed Job Taski EnntisdatIniflutil

or Themeprobe 300 programM.S. can lecogniza and delete false datapoints on the Thennaprobe 300 and RS 50/eki S can bring up Thermaprobe 300 from apower oft condition

60 M S . can change Themiaprobe 300 Nght

4-4bulbM S can recover a walef from theThermal:Kobe 300PA S can back-up Thermaprobe system anddata tapes

IV. COMETS Logging11 S. can view the status of any entity in theimplant bayM.S. can view any given spec on COMETS1.4 S. can correctly and accurately log anyomen event lor an entity in the implant bayM S. can view inventory of prcduction anddetermine processing for each lotU. can pedorm conlimous process loggingM S. knows the relationship betweenCOMETS bgfainp and E10-89

V R .T.A.14.S can verily and edit the currect avian'recipeM.S. can verily and edit the RTS manualsettingsM.S. knows the correct wafer flat odentationin the boatM S. can 4XfreCtty load and unbad watersM.S knows what type ol boat Is to be usedon the RTA

page 32 ot 40CORD/SMTIWO/ExilingbcyMay 2. 1990, 10 34 AM

/

0 r Not ApplicaOkaI

Basic Functions

sage 33 ol 40

Technician Task Ust

PROCESS: RAPLANT(cOntinued)


M.S knows why the dummy wafer is loaded ilf/fitin each cassette iM S knows the correct annealing d latemperature for the implant anneal recipe

VI. Laser ScribeM S. can perlorm long- and short-lermshutdowns on the laser sob*M S. can stad the laser subs from long- andsholl-term shutdown conditionsM S can explain and pedorm scribingprocedures on implant monitor wafersM S. can correctly bad and unload wafersfromthe RS 50, Sudscan 5000 andThermaprobe 300M S. can verily RS 50/e probe 1.0.,successiully change probe head, andperform probe condilbningM.S. has completed S.P.C. classM.S. can generale S.P.C. charts for thePrometrix Rs 50/e and IN Thermaprobe 300

VII. Infant Process FlowM S. knows implant process now, includingsteps, species, resist sift* and approximatepolesf44 S. knows usable particle MONO( reject

M.S. knows what to do with particle monitorsexceeding usable panicle mondor lirnesM.S. knows what type of wafers are to be 1 ;used as particle monitorsM S. knows what to do wilh monitors lorreclaim

CORDSM THulkEdlingbwMay 2. 1990. 10 34 AM 0 Nol Applicable

Basic Functions


PROCESS: MILNE((continued)

Detailed Job Taskl Xnowledge Required

M.S. knows what type of mon:Ior is used tor SafetyIC manufacturingeach knplant lest

M.S. knows the frequency and speaticalions SPD.s-, for monitoring implanl utddy wafers Data entry0M 0 knows response protocol lor OW 044.n

control monitors

Page 34 of 40 CORD/SW 0 r_ Not ApplIcable

Basic Functions

I. OperationsA Implanter technical overview

Vacuum technologya Roughing pumps

Cryo pumpsDelusion pumps

cr% d Turbo pumpsHCIG s, T C gauges,

and other vacuum measurement devices2 Introduction to Me sourcechambers

a Ionization and howradiation is created

ARC charriber functionsSource magnetExtraction electrodeBeam steering and

locusingI. Electron suppression

3 Infroduchon to thebeamlinetnipti tube

a. AMU and anatyzermagnet

b. Post acceleratoreledrodes

Beam focusingBeam blow-up

4 Introduction lo tile processchamber

1 S

a Faradays andsuppiession

Electron showers

page 35 ol 40



EletallecLiob Tasks Knowledge Required

CORD/SMHuIliEcIfing

Basic Functions



Detailed Job Taskq Knowledge Required

U.S. knows Me wed set-up sequence andixoce.ckees (refer tO VIC:63111 5.0, 6.0 and 9.0of spec IMPP0004)M.S. knows how to correctly set-up and tuneeach impiant (refer to sections 5.0, 6.0 and-9 0)s4

sage 37 ol 40

M S. can correctly subme, load, unload andreIneve waters Irom the irriplanterPA S can retrieve data from any givenprevious implantM S. can verily, bad and write a recipeM S. knows correct proceclures tor shuttingdown the implanter (long and short term)PA S can explain the lollowing NV2OAfunctions (refer lo figures 2A and 28):

A. NV20A sourceB. Exit WW1 electrons and axes steeringC. Guadrapole lensD. Resolving SLITE. P.A. electrode assemblyF. Flag FaradayG. Electron shower

M.S. can explain the blowing PI9200functions (refer lo figures lA and 18):

A. Freeman sourceB. Extraction electrode and extraction

electrode alignmentC. VanesD. SternerE. Mass reSolving systemF. P A. electrode asseinblyG Flood gun 1 ( ) ()

;

CORDISMT0 z Not Applical31.

bcyMay 2, 1990 10 34 AM

Basic Functions

Page 38 0140


PROCESS: IMELAFAT(continued)

Detailed Job Tasks

H. Charge monitorI. Beam prohhog

Knowledge Required

CORD/SMTFlue/El:Ming

4

0 z Noi ApplicableUseful

2 knpoitanl

Basic Functions

3 Viewing operation andequipment status4 Continuous process logging5 Viewing S 0 C. data

E Metrology equiment1 Thermawave Therrnaprobe 300%e l

a Technical OveiVIOWb Operationsc. Process flow

2 Prometlix Omnimap R5504a Technical overviewb Open lions

Process flow3. Tencor sudscan 5000

a. Technical overviewOperations

c. Process lbwF RIP 's

1 Peaka. Techriical OverViewb. Operationsc. Process how

2. A G.a. Technical overviewb. OperationsC. Process flow

G laser scribe1. Technical oveiview2 Operations3 Process tkriv

H Inplanl monitor flowParticle monitors

1page 3901 40



Detailed Job Tasks gnowledge Required

COFIDSMI

,-, i nnn 14 A1,4

0 r. Not ApplicableI Useful

Basic Functions

2. linplant monitors3 Corrective actkin response

I Implant process flow1 Phase 1 implants

a StepsIN)

b. SpeciesDosesResist strips

page 40 01 40


PROCESS: IMPLANT(commie)

Detailed Job Tasks Anowledgs Required

CORD/SMT 0 :: Not Applicable

APPENDIX E

Industry SurveyResponsesSummary

121

1 :3;)

NAME:COMPANY:

ATTACHMENT: Technician Training Questionnaire(For SEMATECH Member Companies ONLY)

(1) What is your company-wide technician profile by job function (i.e.,operator, process, device, equipment, test, facilities, integration, other)?

- define present status vs. future needs (with demographics).

(2) Provide an overview of your company's current technician training.

(3) What training resources/aides do you currently utilize?

(4) What type of career pathing is comprehended in the training profile?

(5) What is your company's vision for future technician training programs?

(6) What are the characteristics of a "world class" technician trainingprogram?

(7) What does your company want the educational institutions to do foryou, both presently and in the future?

123

Industry Survey Responses

October 9-10, 1990

The concept of expanding operator training and capability to encompassother tasks is gaining support in the semiconductor manufacturing industry.Jobs such as quality control, routine maintenance, process adjustments andmonitoring and efforts to enhance yields are increasingly added to the routineoperator functions of product movement and machine operation.

These enhanced operator functions result in job titles such as manufacturingtechnician pr production technician. These changes do not eliminate theneed for maintenance or specialized technicians, who have much moretraining in electronics and equipment repair skills and are capable of dealingwith equipment and process problems beyond the capability of themanufacturing technician.

At the industry-wide training workshop held at SEMATECH on October 9 and10, 1990, industry representatives submitted written responses to varioussurvey questions regarding the evolving industry needs.

7ollowing is a collection of responses quoted from the survey that relates tothe evolving role of operators in relation to broader functions: (Underlininghas been added to point out relevant items.)

Advanced Micro Devices

Future implications: there will be a growing number of Manufacturingtechnicians with a broader skill base. Operators will be moving intotechnicians roles with added res onsibili for minor maintenance andprocess engineering tasks.

5. What is your company's vision for future technician training?

Our vision is that operators will be replaced by technicians whichrequires a broader skill base. To get there we will have to doextensi-e training utilizing both external and internal resources. Inaddition, team based groups will evolve with the responsibility ofupgrading the skills of the team to match the requirements of thework.

6. What are the characteristins of a world class technician trainingprogram?

Sound basic knowledge and skills in Math, Chemistry, Physics andCommunication including reading, writing, and speaking skills. Agrounding in troubleshooting, SPC and statistics with a combination ofvendor training, skill training on line, job rotation, and classroomtraining developed internally. In addition, specific skill training at thetask level. There will be continuous cross training and trr 'ning thatexpands ones education level. On average 4 hours per week spent intraining.

IBM

Future Needs

In the future we expect a higher percentage of production technicians anda reduction of production operators, with slight reductions in the othercategories. This is being driven as we move toward making theproduction function self-sufficient for all day to day activities required toget product out the door. This also suggests higher education levels forthis category. Since any new hires typically have a two year technicaldegree, all categories should also see Ovrovernents in educational level.

Finally, as IBM focuses on improved efficiencies, jobs have beenreorganized and employees have been given more responsibility whichrequires significant skill upgrade. One such group that has been affectedare production employees. A total revamp of the jobs and career pathshas taken place. The 'obs have been redesigned to include not onlyproduction responsibilities but also the traditionai support tasks such as

ual' rnairg_awce E_LiggVgIsafe and lo istics.

5. What is your company's vision for future technician training programs?

Ideall future techni6an needs will be sourced throu h the roductionfunction. Selection tests are being developed for production employeeswhich not only test for basic education, but aiso for job related skills, suchas attention to detail, decision making, and motivation. This improvedselection, coupled with the skill based hierarchy will make this group idealcandidates to source other location technician needs.

Micron

I. Technician profile by job function

Technicians (Misc. Process)80% promoted from operator20% hired external sources

Equipment Support Tech20% promoted from operator80% hired with tech degree

Bench Tech10% promoted from operator90% hired with tech degree

Engineering Technician (Process)80% promoted from ES and Bench Tech20% hired from external sources

IV. Career Paths Available

Operator--Set-up TechAssistant TechTechnicianEngineering Tech---Engineer

Operator---Process Tech---Process Engineer

Operator---Bench TechEquipment Support Tech---EquipmentEngineer

Technician--LeadSupeMsorMi...nager

VI. World Class Technician Training Program

Program which:

1. Is designed to solve performance problems of currenttechnicians

2. Prepwas current operators for advancement to technician3. Is business and customer driven4. Uses the most cost effective and efficient training methods5. Is evaluated by changes in work performance

2t 3126

VII. Contributions of Educational Institutions

Currently:

1. Good working relationship2. Eager to hear of industry needs, but often limited in resources

and flexibility3. Provide standard AA program for current employees4. Provide applicants who meet hiring standards5. Share curriculum information6. Provide instruction for short-term specialized classes

Desired:

1. More offerings in semiconductor-specific courses2. More flexibility in scheduling - meet shift needs3. More depth in knowledge of instructors of semiconductor field4. More short-term specialized classes brought on-line quickly5. Vision in finding new ways to provide instruction

Harris

Process Engineering Technicians: LevelsProcess Engineering Technician 34Sr. Process Engineering Technician 35Process Engineering Specialist 36

The Process Engineering Technician job class family is predominantlycomprised of employees that were promoted from the operator job classfamily based on their performance, job skills, and willingness to learn newskills with more responsibility. A two year degree is preferred but notrequired.

Quality Technicians: LevelsQuality Technician 35Sr. Quality Technician 36

The Quality Technician job family is comprised primarily of employees thatwere promoted from the oeilator job family based on their lob

performance and knowledge or hired in as a Technician because ofexperierfcs-and/or education (two year degree). Experienced operatorscan be omoted into the Quality Technician job farnil without a two eardegree.

Production SpecialistProduction SpecialistSr. Production SpecialistSr. Production Specialist (Ill)

Levels343536

The Production Specialist job family requires a two year degree inelectronics or equivalent. Progression within this job family is based onjob performance, years of experience, skill level, and ability to learn morecomplex tasks with varying degrees of increased responsibility. The jobfamily is intended for employees that are multi functional in a broad rangeof manufacturing activities. Employees in, this job family will be trained asan operator in manufacturing (i.e., align, etch, test, thin film, etc.) as wellas in the technical areas such as Equipment Maintenance, ProcessEngineering, and support activities. This job will become prsdominatethroughout manufacturing as we progress to self-directed work teams.The intent of this job family is to involve more employees in a wider rangeof activities with increased responsibility.

For an example, at one plant location we are moving from the Operatorjob class (Wafer Processors, Testers, Assemblers, Quality Inspectors) tothat of a Production Specialist. The Production Specialist category willre resent em lo ees that osses a two ear de ree reform operationalduties and some of the first echelon duties of the EquipmentMaintenance, Process and Engineering Support technicians. TheProduction Specialist job function will represent employees that are multi-skilled, multi-faceted, arid members of self directed work teams.

6. What are the characteristics of a "world-class" technician trainingprogram?

The characteristics of a "world-class" technician training program wouldprovide the skill and knowledge to achieve total asset productivity.Technicians would operate, maintain (equipment maintenance), and utilizemanufacturing tools and processes at a level for which they weredesigned at a zero failure rate. Training would address the technical,academic, administrative, team building, and operational skills needed toprovide a well rounded program.

128 2 r

The CORD/SEMATECH project addresses the evolving role of the enhancedoperator and does not necessarily cover the more equipment-orientatedtechnicians.

21 (;129

APPENDIX F

Boise State UniversityTransformations

Course Descriptions

131 207

TRANSFORMATIONS at BOISE STATE UNIVERSITY

Sponsor US Department of Education through SEMITECH

Training provider Boise State University, Boise, Idaho

Participants 19 workers employed by MICRON--a semiconductormanufacturer

Attended training 3 hours per day, 4 days a week, 26 weeks

Received form MICRON 1.5 hours paid release time 4 days aweek to attend training

Contributed 1.5 hours of personal time 4 days a week forclass attendance plus study time

Worked 12 hour shifts--3 days "on", 3 "off"

Most worked overtime, several were "on-calln

Curriculum Adaptation of Transformations model--300 contact hours

Applied Mathematics

Principles of Technology

Graphics for Technicians

Mechanical Devices and SystemsFluid Power

Keyboard skills

Introduction to WordPerfect

Communications

Introduction to Chemistry

133

2 ( S

Transformations Course Descriptions

Pre Tech Curriculum

Pre Tech provides refresher courses in math and communication, introduces stulents to theuse of personal computers, gives the students a basic understanding of drawings commonly used bytechnicians, provides fundamental knowledge and skills used in working with mechanical devices, andgives students the type of background in physics needed by workers who operate, maintain and repairequipment that incorporates interactive systems. Pre Tech helps orient students to the learningenvironment while providing basic skills they will use throughout the rebnaining curriculum and in futuretechnical employment.

Applied Mathematics makes math subjects relevant by showing how compatation and analyticskills are used in the workplace, and by teaching problem-solving through hands-on, activity-centered environments. Topics include "Using Ratios and Proportions," "Working withStestics," "Working with Scale Drawings," using a calculator and other subjects encounteredin business/ind'strial workplace settings.

Applied Communication helps students improve their reading, writing, listening, speaking,problem-solving, visual, and nonverbal skills, and transfer these skills to both their occupationaland personal lives.

Use of Personal Computers introduces the student to computer terminology and use of"canned" software such as word processing and spreadsheet programs.

The Technical Graphics course teaches students how to develop and interpret technicalsketches, and covers the use of line-types, multiview drawings, dimensioning and tolerancepractices. The course also includes an introduction to computer-aided drafting and shows howcomputers are used to help make drawings of mechanical parts, buildings, and electroniccircuits.

Subjects presented in Mechanical Devices and Systems include different types of flrivemechanisms such as belts, chains and gears. The course also teaches about actuators suchas mechanical linkages and cam systems. Hands-on labs show: techniques for calculatingchain and belt lenyth; measurement and adjustment of backlash between gear teeth; installationprocedures for seals and bearings; practices for working with aerobic and anaerobic sealants;and the use of precision measuring equipment such as a dial caliper and a dial indicator.

Principles of Technology 1 (PT) shows how physics concepts are used in mechanical,electrical, fluid and thermal systemssystems commonly encountered in contemporarytechnical employment. The physics concepts include Force, Work, Rate, Resistance, Energy,and Power. Each concept is reinforced through the use of hands-on learning, videotapes, mathlabs and hardware labs.

Tech Core Curriculum

The Tech Core helps students develop a basic understanding of scientific principles underlyingtechnology. The Tech Core provides students the opportunity to develop fundamental skills in the areasof electricity/electronics, fluid power, and quality controVstatistical process control. The knowledge and skillsdeveloped in the Tech Core are commonly used in a variety of technical occupations.

Principles of Technology 2, a continuation of PT 1, also shows how physics concepts areused in mechanical electrical, fluid and thermal systems. The physics concepts studied hereinclude Force Transformers, Waves and Vibrations, Energy Convertors, andTransducersconcepts commonly encountered in technical equipment. Again, each concept isreinforced through the use of hands-on learning, videotapes, math labs and hardware labs.

134

2N)

Fluid Power Systems covers common hydraulic and pneumatic systems and common types ofpumps, 'xintlol valves, pressure-control devices, flow regulators, cylinders and motors.Discussion of hoses, tubings and fittings is also presented. Hands-on labs emphasize the useof test devices such as a pressure gauge and a flowmeter to diagnose system faults.

The Electricity/Electronics course is focused on voltage, current, resistance, Ohm's law,series and parallel circuits, capacitance, inductance, and the basic operation of solid-statedevices. Hands-on labs include instruction in test equipment such as volt-ohm-milliammeters,oscilloscopes, and signal genc-dtors. AC and DC circuits are assembled and tested.

Quality Control is an inspection methods course. Hands-on labs give practice in using all ofthe commonly used inspection instruments. Within the course, tolerance limits and tolerancesystems are related to the inspection methods.

Tech Specialty CURICuluril

Tech Specialty provides students the opportunity to develop specialized employment skills bytaking selected course work in a specific area of technology. Tech Specialty is a flexible component ofthe retraining curriculum that can be modified to address job-specific training or general employmentopportunities in the Saginaw region. The following describes examples of Tech Specialty training areas.

CNC is focused on the fundamentals of Computer Numerical Control operations andterminology. Common program formats are presented. In hands-on labs, CNC machines areset up and operated.

0/4/0C provides instruction on quality control inspection methods and the relationship of quality.control to production, inspection and engineering. Instruction includes discussion ot frequencydistribution, sampling, average and standard deviation. Quality control techniques aredemonstrated and practiced in hands-on labs. Computer data are presented and problemsfocused on quality control statistical analysis are solved. The organization of quality controldepartments, the role of the technician in quality control and the implementation of basic qualityconieol methods are discussed.

Plastic injection Molding Technology Tech Specialty curriculum gives students acombination of classroom and hands-on experience in the setup and operation of plasticsinjection molding equipment. Students learn about the characteristics of various types ofthermoplastic materials including polystyrene, polyethylene, nylon, acrylic and Teflon. Thestudents also learn about the structure of thermoplastic materials and the effect of structure onpolymerization. Through hands-on lab work, the students gain knowledge and skills in thesetup, operation, and fault correction of plastic iniection molding equipment.

Electronic Systems is a Tech Specialty curriculum that prepares workers for entry-levelpositions in electronics manufacturing environments and telecommunications. This curriculumbuilds on concepts learned in Principles of Technology and the Tech Core course, Introductionto ElectlicitylEfectronics. The Electronic Systems curriculum places emphasis on theinstallation, operation, and use of electrical and electronic apparatus common to industrial andcommercial applications. Students in the curriculum learn about technical concepts involvingsolid-state devices, rotating machinery, and programmable logic controllers. They also gainknowledge and skills in working with integrated circuits.

The Metal Blanking Tech Specialty curriculum for the large sheet-metal-panel industry givesstudents technical knowledge and skills commonly used in sheet-metal forming operations.Students learn about some of the classifications of sheet metal, physical properties of sheetmetalfiardness, toughness, ductilityand chemical properties of metal. Students learn aboutthe construction and terminology associated with stamping dies and stamping operations.Through hands-on lab work, the students gain knowledge and skil!s in the setup and operationof metal blanking equipment.

135 2 1

APPENDIX G

Boise State UniversityTransformations

Demographics and Schedule

137 211

Class Demographic

GenderMale Female

17 2

Age<18 18-22 23-29 30-39 40+

3 5 4 4

RaceWhite Black Hispanic Asian Other

16 1 2

Educational Attainment<12th grade 12 yrs. 13-15 yrs. 16 years or more

11 3 1

Educational or Vocational GoalJob Placement Job Promotion Vocational Certification

8

High School Diploma or GED College Credit1

AAS degree BS degree8 1

138212

DAYS:TIME:TOTAL WEEKS:TOTAL HOURS:BEGINNING DATE:ENDING DATE:

COURSES:

"TECH PREP"

SCHEDULE2/22/91

MONDAY THROUGH THURSDAY5:00 PM TO 8:30 PM22301.5MARCH 4, 1991AUGUST 5, 1991

APPLIED MATHTOTAL HOURS: 42 (60)TOTAL CLASSES: 12 DAYS: M/Th

TIME: 5-8:30pmDATES: 3/4 TO 4/11

INSTRUCTOR: FRED BAKERROOM #: MT109

GRAPHICSTOTAL HOURS: 31.5 (40)TOTAL CLASSES: 9 DAYS: T

TIME: 5-8:30PMDATES: 3/5 TO 4/30

INSTRUCTOR: REED SHINNROOM #: MT109

PERSONAL COMPUTERS(10 HRS. KEYBOARDING, 10 HRS. INTRO TOMICROCOMPUTERS, 10 HRS. WORD PERFECT)TOTAL HOURS: 30 (40)TOTAL CLASSES: 15 DAYS: W

DATES: 3/6 TO 5/1DAYS: M/WDATES: 5/6 TO 5/22TIME: 5-7PM

INSTRUCTOR: SUSAN JOHNSON &JEANINE BRINKERHOFF

ROOM #: TE 219

APPLIED COMMUNICATIONSTOTAL HOURS: 19.5 (20)TOTAL CLASSES: 13 DAYS: W

DATES: 3/6DAYS: M/WDATES: 5/6TIME: 7-8

INSTRUCTOR: DARRO ANN PRESTRIDGEROOM #: MT109

139

213

TO 5/1

TO 5/15:30PM

MECHANICAL DEVICESTOTAL HOURS: 21 (20)TOTAL CLASSES: 6

INSTRUCTOR: BOB ALLENROOM #: V119

DAYS: M/THTIME: 5-8:30PMDATES: 4/15 TO 5/2

FUNDAMENTALS OF FLUID POWERTOTAL HOURS: 28 (30)TOTAL CLASSES: 8 DAYS: T/TH


INSTRUCTOR: BOB ALLENROOM #: V119

PRINCIPLES OF TECHNOLOGY ITOTAL HOURS: 49 (60)TOTAL CLASSES: 14 DAYS: M/W/TH


INSTRUCTOR: ED LONSDALEROOM #: TB105 & TB107

CHEMISTRYTOTAL HOURS: 31.5TOTAL CLASSES: 9

INSTRUCTOR: MARK PURDYROOM #: TB105

DAYS: TTIME: 5-8:30PMDATES: 6/4 TO 7/30

PRINCIPLES OF TECHNOLOGY IITOTAL HOURS: 49 (60)TOTAL CLASSES: 14 DAYS: M/W/TH


INSTRUCTOR: ED LONSDALEROOM #: TB105 & TB107

APPENDIX H

The Texas State Technical College at WacoSemiconductor Manufacturing Technology

Outlines (9) Specialty Course

215141

COURSE SYLLABUS

TITLE: SEMICONDUCTOR PROCESS I

NUMBER: SMT103

LECTURE: 3 LABORATORY: 4 CREDIT: 4

PREREQUISITE: NONE

PREPARED BY:

APPROVED BY:

DATE:

SMT 103

THIS SYLLABUS HAS BEEN REVIEWED AND IS CURRENT ON THE DATE INDICATED

REVIEWED BY: DATE:

I. COURSE DESCRIPTION: (catalog description)An introduction to Semiconductor Manufacturing Processes for

the integrated circuit industry. This course will provide.the basicundorstanding of materials, processes and equipment used in a waferFabrication facility. Emphasis will be the total procAss in lecturewhere the laboratory will urdertake the safety, handling, and basicprocess in step by step activities to produce a Solar Cell. This coursewill only process with limited hazardous materials required.

II. COURSE OBJECTIVES:This course is intended to introduce the student to the various

process used in the fabrication of semconductor wafers. The student willbe taught the characteristics of the materials, processes and equiPmentused in the *abrication, laboratory safety, material handling, chemicalhandling, and step by step process for production of Solar Cells.

Upon completion of this course, the student will be expected todemonstrate competency in these areas:

A) Define terms applicable to Semiconductor Manufacture with aworking vocabulary of equipment, process, and procedure.

8) Demonstrate an understanding of the materials used in themanufacture of semiconductor devices.

C) Demonstrate an understanding of the applications andlimitations of the materials used in semiconductor manufacture.

143

216

SMT 103

D) Demonstrate an understanding of the processes used, and thelimitations of the processes used in the manufacture of varioussemiconductor devicea.

E) Demonstrate an understanding of the types, functions, andoperation of the equipment used in the manufacture of semiconductordevices.

F) Demonstrate an understanding of the processes used to makesolar cells in a laboratory setting.

III. COURSE OUTLINE: (content)

A. Lecture

1) HISTORY OF THE SEMICONDUCTOR INDUSTRY

A) Birth of the industry

B ) Solid State Devices

C) Stages of Manufacturing

D ) Semiconductor Industry Growth

2) SEMICONDUCTOR MATERIALS AND PROCESS CHEMICALS

A) Atomic Structure (Bohr Atom Model)

B ) Semiconductor Production Materials

C) States and Properties of Matter

3) LABORATORY AND CHEMICAL SAFETY

A) Chemical Safety with Acid

B ) Chemical Safety with Solvents

C) Labori-tory Safety Guidelines

O ) Chemical Mix Safety ProCedure

4) CONTAMINATION CONTROL

A) Contamination: The Problem

B ) Contamination Sources

C) Contamination Control Strategies

5) WAFER FABRICATION

A) Goals of Wafer Farication

' B) Wafer Terminology

C) Construction of Semiconductor Circuit

144

217

SMT 103

0) Packaging

E ) Wafer Fabrication Yeild Limiters

6) OXIDATION

A) Silicon Dioxide Layer Uses

B ) Thermal Oxidation Methods

C) Hi Pressure Oxidation Methods

O ) NitirdatIon

7) PHOTOLITHOGRAPHY

A) Overview of Photomasking

B ) Ten Step Process

C) Photo Resist Positive and Neg.ative

O ) Photomasking Processes

E ) Develop

F) Hard Bake

G ) Inspect

H) Etching

8) DOPING

A) Forming a Junction

El) Diffusion

C) Ion Implantation

O ) Atomic Considerations

9) DEPOSISTION

A) Chemical Vapor Deposition

B ) Low Pressure Deposition

C) Deposited Films

10) METALIZATION

A) Metal Film Uses

B ) Materials

C) Methods145 21S

SW 103

11) MANUFACTURING TECHNOLOGY

A) Costs

B) Yields

C) Statistical Process Control

B. Laboratory

Lab will cover the required processes and techniques forthe manufacture of Solar Cells in the Lab environment.

IV. REQUIRED TEXT OR MANUALS:

Microchip Fabrication by Peter Van Zant

V. REQUIRED STUDENT MATERIALS AND SUPPLIES:

1 ea Spiral Notebook 70 pages minimum

2 ea 02 Pencils

2 ea Black Fine Ballpoint Pens

1 ea Metal Metric/English Scale or Ruler 6 inches long

VI. GRADING POLICY:

A = 90 - 100

B = 80 - 89

C = 70 - 79

D = 65 - 69

VII. ATTENDANCE POLICY:

Students must comply with school catalog policy.

COURSE SYLLABUS

TITLE: QUALITY CONTROL / STATISTICAL PROCESS CONTROL

NUMBER: SMT104


PREREQUISITE: NONE

PREPARED B

APPROVED BY:

DATE:

SMT 104

THIS SYLLABUS HAS BEEN REVIEWED AND IS CURRENT ON THE DATE INDICATED

REVIEWED BY: DATE:

I. COURSE DESCRIPTION: (catalog description)A comprehensive study of the practical application of

statistically sound methods to ,i'v;.qtor (and continually improve)individual manufacturing process and equipmenu. performa-ce.

II. COURSE OBJECTIVES:This is an introductory to intermediate course in the practical

application of statistics in a fabrication environment. This course isto cover introduction to the concepts, language and formulas inStatistical Quality Control and Statistical Process Control applications.

Upon completion of this course, the student will be able to:

1) Demonstrate a working vocabulary with terms applicable tostatistical analysis.

2) Demonstrate a knowledge of the basic statistical formulas andinter-relationships.

3) Demonstrate sound data collection techniques, and design ofstatistical experiments.

4) Explain the importance of Quality testing and Quality improvementprograms in the workplace.

5) Demonstrate their knowledge of the potential weak points of datacollection techniques, data analysis techniqubs, and Praeto analysistechniques.

147 2 '

SMT 104

6) Demonstrate the ability to correctly operate and obtain accurat,results from the computer software included in the book.


A. Lecture

1) VARIABLES AND LEVELS OF MEASUREMENT

A) TYPES OF STATISTICAL MEASURES

B ) LEVELS OF MEASUREMENT

C) TYPES OF VARIABLES

D ) SUMMARIZING DATA

2) MEASURES OF CENTRAL TENDENCY

A) MODE

B ) MEDIAN

C) MEAN

3) DISPLAY OF DATA

A) PIE CHARTS

B ) BAR GRAPHS

C) BAR HISTOGRAMS

O ) FREQUENCY POLYGONS

E ) TYPES OF DISTRIBUTION CURVES

4) POPULATIONS AND SAMPLES

A) POPULATIONS

B ) SAMPLES

5) MEASURES OF VARIABILITY

A) RANGE

B ) AVERAGE DEVIATION

C) VARIENCE

D ) DEGREES OF FREEDOM

6) NORMAL DISTRIBUTION

A) NORMAL CURVE

148 221

SMT 104

B) Z SCORE

7) PROBABILITY

8) DISTRIBUTION OF SAMPLE MEANS

A) ESTIMATING STANDARD ERROR OF THE MEAN

9) ESTABLISHING CONFIDENCE INTERVALS

A) 95% CONFIDENCE INTERVALS

8) 99% CONFIDENCE INTERVALS

C) t DISTRIBUTION

10) CORRELATION

A) COMPUTING THE CORRELATION COEFFICIENT

11) REGRESSION

A) REGRESSION OF Y ON X

B ) REGRESSION OF X ON Y

C) MULTIPLE REGRESSION

12) TESTING FOR DIFFERENCE BETWEEN POPULATION MEANS

A) TESTING FOR DIFFERENCE BETWEEN INDEPENDENT MEANSVARIANCES ASSUMED EQUAL

B ) TESTING FOR DIFFERENCE BETWEEN INDEPENDENT MEANSVARIANCES ASSUMED UNEQUAL

C) TESTING FOR DIFFERENCE BETWEEN DEPENDENT MEANS

13) ANALYSIS OF VARIANCE - ONE WAY

A) THE F DISTRIBUTION

8) TEST OF MULTIPLE COMPARISONS

C) TUKEY METHOD - EQUAL SIZED SAMPLES

D ) SCHEFFE METHOD - UNEQUAL SIZED SAMPLES

14) ANALYSIS OF VARIANCE - TWO WAY

A) TWO - WAY ANALYSIS OF VARIANCE

B ) ANALYSIS OF COVARIANCE

C) ONE-WAY ANALYSIS OF VARIANCE WITH REPEATED MEASURES

15) CHI-SQUARE TESTS

1492.22

SMT 104

A) TEST FOR GOODNESS OF FIT

B) TEST FOR INDEPENDENCE OF TWO VARIABLES

C) TEST FOR EQUALITY OF PROPORTIONS

B. LaboratoryNONE

IV. REQUIRED TEXT OR MANUALS:Introductory Statistics, a Microcomputer App'oach

by Freeman F. ElzeY



2 ea #2 Pencils



1 ea 5 1/4 floppy diskette, Double Sided/Double Density

VI. GRADING POLICY:

A = 90 - 100

8 = 80 - 89

C = 70 - 79

D = 65 - 69



150

COURSE SYLLABUS

TITLE: SEMICONDUCTOR PROCESS II

NUMBER: SMT203


PREREQUISITE: SMT103, MATH 1 4 LET305

PREPARED BY:

APPROVED B

DATE:

OBERT

?/

SMT 203

THIS SYLLABUS HAS BEEN REVIEWED AND IS CURRENT ON THE DATE INDICATEDREVIEWED BY: DATE:

I. COURSE DESCRIPTION: (catalog description)A continuation of SMT103 into the intermediate areas ofProcess. This course will provide an indepth look at wafer preparation,oxidation, diffusion, CVD, thin films, photolithography, methodologies,and etch methods. Students will be expected to produce working SolarCells by the end of this course.

II. COURSE OBJECTIVES:This course is designed for the student to apply the variousprocess used in the fabrication of semconductor wafers. The student willbe taught the characteristics of the materials, processes and equipmentused in the fabrication, laboratory safety, material handling, chemicalhandling, and step by step process for production of Solar Cells.

Upon completion of this course, the student will be expected todemonstrate competency in these areas:


8) Demonstrate an understanding of the materials used in themanufacture of semiconductor devices.

C) Demonstrate an understanding of the applications andlimitations of the materials used in semiconductor manufacture.

151 221

SMT 203

0) Demonstrate an understanding of the processes used, and theJimitations of the processes used in the manufacture of varioussemiconductor devices.

E) Demonstrate an understanding of the types, functions, andoperation of the equipment used in the manufacture of semiconductordevices.

F) Demonstrate an understanding of the processes used to makesolar cells in a laboratory setting.


A. Lecture

1) SOLAR CELL PRODUCTION PROCESS

A) Preparation of materials and equipment

B ) Production of Solar Cells in the Lab

C) Standardized Testng of Solar Cells

Co) Documentation of Solar Cell (Duality

2) SEMICONDUCTOR MATERIALS AND PROCESS CHEMICALS

A) Atomic Structure (Bohr Atom Model)

B ) Semiconductor Produntion Materials

C) States and Properties of Matter




C) Laboratory Safety Guidelines

B ) Chemical Mix Safety Proceduf-e


A) Contamination: The Problem



5) WAFER FABRICATION

A) Goals of Wafer Farication

B ) Wafer Terminology

C) Construction of Semiconductor Circuit152 r-

iff )

0) Packaging

E) Wafer Fabrication Yeild Limiters

6) OXIDATION

A) Silicon Dioxide Layer !Jses

B ) Thermal Oxidation Methods


D ) Nitirdation

7) PHOTOLITHOGRAPHY

A) Overview of Photomasking

B ) Ten Step Process

C) Phuto Resist Positive and Negative

O ) Photomasking Processes

E ) Develop

F) Hard Bake

G ) Inspect

H ) Etching

8) DOPING


8) Diffusion

C) Ion Implantation


9) DEPOSISTION



C) Deposited Films

1(d) METALIZATION

A) Metal Film Uses

B ) Materials

C) Methods1 53 2.26

SMT 203

SMT 203


A) Costs

B) Yields


B. Laboratory

Lab will cover the required processes and techniques forthe manufacture of Solar Cells in the Lab environment, and tracking ofthe tested Cell quality..




2 ea 02 Pencils



VI. GRADING POLICY:

A = 90 - 100

8 = 80 - 89

C = 70 - 79

= 65 - 69



:OURSE SYLLABUS

TITLE: MANUFACTURING METHODOLOGIES

NUMBER: SMT302

LECTURE: 3 LABORATORY:

PREREQUISITE: NONE

PREPARED BY

APPROVED B

DATE:

4 CREDIT : 4

OBER ST

oe,e-

SMT 302

THIS SYLLABUS HAS BEEN REVIEWED AND IS CURRENT ON THE DATE INDICATEDREVIEWED BY:

DATE:

I. COURSE DESCRIPTION: (catalog description)This course will provide a basic understanding ofinventory/production control logistics and resultant product cycle timeand costs. There will be particular emphasis in understanding ofindividual productivity/efficiency as it relates to overall manufacturingsuccess.

II. COURSE OBJECTIVES:This course will challenge the student to understand the inter-relationships of the inventory, production, logistics, documentation,work flow, employee contributions, and efficiency to the profits orlosses of a company.


1) Demonstrate a working vocabulary with terms applicable toManufacturing techniques.

2) Demonstrate a knowledge of the basics of manufacturing, and theinter-relationships of the planning, coordination, and organizationactivities inside the company.

3) Demonstrate sound inventory, production, logistics,documentation, work flow, and efficiency planning and control principles.

4) Explain the importance of Planning and Control programs in themanufacturing environment.

)155

SMT 302

.5) Demonstrate their knowledge of the potential weak points in themanufacturing environment, and methods to detect, improve, and preventproblems.


A. Lecture

1) INVENTORY CONTROL

A) INVENTORY AS A PRODUCTION EXPENSE

8) JUST IN TIME INVENTORY PLANNING

C) INVENTORY IN WORK FLOW PLANS

D ) INVENTORY DOCUMENTATION

E) AUDIT TRAILS IN THE STOCKROOM

2) MANUFACTURING LEAD TIME PLANNING

A) PRODUCTION LAYOUT, FLOWS, AND SCHEDULING

B ) WORK FLOW PLANNING

C) MANUFACTURING CAPACITY PLANNING

D ) MANUFACTURING WORKLOAD PLANNING

3) PRODUCTION CONTPOL

A) QUALITY IMPACTS ON PROFITS/LOSSES

8) PRODUCTION YIELDS AND QUALITY ANALYSIS

C) PRODUCTION QUALITY TRACKING

D ) PRAETO ANALYSIS FOR PROBLEM RESOLUTION

4) LABOR

A) LABOR AS A MAJOR EXPENSE

B ) LABOR EFFICIENCY PROGRAMS

C) EMPLOYEE TRAINING COST VERSUS BENIFIT

D ) EMPLOYEE CONTRIBUTION PROGRAMS

5) PRODUCT CYCLE TIME

A) EFFECTS ON PROFITS AND LOSSES

B ) JUST IN 7-ME PRODUCTION PLANNING

C) PRODUCTION DOCUMENTATION

156 22 .()

SMT 302

D ) WORK IN PROCESS TRACKING

6) AUTOMATION IN MANUFACTURING

A) ROBOTIC APPLICATIONS

B , BAR CODE TRACKING SYSTEM INTEGRATION

C) AUTOMATED MATERIAL DELIVERY SYSTEMS

D ) COMPUTER AIDED MANUFACTURING EQUIPMENT/TECHNOLOGY

7) COMPUTERIZATION IN MANUFACTURING

A) COMPUTER AIDED DESIGN EQUIPMENT/TECHNOLOGY

B ) WORK IN PROGRESS TRACKING/ANALYSIS TECHNOLOGY

C) AUTOMATED QUALITY TRACKING/ANALYSIS TECHNOLOGY

D ) AUTOMATED MATERIAL SCHEDULING SfSTEMS

E) AUTOMATED MATERIAL PURCHASING SYSTEMS

B. Laboratory

Lab will apply the Manufacturing Methodologies to theproduction of Solar Cells.

IV. REQUARED TEXT OR MANUALS:



2 ea 02 Pencils



VI. GRADING POLICY:

A = 90 100

B = 80 - 89

C = 70 - 79

D = 65 - 69



157 2 3 o

COURSE SYLLABUS

TITLE: SEMICONDUCTOR PROCESS III

NUMBER: SMT303


PREREQUISITE: SMT203, MATH 124, LET317

PREPARED BY

APPROVED BY.

DATE: o 9/

THIS SYLLABUS HAS BEEN REVIEWED AND IS CURRENT ON THE DATE INDICATE'

REVIEWED BY: DATE:

I. COURSE DESCRIPTION: (catalog description)A more advanced and ddtailed study of each process learned in

previous Process and Fabrication courses. Emphasis will be on producingthe highest yeild, highest efficiency Solar Cell possible. Students willengage in all areas of the manufacturing procedure.

II. COURSE OBJECTIVES:This course is designed for the student to apply the various

process used in the fabrication of semconductor wafers. The student willbe taught the characteristics of the materials, processes and equipmentused in the fabrication, laboratory safety, material handling, chemicalhandling, and process improvement techniques for production of SolarCells.

Upon completion of this course, the student will be expected tcdemonstrate competency in these areas:


B) Demonstrate an understanding of the materials used in themanufacture of semiconductor devices and alternative materials forquality, yeild, and output improvement.

C) Demonstrate an understanding of the applications andlimitations of the alternative materials used in semiconductormanufacture.

158

SMT 303

D ) Demonstrate an understanding of the processes used, and thelimitations of the processes used in the manufacture of varioussemiconductor devices and quality improvement techniques.E ) Demonstrate an understanding of the tyPes, functions, andoperation of the equipment used in the manufacture of semiconductordevices.

F) Demonstrate an understanding of the processes used toimprove solar cells in a laboratory setting.


A. Lecture

1) SOLAR CELL PRODUCTION PROCESS

A) Preparation of materials and equipment

B ) Production of Solar Cells in the Lab

C) Standardized Testing of Solar Cells

D ) Documentation of Solar Cell Quality




C) Laboratory Safety Guidelines

O ) Chemical Mix Safety Procedure


A) Contamination; The Problem



4) OXIDATION

A) Silicon Dioxide Layer as Concentrator

B ) Thermal Oxidation Methods with Spin on Glass


D ) Nitirdation

5) PHOTOLITHOGRAPHY

A) Alternative Methods of Photomasking

B ) Ten Step Process Integration

159

2.12

C) Photo Resist Positive and Negative

Photomasking Processes

E) Develop Alternatives

F) Hard Bake

G ) Inspect Techniques for Product Improvement

H ) Etching Alternatives

8) DOPING


B ) Diffusion

C) Ion Implantation


9) DEPOSISTION



C) Deposited Films

10) METALIZATION

A) Metal Film Alternatives

8) Materials Alternatives

C) Methods


A) Costs

B ) Yields


B. Laboratory

Lab will cover the required processes and techniques forimprovements in the manufacture of Solar Cells in the Lab environment, aswell as tracking of the tested Cell quality.


160 2:13

SMT 303V. REQUIRED STUDENT MATERIALS AND SUPPLIES:

1 ea Spiral Notebook 70 pages minimum2 ea $2 Pencils


1 ea MetalMetric/English Scale or Ruler 6 inches long

VI. GRADING POLICY:

A = 90 - 100

B = 80 - 89

C = 70 - 79

D = 65 - 69



2 3 .1161

SMT304

COURSE SYLLABUS

TITLE: CONTAMINATION CONTROL, ION IMPLANT

NUMBER: 5M7304


PREREQUISITE: NONE

PREPARED BY:

APPROVED B

DATE: /Cc,

THIS SYLLABUS HAS BEEN REVIEWED AND IS CURRENT ON THE DATE INDICATEI

REVIEWED BY: DATE:

I. COURSE DESCRIPTION: (catalog description)A detailed study of processes, materials, and equipment in thefollowing wafer fabrication areas: basic clean-room concepts and design,defect density analysis and control, wafer handling techniques andprocessing procedures, ion implant systems and dose control, ion ranges,annealing and diffusion of dopant impurities, shallow junction effects,and gettering.

II. COURSE OBJECTIVES:This is a more advanced study in the area of contaminationcontrol, and what can be done to limit the problems caused by

contamination in the production of semiconductor devices.


1) Converse with a working vocabulary wi/ th terms applicable toContamination Control.

Processes.

Materials.

Materials.

2) Demonstrate a working knowledge of Contamination ContrDl

3) Demonstrate a working knowledge of Contamination Control


162

23 .5

SMT304


6) Demonstrate a working knowledge of Contamination ControlClean Room Concepts.

Equipment.

7) Demonstrate a working knowledge of Contamination ControlClean Room Design.

8) Demonstrate a working knowledge of Contamination ControlDefect Density Analysis.

9) Demonstrate a working knowledge of Contamination ControlWafer Handling Techniques.

10) Demonstrate a working knowledge of Contamination ControlDopant Impurities.

11) Demonstrate a working knowledge of Contamination ControlGettering.


A. Lecture

1) Contamination Control Processes

A) Processes Used for Contamination Control

8) Class 1000 Considerations

C) Class 100 Considerations

D ) Class 10 Considerations

2) Contamination Control Materials

A) Materials Used for Contamination Control

8) Class 1000 Considerations


D ) Class 10 Considerations

3) Contamination Control Equipment

A) Equipment Used for Contamination Control

B ) Class 1000 Considerations


O ) Class 10 Considerations

4) Contamination Control Clean Room Concepts

A) Class 1000 Considerations

23f;163

SMT304



5) Contamination Control Clean Room Design




6) Contamination Control Defect Density Analysis

A) Equipment Used for Defect Analysis

B ) Analysis Techniques

C) Improvement Reporting

7) Contamination Control Wafer Handling Techniques




8) Contamination Control Dopant Impurities

A) Dopant Purity Efforts

B ) Wafer Purity *Efforts

C) Counter Acting Impurities

O ) Impurity Removal Techniques

9) Contamination Control Gettering

A) What is Gettering

B ) Gettering Techniques

C) Gettering Limitations

D ) Alternatives to Gettering

B. Laboratory

Lab will cover the planning and implementation ofContamination Control techniques in the production of Solar Cells.


164

237

V . REQUIRED STUDENT MATERIALS AND SUPPLIES:

VI . GRADING POLICY:

VII . ATTENDANCE POLICY:

165

23S

SMT304

COURSE SYLLABUS

TITLE: PREVENTATIVE MAINTENANCE

NUMBER: SMT306


PREREQUISITE: NONE

PREPARED BY.

APPROVED BY:

DATE:

SMT306

THIS SYLLABUS HAS BEEN REVIEWED AND IS CURRENT ON THE DATE INDICATE!

REVIEWED BY: DATE:

I. COURSE DESCRIPTION: (catalog description)A study of the basic techniques, benifits, and costs of a

comprehensive equipment maintenance program, including theimpact/improvement of manufacturing parameters such as mean-time-between-failures (MTBF), mean-time-to-repair (MTTR), machine availablity, andutilization.

II. COURSE OBJECTIVES:This is an introductory course on the effects of an efficient

equipment maintenance program in the production environment. The studentwill learn about the key elements of the preventative maintenanceprogram, how to identify the elements required, and how to identifychanges that need to be made to existing programs.


1) Converse with a working vocabulary with terms apPlicable toPreventative Maintenance and repair maintenance.

2) Demonstrate a working knowledge of calculating Mean Time ToRepair in a maintenance program.

3) Demonstrate an understanding of the use of Mean Time ToRepair in a maintenance program.

4) Demonstrate a working knowledge of calculating Mean TimeBetween Failures in a maintenance program.

166

2 3H

5) Demonstrate an understanding of the use of Mean Time BetweenFailures in a maintenance program.

6) Demonstrate a working knowledge of caculating MachineAvailability in a maintenance program.

7) Demonstrate an understanding of the use of MachineAvailability in a maintenance program.


A. Lecture

1) PREVENTATIVE MAINTENANCE PROGRAMS

A) What is a Preventative Maintenance Program

B ) What does a Preventative Maintenance Program Do

C) Who is responsible for Preventative Maintenance

D ) How is a Preventative Maintenance Program Started

2) REPAIR MAINTENANCE PROGRAMS

A) What is a Repair Maintenance Program

B ) What does a Repair Maintenance Program Do

C) (.Jho is responsible for Repair Maintenance

O ) How is a Repair Maintenance Program Started

3) MAINTENANCE TECHNIQUES

A) Board Swapping repair techniques

B ) Component Level Repair Techniques

C) Service Contract Maintenance

D ) In House Maintenance

4) PREVENTATIVE MAINTENANCE PROGRAM BENIFITS

A) Reduction of Equipment Down Time

B ) Reduction of Repair Maintenance Costs

C) Production Process Accuracy

D ) Product Quality

5) REPAIR MAINTENANCE PROGRAM BENEFITS

A) Reduced Equipment Down Time

H2.10

O

SMT306

B ) Factory Contract Support

C) Reduction of Spare Parts Inventory Costs

D ) Engineering Support

6) MAINTENANCE PROGRAM COSTS

A) Preventative Maintenance Requirements

8) Supplies Inventory Requirements

C) Repair Maintenance Requirements

D ) Repair Inventory Requrements

7) MEAN TIME TO REPAIR

A) What is MTTR

B ) How is MTTR Used

C) Calculating MTTR

D ) Evaluating MTTR Results

8) MEAN TIME BETWEEN FAILURES

A) What is MTBF

8) How is MTBF used

C) Calculating MTBF

O ) Evaluating MTBF Results

9) MACHINE AVAILABILITY

A) What is AVAILABILITY

B ) How is AVAILABILITY used

C) Calculating AVAILABILITY

O ) Evaluating AVAILABILITY Results

B. Laboratory

The Lab will cover the installation and execution of aPreventative Maintenance Program on existing equipment


V. REQUIRED STUDENT MATERIALS AND SUPLIES1


168 2.1 1

SMT306

2 ea #2 Pencils



VI. GRADING POLICY:

A = 90 - 100

8 = 80 - 89

C = 70 - 79

D = 65 - 69


Students must comply with school catalog policY.

212169

COURSE SYLLABUS

TITLE: SEMICONDUCTOR MANUFACTURING PROJECTS

NUMBER: SMT312

LECTURE: 1 LABORATORY: 8 CREDIT:

PREREQUISITE:

PREPARED BY: F6D

'IPPROVED BY:

DA7E: /Cr/

SMT312

3

$MT103, 5MT203, SMT303, EEC1004, EEC1104, LET108

THIS SYLLABUS HAS BEEN REVIEWEC AND IS CURRENT ON THE DATE INDICATE;

REVIEWED BY: DATE:

I. COURSE DESCRIPTION: (catalog description)A laboratory intensive exercise to allow the student to apply

integrated process and equipment knowledge to fully fabricate a workingcircuit on silicon or improvement in equipment or process. This projectwill require execution, analysis, and documentation of all relavantaspects of the manufacturing sequence, including final electrical testresults.

II. COURSE OBJECTIVES:This is an advanced course designed to challenge the student tc:

go beyond the routine of following prescribed process steps. The studentis challenged to utilize all of the knowledge from all of the previouscourses in the program.


1) Demonstrate a working knowledge and understanding of theprocess steps required to produce a semiconductor device.

2) Demonstrate a working knowledge of the inter-relationshipsof the sequence of processes used in the production of semiconductordevices.

3) Demonstrate a working knowledge of the equipment used in theprocessing of the semiconductor device.

4) Demonstrate a working knowledge of the maintenance, repair,and improvement of the equipment used to produce semiconductor devices.

170 24 3

SMT312

S) Demonstrate an understanding of the stePs to evaluate.analyze, and improve on the processing of silicon devices.

6) Demonstrate an understanding of the steps to evaluate,analyze, and improve on the equipment used to process the silicondevices.


A. Lecture

Lecture is limited to counselling and individualassistance on assigned projects.

B. Laboratory

Lab time is allowed for the development, completion, anddocumentation of assigned project.




2 ea #2 Pencils



VI. GRADING POLICY:

A = 90 - 100

B = 80 - 89

C = 70 - 79

D = 65 - 69



21 I171

SMT314

COURSE SYLLABUS

TITLE: DIAGNOSTICS AND TROUBLESHOOTING OF AUTOMATED SYSTEMS

NUMBER: SMT314


PREREQUISITE: NONE

PREPARED BY:

APPROVED

DATE:

THIS SYLLABUS HAS BEEN REVIEWED AND IS CURRENT ON THE DATE INDICATEC

REVIEWED BY: DATE:

I. COURSE DESCRIPTION: (catalog description)A structured approach to the diagnosis and problem-solving

methods of semiconductor processes and equipment to increase theoperational stability and availability. The primary focus of theinstruction is to emphasise the automated aspects of the equipment.

II. COURSE OBJECTIVES:

This is an introductory course to the applications, use,implementation, improvement, and repair of automated equipment in themanufacture of semiconductor devices. Particular attention will be paidto practical function in the Solar Cell fabrication Lab.


1) Converse with a working vocabulary with terms applicable toautomated equipment and repair technology.

2) Demonstrate an understanding of the needs and requirementsof automated systems in the manufacture of semiconductor devices withemphasis on Solar Cell Production.

3) Demonstrate an understanding of the purpose and reasons forthe use of automated and semi-automated systems in the Clean RoomEnvironment.

2 4 ,9172

SMT314

4) Demonstrate an understanding c.f the needs survey ofrequirements for the design and implementation of automated systems forthe fabrication operations.

5) Demonstrate an understanding of the design, construction,and implementation of automated systems for the fabrication activity.


A. Lecture

1) THE HISTORY OF AUTOMATED SYSTEM APPLICATIONS

A) The development of Automated Systems

B ) The Industry Requirements for Automated SystemsC) Automated Systems Impact on Industry

D ) Automated Systems as an Industry

2) AUTOMATED SYSTEMS IN SEMICONDUCTOR FABRICATIONA) Automation versus Manual Processing

8) Types of Automation in Industry

C) Levels of Automation

D ) Cost versus Benifits of Automation

3) TERMINOLOGY OF AUTOMATED SYSTEMS

A) Terms at Component Level

B ) Terms at Module or Subassembly Level

C) Terms at System Level

D) Terms at Cluster System Level

4) AUTOMATED SYSTEMS APPLICATIONS IN RESEARCH

A) Need or Requirement for Automation

B ) Benifits vs Cost Analysis

C) Development of Present Automation Systems

D ) Development of Future Automation Systems.

5) AUTOMATED SYSTEMS IN PRODUCTION ENVIRONMENTS

A) Need or Requirment for Automation

B ) Benifits vs Cost Analysis

17324E;

SMT314

C) Development of Present Automation Systems

O ) Development of Future Automation Systems

6) AUTOMATED SYSTEM REQUIREMENTS SURVEY

A) Present Production Techniques and Problems

8) Job Criteria for Automation

C) Complexity vs Feasability of Automation

D ) Benifits vs Cost of Automation

7) PURPOSE OF AUTOMATED .SYSTEMS

A) Reduction of Personnel Requirements

B ) Reduction of Repetitive Jobs

C) Accuracy of Automation Systems

D ) Repeatability of Automated Systems

E ) Hazardous Environment Automation

8) DESIGN OF AUTOMATED SYSTEMS

A) Mechanical Limitations

8) Complexity Limitations .

C) Computer Applications

O ) Maintenance Considerations

9) CONSTRUCTION OF AUTOMATED SYSTEMS

A) Technology Availibility at Present

B ) Development of New Technology

C) Cost of Production of Automated Systems

D ) New Applications of Existing Automation

10) IMPLEMENTATION OF AUTOMATED SYSTEMS

A) Upgradable System Applications

5) Reliability Considerations for Automation

C) Maintainability Considerations for Automation

D ) Integration Considerations for Automation

174 2.1 7

SMT314

B. Laboratory

The Lab will look at automation applicas anJ poter1tie.1in the existing facility. Each functional part of thP process will besurveyed, and projects will be undertaken.




2 ea 02 Pencils



VI. GRADING POLICY:

A = 90 - 100

B = 80 - 89

C = 70 - 79

D = 65 - 69



175 2-1S

APPENDIX I

The Texas State Technical College atWaco Curriculum and Course

Descriptions

177 2.1H

TICETSTI-wACO

SENICONDUCTOR MANUFACTURING TECKNOLOGYCURRICULUM 1991-1992

PERIOD PERFIRST QUARTER LIC: L.CHT 132 Topics in Chemistry and Metallurgy 2 4CST 2060 Application Software 0 6ENGL 104 Composition I 4 0GT 102 Orientation 1 0SMT 103 Semiconductor Process I 3 4MATH 104 Intermediate Algebra -4 -2

14 14

CODE:

WEEKRJ.

003634

CONT. IRS.EIB-22d:

7272481284Ai

336

3

3

31

4

-217

SECOND QUARTER

EEC 1004 DC Circuits 2 a 4 120MGT 108 Intro To Metal Working Processes 2 6 4 96MATH 124 Plane Trigonometry 4 0 3 48LET 108 Electro-Optics Components -a --4

14 33610 18THIRD QUARTER

EEC 1104 AC Circuits 2 a 4 120EEC 1404 Semiconductors I 2 a 4 120SMT 104 Quality Control/SPC 2 0 2 24SMT 203 Semiconductor Process II 2 A A 121

9 22 14 372FOURTH QUARTER

EEC 1503 Solid State Devices 2 4 3 72EEC 1203 Digital Electronics 2 4 3 72LET 305 Vacuum Systems I and Glass Fabrication 2 a 4 120PHYS 105 College Physics A A A AiFIFTH QUARTER

ENGL 134 Interpersonal CommunicationsLET 317 Vacuum IISMT 302 Manufacturing MethodologiesSMT 304 Contamination Control

10

433

_Ii.

20

044

A

14

344

A

360

488484

Ai13 12 15 300

SIETE QUARTER

SKr 306 Preventive Maintenance 2 4 3 72SMT 303 Semiconductor Process III 3 12 6 180LET 320 Vacuum III 3 4 4 84PYSC 104 General Psychology _A ...2 _2 Al

12 18 15 384SEVENTH QUARTER

GT 310 Elements of Supervision 2 2 3 48SMT 312 Semiconductor Manufacturing Projects 1 8 3 108SMT 314 Diagnostics/Troubleshooting of

Automated Systems 2 6 4 96EEC 1603 Microprocessors _2Z-a

7-..20

_I13 324

Program Totals 75 126 102 2412

VICE CODE: 003634,

SEMICONDUCTOR MANUFACTURING TECHNOLOGYCOURSE DESCRIPTIONS

1991-1992

SMT 103 semiconductor Process I (3-4-4) An introduction to Semiconductormanufacturing Processes for the integrated circuit industry. This coursewill provide the basic understanding of materials, processes and equipmentused in a wafer (Fab) fabrication. Emphasis will be the total process inlecture where the laboratory will undertake the safety, handling and basicprocess in step by step activities to produce a Solar Cell. This coursewill only process with limited hazardous materials required.Prerequisite: None.

SMT 104 Quality Control/SPC (2-0-2) A comprehensive study of the practicalapplication of statistically sound methods to monitor (and continuouslyimprove) individual manufacturing processes/equipment performance.

SMT 203 Semiconductor Process II (3-6-4) A continuation of SMT 103 into theintermediate areas of Process. This course will provide an in depth look atwafer preparation, oxidation/diffusion, CVD, thin films, photolithography,methodologies and etch methods. Students will be expected to produceworking Solar Cells by the end of the term. Prerequisite: SMT 103,MATH 104, LET 305.

SMT 302 Manufacturing Methodologies (3-4-4) This course will provide a basicunderstanding of inventory/production control logistics and resultantproduct cycle time, and costs. There will be particular emphasis in under-standing of individual productivity/efficiency as it relates to overallmanufacturing success.

SMT 303 Semiconductor Process III (3-12-6) A more advanced and detailed studyof each process learned in previous Process and Fabrication courses.Emphasis will be on producing the lightest yield, highest efficiency SolarCell possible. Students will engage in all areas of the manufacturingprocedure. Prerequisites: SMT 203, MATH 124, LET 317.

SMT 304 Contamination Control, Ion Implant (3-4-4) A detailed study ofprocesses, materials and equipment in the following wafer fabrication areas:basic clean-room concepts and design, defect density analysis and control,wafer handling techniques and processing procedures, ion implant systems anddose control, ion ranges, annealing and diffusion of dopant impurities,shallow junction effects and guttering.

SMT 306 Preventative Maintenance (2-4-3) A study of the basic techniques,benefits and costs of a comprehensive equipment ma! itenance program, includ-ing the impact/improvement of manufacturing parameters such as mean-time-between-failures (MTBF), mean-time-to-repair (MTTR), machine availabilityand utilization.

SMT 312 Semiconductor Manufacturing Projects (1-8-3) A laboratory-intensiveexercise to allow the student to apply integrated process and equipmentknowledge to fully fabricate a working circuit on silicon. This projectwill require execution, analysis, and documentation of all relevant aspectsof the manufacturing sequence, including final electrical test results.

SMT 314 Diagnostics/Troubleshooting of Automated Systems (2-4-3) A structuredapproach to the diagnosis and problem-solving methods of semiconductorprocesses/equipment to increase operational stability and availability.

FICE CODE: 0034341,

SEMICONDUCTOR MANUFACTURING TECHNOLOGYSUPPORT COURSES

1991-1992

CHT 132 Topics in Chemistry and Metallurgy (2-4-3) Fundamentals of chemistryincluding atomic structure, properties of lements, simple compounds,bonding, reactions and solutions involving acids, bases, and salts. Charac-tristics of photo-reactive materials. Structure and characteristics ofcrystalline elements and metals, including solid solutions, lattices,defects, diffusion, ion implants, and electrical behavior. Emphasis onsafety and handling of hazardous matrials.

CST 2060 Applications Software (0-6-3) A study of existing software packagesthat may b used by non-majors to solve problems within their respectivetechnologies.

EEC 1004 DC Circuits (2-8-4) Fundamentals of direct current which includes thestudy of Ohm's Law, Watts Law, Kirchoffs Laws, superposition, thovenin, andNortons Theorems, capacitance and inductance. Emphasis is placed on alge-braic analysis of resistive networks and DC circuit measurement.Prrequisites: MATH 114 or concurrent enrollment.

EEC 1104 AC Circuits (2-8-4) Fundamentals ofalternating current which in-cludes series and parallel AC Circuits, phasors, capacitance and inductivenetworks, transformers, resonance, filter and pulse characteristics.Emphasis is placed on methods of analysis and circuit measurements.Prerequisites: EEC 1004 and MATH 124, or concurrent enrollment.

EEC 1203 Digital Electronics (2-4-3) An entry level course in digital elec-tronics using TTL and CMOS Logic. The course covers numbering systems,logic gates, flip-flops, encoders, decoders, counters, registers, and avariety of other basic logic circuits. An introduction to A/D and D/Adevices, and digital systems will be presented. Prerequisite: EEC 1104.EEC 1404 Semiconductor Circuits (2-8-4) A study of diode and bipolar semicon-ductor devices. Analysis of static and dynamic characteristics, biastechniques, and thermal considerations of small, large and DC coupled signalamplifiers are mphasized. Prerequisites: EEC 1104 or concurrent enroll-ment.

EEC 1503 Solid State Devices (2-4-3) A study of various solid state deviceswhich includes FET, UJT, SCR, triac and disc devices. Emphasis is placedon application, substitution and modification of circuit parameters.Prerequisites: EEC 1404

EEC 1603 Microprocessors (2-4-3) A basic course in microprocessor hardware,its architecture timing sequnces, operation, and programming.Prerequisite: EEC1203

GT 102 Orientation (1-0-1) A course in which the student is acquainted withthe organizational structure, history, policies, and course offerings atTSTI.

GT 310 Elements of Supervision (2-2-3) Study of supervisory duties and respon-sibilities in industrial organization and procedures for meeting theseresponsibilities. Prerequisite: Second-year classification.

LET 108 Electro-Optics Components (2-4-3) Properties, applications, andcommercial sources of optical and mechanical components commonly used inindustry. The laboratory will stress the specifying and ordering ofcomponents from manufacturers catalogs and technical publications.

VICE CODE: 003634

LET 305 Vacuum I and Glass Fabrication (2-8-4) Elementary vacuum concepts andterminology. Physics of vacuum. Pumping principles, Pumps, Vacuummeasurements, Vacuum gages, and auxiliary vacuum equipment. Elementaryglass forming operations includes laboratory exercise in joining andbending of glass tubing.

LET 317 Vacuum Systems /I (3-4-4) A study of industrial vacuum equipmentincluding: mechanical pumps, oil-diffusion pumps, turbo-electric pumps, andvacuum instrumentation. Laboratory work includes disassembly, cleaning,and assembly of vacuum systems; and the deposition of metallic anddielectric coatings. Prerequisite: LET 305 or permission of ProgramChairman.

LET 320 Vacuum III (3-4-4) Advanced leak detection techniques using HeliumLeak Detectors and residual gas analyzer. A study in Vacuum depositionTechnology and Systems. The course will enable the student to plan,repair, maintain, and test various systems which will include vaporators,e-guns, Ion plating, D.C. Sputtering and R.F. Sputters.Prerequisites: LET 317

MGT 108 Introduction to Metal Working Processes (2-6-4) A course designed forthe student enrolled in technologies that are associated with metal workingprocesses to become familiar with metal working equipment and processes usedindustry. Equipment and processes introduced will include foundry, benchwork, drills, grinders, lathe, milling machines, and demonstrations onComputerized Numerical control machining.

182 253

?ICE COM: 003634

SEMICONDUCTOR MANUFACTURING TECHNOLOGYACADEMIC COURSES

1991-1992

ENGL 104 Composition I (4-0-3) (2304015135)Principles and techniques of written compcsition, textual analysis, andcritical thinking.Prerequisite: ENGL 101 or equivalent as determined by English placementtest.

ENGL 134 Interpersonal Communication (4-0-3) Theories and exercises in verbaland nonverbal communication with focus on interpersonal relationships.

MATH 104 Intermediate Algebra (4-0-3) (2701015237)A study of relations and functicns, inequalities, factoring, polynomials,rational expressions and quadratics with an introduction to complx num-bers, exponential and logarithmic functions, determinants and matrices,sequences and series.Prerequisite: MATH 101 or equivalent as determined by MATH placementtest.

MATH 124 Plane Trigonometry (4-0-3) (2701015337)Topics in trigonometric functions, right triangles, trigonometric identi-ties, radian measure, graphs of periodic functions, and oblique triangles.Prerequisite: MATH 104 or MATH 114

PHYS 105 College Physics / (4-4-4) (4008015339]Principles and application of mechanics, wave motion, and heat with empha-sis on fundamental concepts, problem solving, notation and units.Prerequisite: MATH 124

PSYC 104 General Psychology (4-0-3) A survey of the major topics inpsychology. Introduces the study of behavior and the factors thatdetermine and affect behavior.

APPENDIX J

Center for Occupational Researchand Development Model Curricula

and Course Descriptions

185

255

Semiconductor Manufacturing TechnologyAuociate Degree Curriculum Four Semester Schedule

Center For Occupational Research and Developmern

FIRST SEMESTER LEC LAB CREDIT HRSBC Technical Algebra and Tngonometry 4 0 4BC Technical Communications 3 0 3TC Topics in Chemistry and Metallurgy 2 4 3TC DC and AC Circuits 3 6 5SP SMT Manufacturing Processes

(Wafer Mfg., Contamination Control

Oxidation/Ditlusion) 3 3 4

15 13 19SECOND SEMESTER

BC Physics for Technicians 4 3 5TC Digital Electronics and MICrOprOCEISSOIS 3 6 5BC Personal Computer Skills 1 4 2TC Semiconductor Electronics 3 3 4SP SMT Manufactunng Processes

(Photolithography, Wet and Dry Etch 2 6 4

13 22 20THIRD SEMESTER

TC Production/Duality/Yield Improvement

Inventory Control 3 3 4

TC Mechanical, Vacuum, Laser Systems 3 3 4

TC Electronic Test and Instrument Systems 2 0 2SP SMT Manufacturing Processes

(Thin Films, Metallization, Chemical Vapor

Deposition) 2 6 4

10 12 14

FOURTH SEMESTER

BC Technical Communications 4 0 3

BC Elements of Supervision 2 0 2

BC Principles of Economics 2 0 2

TC Automated Production Systems 3 6 5

SP SMT Manufacturing Processes

Ion Implant, Etching, Protects) 2 6 4

13 12 16

TOTALS 51 59 69

Curriculum Distribution LEC LAB CREDIT

Legend: BC Basic Core 20(39%) 7(12%) 21(30%)

TC Tech Core 22(43%) 31(53%) 32(46%)

SP SPecialtY 9(18%) 21(36%) 16(23%)

TOTALS 51 59 69

FIRST OUARTERBC

BC

BC

TC

SP

Semiconductor Manufacturing TechnologyAssociate Degree Curriculum - Six QuarterCenter For Occupational Research and Development

Technical Communications

Technical Algebra

Personal Computer Skills

Topics in Chemistry and Metallurgy

Overview of Semiconductor Mtg.

Schedule

LEC3

3

2

2

2

LAB0

0

4

4

3

CREDIT HRS3

3

3

3

3

12 11 15SECOND OUARTER

BC Physics for Technicians I 3 3 4

TC DC and AC Circuits 3 6 5SP SMTI: Wafer Prep., Contamination

Control, Oxidation, Ditfusion/Doping 3 4 4

BC Technical Trigonometry 3 0 3TC Mechanical Systems 2 3 3

14 16 19

THIRD QUARTERBC Physics for Technicians II 3 3 4

TC Semiconductor Electronics I 2 6 4

TC Digital Electronics 2 3 3

SP SMT-II: Photolithography, Wet & Dry Etch 3 6 5

10 18 16FOURTH OUARTER

TC Semiconductor Electronics II 2 6 4

TC Vacuums and Lasers 2 3 3

TC Electronic Test and Instrumentation 3 6 4

SP SMT-III: Chemical Vapor Depostion (CVD)

Thin Films, Metalization, Ion Implant 3 4 4

10 19 16

FIFTH OUARTER

BC Group Communication 3 0 3

TC Vacuums II 2 3 3

TC Automated Production Systems 2 6 4

TC Production/Quality/Yield Improvement

and Inventory Control 3 3 4

BC Technical & Business Writing 4 0 3

14 12 17

SIXTH QUARTER

BC Principles of Economics 3 0 3


TC Microprocessor Controls 2 4 3

TC Diagnostics/Troubleshooting

of Automated Systems 2 6 4

SP Projects in SMT Manufacturing 1 6 3

10 18 16

TOTALS 70 94 98


Legend: BC Basic Core 29(41%) 12(13%) 32(33%)

TC Tech Core 29(41%) 59(63%) 47(48%)

SP Specialty 12(17%) 23(24%) 19(19%)

TOTALS 70 94 98

188

25 7

Semiconductor Manufacturing Technology ProgramCourse Descriptions

BASIC CORE (BC)

Composition I (3-0-3) Principles and techniques of written riomposition, textualanalysis, and critical thinking.

College Algebra (3-0-3) A study of quadratics; polynomial, rational, logarithmicand exponential functions; systems of equations, progressions; sequences andseries; matrices and determinants.

Personal Computer Skills (2-4-3) Students learn the fundamentals of starting acomputer, loading specific programs and manipulating data. Word processing,spreadsheets and databases will be explored.

Physics for TechniciansA Systems Approach (3-3-4) This course teachesstudents the principles of physics by explaining similarities between systemsmechanical, electrical, fluid, and thermal. For example, the concept of force istaught as it applies to each system before another concept is discussed. Studentsfind this manner of learning easier as it allows a transfer of knowledge from onesystem to another. This course contains 12 different concepts; six are taught in thefirst quarter of PFT and six in the second.

Plane Trigonometry (3-0-3) Topics in trigonometric functions, right triangles,trigonometric identities, radian measure, graphs of periodic functions, and obliquetriangles.

Group Communication (3-0-3) Discussion and small group theories andtechniques as they relate to group process and interaction.

Principles of Economics (3-0-3) History, development and application of macroand micro economic theory underlying the production, distribution and exchange ofgoods and services, utilization of resources; analysis ef value and prices; nationalincome analysis; fiscal policies; monetary and banking theory and policy.Distribution of income; labor problems; international economics; economics systems.Attention given to the application of economic principles to economic problems.

Elements of Supervision (2-2-3) Study of supervisory duties and responsibilitiesin industrial organization and procedures for meeting these responsibilities.

189 25 s

Technical and Business Writing (4-0-3) Technical and Business Writing teachesstudents to prepare letters and memos for distribution within and without a company.Students also learn to prepare technical reports that are organized in a logicalmanner. The use of good grammar and accurate spelling is stressed. This courseemphasizes the importance of accurate written communication to students who areready to graduate.

Physics for Technicians (3-3-4) This is a continuation of the second-quartercourse.

TECHNICAL CORE (TC)

Vacuums and Lasers (2-3-3) Students are introduced to the equipment andtechniques used to attain the reduced pressures (vacuums) required to producehigh-quality, pure materials for manufacturing semiconductors. Students will alsohave opportunities to assemble the necessary equipment and to troubleshootproblems that occur with the vacuum-producing system.

Production/QualltyfYield improvement and Inventory Control (3-3-4) Thiscourse introduces students to several ideas and practices that combine to maximizeproduction while minimizing cost of pro& ..:sion stressed are quality and yieldimprovement by use of tools such as stE -tt;al process control and knowing whatdesign and production parameters are and how they interact to affect production.

Preventive Maintenance (2-6-4) Preventive Maintenance teaches students theimportance of keeping records and foilowing manufacturers' recommendedmaintenance procedures for establishing an ongoing plan for keeping machinery andequipment in operable condition. Students will develop a complete preventivemaintenance program for a given assigned set of equipment.

Automated Production Systems (2-6-4) This course introduces students to theintegrated production-line concept. Students will examine and test interfacesbetween mach:nes and their controllers and interfaces with other machines. Theywill be given the .pportunity to interconnect machines, set them up to operate,program them, and place them in operation; then, as troubleshooting becomesnecessary, students will determine the source of problems and corrint the problems.

Electromechanical Devices and Systems (3-4-4) This course is designed toprovide the student with a working knowledge of electronic devices and to developthe student's ability to assemble and test basic solid-state components and vacuum-tube circuits. Topics include active electrical devices, analog devices, digitaldevices, input-output devices, analog systems, and digital systems.

190 25

Design and Run of Experiments (2-0-2) Design and Run of Experiments providesstudents with the opportunity to design a test procedure to evaluate a specificcharacteristic about a component or system. Students will conduct the experimentand then evaluate the test to determine if they learned the data they expected to andif the criterion being tested is satisfactory or not.

Electrical Test and Instrumentation In Electrical Test and Instrumentationstudents will learn the fundamentals of installing, setting up, calibrating, and placinginstrumentation systems in service. Students will apply previously gained knowledgeand skills using test instruments as they monitor and troubleshoot the new processmonitoring and controlling systems.

Vacuums II (2-3-3) A,eontinuation of vacuums and lasers with major emphasis onvacuum systems. Students explore advanced high vacuum techniques; theyassemble vacuum systems and troubleshoot from a system approach.

Topics in Chemistry and Metallurgy (2-4-3) Fundamentals of chemistry includingatomic st"ucture, properties of elements, simple compounds, bonding, reactions andsolutions involving acids, bases, and salts. Characteristics of photo-reactivematerials. Structure and characteristics of crystalline elements and metals, includingsolid solutions, lattices, defects, diffusion, ion implants, and electrical behavior.Emphasis on safety and handling of hazardous materials.

Digital Electronics (2-3-3) An entry-level course in digital electronics using TTLand CMOS Logic. The course covers numbering systems, logic gates, flip-flops,encoders, decoders, counters, registers, and a variety of other basic logic circuits.An introduction to A/D and D/A devices, and digital systems will be presented.

Semiconductor Electronics (2-6-4) A study of diode and bipolar semiconductordevices. Analysis of static and dynamic characteristics, bias techniques, andthermal constderations of small, large and DC coupled signal amplifiers isemphasized.

Mechanical Systems (2-3-3) Include actuators and drive mechanisms such asbelts, chains and gears. These courses will also offer instruction in such actuatorsas mechanical linkages and cam systems. Basic components of vacuum, pneumaticand hydraulic systems. Hands-on labs show techniques for calculating chain andbelt length; measurement and adjustment of backlash between gear teeth;installation procedures for seals and bearings; practices for working with aerobic andanaerobic sealants; and the use of precision measuring equipment such as dialcalipers and dial indicators.

191 2,6i)

Electronic Test and Instrumentation Systems (2-3-3) A study of the varioustypes of test instruments available to the technician and their proper usage.Additionally, the student will study common types of instrumentation equipment inprocess control loops. .

DC and AC Circuits (3-6-5) Fundamentals of direct current which includes thestudy of Ohm's law, Watts law, Kirchhoff's Law, superposition, Thevenin's, andNorton's Theorems, RC and RL time constants. Emphasis is placed on algebraicanalysis of resistive networks and DC circuit measurement. Fundamentals ofalternating current includes series and parallel AC circuits, phases, capacitance andinductive networks, transformers, rescnance, filter and plus characteristics.Emphasis is placed on methods of analysis and circuit measurements.

SPECIALTY CORE (SP)

Overview of Semiconductor Manufacturing (2-3-3) An introduction to thesemiconductor industry and an overview of integrated circuit manufacturing. Thiscourse will provide a basic understanding of materials, processes, and equipmentcurrently usod in wafer fabffcation.

Semiconductor Manufacturing Projects (1-6-3) A laboratory-intensive exerciseto allow the student to apply integrated process and equipment knowledge to fullyfabricate a working circuit on silicon. This project will require execution, analysis,and documentation of all relevant aspects of the manufacturing sequence, includingfinal electrical tests results.

SP Course Descriptions

SMT-I: Wafer Preparation, Contamination Control, Oxidation, Diffusion (3-4-4)

A detailed study of precesses, materials and equipment in the following waferfabrication areas:

Wet chemical cleaning, basic clean-room concepts, wafer contamination anddefect density analysisOxidation techniques and systems, oxide properties and defectsDiffusion mechanisms of dopants and measurement techniques, and epitaxy

192 2t; i

SMT-II: Photolithography, Wet and Dry Etch (3-6-5)

A detailed study of precesses, materials and equipment in the following waferfabrication areas:

Pattern transfer principles, photoresist chemistry (negative and positiveresist), principles of optical lithography, reticle cleaning, surface preparation,resist application, exposure systems, develop methods, inspectionprocedures and critical line-width controlWet chemical etchants and their properties, plasma etching, ion beam andreactive ion etching techniques, control of rates and selectivity, edge profilesand geometry considerations.

SMT-III: Chemical Vapor Deposition (CVD), Thin Films, Metalization, Ion Implant(3-4-4)

A oetailed study of processes, materials, and equipment in the following waferfabrication areas:

Atmospheric and low-pressure chemical vapor deposition techniques andsystems, plasma-assisted depositionsDeposited films, single and multilayer metalization techniquesIon implant systems and dose control, ion ranges, annealing and diffusion ofdopant impurities, shallow junction effects and gettering

193

APPENDIX K

Press Notices

195 2 63

Tem,

lillinmmimm7Vol. 5,March 20, 1990 Business and Industry Newsletter

A 2

Students Save Program Big Bucks.Teamwork was the key in saving

Mechanical Engineering Technology$6,000 on a machine the programneeded.

Kenneth Kornele of Belton, andPaul Petmecky of San Antonio, twostudents in the MET program, de-signed and built a machine with thehelp of their instructor, PaulRaborn.

The machine they built is called asheet metal nibbler. It is designedto cut sheet metal up to 16 gaugesin thickness into different shai,esand sizes.

The nibbler acts like a paper holepunch, but instead of cutting paper,it cuts metal.

It was designed and built to beused for a Manufacturing Materialsand Processes class.

The program had bought a hand-held sheet metal nibbler whichbroke right away because of poordesign for withstanding itsintended uses.

Raborn said a better machine wasneeded to take its place, but theprogram could not afford the $6,000it would cost to buy it at the time.

"We couldn't buy anything thatcould do the job, so we had to buildour own," Raborn said.

Kornele and Petmecky's goal wasto redesign a better sheet metalnibbler to handle tougher uses.

Kornele said he and Petmecky,who ate student workers in the pro-gram, each put in 15 hours of work aweek on the machine, finishing theproject in one quarter.

The materials used to build themachine came from surplus partsbelonging to the school, Kornelesaid.

Raborn said the project was suc-

By Monica Ortega, Public Information and News intern

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=qui with the engineering help ofGeorge Gray, MET program chair-man, and MET Instructor ThomasMiddleton.

The calculations in fitting thepieces together needed to be precisein order for the machine to work,Raborn said. Some of the measure-ments could not even deviate three-thousandths of an inch; (that is thewidth of a human hair.)

Now that the machine is success-fully completed, Raborn speaks ofKornele and Petmecky with praise.

"There are a lot of good studentsin the pregram (MET), but these areexceptional students," Raborn said..

Petmecky said he is finishing his

fifth quarter at TSTI and would liketo continue his education in me-chanical engineering at SouthwestTexas State University in SanMarcos when he graduates.

Kornele, who is also finishing hisfifth quarter, said he would like towork in mechanical engineeringfor General Dynamics or some otherlarge corporation that would helphim continue his education towarda bachelor's degree.

Raborn and the entire MET staffare proud of tte finished productand welcome anyone who is inter-ested in seeing the nibbler to stop bythe program.

Issue Highlights:Division Spotlight...Applied Service and Construction

TechnologiesNew Face On Campult...Nick GalvanIndustry Interviews Upcoming Graduates...American MrlinesBigger and Better Airshow...Texas Air Expo

197

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TSTI and CORD Win Contract For TrainingTSTI/Waco and the Center for Oc-

cupational Research and Develop-ment, also known as CORD, havelanded a $417,000 contract to trainworkers at Sematech, an Austin-based semiconductor researchconsortium.

The grant comes from the U.S.Department of Education to designa program for workers inside thenation's "clean rooms," the sterilemanufacturing lines where computerchips are made.

CORD is splitting the grant with

TSTI Historylb celebrate TSTI's 25th Anniver-sary, each month we will highlighthistorical facts:

Did you know...By 1%4, James Connally Air ForceBase had a total of 4,034 assignedpersonnel and an annual payroll ofover S19 million. It was at this timethat the Secretary of DefenseRobert S. McNamara announcedthat the base would be phased out byJuly 1966. The people of Waco wereshocked because of the drastic effectit would have on Waco's economy.Civic leaders immediately startedthinking of ways to ease the blow. A

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TSTI/Waco, which will serve as thenew program's pilot site. PresidentGoodwin said students can begintaldng the new classes toward anassociate degree in the fall of 1990.

Rosie Oswald, Sematech's manu-facturing supervisor, said theprogram is only one of a handful ofeducational programs in the countryaimed at the chip industry.

"It's so much more technical thanit used to be that we need a higherlevel of operator," Oswald said.

special committee was formed tobegin solving the problems the losswould create. Harry Provence,Harlon Fentreu and J.H. Kultgenwere responsible for attempts tosave the base, by visiting PresidentLyndon B. Johnson, and going toWashington, D.C. to try to stop theclosing. By February 1965, discus-sions between Gen. Earl Rudder,president of Texas A&M University,and Gov. John Connally hadresulted in the idea to turn the baseinto a technical institute. Thesemen realized the need for bettereducation and training to meet themanpower demands within the state.

Calendar of Events

198

Board a Regenu Meeting, =1/WacoWind Festival and Charity SailFaculty Grad. Gown Sizing. BookstoreFHT Club Bedding Plant SaleEMT Campus Commentary, CST/IPTDC Pawn Supply Seminar, IDEAS CenterFaculty Grad. Gown Sizing, Bookstore

Chemical Emergency Response ClassCareer Awareness D-y, University HighCampus Commentary, Ch. 34, CST/IPTVICA ContestPostmark deadline for next TASP TestGirl Scouts Visit TST1/WacoDaylight Savings Time, (turn clocks up)Women's Club Meeting, Student CenterCareer Awareness Day. Waco HighTSTI Development Foundation MeetingSneak PreviewGood Friday, Holiday!Texas Air ExpoIndustry Carta DaysKCIF Campus Commentary. DDTSecretaries DayCampus Commentary, Ch. 34, DDTTASP Test

f; 5 3EST COPY AVAILABLE

Tribune-Herald

sommy LOCIyarch 18, 1990*

SECTION BObituaries 3B

Marketplace 4B

Gramm to battle for Fort HoodBy DARLENE McILVAINETribune-Harald stet writer

U.S. Sen. Phil Gramm said Saturday in Wacothat he still is fighting for the survival of a FortHood division and is concerned about reports

7 that troops withdrawn from Europe won't be re-assigned to Fort Hood.

Gramm, 11-College Station, took time out of abriefing on a new semiconductor program atTexas State Technical Institute to talk about the

'° Fort Hood situation.On Wednesday, Maj. Gen. John Greenway,

the Army's assistant deputy chief of staff, gavewritten testimony to a House committee that"contained a presumption or a policy" that theConventional Forces in Europe treaty would de-activate troops as they came home instead ofreassigning them. Gramm said.

Gramm said there have been conflicting re-ports since Wednesday. adding that he and U.S.Rep. Marvin Leath, D-Waco, will try to meetwith the secretary of the Army and the ArmsControl and Disarmament Agency this week fora clarification

"We are going I n nail down where we are and

agree on a joint strategy with one objectivetry to protect Central Texas from the impactthat would clearly occur, costing us thousandsof jobs and generating a fallout of millions ofdollars in negative economic impact, if we deac-tivated the 2nd Armored Division and did nothave troops to replace them with on any kind oftimely basis," Gramm said.

Confusion about the issue is not intentional,he said. "It is a question of the right hand notknowing what the left is doing."

Gramm said he and Leath have an alterna-tive plan if troops returning from Europe can'tbe reassigned. If they are reassigned, he said hebelieves Fort Hood has a good chance of receiv-ing "backfill."

"If we do have an INF treaty agreed to withthe Soviet Union which does deactivate troopstx,ng pulled out of Europe ... obviously, back-filling at that point would be impossible.

"But it would not be impossible at that pointfor the Army to go back and say the decision todeactivate the 2nd Armored Division was a de-

See FORT, Page 10B

European troop cutswould hurt Fort HoodBy DREW PARMATribune-Herald staff writer

Fort Hood's future looks d lit-tle bleaker after testimony byan Army deputy chief of staffabout a proposed force reduc-tion treaty in Europe.

Major Gen. John Greenwaytold The Dallas Morning Newsthis past week that a pact beingnegotiated with the Soviets overreduced levels of conventionalforces in Central Europe mightnot allow troops withdrawnfrom Germany to be rekkatedto Fort Hood or other domestic

bases. According to Greenway,the troops withdrawn from Ger-many under a ConventionalForces in Europe treaty as itstands now would be demobi-lized, not re'ocated.

In other .vords, in the treatyas it is written now, there wouldbe no "backfill" of Europebasedtroops to fill in at the giant Armybase after the 2nd Armored Di-vision is demobilized.

"I've always been suspiciousof the old 'backfill' line," said

See PROPOSED, Page 2B

elsion that was based on a be-lief that the troops being broughthome from Europe would be usedto backfill.

"If, in fact, those troops were go-ing to be deactivated, the decisionconcerning the 2nd Armored Divi-sion was a mistake," he said.

Gramm added: "Obviously, thesecretary of the Army can makethe decision on terms of deactiva-tion. I can't help but believe, how-ever, that we will have some im-pact on the debate, since I'm on theappropriations committee that pro-vides their money and since Mar-vin (Leath) is on the authorizationcommittee that authorizes the waythey can spend it."

Defense Secretary Dick Cheneyhas recommended that the 2nd Ar-mored Division be dismantled un-der a larger base-closing proposalannounced in January. Grammsaid he doesn't think Cheney wentback on his commitment to giveFort Hood first claim on forcescoming home from Europe.

After discussing Fort Hood,Gramm toured the TSTI facilitieswhere a semiconductor curriculumwill be taught that industry andschool officials hope will become amodel for the nation.

Gramm said he hopes the semi-conductor curriculum will spawnother programs to further traintechnicians involved in the $8 bil-lion superconducting super colliderto be built near Waxahachie.

The local project, which is beingfunded by a $419,000 grant from theU.S. Department of Education, willinvolve TSTI, the Center for Occu-pational Research and Develop-ment, Semiconductor and Manu-facturing Technology orSematech and the National Co-alition of Advanced TechnologyCenters.

Dan !lull, a representative of theWaco-based CORD, said the pro-ject began when Sematech, a con-sortium of 14 U.S. semiconductormanufacturers, approached thefirm with a need for new tech-nicians.

!lull said he contacted Grammand TSTI about the project. TSTIwas chosen to participate, he said,because it Ms "60 to 70 percent" ofthe technology needed to train stu-dents in semiconductor technologyana because the school and CORDhave worked well together in thepast.

10B TRIBUNE-HERALD SUNDAY, MARCH 18, 1990*

LOCAL / TEXAS

imeafitablParw-

Reports of whether U.S.soldiers returning from Europewill be stationed at Fort Hoodhave been conflicting, U.S.Sen. Phil Gramm says.

Fort Hooda concern,Granun says0 From Page 1B

2002f;!-

BEST COPY AVAILABLE

Tribune-Herald

THURSDAYDec. 7, 1989

1 4A

TSTI, Waco firmwin nod to trainSematech workersFrom staff and wire reports

A Waco firm and Texas StateTechnical Institute have landed a$417,000 contract to train workersat Sematech, an Austin-based semi-conductor research consortium.

The program is part of a'uniqueworker training program for manu-facturers of computer chips.

The research consortium.formed to improve the chip-makingprocess, said Wednesday it will as-sist the Waco-based Center for Oc-cupational Research and Develop-ment, also known as CORD, indevising the training curriculum.

CORD, a non-profit organization,has received a $417,000 grant fromthe U.S. Department of Educationto design a program for workers in-side the nation's "clean rooms," thesterile manufacturing lines wherecomputer chips are made.

CORD is splitting the grant withTSTI-Waco, which will serve as thenew program's pilot site.

Rosie Oswald, Sematech's manu-facturing supervisor, said the Wacoprogram is one of only a handful ofeducational programs in the coun-try aimed at the chip industry,known for its razor-thin margins oferror and its reliance on advanced

and often complicated manu-facturing equipment.

"It's so much more technicalthan it used to be that we need ahigher level of operator," Oswald

said."Sematech's expertise in semi-

conductor research and develop-ment will play a vital role in thesuccess of this project," said CORDPresident Dan Hull. "Working to-gether in this high technology part-nership with Sematech will give usthe edge we need to effectivelytrain the technicians of the future"

While the Waco effort is unusualin its focus on chip workers, it issimilar to a proposal by Austin eco-nomic development officials, whohave promised U.S. Memories Inc.a 15 million training and researchcenter if it decides to locate its pro-posed computer-chip plant in thecity.

That center would be a 20,000-square-foot building and would beoperated by Austin Community.College, state documents show.

Oswald said Sematech officialsare volunteering their time to theCORD effort and will help the orga-nization pinpoint areas to be includ-ed in the training.

Officials say they already plan topresent courses in inorganic chem-istry, high vacuum systems, optics,semiconductor materials, electrOit-ics and electromechanicalsystems.

Don Goodwin, president of TSTI-Waco, said students can begin tak-ing the new classes toward an asso-ciate degree in the fall of 1990.

201 2W)

Computer chip consortium dissolvesBy CATALINA ORTIZThe Associated Press

SANTA CLARA, Calif. U.S.Memories, a joint venture createdto expand America's small shareof the computer chip market, isdissolving because of inadequatefinancial support from the indus-try, it was announced Monday.

"What.we saw was an unwilling-ness to support sufficient equity aswell as purchase commitments togo forward," said company presi-dent Sanford L. Kane.

At the same time, he criticizedthe industry for concentrating onshort-term tactics rather thanlong-term strategy.

U.S. Memories, hailed by Ameri-can companies when it was formedlast June to invest $1 billion in achip-making plant, decided to ter-minate the venture after a meetingWednesday in Dallas with the orig-inal seven investing companiesand four other potential backers.

Two original backers, Interna-tional Business Machines Corp.and Digital Equipment Corp.,

maintained their major commit-ment to the venture, but Kane saidthe others were not willing to putup enough money to fund the ven-ture's first plant or agree to buyenough of its 4-megabit dynamicrandom access memory chips, orDRAMs.

"From early on, we all knew theviability of U.S. Memories wascontingent on (that)," Kane said ata news conference.

American computer companiesdepend heavily on foregin manu-facturers primarily those in Ja-pan for DRAMS, a commonform of chip important in comput-ers, household appliances and theU.S. defense system. They oftenare compared to crude oil in theirimportance to industry.

U.S. Memories, which estimatedthat American companies current-ly supply no more than 10 percentof the American demand for thechips, hoped to produce 25 percent

202

of the DRAMS needed by U.S. com-puter companies.

Inadequate supply and high costof DRAMs prompted the formationof U.S. Memories last year. In ad-dition to IBM and Digital, originalinvestors included Hewlett-Pack-ard Co., Intel Corp., Advanced Mi-cro Devices Inc., National Semi-conductor Corp. and LSI Logic.

But since then, supply has in-creased and the price has dropped,largely because several new com-panies, including Samsung of SouthKorea, have begun making thechips, according to analysts. U.S.companies needing DRAMs appar-ently no longer think they have aproblem, Kane said.

J. Richard Iverson, president ofthe American Electronics Associa-tion, which supports efforts to in-crease the U.S. share of the chipmarket, said, "I don't know whatwe could have done more."

141 TRIBUNE-HERALD TUESDAY, JAN. 16, 1990

Sematech, supercollider funds OK'dBy SETH KANTORCox News Service

WASHINGTON In a major victoryfor Texas interests, the White Howehas approved full federal funding of$100 million for Sematech and $393 mil-lion for the superconducting supercol-lider, sources reportet. Monday.

Although Sematech and the supercol-lider had faced serious threats of bud-get cutbacks, sources said PresidentBush on Jan. 29 would recommend fullfunding for the two projects when hereleases his proposed spending plan forfiscal 1991, the 12-month period that be-gins Oct. 1.

At the same time, U.S. Rep. JakePickle, DAustin, said, "There is no evi-dence the budget will include Berg-strom Air Force Base on any list of mil-itary bases to be closed" in the effort toreduce defense spending in 1991.

Sources on Capitol Hill and close to

Gov. Bill Clements said they have re-ceived confirmation from the White!louse that Sematech and the supercol-lider will receive the spending levelsought by Texas backers of the two ma-jor projects.

Two months ago, opposition report-edly was growing within the DefenseDepartment and the president's Officeof Management and Budget to a plan todivide the cost of Sematech equally be-tween the microchip industry and thePentagon.

Widespread reports of attempts bygovernment officials to cut back on Se-matech funding in the new budget weretermed "alarming" by Miller Bonner,Sematech spokesman.

Strong arguments were made duringbudget discussions, according to sever-al Washington source§, that the semi-conductor industry should pick up alarger share of the financial burden be-

203

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cause American-based firms ultimate-ly will profit from research and devel-opment under way at Sematech'sAustin facility.

But in the end, Budget Director Rich-ard Darman and Defense SecretaryRichard Cheney agreed to continue thefourth year of a five-year pact betweenthe government and the industry con-sortium, which was formed to re-estab-lish U.S. leadership in advanced high-tech processes.

While Sematech was under review,some of the president's budget-cuttersand other scientists lobbying for L.carcefederal research dollars attempted toslow down construction of the multi-billion-dollar supercollider facility.

Meanwhile, Pickle said he could "layto rest" speculation in the Austin areathat Bergstrom might be forced to shutdown because of military belt-tightening in thinew budget.

Thursday, December 7, 1989 Austin American-Statesman

Sematech plans tramm**g programfor employees who assemMe chipsBy Kyle PopeAmerican-Statesman Staff

Semateclt officials said Wednes-day the consortium is planning aunique worker training programfor computer chip manufacturingcompanies.

The Austin-based research con-sortium, formed to improve thechip-making process, said it willassist the Wano-based Center forOccupational Research and Devel-opment, CORD, in devising thecurriculum for the training effort.

Work ast the pmpam will beginshortly in Waco aW later will be of-fered to colleges and universitiesacross the countiy.

CORD, a non-profit organiza-tion, has received a $417,000 grantfrom the U.S. Department of Edu-cation to design a program forworkers inside the nation's "cleanmoms," the ultra-sterile manufac-turing lines where computer chipsars made.

CURD is splitting the grant withthe Texas State Technical Insti-tute in Waco, which will serve asthe pilot site for the new program.

Rosie Oswald, Sematech's man-ufacturing supervisor, said theWaco project is one of only a hand-ful of educational programs in thecountzy aimed at the chip industry,known for its razor-thin margins ofernstand its reliance on advanced

BEST COPY AVAIMILF

204

27.2

and often complicated manu-facturing equipment.

"It's so much more technicalthan it used to be that we need ahigher level of operator," Oswaldsaid.

Oswald said Sematech officialsare volunteering their time to theCORD effort and will help pinpointthe technology areas that will be in-cluded in the training programs.

Don Goodwin, president ofTSTI in Waco, said students canbegin taking the ck saes toward anassociate depee in the fall.

"Once the curriculum is devel-oped, we'll make it available to anyeducational institution that wantsit," Goodwin said.

Xerox executivechosen to headSematech groupBy MICHAEL HOLMESToe Msooated Press

AUSTIN William J. Spencer,a microelectronics researcher andXerox Corp. vice president,Wednesday was chosen presidentand chief executive of the Sema-tech semiconductor research con-sortium.

Spencer, 60, succeeds RobertNoyce, who died of a heart attack.

Noyce, co-inventor of the inte-grated circuit and a pioneer in thesemiconductor industry, had head-ed the Austin-based chip manufac-turing research center since 1988.

Spencer will play an importantrole in guiding Sematech's re-search. He also will serve as a keyspokesman for the microchip in-dustry on issues such as federalfunding and bolstering the semi-conductor industry and its supportcompanies against foreign com-petitors.

"The national mission we mustaccomplish is key to America'scompetitiveness and key to pre-serving our standard of living forour children and our grandchil-dren," Spencer told Sematech'sAustin workforce after his ap-pointment Wednesday.

The nonprofit Sema tech wascreated by 14 companies in 1988 toregain the world lead in micrGthipmanufacturing technology for theUnited States by 1993.

The consortium employs 650people in Austin. 't has an annualbudget of V00 million, which issupported !ember companiesand by m. funds from theDefense A& .-ed Projects Re-search Agency.

Spencer brings to his new post alengthy background in microelec-tronics research.

He was group vice president and:senior technical officer for Xerox

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William J.Spencersucceedsthe lateRobotNoyes asSematechpresident.

Corp. in Stamford, Conn.Spencer joined Xerox in 1981,

when he became manager of thecompany's integrated circuit lab-oratory at its Palo Alto ResearchCenter. He formerly worked for thegovernment-funded Sandia NationalLaboratories in Livermore, Calif.,and Albuquerque, N.M., and was aresearch professor of medicine atthe University of New Mexico.

Holder of a master's degree ibmathematics and a doctorate inphysics from Kansas State Univer-sity, Spencer began his career in1959 with Bell Laboratories.

Sematech is developing ad-vanced semiconductor manufac-turing methods, equipment andmaterials. Research results aregiven to the member companiesand the federai government torcommercial and military appli-cations.

As CEO, Spencer will direct Se-matech's advance semiconductor-manufacturing staff and will serve.as the consortium's primary liai-son to its 14 member companies-and the government.

Member companies include Ad-vanced Micro Devices, AT&T,.DEC, Harris Corp., Hewlett-Pack-*ard, IBM, Intel, LSI Logic, Micron_Technology, Motorola, NCR, Na-tional Semiconductor, RockwellInternational and Texas In-.struments.

February 11, 1991 The IDAHO BUSINESS REVIEW, Inc. Paal2C

VowTech: Dynamic Programs for Diverse People

Micron workers gain technical knowledge in 'Tech Prep'fly Amy StahlBSU News Services

Twenty workers at MicronTechnology Inc. will have an op-portunity to improve their techni-cal know-how with the help of aprogkam to begin in March atBoise state. "Tech Prep," a five-month, pilot program offeredthrough the College of Tech-nology, is considered to bc on"the cutting edge" of vocationaltechnical education.

Modeled after a program deve-oped by the Texas-based Centerfor Occupational Research andDevelopment, Tcch Prep was ere-

0 '7' .1Ar 4

Wed in response t.) the needs ofemployers competing in today'sglobal marketplace, Cook says."Employers want men and womenwho have a broad-based knowledgeof the principles behind technol-ogy, and a practical understandingof technology's application in thework place. They want, and nccd,employees who can cope with ac-celerating technological change."

Tcch Prep students will explorethe basics in computers, technicalgraphics, applied communicationand mathematics, principles oftechnology, cloc-uonics, hydraulicand pneumatic systems, and qual-ity control.

Specifically, the program in-cludes three phases of instructionand training: pre-tech, tech coreand tech specialty. In pre-tech, thestudents learn basic skills in re-fresher courses such as math, ap-plied physics, computers andMOM. Next, they will participatein hands-on courses in electronicsand other technical fields. Finally,they will develop specializedskills by focusing on high-techfields.

Studenti in the program willcontinue to work on their regularline snifts at Micron whileattending courses from 5:30-8:30p.m. at BSU.

Upon completion of the pro-gram the workers arc expected tobe more eligible for promotionwithin their industry and better-equipped to pursue college de-grees, Cook says.

Micron's Betty Sims believesTcch Prep exemplifies doe type ofeducational training that is des-perately needed by worxers at hercompanyand others. "Wc have ahunch that wc have employeeswho nccd a better fundainentalgrasp of thc basics and who wouldlike to go on to an AA(associate's) degree but need morebackground," says Sims, managerof training and education programs

le IDAHO BUSINESS REVIEW, Inc.

at Micron. "This is going to equipour people by giving them abroader basc."

Tcch Prep comes on the heelsof an AA program that beganseveral wccks ago at Micron.From tests interested workerstook, it was determined that somewould benefit form first enrollingin Tcch Prep, before attending theAA classes.

Cook is optimistic about thesuccess of tech Prep, based on theexperiences of otkr institutions.A similar program at LorainCounty (Ohio) Community Col-lege enjoyed phenomenal success.

Scc MICRON, Page 21C

Page 21C

Programs for Diverse PeopleMicron

Continued from Page 7CThc arca suffered from a (lire needto retrain workers laid off duringthe recent RUNI Bell economiccrkis, and Lorain program placed1(K) percent of the workers in newjobs. "It was able to retool andretrain all these dislocated win kersin a high .lechnology lield," Cooksays.

Ultimately, she says. BSUwould like to see Tcch Prep

available at the high school level,and offer it regularly through theCollege of technology. "We intend to implement it in our cur-riculum for students in electron.ics, drafting and constructionmanagement. because some studolts seem to he deficient in thesebask. areas," Cook says.

2 "f1 ;

MICRON WORKERSGET 'TECH° TRAINING

Twenty workers at Micron Technologswill hase an opportunity to improse theirtechnical know-how with the help of a pro.gram to begin in \larch al Boise State -TechPrep" is a fise-monih. pilot program titteredthrough the College of Technologs

Tech Prepstudents will learn basic skilk inretresher courses such as math, appliedphssics. computers and more Then the stu-dents will participate in handson courses inelectronics and other technical fields \ ndfinalls thes will des clop specialized sk ilk b%tocusing on hightech fields.

Students in the program voll cont mink towork on their regular line shuts at Micronwhile attending es ening courses at BSI.'

Upon completion of the program. theworkers art expected to be more eligible forpromotion within their industry and betterequipped to pursue college degrees. sassSharon Cook. acting associate dean ot theCollege uf Technology.

BSU SEARCHESFOR THREE DEANS

Boise State is nearing the end ot nationalsearches to fill vacancies for deans in three otthe university's seven colleges.

The positions opened for a varlets ot reasons. Tom Stitzel. business. will return toteaching next fall. John Entort, iechnologs.died last summer. and Richard Hart. educa-tion. will retire at the end of this semester

Search committees in business and technology spent the fall semester combing re-sumes to arrive at lists of candidates forinterviews. Applications for the educationposition closed in mid-January.

The selection of all three deans is c-pected in February or early March. C

MANELINE DANCERSTHIRD IN DIVISION

Like the Bronco i'outball team. theMantLine dancers improved their recordthis "season" with a third-place finish inDivision lof the NCAA National CollegiateCheerleading and Pom Dance Champion.ship in Dallas. The squad finished fourth inthe competition last year.

The 20-member team competed againstDivision [teams such as Southern MethodistUniversity and the University ot MiamiThe University of Missouri won the contest.Long Beach State University placed second.

Adviser/coach Julie Stevens said she wasproud of the dancers, who worked hard tucollect the funds needed to participate in thechampionship. The team raised $12.n04)from fans, businesses and the BSU athleticdepartment. 0

ocus Magazine, Boise State University, Vol. XVI, No. 2, Winter 1991.207

APPENDIX L

Promotion/Dissemination ofSemiconductor Manufacturing

Technology Materials

209 277

Promotion of Semiconductor Manufacturing Technologyand Dissemination of Materials

Meetings

SRC Competitiveness Foundation Workshop:Rensselaer Polytechnic InstituteTroy, New YorkMay 30-31, 1991

Microstlectronic Manufacturing EducationAn Operating Training Program30-minute presentation by Dr. Walter Ed ling, Vice President for Programs, Centerfor Occupational Research and Development (CORD)

National Coalition of Advarsed Technology Centers (NCATC)Waco, Texas

NCATC Fall ConferenceNovember, 7-9, 1991, Waco, TexasCurrent Developments in Technical Course Materialsby Dr. Walter Ed lingNinety percent of presentation on Semiconductor Manufacturing Technologyprogram at the Texas State Technical College at Waco (TSTC) and workerretraining for Micron Technology, Inc. at Boise State Univcnaity (BSU)

NCATC Summer ConferenceJune 21-23, 1990, Camden, Jew JerseySemiconductor or Manufacturing Technician"Manufacturing SpecialisrAssociato Degree and Retraining Programsby Dr. Walter Ed ling

Applied Materials CorporationEducation Council meetingAustin, TexasNovember 18, 1991

Technician Trairing for the Semiconductor Devices IndustrySemiconductor Manufacturing Technology/Technician Training Project2-1/2-hour presentation and discussion of Applied Materials with staff and areaeducators by Mr. Bob Thompson, CORD.

211 2 7S

Semiconductor Manufacturing TechnologyDissemination ConferenceMay 9-10, 1991, TSTCby CORD, TSTC, SEMATECH, NCATC

Semiconductor Manufacturin9 TechnologyTechnician Training Project Status ReportTechnical Advisory Committee and Curriculum Committee joint meetings

October 9-10, 1990February 3-4, 1991

by CORD, TSTC, SEMATECH, NCATC

National Association of Industry Specific Training DirectorsMarch 8-9, 1990, Austin, TexasOverview of early Semiconductor Manufacturing Technology program and the baselinemanagement byMr. Tom Liberty of SEMATECH

Texas instruments Production Managers meetingTexas Instruments, Dallas TexasFebruary 14, 1991Presentation on the Semiconductor Manufacturing Technology curriculum as ofFebruary 7, 1991, by Mr. Bob Thompson

National Conference for Occupational EducationSeventeenth Annual ConferenceOctober 20-23, 1991San Antonio, Texas

Transformations:Technical Literacy TrainingRetraining for TechnologyTech Prep Bridge Programby Dr. Walter Edling

Included discussion of Micron worker training at BSU

27u212

National Council on Community Services and Continuing EducationAnnual Fall ConferenceOctober 21, 1991, Corpus Christi, Texas

Transformations:PreparingWorkers for Entry-Level Employmentthrough Technology Literacy Trainingby Mr. Alan Sosbe, Research Associate, CORD

Included discussion of Micron worker training at BSU

North Harris County College DistrictBoot Camp ProgramOctober 9, 1991, Houston, Texas

Transformations:Retraining for TechnologyIncorporating Applied Academicsby CORD staff, including Dr. Walter Edling

Included discussion of Micrr worker training at BSU

Promotion of Semiconductor Manufacturing Technologyand Dissemination of Materials

Publications

Ed ling, Walter, and Alan Sosbe. "Technology Training for Dislocated WorkersTransformations". Economic Development Commentary. National Council forUrban Economic Development. Winter 1991, Volume 14, Number 4.

Stahl, Amy. "Micron Workers Gain Technical Knowledge In Tech Prep".Idaho Business Review, Inc. February 11, 1991, page 7C.

"Micron Workers Get Tech Training". FOCUS. Biose State University.Volume XVI, Number 2, Winter 1991.

Hull, Dan, and Dale Parnell. "Anatomy of a Transformation," Tech PrepAssociate Degree: A Win/Win Experience. CORD, Waco, TX, 1991, pp 214-223.

NCATC Newsletter. The National Coalition of Advanced Technology Centers.Waco, TX. "CORD Receives Major Federal Educational Grant; NCATC toParticipate in Project. " December 1989, page 3.Update on the Semiconductor Project. June 1990, page 2.NCATC Members to Test Curriculum on Semiconductor ManufacturingTechnology. December 1990, page 2.

Update: Semiconductor Technician Training. March 1991, page 2.NCATC Ahead of Money. August 1991, page 1.

Semiconductor Manufacturing Technology: TSTC Accepts the Challenge.October 1991, page 1.

2S1214

APPENDIX M

Evaluation Report (Glen Bounds)

282215

TECHNICIAN TRAINING FOR TME

SIS_OAQI IUMUCjiiB21.__IN

EVALUATION REPORT

DR. GLEN I. BOUNDSEXTERNAL EVALUATOR

NOVEMBER 16, 1991

217 2s3

TECHNICIAN TRAININGJOR THE

SEMICONDUCTOR MICRODEVICES INDUSTRY

EVALUATION_REPORT

I. Introduction

II. Summary

III. Procedure

IV. Results

A. The Effectiveness and Value of the Specific Project Tasks andDeliverables.

1. Project Advisory Committee2. Preliminary Task List and Curriculum Design3. Validation of the Task List4. Forecast of Future Training Needs5. Design Curriculum/Develop Courses6. Implement Retraining Classes7. Implement Associate Degree in Semiconductor Manufacturing

Technology8. Provide for Semiconductor Training Program Replication9. Evaluate Project

10. Disseminate Information11. Design a Model for Technical Training Development12. Report Project Progress

B. The Achievement of the Four Primary Objectives of the Project.

V. Recommendations

218

INTRODUCIEN

The Technician Training for Semiconductor Microdevices Industry project, or theSemiconductor Manufacturing Technology (SMT) project, as it is now called, isdesigned to produce associate degree technicians who are capable of advancing tosenior technician positions and with additional training, to maintenancetechnician or engineering levels. In addition to the need for an SMT associatedegree program, there is a pressing need for using portions of the curriculummaterials for retraining and upgrading of skills for employees currently workingin semiconductor manufacturing settings.

The SMT curriculum is divided into the following major components:

. Basic Core (BC)

CompositionCollege AlgebraPersonal Computer SkillsPhysics for Technicians--A systems approachPlane TrigonometryGroup CommunicationPrinciples of EconomicsElements of SupervisionTechnical and Business WritingPhysics for Technicians

. Technical Core (TC)

Vacuums and LasersProduction/Quality/Yield Improvement and Inventory ControlPreventive MaintenanceAutomated Production SystemsElectromechanical Devices and SystemsElectrical Test and InstrumentationVacuums IITopics in Chemistry and MetallurgyDigital ElectronicsSemiconductor ElectronicsMechanical SystemsElectronic Test and Instrumentation SystemsDC and AC Circuits

. Specialty Core (SP)

Overview of Semiconductor ManufacturingSemiconductor Manufacturing Projects

The Semiconductor Manufacturing Technology (SMT) associate degree program wasdeveloped and is being pilot tested at Texas State Technical College (TSTC).Concurrently, a group of employees from Micron Technology, Inc was i4entifiedfor participation in a retraining project in cooperation with Boise StateUniversity (BSU). The employees identified did not have a sufficient technicalbackground to enter into advanced operator training nor directly into the SMTprogram. Instead, they were enrolled in the Center for Occupational Research &Development's (CORD) Transformations program, a tech-prep bridge curriculumprior to entering the SMT curriculum.

The evaluation component of this project was designed to provide an outsideassessment of the program as implemented. The primary questions audressed in theevaluation effort included:

A. The effectiveness and value of the specific project tasks anddeliverables.

B. The achievement of the four primary objectives of the project.

Both the SMT Associate Degree Project and thb Tech-Prep Retraining Project werefunded through a grant from the U.S. Cepartment of Education, Office ofVocational and Adult Education. The approval received was for a cooperative hightechnology demonstration project.

The Semiconductor Manufacturing Technology (SMT) project ilas been very success-ful, and the curriculum which has been produced and pilot tested should beimplemented in other areas of the country where there is a concentration ofsemiconductor industries. A key factor which contributed significantly to thesuccess of the project is the cooperative effort combining the talents andexpertise of five major organizations:

CORD - A nonprofit organization with a 20-year track record indesigning/disseminating technician curricula in new andemerging technologies.

TSTC - The statewide institute in Texas with the responsibilityfor creating and delivering technician education/trainingfor emerging technologies.

SEMATECH - A manufacturing R & D consortium of 14 major semiconductorindustries having locations throughout the United States.Micron Technology, Inc., a member of the SEMATECH consor-tium, participated in the retraining segment of the projectin cooperation with BSU.

NCATC - (The National Coalition for Advanced Technology Centers) isa coalition of 60 technical and community colleges through-out the U.S. with specific commitment to sharing resourcesand curricula for customizing technical education/training.

BSU - A state university in Idaho which is committed to providingtechnician level education/training to industry in theBoise area.

The SMT curriculum is highly technical, costly equipment intensive and specificto the semiconductor industry. As such, it should not be offered except in areaswhere there is sufficient demand to justify the program. The retraining ofemployees currently in the semiconductor industry appears to have similarpotential to that-of the two-year associate degree program.

221 2S 7

PROCEDURE

The procedure for the evaluation segment of this SMT program included review ofwritten materials about the program and discussions discussions with staff atCORD, BSU, and Micron Technology, Inc. During the site visits to BSU and TSTC,classes were observed; administrators, faculty, and students were interviewed;and laboratory facilities and equipment were examined. Also, during the visitto Boise, a tour was made of the Micron Technology, Inc. facility. One ProjectAdvisory Committee meeting was observed at SEMATECH in Austin, Texas.

Data relative to the Semiconductor Manufacturing Technology program wererequested and obtained during the site visits to the two educational institu-tions. Additional data were provided by project staff at CORD.

2S S

222

EZULLI

A. Effectiveness and value of the specific proiest tasks and deliverables:

1. Project Advisory Committee (PAC)The attached PAC list represents the vanguard of the semiconductormanufacturing industry. Assisting in and responding to each of thePAC meetings were representatives from TSTC and CORD. The PACremained actively involved in the project throughout its duration.

2S9223

SEMICONDUCTOR MANUFACTURING TECHNOLOGY

ADVISORY COMMITTEEApril, 1990

Bill BrennanAMD2706 Montopolis DriveAustin, Texas 78741

Mike HillAMD2706 Montopolis DriveAustin, Texas 78741

Joe Carroll IBM1000 River RoadEssex Junction, Vermont 05452

Wayne CroninMotorola10803 Graymere CourtAustin, Texas 78739

Bernard FaySemi/SEMATECH2706 Montopolis DriveAustin, Texas 78741

John GeorgickTexas InstrumentsMS 38513353 Floyd RoadDallas, Texas 75265

Jim LaiblHuman Resource ManagerHarris SemiconductorMS 62-003P. 0. Box 883Melbourne, Florida 32901

Tom LibertyIBM/SEMATECHBurlington, Vermont802/769-1971

Vijay PersuadHarris Semiconductor2706 Montopolis DriveAustin, Texas 78741

John Waite NSCMS 27-100P. 0. Box 58090Santa Clara, California 950528090

Skip WeedSEMATECH/Motorola2706 Montopolis DriveAustin, Texas 78741

Keith R. WhitesideTraining end EducationSemiconductor GroupTexas instrumentsMS 39097800 Banner DriveP. O. Box 650311Dallas, Texas 75251

224 2:()

2. Preliminary Task List and Curriculum DesignThe original task information was obtained from SEMATECH and membercompanies. An advisory sub-committee (list attached) was then formedto address task validation and expansion.

225

SEMICONDUCTOR MANUFACTURING TECI1NOLOGY

ADVISORY SUB.COMMITTEE

TASK VALIDATION AND EXPANSIONMay, 1990

MemberBill LigonJason LeeJake TheisenDar Gre linger)(sifter ElliottJose ChaconJoel BamettTom LibertyJack LubyWayne Hughes

Main ContributionPhotolithographyCVDPlasma EtchingMetrologyOxidation/DitfusioniCVDWafer CleaningImplantAll TasksAll TasksAll Tasks

226 2'..2.

ConmanyHarris CorporationNCRAMDA T & TSEMATECHA T & TLSI LogicIBMA T & TNCR

3. Validation of the Task List

The task list was then reviewed by the PAC and fifty-four othertechnical professionals for validation. Final editing of the tasklist was done by staff from CORD and TSTC.

4. Forecast of Future Training Needs

Since enough time has not elapsed for students to have completed theprogram, placement is still an unknown. However, according toinformation received during student interviews, :lose students whoare nearing completion are being interviewed with great interest bymultiple companies. The demand for semiconducto s in the computer,aerospace, and telecommunications industries continues to expand;and with such growth, the demand for technicians appears to becontinually on the increase.

Responses received from an industry survey conducted October, 1990,include the following:

In an MDP Associates study for the Portland (Oregon) Develop-ment Commission, (11) companies were interviewed. Thesecompanies expect to hire SOO entry level persons next year.

Micron Technology, Inc. emphasized the need tor their opera-tors who are interested in moving into technician roles toreceive training with a significant emphasis on mathematics,physics, chemistry, communications skills, and knowledge ofcomputers and integrated circuits processes.

Memorandums from five SEMATECH managers echo the Micronrequest.

TSTC Laser Electro Optics and Instrumentation Departmentsindicate that semiconductor plants that are laying offoperators, continue to hire their technician trainees.

5. Design Curriculum/Develop Courses

The valilated task list was used as the basis for the curricululdesign. The curriculum has been designed in three differentpatters: a four-semester schedule; a six-quarter schedule; and aseven-quarter schedule. Each of the patterns includes a basic core,a tech! .cal core, and a specialty core. The seven-quarter schedulealso allows for an additional component of electives. (Seeattached curriculum patterns.)

227

Semiconductor Manufacturing TechnologyAesocleteDegree Currlouken FourSemester Schedule

Canter FOr Occupational Research and Development

mast Sasitanit Lac LAS CREDIT HASBC College Algebra and Plans Trigonometry 4 0 4BC College English 3 0 3TC Topics in Chemistry and Metallurgy 2 4 3TC DC and AC Circuits 3 6 5SP SMT Manufacturing Processes

(Wafer Mfg., Contamination Control

Oxidation' Diffusion) 3 3 4

15 13 19SECOND samastan

BC Physics for Technicians 4 3 5TC Digital Electronics and fAcroprocessors 3 6 5BC Personal Computer Skills 1 4 2TC Semiconductor Electronics 3 3 4SP SMT Manufacturing Processes

(Photolithography, Wet and Dry Etch) 6 4

13 22 20THIRD SEMESTER

TC Production/Duality/Yield ImprovementInventory Control 3 3 4

TC Design arid Run Exceriments 2 0 2TC PMchanical, Vacuum, User Systems 3 3 4TC Elecvonic Test and Instrument Systems 2 0 2SP SMT Manufacturing Processes

(Thin Films. Metallization,

Chemical Vapor eposition) 2 6 4

12 12 16

FOURTH SEMESTER

BC Technical Communications 4 0 3BC Elements of Supervision 2 0 2BC Principles of Economics 2 0 2TC Automated Production Systems 3 6 5SP SMT Manufacturing Processes

(Ion Implant, Etching, Projects) 2 6 4

13 12 16

TOTALS 53 59 71

Curriculum Distribution LEC LAB CREDITLegend: BC Basic Core 20 (38%) 7 (13%) 21 (30%)

TC Technical Core 24 (45%) 31 (53%) 34 (48%)SP Specialty Core 9 (17%1 21 (40%1 16 (22%1TOTALS 53 59 71

BEST COPY AVAILABLE

Semiconductor Manufacturing TechnologyAnooknoDegrae Cwnaulum Illwataarfar ScheduleCanter For Oacupadanal Research and Oavelopnwnt

PUNT QUARIIIR Lac LAS OZIEDIT los'' BC College English Composition 3 0 3

BC College Algebra 3 0 3sc Personal Computer Skills 2 4 3TC Topics in Chemisby and Metallurgy 2 4 3SP Overview of Semiconductor Mfg. 2 3 3

mow WARM12 11 15

BC Physics for Tochnans I 3 3 4TC DC and AC Circuits 3 6 sSP SMT-I: Wafer Prep., Contaniination

Control, Oxidation, Diffusion/Ooping 3 4 4BC Plane Trigonometiy 3 0 3TC Mechanicel Systems 2 3 3

14 18 19THIRD OUART1R

SG Physics for Technklans II 3 3 4TC Semiconductor Electronics I 2 6 4TC Digital Electronics 2 3 3SP SMT-II: Photolithography,

Wet and Dry Etch 3 6 5

'0 18 16FOURTH OUARTER

TC Semiconductor Electronics II 2 6 4TC Vacuums and Lasers 2 3 3TC Elecvonic Test and Instrumentation 3 6 4SP SMT-III: Chemical Vapor Depostion (CVD)

Thin Films, Metalization, Ion Implant 3 4 4TC Design and Run Experiments 2 0 Z

12 19 18FIFTH WARM

BC Group Communication 3 0 3TC Vacuums II 2 3 3TC Automated Production Systems 2 6 4TC Production/Ouality/Yield Improvement

and Inventory Control 3 3 4BC Technical and Business Writing 4 0

sum( OU ARMS

14 12 17

BC Principles of Eoonomics 3 0 3BC Elements of Supervision 2 2 3TC Microprocessor Controls 2 4 3TC Diagnostics/Troubleshooting

of Automated Systems 2 6 4SP Projects in SMT Manufacturing 6 3

10 18 16

TOTALS 72 94 100

Curriculum Distribution LEC LAB CREDITLegend: BC Basic Core 29 (40%) 12 (13%) 32 (32%)

TC Technical Core 31 (43%) 59 (63%) 49 (49%)SP Specialty Core 12 (17%) 23 124841 19 119%1

TOTALS 72 94 100

229 295

Semiconductor Manufacturing TechnologyMewls leDogrce Curriculum flevenCuarter Schedule

Center for Commadonal Raseardi and Development

MIT WARIER LSO LAI Caw HeslIle College English Composition 3 0 3BC College Algebra 3 0 3BC Personal Computer Skills 2 4 3TC Topics in Chemistry and Metallurgy 2 4 3SP Overview of Semiconductor Mfg. 2 3

12 11

I15

SECOND QUARTO

BC Physics for Technicians I 3 3 4

Approved Elective 2 4 3BC Plane Tngonometry 3 0 3

TC Mecnanical Systems 2 3 3

10 10 13THRD QUARTER

BC Group Communication 3 0 3BC Physics Mr Techniciacs II 3 3 4TC DC and AC Circuits 3 6 5TC Vacuums and Lasers 2 3 3

11 )2 15

FOURTHQUARTER

BC Principles of Economics 3 0 3TC Digital Electronics 2 3 3TC Automated Production Systems 2 6 4TC Vacuums II 2 3 3SP SMT: Wafer Prep., Contamination Conrol,

Oxidation, Ditfusion/Doping -1----- 4 4

12 16 17

Firr14 QUARTER

TC Semiconductor Electronics I 2 6 4

TC Electromechanical Devices and Systems 3 4 4

TC Production/OualiryNield Improvement

and Inventory Control 3 3 4

SP SMT: Photolithography, Wet and Dry Etch 3 6 5

11 19 17

SIXTH QUARTER

TC Semiconductor Electronics II 2 6 4

Approved Technical Elective 2 4 3

TC Design and Run Experiments 2 0 2

SP SMT: Chemical Vapor Deposition (CVD),

Thin Films (Matalizations), Ion Implant 3 4 4

9 14 13

SEVENTH QUARTER

BC Technical and Business Writing 4 0 3


TC Microprocessor Controls 2 4 3

TC Elecronic Test and Instrumentation 3 6 4

SP Proiocts in SMT Manufacturing 1 6 3

12 18 16

TOTALS 77 100 106


Legend: BC Basic Core 29 (38%) 12 (121) 32 (30%)

TC Technicll Core 32 (42%) 57 (57%) 49 (46%)

SP Specialty Core 12 (15%) 23 (23%) 19 (18%)

Electives A (5%) 8 (8%) 6 (6%1

TCTALS 77 100 106

230

6. Implementing Retraining Classes

Micron Technology, Inc., as a member of SEMATECH, was chosen as thesite for pilot testing a retraining program. Boise State University,located a few miles away, cooperated in providing staff, facilities,and equipment for offering retraining to a selected group of Micronemployees. The employees were recommended by their supervisors forparticipation in the pilot project. The 20 employees selected wereconsidered to be unprepared for further training in the Micron plant aswell as the regular SMT curriculum; therefore, they were offered a 302hour adult-tech-prep curriculum taken from CORD's Transformationsprogram. The program consisted of:

. Applied Mathematics

. Principles of Technology

. Graphics for Technicians

. Mechanical Devices and Systems

. Fluid PowerPersonal ComputersApplied Communications

. Introduction to Chemistry

The training was scheduled as follows:

Three hours per day, 4 days a week, for 26 weeks,Micron paid 2.5 hours release time 4 days a week,Employees contributed 2.0 hours of personal time 4 days

a week for class attendance and study time,Employees worked 12 hour shifts -- 3 days "on", 3 "off",Most of the employees worked overtime. Several were "on-call."

Of the 20 employees, from quite varied academic and experientialbackgrounds, 19 completed the training. One student dropped due toillness.

Pre-tests and post-tests were administered in three of the classes.Those students who took both the pre-test and post-test showed meanimprovements of 27 percent in Mathematics; 39.3 percent in Fluid Power;and 21.6 percent in Principles of Technology as reflected in Chart 1.Charts 2 and 3 reflect an overall mean improvement of 9.4 percent froma raw score of 38.64 to 41.04 on ACT's ASSET test of basic skills.

A consensus of the students was that the schedule was entirely toounrealistic for maximum achievement of the program objectives. Thestrenuous schedule obviously affected the rate of attendaAce, as shownin Chirt 4. Several of the students expressed a desire for moremathematics to better prepare them for the science and technicalcourses which follow.

231 2117

An indication of the effectiveness of the program is reflected inthe fact that all nineteen of the employees who completed the tech-prep program are now participating in further training in thecompany. Discussions among CORD, BSU, and Micron indicate aninterest in beginning another group of employees in a repeatoffering of the program. Additionally, there is interest inbeginning the SMT curriculum with the program completers.

232 2,('S

CHART 1

TECH PREP

CLASS PRE/POST TEST SCORES

Student Math .

*/20Pre Post

Graphics*/5

Pre Post

Mach DevT.Pluid*/5

Pre Post

Power*/10

Pre Post ,Pre

PT*/20Post,

3261 14 na na 5 na na na 15 16

3816 7 16 na 4 1 1 7 10 12

2044 17 16 na 5 3 8 8 na na

6789 14 16 na na 1 4 na 8 8

3699 10 15 na 5 3 6 8 6 na

4260 10 16 na 4 3 8 8 11 16

181 13 16 na 5 1 7 na na 10

3238 14 na na 5 na na 9 10 11

2574 10 na na 5 na na 7 7 12

3029 12 na na na na na 8 10 9

6810 10 na na 5 na na 8 6 11

6092 17 na na na na na na 11 na

5886 9 na na 5 na 8 9 11 15

5754 11 16 na 5 4 6 8 9 11

6522 14 14 na 5 3 6 8 10 15

1386 5 12 na 5 1 4 7 6 7

2640 9 17 na 3 3 4 7 6 4

559 5 13 na 4 0 2 7 11 na

3869 13 15 na na 3 na 8 9 15

2709 15 15 na 5 2 5 7 10 14

Note: Pre-Test for the Graphics course was not administered.

20233

CHART 2

BSU "TECH PREP" PARTICIPANTSPRE & POST ASSET SCALE SCORES

Pre Test Post TestStudent Writ. Read 'Algebra Num. Avg. Writ. Read Algebra Num. Avg. DIM

181 50 51 34 38 43.25 50 45 40 45 45.00 1.751386 30 35 27 34 31.50 35 35 32 37 34.75 3.252044 42 48 32 47 42.25 43 46 40 50 44.75 2.502574 40 35 36 36 36.75 45 43 32 44 41.00 4.252640 35 40 34 38 36.75 2 7 41 34 45 39.25 2.502709 39 39 31 42 37.75 37 39 42 50 42.00 4.25559 28 27 36 30.33 33 40 26 34 33.25 2.92

,3029 45 46 32 48 42.75 46 41 40 47 .13.50 0.753238 54 53 45 46 49.50 49 48 44 47 47.00 .2.503261 49 44 47 44 46.00 50 46 48 52 49.00 3.003699 45 38 27 45 38.75 39 39 36 43 39.25 0.503816 29 32 26 32 29.75 31 30 27 34 30.50 0.753869 44 46 31 41 40.50 44 46 31 48 42.25 1.754260 31 34 34 38 34.25 40 36 44 48 42.00 7.755754 38 37 29 40 36.00 38 34 40 38 37.50 1.505886 37 39 32 37 36.25 41 41 40 45 41.75 5.506092 52 51 36 51 47.506522 42 46 27 40 38.75 52 48 29 47 44.00 5.256789 41 38 27 39 36.25 43 45 31 46 41.25 5.006810 42 41 25 43 38.00 39 39 40 49 41.75 3.75

TOTAL: 40.65 41.00 32.26 40.75 38.64 41.68 41.16 36.63 44.68 41.04

234

Numerics

Algebra

Reading

Writing

Pre

Post

301

BSU "TECH PREP" PARTICIPANTS PRE AND POST ASSET TEST RESULTSDIFFERENCE IN SCALE SCORES

a

1fs

Overall Test Scores

111 Pre-Test

111 Post-Test

302

CHART 4

ECH PREP

SUMMARY OF STUDENT ATTENDANCE

Student MATH GRAPHICS COMP. COMMMECHDWI.

FLUIDPOWER CHEM PT TOTAL

42 ILA 30 19.5 21 28 31.5 84 287.5

3261 35 28 26 16.5 14 21 28 74 242.5

3816 38.5 24.5 26 15 17.5 28 31.5 84 2652044 42 21 26 12.5 21 21 25.5 45.5 214.5

6789 42 28 26 15 17.5 28 31.5 81 269

3699 38.5 24.5 24 16.5 14 24.5 30 81 253

4260 42 24.5 22 15 17.5 28 24.5 73 246.5

181 42 21 18 10.5 17:5 17.5 3.7 34.5 178

3238 42 28 20 13.5 10 21 10.5 64.5 209.5

2574 35 31.5 24 15 17.5 28 17.5 67.5 2363029 31.5 24.5 17 15.5 10.5 17.5 28 60 204.5

6810 35 31.5 26 13.5 21 28 28 75 2586092 35 17.5 10 7.5 3.5 0 0 12 85.5

5886 38.5 31.5 25.5 15 21 24.5 30.5 83. 267.5

5754 38.5 31.5 24 15 3.7.5 28 28 73 255.5

6522 42 31.5 30 18 21 28 31.5 84 2861386 42 21 26 9 14 24.5 21 71 228.5

2640 38.5 24.5 12 7.5 17.5 28 23.5 74 225.5

559 42 31.5 30 19.5 14 28 31.5 84 280.5

3869 42 24.5 26 16.5 14 26 31.5 80 262.5

270 . . 7._262.

236

3

7. Implement an Associate Degree in Semiconductor Manufacturing Technology

TSTC had the primary responsibility for developing the curriculumand course outlines; identifying required equipment, training aids,reference materials, and textbooks; setting up a laboratory;recruiting the first class of students; and pilot testing theprogram with students at TSTC.

TSTC has met all the requirements of the project. The one weaknesshas been in student recruitment. Less than ten declared SMT majorshave partic4ated in the first year of the program. Approximatelytwenty students from other related technology programs, such asLaser Electro-Optics Technology, have taken SMT courses. This isseen as an appropriate and viable method of recruiting technicallyprepared students for the program. Brochures are available, andexpanded recruitment efforts have been initiated.

Student attrition has been almost 50%. Reasons for not persistinghave included family and financial problems, fear of chemicals usedin the laboratory, and the difficulty of the curriculum. Moreextensive assessment is now being conducted prior to acceptingstudents into the program.

A laboratory space was retrofitted and with the use of a donatedfilter system, the laboratory should reach a clean-room status ofperhaps Class 50,000 or better; certainly more than adequate forclassroom purposes.

8. Provide for Semiconductor Training Program Replication

A complete curriculum guide made up of course materials, referencelists, training aids lists, suggested textbook list, and equipmentlist is currently well under way and will be available by January1992. All materials and resources will be readily tranportable toother locations as needed. Replication of this program requiresserious consideration due to the high cost of setting up a laborato-ry and the highly specialized nature of the technology; requiredonly in locations where there are concentrations of semiconductormanufacturers.

9. Evaluate Project

A comprehensive evaluation of the project is hampered by the factthat the students in the two-year, associate degree program have not.ad time to complete the program. Interviews with the students atTSTC revealrd that they are confident they have benefitted by beinga part of the pilot project in that they have enjoyed the hands-onexperience of installing and making ready the equipment in thelaboratory.

Observing the early student attrition rate at TSTC has caused theprogram staff to make extra efforts at assessing students prior toaccepting them into the program. Pre-tests and post-tests wereadministered in most of the classes in the retraining program. Toenhance the program evaluation, this practice needs to be done inall the classes.

10. Disseminate Information

Presentations about the program have already been made at severalnational and state-wide conferences including:

SRC Competitiveness Foundation Workshop:Renssalaer Polytechnic Institute, Troy, NYMay 30-31, 1991

Microelectronic Manufacturing EducationAn Operating Training Program30 minute presentation by Dr. Walter Edling, CORD

National Coalition of Advanced Technology Centers (NCATC)

NCATC Summer Conference, June 21-23, 1990, Camden, N.J.Semiconductor or Manufacturing Technician'Manufacturing Specialist'Associate Degree and Retraining Programsby Dr. Walter Edling, CORD

NCATC Fall Conference, Nov. 7-9, 1991, Waco, TXCurrent Developments in Technical Course Materialsby Dr. Walter Edling, CORDNinety percent of presentation on SMT program at TSTC andand worker retraining for Micron at BSU

Applied Materials CorporationEducation Council Meeting, November 18, 1991, Austin, TX

Technician Training for the Semiconductor DevicesIndustrySemiconductor Manufacturing Technology/TechnicianTraining Project2-1/2 hour presentation and discussion at AppliedMaterials with staff and area educators by Bob Thompson,CORD.

Semiconductor Manufacturing TechnologyDissemination ConferenceTexas State Technical College, May 9-10, 1991, Waco, TXby CORD, TSTC, SEMATECH, NCATC

238 3:

Sem:onductor Manufacturing TechnologyTechnician Training ProjectStatus Report Meetings

October 9, 1990February 4, 1991

CORD, TSTC, SEMATECH, NCATC

National Conference for Occupational EducationSeventeenth Annual Conference, October 20-23, 1991San Antonio, TX

Transformations:Technical Literacy TrainingRetraining for TechnologyTech Prep Bridge ProgramDr. Walter Edling9 CORD

Included discussion of Micron Worker training at BSU.

National Council on Community Services and Continuing EducationAnnual Fall Conference, October 21, 1991, Corpus Christi, TX

Transformations:Preparing Workers for Entry-Level Employment ThroughLiteracy Trainingby Alan Sosbe, CORD


North Harris County College DistrictBoot Camp Program, October 9, 1991, Houston, TX

Transformations:Retraining for TechnologyIncorporating Applied Academicsby CORD Staff, including Dr. Walter Edling


Publications include:

NCATC NewsletterThe National Coalition of Advance Technology Centers

December 1989, page 3CORD Receives Major Federal Educational Grant;NCATC to Participate in Project

239 3 0 6

June 1990, page 2Update on the Semiconductor Project

December 1990, page 2NCATC Members to Test Curriculum on SemiconductorManufacturing Technology

March 1991, page 2Update: Semiconductor Technician Training

August 1991, page 1NCATC Ahead of Money(two line mention of TSTC part of SMT project)

October 1991, page 1Semiconductor Manufacturing Technology:TSTC Accepts the Challenge

11. Design a Model for Technical Training Development

The cooperative process used in this project should serve as a modelfor developing technical training programs. The integrated effortsof industrial consortia, educational institutions, and independenttechnical researchers provides state-of-the-art, cutting-edgetechnological information for designing the very best possiblecurricula.

12. Report Project Progress

Comprehensive and timely reports have been submitted to the UnitedStates Department of Education. These reports have also been a partof the information shared in the Dissemination Conference.

240

3: 7

3. The Achievement of the Four Primary Objectives of the Project

1. To work with industry experts and educators to design and developa curriculum that will meet the need for semiconductor techniciantraining.

This objective was accomplished in an exemplary mannerutilizing the very best resources available from the semicon-ductor industry, well-known technical educational institu-tions, and an independent research and development center.

2. To implement and test the curriculum at a technical college with atrack record of working with the semiconductor industry.

TSTC has fully implemented the SMT program and has fulfilledthis objective for the project. Curriculum materials have beentested and revised as needed. The experience they have gainedin setting up and equipping an SMT laboratory will be veryvaluable for other institutions wishing to implement theprogram.

3. To disseminate information on the retraining courses and thecomplete program, including the curriculum, and encourage itsreplication at community and technical colleges throughout thecountry.

Presentations at national conferences has heen accomplishedand will continue to happen. The final curriculum paterialsare in draft form and will be ready for dissemination byJanuary. Professional quality brochures describing theprogram are available. Since the associate degree programhas not completed its first cycle, a journal article on theprogram is premature. Such articles are planned by CORD andTSTC upon completion of the first program cycle.

4. To create a model for the development of technician trainingprograms for new and emerging technologies.

The process used in developing the SMT associate degree programand the retraining program has been chronicled by CORD, TSTCand BSU and can be made available upon request. The process ofincorporating efforts of a manufacturing conscrtium, atechnical college, an area university, and an inowldentresearcn and development center, provided for optimum expertisein designing the program.

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RECOMMENDATIONS

I. The Semiconductor Manufacturing Technology program development model is onewhich should be replicated, particularly in high technology program areaswhere industrial consortia can be called upon to provide a vanguard ofresources and expertise in a cooperative relationship with educationalinstitutions and research centers.

2. The scheduling for the Transformations, tech-prep, retrailing program shouldto be reviewed to determine ways to provide a more reasonable time frame forstudents who are also full-time employees. There must be more time providedfor class preparation between work hours and class sessions.

3. A strategic student recruitment plan for the SMT program is needed.Communicating the potential of this highly specialized program, even tohighly capable students, can be very difficult. The industrial demand isapparent. Recruitment of capable students must match this demand.

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xcument resume ce 060 048 title technician training for

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