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PCB Products & Services

ZEN VOCE CORPORATION

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1. Product Line-up & General Capability

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We define the PCB design and production considerations. This includes the signal type, calibration capability, speed, resolution, and interconnect configuration for power supply, I/O channels, and control signals. These considerations and requirements are factored into fabrication decisions including the selection of a dielectric material, the various metals that will be deposited, and optimum layer stack up.

PCB (Printed Circuit Board)

High Frequency Multi-Layered PCB

- Customized High Technology products , High Frequency & Impedance Controlled Product

- Required short delivery (One Device – Multi designer System)

- Massive product library & Experienced in major test systems / Interfaces

▶We design and plan products considering the degree of noise and produce High Multi

site Probe Card PCB through High Multi Layer technology.

PCB Specification & Core Technology- CAD/CAM Design Tool & PCB Software - Design & Manufacturing capability of Multi Layered PCB (up to 52 layers) - Signal matching technology for high frequency

Product Line Up

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Test Load Board & Probecard PCB

Offer full range of PCB design services, Digital Analog Mixed signalMemory boardsMulti-layer PCB

Provide design & fabrication solution on probe card PCB, load board and PRVX motherboards.

Provide full turn-key solution with componentassembly solution according to customer’s

request.

Very competitive pricing with fast delivery time.

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High Technology PCB- Multi Layer (More than 52Layer)

- High Frequency (Mobile Base Band)

- High Speed Interface (USB2.0 , S-ATA)

- Controlled Impedance PCB (50Ω±5Ω, Custom Spec :±10% , Special Spec :±5%)

Design CAD TOOLS- Mentor Graphics, Power PCB(PADS) - Accel (P-CAD)- Cadence, Allegro, Orcad Capture- CAM350 - Auto CAD

PCB Design Capability

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Product Line Up

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Product Line Up

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Layers : 14 – 52Materials : FR-4, FR-5, Polymide, PPE, BT Thickness : 3.2T - 7.0TImpedance matching : 50 ± 5ohmMemory (DRAM & FLASH & WFBI) , Non Memory

2-2. PCB For Probe Card

WFBI ø440DRAM ø440 DRAM ø305

PCB For Probe Card

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Configuration - Motherboard PCB- Pogo Mold & Pin - Upper Base & Down Base- Other Tools

Product Item (PRVX III)- Teradyne Catalyst - Teradyne Flex - Teradyne Tiger - Yokogawa ST6730 - Advantest T6372 - Advantest T6673 - HP 93000 - Fostes SF3000

3. Mother Board (PRVX)

Motherboards

We designs and manufactures a diversified product of line of motherboards. Motherboards used in conjunction with probe card analyzing equipment are a critical and necessary component to measure probe card correlation and performance prior to production wafer testing.

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50Ω±5ΩCustomer Spec : ±10%(Special Spec : ±5%)

50Ω±5ΩCustomer Spec : ±10%(Special Spec : ±5%)

Impedance

FR-4

FR-4Polyimide

PPEBT

Rogers

FR-4Polyimide

PPEBT

Rogers

Material

LogicMixed

2~6.352~48Load Board

580x725.5470 x 730 x 75

4.86~26Mother Board (PRVX)

Memory DD ILogicMixed

3.2 ~7.02~52Probe Card

비고ThicknessLayer제품명

PCB Specification

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Specifications

ITEM Standard Special

Material Board Material FR4,FR408,N4000-13 Getek, Polyimide, Ceramic

Structure Flatness/Warpage ±5 mil/in ±2 mils/in

Layers Max. 24 Layers Max. 52 Layers

B/d Thickness Tol. +/- 10% +/- 5%

Hole Drilled Hole Size Min. Finish 6milsψ Min. Finish 4milsψ

Aspect Ratio 10 32

Design Rule

Trace Width 3mils 2mils(Internal),3mils (external)

Line Spacing 3mils 2mils(Internal),3mils (external)

Annular Ring 2.5mils 1.5mils

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PCB Material Applications in different Temperature

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Our Major Performance

Item Para Layer Remark Memory 16~256 16~52 T5365,T5371,T5375,T5377,AL6050,FOS8000

DDI 1~12 10~48 T6700,T6371,T6372,ST6730 and etc.CIS 1~32 10~32 J750,IP750,MAGNUM

LOGIC 1~4 4~24 T3324,T6682,ITS9000,VERSA and etc.MIXED 1~4 4~30 FLEX,HP93K,SHAPPHIR,FUSION and etc.

PROBE CARD PCB

Item Tester RemarkR/F Catalyst, U-Flex Mobile Bandwidth

High Speed Tiger, Fusion USB2.0, S-ATALOGIC T3324,T6682MIXED CATALYST,FLEX,HP93K, SHAPPHIR ADC,DAC

LOAD Board

Item Tester RemarkMother Board PRVXⅡ, PRVXⅢ HP93K,T5375,ST6730 and etc.

PRVX Mother Board

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Platform Supported (LCD & Memory)

• Universal Probe Card<For LCD Driver>

TS6700-B Type T7315-A TypeT7315-B Type (No GND)T6371 (ND-1)ST6730

<For Memory >T5335P-8DUTs-HorizonT5335P-8DUTs-VerticalT5335P-4DUTsT5335P-1DUT-T10514T5363 V3300-8DUTsV3300-4DUTsV3300-4DUTs-Diagonal

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Platform Supported (Mixed signal/RF)

Load BoardHP93000TigerUflexIFLEXChroma 3600SC312HP83000V7100J750Catalyst

Universal Probe Card<For Logic >

HP83000HP93000DUO 9”KALOSJ750CatalystTiger

SC312

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Customized PCBAll Teradyne platformAll HP/Verigy platformAll Credence platformAll LTX platform

PRVX Mother BoardHP93KJ750CatalystTigerUflexKALOSDUO6”DUO9”

Platform Supported (Mixed signal/RF)

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▣ PROBE CARD & TEST B/D LIBRARY

Product Line-up

ADVANTESTT3324T5365T5335T5371T5581T5377T6371T6372

TERADYNE

J750

J937

J994

J995

J996

J997

Catalyst

FLEX

A565

A580

LTX SystemDelta 50Delta trillium

YOKOGAWAYOKOGAWA

TS6700

TS6730

MOSAIDMOSAID

MS3400

MS4155

MS4205

HPHP

HP 83K

HP 93K

HP 4062

HP 4071

HP 4072

CREDENCE

QUARTET

KALOS

SC312

SC212

DUO

ASIAA7160A7162A7163A7164

VERSAV2000V3000V3300

SCHLUMBERGERITS9000

EAGLEETS364

ITS9000

J750

FLEX

SAPPHIRE

T6372

T6371

HP93K

HP94K

KALOS

TS6700

▣

PRVX II & III M/B LIBRARY

CATALYST

T5371

T5377

AL6050

FOS7000

HF3000

SF3000

T3326

VALSTAR

VLCT

ST6730

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PCB Manufacture Capability

Description Korean Fab. Japanese Fab. American Fab.

Mechanical spec.

Material FR4, Polymide, Nelco, Roger's ,BT, Polymide, etc.. FR-5, Polymide, Megtoron6, etc..

GETEK, Nelco, Roger's, Polymide, Cyanate Ester, ARLON, Hybrid Construction

Combinations

Pannel Size 770 x 580 mm 500 x 720 mm 660 x 890 mmLayer (6.35mm) 60 lyrs 58 lyrs 60 lyrs

Min Copper weights 1/2 oz (18 micron) 1/2 oz (18 micron) 1/4 oz (9 michron)

Min. Drill hole diameter

6.35T: ∮0.3 6.35T: ∮0.3 6.35T: ∮0.25

6.2T:∮0.3 6.2T:∮0.25 6.2T:∮0.20

4.8T: ∮0.25 4.8T: ∮0.25 4.8T: ∮0.15

3.2T: ∮0.20 3.2T: ∮0.20 3.2T: ∮0.15

2.0T:∮0.20 2.0T:∮0.20 2.0T:∮0.10

1.6T: ∮0.15 1.6T: ∮0.15 1.6T: ∮0.10

Plating thicknessNormal: NI 4㎛, AU 0.05㎛ Normal: Ni 3㎛, AU0.05㎛ Normal: Ni 5.08㎛, AU0.076㎛

Max: NI 8㎛, AU 0.09㎛ Max: NI 7㎛ , AU 3㎛ Max: NI 7.62㎛, AU 1.27㎛

T 6.35mm (P/C)

Min pitch 0.9 mm pitch 0.8 mm pitch 0.8 mm pitchMin. Pad size 0.50 mm 0.45 mm 0.45 mm

Clearance 0.20 mm 0.20 mm 0.20 mm

T 4.8mm (L/B)Min pitch 0.6 mm pitch 0.5 mm pitch(developing 0.4pitch) 0.4 mm pitch

Min. Pad size 0.3 mm 0.30 mm 0.20 mmClearance 0.15 mm 0.1 mm 0.1 mm

AdvanceQuick turn delivery Hiper Via Low DK speciall material

Laser Via for pine pitch, Excelent plating High Thickness of plating

ApplicationLow layer product / stable quality Fine pitch BI Board Low DK Load board

Probe Card / Load Board High performance probe card High performance Load Board

Lead time 7 days 2 weeks 2~3 weeks

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MLC Design / Manufacture Capability

Property LTCC HTCC

Dielectric Ceramic Material

Dielectric Constant 5.1±0.2 8.8±0.2

Fired Density 3.10 g/cm3 3.54 g/cm3

Flexural Strength 203 Mpa 435 Mpa

Thermal Conductivity

200℃ 2.56 9.23

400℃ 2.41 9.62

Thermal Expansion Coefficient

RT~200℃ 6.245×10-6/℃ 7.527×10-6/℃

RT~400℃ 6.237×10-6/℃ 7.592×10-6/℃

RT~500℃ 6.308×10-6/℃ 7.462×10-6/℃

Conductor Metal

Conductor Ag Ag W W

Metal Contents 85±1% 90±1% 85±1% 90±1%

Firing Temp. 850~900℃ 850~900℃ 1,500~1550℃ 1,500~1550℃

UsageSignal Line Inner GND

Power PlaneVia Filling

Signal Line Inner GND

Power PlaneVia Filling

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2. Software

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EDA Simulation Tools

Enough Engineering of of EDA Tool Expertise Background

Allegro PCB SI

Allegro PCB PI

Allegro Package SI

Hyper-lynx

Paksi-E and Tm

PowerGrid

Hspice

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Advantest Schlumberger Teradyne Credence Yokokawa Mosaid Verigy Versa Nextest TIT5335 ITS9000 J973 SC212 TS6700 MS3440 HP83000 V1000 M1 VLCT 8"T5365 ITS9000EX J993 SC312 TS6700A MS3480 HP93000 V2000 M2 VLCT12"T5371 DX2000 J994 Kalos TS6700B MS3485 HP94000 V3300 Maveric RASPT5375 DX2001 J995 KalosII TS6700C MS40xx HP95000 V4400 All series SPREADT5377 DX2200 J996 KalosXW AL6050 V5400

T5377(250mm) DX3000 J997 VV AL6060T5363 J971 Duo CatalystT5581 Tiger QuartetT5591 J750 OctetT5592 IP750 SapphireT5595 CatalystT6371 Flex SeriesT6372T7315T5771T5575LM4

Library

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Library

Teradyne J750-1024 / 512

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3. Equipment

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Equipment

<1> TDR SystemBrand : Tektronix Model : TDS8000Function : Impedance Check

<2> Digital Dial GaugesBrand : SylvacModel : S229Spec : 12.5 mm – 0.001 / 0.5” – 0.00005Function : Flatness/Thickness Check

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Equipment

<3> 2 Dimensions Coordinate Measuring Machine

Brand : ChienWeiModel : PJG-600 DVFunction : Dimension/Mechanical Hole Check

<4> Flying Probe

Brand : MicroCraftModel : ELX6146Function : Leakage/Open/Short Test

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4. Special Capabilities

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RF Capability

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Actual Tester EnvironmentVerigy, Teradyne,Credence,etc..

RF Test Capability

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Design Signal Integrity (SI) Capability

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Design SI Simulation

Load Board Design – Micro strip Implementation – Single ended

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Design SI Capability

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• Rise time becoming more rapid (bandwidth increasing)– Reflection and Ringing– Crosstalk– SSN– Skew– Jitter– Loss & ISI

• Lower power-supply voltage and High current– Power supply droop and ground bounce– Adequate power plane decoupling is the key– Power delivery impedance is frequency dependent– Common-mode radiated noise (EMI)

CROSSTALK INTERCONNECT DELAYGROUND BOUNCE

ATTENUATION

REFL

ECTI

ON

RADIATIONEMI SUSCEPTIBILITY THERMAL NOISE

Design SI Capability

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Signal Integrity Analysis Flow

MeetSpec.MeetSpec.

FabricationFabrication

Yes

No

Driver ModelsPre-layoutAnalysis

Schematic

Constraint DrivenLayout

Constraint DrivenLayout

Post LayoutAnalysis

Post LayoutAnalysis

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• Define Specification & Verification• Schematic & Topology Optimization • Stack-Up & Floor Planning

Pre Layout Analysis

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Pre Layout Analysis

• Reflection and Ringing Analysis• Propagation delay variations (skew)• Crosstalk Analysis• Single-ended I/O supply noise (SSN)

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Power Layout Analysis

• Power supply droop and ground bounce• De-coupling Capacitors Estimation• Common-mode radiated noise (EMI)

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RF Capability

Teradyne Catalyst

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RF Capability

Integraflex

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5. Process Flow

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Artwork Flow

Getting Design Info.

Verify Design Info.

Registration of Library

Sch. (Net_list)Import

Part Placement

PCB Art-Work

Design Verification Plot (.DXF)

CAM OUT

PCB FAB

PCB Inspection

Assemble of Parts

Delivery

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Working Procedure

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Load Board Design Request

•Tester Data •Tester Mechanic Drawing

•Tester Channel Mapping

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Load Board Design Request• Schematic

• IC Datasheet

Critical Line SPEC Socket Drawing

IBIS(IC/Component)

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7. Quality

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Quality Policy

Our goal is to provide the highest quality our item available anywhere. We guarantee the customer's satisfaction.

Prompt delivery is our objective of production. Our experienced engineers guarantee the quality and schedule production. So that you can catch up on challenging market.

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Quality Assurance

• by SMD system.

• TDR , L R C Check in House ( Not depend on third party )

• Repair Service in Local

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* All signal ( Leakage / Short ) being guaranteed by QA system for Probe card PCB

Quality Assurance

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• External Check• Dimension • Thickness• Flatness• Bending• Open/Short Test• Leakage Test• TDR for Impedance Test

Outgoing QC Inspection System

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Quality Assurance

•All signal ( TDR / Impedance ) being guaranteed

by QA system for all product

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7. Contacts

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Contact us

Zen Voce Manufacturing Pte Ltd

5004 Ang Mo Kio Avenue 5 #04-06 TECHplace II Singapore 569872

Tel: 65 6319 9991 Fax: 65 6319 9997

www.zenvoce.com

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Thank You