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© Copyright 2009 Xilinx Copyright 2012 Xilinx August 2012 Zynq-7000 All Programmable SoC Product Overview The SW, HW and IO Programmable Platform

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© Copyright 2009 XilinxCopyright 2012 Xilinx

August 2012

Zynq-7000 All Programmable SoC Product Overview

The SW, HW and IO Programmable Platform

Copyright 2012 Xilinx

Breakthrough Processing Platform– Higher system performance, lower total power– Flexible and scalable solution

Industry Standard Design Environments– Well defined SW programming model– Familiar SW & HW design flows

Flexible Accelerators and IP– World class 28nm unified Programmable Logic– Standard AMBA® 4 AXI interfaces

Broad Ecosystem Support– Tools, OS’s & IPs– Middleware, codecs– System integrators and training partners.

Page 2

Introducing the Zynq™-7000 All Programmable SoC

Familiar Processing System + Scalable Programmable Logic

Copyright 2012 Xilinx

Next level of Programmable System Integration– All programmable (Hardware and Software) processing platform – ARM Cortex™-A9 MPCore™ Processing System with hardened peripherals,

ADC and 28nm scalable optimized programmable logic

Increased System Performance– 1 GHz, dual core processors with NEON and vector floating point units– 7 series programmable logic (PL) with built-in DSP– High bandwidth, low latency connects enable acceleration of key functions

BOM Cost Advantage in an cost optimized 28nm platform– Integration for component reduction, PCB simplification and area reduction– Platform approach enables aggregation of volumes over several projects

Low Total Power solution– Industry-leading ARM processors maximize MHz/W and low power states– 28nm HPL process and Integration provides ultra-lower power data transfers– Software and Hardware programmable power control and operating modes

Accelerated Design Productivity for TTM and TIM advantage– Industry standard HW and SW development tools for fast Time-To-Market– Flexible and scalable platform enables extended Time-In-Market– Extensive ecosystem of tools and solutions partners

Page 3

Value of the Zynq-7000 All Programmable SoC

Copyright 2012 Xilinx

Complete ARM®-based Processing System– Dual ARM Cortex™-A9 MPCore™, processor centric– Integrated memory controllers & peripherals– Fully autonomous to the Programmable Logic

Tightly Integrated Programmable Logic– Used to extend Processing System– High performance ARM AXI interfaces– Scalable density and performance

Flexible Array of I/O– Wide range of external multi-standard I/O– High performance integrated serial transceivers– Analog-to-Digital Converter inputs

Page 4

Zynq-7000 Family Highlights

Software & Hardware & IO Programmable

7 SeriesProgrammable

Logic

Common Peripherals

CustomPeripherals

Common Accelerators

Custom Accelerators

CommonPeripherals

ProcessingSystem

MemoryInterfaces

ARM®

Dual Cortex-A9 MPCore™ System

Copyright 2012 Xilinx

AMBA Open Standard Interconnect High bandwidth interconnect

between Processing System and Programmable Logic

ACP port for enhanced hardware acceleration and cache coherency for additional soft processors

Page 5

Complete ARM-based Processing System

Processing System Ready to Program

Integrated Memory Mapped Peripherals 2x USB 2.0 (OTG) w/DMA 2x Tri-mode Gigabit Ethernet w/DMA 2x SD/SDIO w/DMA 2x UART, 2x CAN 2.0B, 2x I2C, 2x SPI, 32b GPIO

Processor Core Complex Dual ARM Cortex-A9 MPCore

with NEON™ extensions Single / Double Precision

Floating Point support Up to 1 GHz operation

High BW Memory Internal

– L1 Cache – 32KB/32KB (per Core)– L2 Cache – 512KB Unified

On-Chip Memory of 256KB Integrated Memory Controllers

(DDR3, DDR2, LPDDR2, 2xQSPI, NOR, NAND Flash)

Copyright 2012 Xilinx

On-Chip Memory (OCM)– Dual-ported 256KB– Low-latency CPU access– Accessible by DMAs, Programmable

Logic, etc.

Powerful Application Processor at HeartThe Application Processor Unit (APU)

Page 6

MIO

NEON™/ FPU Engine

Cortex™-A9 MPCore™32/32 KB I/D Caches

NEON™/ FPU Engine

Cortex™-A9 MPCore™32/32 KB I/D Caches

512KB L2 CacheSnoop Control

Unit256 KB OCM

Interrupt Controller, Timers, DMA, Debug, etc.

Dual ARM Cortex-A9 MPCore with NEON extensions– Up to 1 GHz operation (7030 & 7045)– 2.5 DMIPS/MHz per core– Multi-issue (up to 4), Out-of-order,

Speculative– Separate 32KB Instruction and Data Caches

with Parity

Snoop Control Unit– L1 Cache Snoop Control

• Snoop filtering monitors cache traffic• Accelerator Coherency Port

Level 2 Cache and Controller– Shared 512 KB Cache with parity– Lockable

Copyright 2012 Xilinx

DDR controller– DDR3, DDR2, and LPDDR2– 16 bit or 32 bit wide; ECC on 16 bit – DDR3 @ up to DDR1333– DDR2 @ up to DDR800– LPDDR2 @ up to DDR800– 73 dedicated DDR pins

NAND Controller– ECC – 8 bit or 16 bit data widths

NOR/SRAM Controller– 8 bit data width

Quad SPI (QSPI) Controller– Up to 2 QSPI parallel memories for high-

speed boot and configuration

Processing System External MemoriesBuilt-in Controllers and dedicated DDR Pins

32 bit 16 bit

4 x 8 bit 2 x 8 bit

2 x 16 bit 1 x 16 bit

1x 32bit NA

NANDCTRL

NOR /SRAM CTRL

QSPICTRL

To MIO

2 Chip Selects

APU

DDR Controller

LegendArrow direction shows control, Data flows both directionsAXI3 64 bit / APB 32 bit

From L2 Cache

Controller

From Central Interconnect

2 Dedicated to Programmable

Logic

Page 7

Copyright 2012 Xilinx

Two USB 2.0 OTG/Device/Host

Two Tri- Mode GigE (10/100/1000)

Two SD/SDIO interfaces

Two CAN 2.0B, SPI , I2C , UART

Four GPIO 32bit Blocks

Multiplexed Input/Output (MIO)– Multiplexed output of peripheral and static memories– Two I/O Banks: each selectable - 1.8V, 2.5V or 3.3V– Configured using new feature in XPS

Extended MIO– Enables use of Select IO with PS peripherals

Comprehensive set of Built-in PeripheralsEnabling a wide set of IO functions

2x GigEwith DMA

2x USBwith DMA

2x SD/SDIOwith DMA

I/OMUX

2x SPI

2x I2C

2x CAN

2x UART

GPIO

Extended MIO

54

Static MemoryControllers

Page 8

Copyright 2012 Xilinx

Programmable Logic to Memory– 2 Ports to DDR Controller

– 1 Port to OCM SRAM

Central Interconnect– Crossbar switches for high bandwidth

communications

– Processing System Master Ports• 2x 32b AXI Ports from Processing System to

Programmable Logic

• Connects CPU Block to Common Peripherals, through the Central Interconnect

– Processing System Slave Ports• 2x 32b AXI Ports from Programmable Logic to

Processing System

ACP (Accelerator Coherence Port)– Low-latency cache-coherent port for

programmable logic

Enables application-specific customizations with a standard programming model

Page 9

Primary System InterconnectsMaximizing Data Transfers

LegendConfigurable AXI3 32 bit/64 bitAXI3 64 bit / AXI3 32 bit / AHB 32 bit / APB 32 bit

DDR Controller

Pro

gra

mm

able

Lo

gic

to

Mem

oryOCM

Arrow direction shows control, Data flows both directions

. . .

NAND, NOR/SRAM, QSPIControllers

Pe

rip

he

rals

L2Cache

DMA

Master/Slave AXI Interfaces to Programmable Logic

Central Interconnect

OCM

APU

ACP

Copyright 2012 XilinxPage 10

Tightly Integrated Programmable Logic

Scalable Density and Performance

Integrated Analog Capability Dual multi channel 12-bit A/D

converter Up to 1Msps

Over 3000 Internal Interconnects Up to ~100Gb of BW Memory-mapped

interfaces

Built with State-of-the-art 7 Series Programmable Logic Artix-7 & Kintex-7 FPGA Fabric 28K-350K logic cells 430K-5.2M equivalent ASIC gates

Note: ASIC equivalent gates based on analysis over broad range of designs

Enables Massive Parallel Processing Up to 900 DSP blocks

delivering over 1334 GMACs

Copyright 2012 XilinxPage 11

Flexible External I/O

Flexibility Beyond Any Standard Processing Offering

73 Dedicated Memory I/Os DDR3 / DDR2 / LPDDR2 Memory

Interfaces Configurable as 16bit or 32bit

54 Dedicated Peripheral I/Os Supports integrated peripherals Static memory (NAND, NOR,

QSPI) More I/Os available though the Programmable Logic

High Performance Integrated Serial Tranceivers (Two largest devices only) Up to 16 transceivers Operates up to 12.5Gbs Supports popular protocols Integrated PCIe Gen2 block

Over 350 Multi-Standard and High Performance I/O Up to 212 3.3V capable

multi-standard I/O Up to 150 high performance I/O Up to differential 17 ADC inputs

Copyright 2012 XilinxPage 12

Zynq-7000 Device Portfolio SummaryScalable platform offers easy migration between devices

Zynq-7000 AP SoC Devices Z-7010 Z-7020 Z-7030 Z-7045

Processing Syste

m

Processor Core Dual ARM® Cortex™-A9 MPCore™

Processor Extensions NEON™ & Single / Double Precision Floating Point

Max Frequency 800 MHz 1 GHz

Memory L1 Cache 32KB I / D, L2 Cache 512KB, on-chip Memory 256KB

External Memory Support DDR3, DDR2, LPDDR2, 2x QSPI, NAND, NOR

Peripherals 2x USB 2.0 (OTG), 2x Tri-mode Gigabit Ethernet, 2x SD/SDIO, 2x UART, 2x CAN 2.0B, 2x I2C, 2x SPI, 4x 32b GPIO

 

Programmable

Logic

Approximate ASIC Gates ~430K (30k LC) ~1.3M (85k LC) ~1.9M (125k LC) ~5.2M (350k LC)

Block RAM 240KB 560KB 1,060KB 2,180KB

Peak DSP Performance (Symmetric FIR) 100 GMACS 276 GMACS 593 GMACS 1334 GMACS

PCI Express® (Root Complex or Endpoint) - Gen2 x4 Gen2 x8

Agile Mixed Signal (XADC) 2x 12bit 1Msps A/D Converter

I/O

Processor System IO 130

Multi Standards 3.3V IO 100 200 100 212

Multi Standards High Performance 1.8V IO - - 150 150

Multi Gigabit Transceivers - - 4 16

Copyright 2012 Xilinx

BOM Cost Reduction

Reduced Devices per Board– Processors, PLDs, DSPs– A/D converters– Power supplies, fans, etc…

Reduced PCB Complexity– Fewer traces/interconnect/layers– Fewer power supplies– Smaller overall PCB

In-System Reconfiguration Combines Multiple Device Functions– Reconfigureable programmable logic to provide specific functionality at a given time

PS Aggregates Numerous IP Royalties for Net Cost Benefit– ASIC or full FPGA solutions would require purchase of these IPs from 3 rd parties.

Multi-chip Zynq-7000

PCB / Other Components

AP SoC

DSP

BO

M C

os

t

FPGA

Processor

Platform approach enables higher volumes and lower prices

Up to 40% BOM Cost Reduction vs. Multi-Chip Solutions

Copyright 2012 Xilinx

Total Power Reduction

Flexible/Tunable Power Envelope– Adjustable processor speed– Adjustable ARM AMBA®- AXI & memory

speeds– ARM low power states– Programmable logic can be turned off– Programmable logic clock gating– Partial reconfiguration to reduce

Programmable logic requirement

Integration Power Reduction– Reduced interconnections between devices– Fewer system devices– Lower programmable logic power (28nm HPL process)

Multi-chip Zynq-7000

DSP

FPGA

ProcessorAP SoC

Up to 50% Lower PowerVs. Multi-Chip Solutions

Significant Power Reduction at the System Level

Copyright 2012 Xilinx

Accelerated Design Productivity

Reduced Time To Market– Fixed processor system with large set of built in peripherals– Xilinx standardizing on AMBA-4 AXI enhances portability of IPs – Scalable optimized architecture for IP re-use; AXI interfaces for plug & play IP– Accelerate development with targeted design platforms

Increased Time In Market– Software and hardware re-programmability– Field upgradable– Address Processor/ASSPs short shelf life

Dev. Design #1

Platform #1

Dev.

Dev.

Dev.

Design #3

Design #2

Dev. Dev.

ASIC /ASSP /2 Chip

AP SoC

Extended Product life

Platform Approach Enables Horizontal and Vertical Scalability

Copyright 2012 XilinxPage 16

Zynq-7000 AP SoC Applications Mapping

© Copyright 2009 XilinxCopyright 2012 Xilinx

Device Table

Copyright 2012 XilinxPage 18

Zynq-7000 Device TableProcessing System

Device Name

Part Number

Processor Core

Processor Extensions

Maximum Frequency

L1 Cache

L2 Cache

On-Chip Memory

External Memory Support(5)

External Static Memory Support(5)

DMA Channels

Peripherals

Peripherals w / built-in DMA(5)

Security(1)

Processing System to Programmable Logic Interface Ports (Primary Interfaces & Interrupts Only)

See next slide for Programmable Logic and package details

XC7Z010 XC7Z020 XC7Z030 XC7Z045

2x AXI 32b Master, 2x AXI 32b Slave,4x AXI 64b/32b Memory

32 KB Instruction, 32 KB Data per processor

512 KB

256 KB

800 MHz 1 GHz

Processing System

2x USB 2.0 (OTG), 2x Tri-mode Gigabit Ethernet, 2x SD/SDIO

AES and SHA 256b Decryption and Authentication for Secure Boot

Z-7010 Z-7020 Z-7030 Z-7045

DDR3, DDR2, LPDDR2

2x Quad-SPI, NAND, NOR

8 (4 dedicated to Programmable Logic)

2x UART, 2x CAN 2.0B, 2x I2C, 2x SPI, 4x 32b GPIO

Zynq™-7000 All Programmable SoC

Dual ARM® Cortex™-A9 MPCore™ w ith CoreSight™

NEON™ & Single / Double Precision Floating Point for each processor

Copyright 2012 XilinxPage 19

Zynq-7000 Device TableProgrammable Logic and Packages

Device Name

Part Number

Xilinx 7 Series Programmable Logic Equivalent

Programmable Logic Cells (Approximate ASIC Gates (3))

Look-Up Tables (LUTs)

Flip-Flops

Extensible Block RAM (# 36 Kb Blocks)

Programmable DSP Slices (18x25 MACCs)

Peak DSP Performance (Symmetric FIR)

PCI Express® (Root Complex or Endpoint)

Agile Mixed Signal (AMS) / XADC(5)

Security(1)

Commercial (0C to 85C)

Extended (0C to 100C)

Industrial (-40C to 100C)

Package Type (4) CLG225(5) CLG400 CLG400 CLG484 FBG484 FBG676 FFG676 FBG676 FFG676 FFG900

Size (mm) 13x13 17x17 17x17 19x19 23x23 27x27 27x27 27x27 27x27 31x31

Pitch (mm) 0.8 0.8 0.8 0.8 1.0 1.0 1.0 1.0 1.0 1.0

Processing System User I/Os (Excludes DDR dedicated I/Os) (2) 32 54 54 54 54 54 54 54 54 54

Multi-Standards and Multi-Voltage SelectIOTM Interfaces(1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V)

54 100 125 200 100 100 100 100 100 212

Multi-Standards and Multi-Voltage High Performance SelectIO Interfaces

(1.2V, 1.35V, 1.5V, 1.8V)— — — — 63 150 150 150 150 150

Serial Transceivers — — — — 4 4 4 8 8 16

Maximum Transceiver Speed (Speedgrade Dependant) N/A N/A N/A N/A 6.6 Gb/s 6.6 Gb/s 12.5 Gb/s 6.6 Gb/s 12.5 Gb/s 12.5 Gb/s

Notes: 1. Security block is shared by the Processing System and the Programmable Logic.

2. Static memory interface combined w ith the usage of many peripherals could require more than 54 I/Os. In that case the designer can use the Programmable Logic SelectIO interface.

3. Eqivalent ASIC gate count is dependent of the function implemented. The assumption is 1 Logic Cell = ~15 ASIC Gates.

4. Devices in the same package are pin to pin compatible, FBG676 and FFG676 are also pin to pin compatible

5. Z-7010 in CLG225 has restrictions on PS peripherals, Memory interfaces and I/Os. Please refer to the datasheet for more details

6. Preliminary product information. Subject to change. Please contact your Xilinx representative for the latest information

— — Gen2 x4 Gen2 x8

Packages

2x 12 bit, MSPS ADCs w ith up to 17 Differential Inputs

AES and SHA 256b Decryption and Authentication for Secure Programmable Logic Configuration

Speed Grades

-1

-2, -3

-1, -2

Programmable Logic

Artix™-7 FPGA

80 220 400 900

100 GMACS 276 GMACS 593 GMACS 1334 GMACS

218,600

240 KB (60) 560 KB (140) 1,060 KB (265) 2,180 KB (545)

35,200 106,400 157,200 437,200

17,600 53,200 78,600

Artix™-7 FPGA Kintex™-7 FPGA Kintex™-7 FPGA

28K Logic Cells (~430K) 85K Logic Cells (~1.3M) 125K Logic Cells (~1.9M) 350K Logic Cells (~5.2M)

XC7Z010 XC7Z020 XC7Z030 XC7Z045

Zynq™-7000 All Programmable SoCZ-7010 Z-7020 Z-7030 Z-7045